CN211580514U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN211580514U CN211580514U CN202020483769.4U CN202020483769U CN211580514U CN 211580514 U CN211580514 U CN 211580514U CN 202020483769 U CN202020483769 U CN 202020483769U CN 211580514 U CN211580514 U CN 211580514U
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- circuit board
- heat dissipation
- heat conducting
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Abstract
The application relates to a heat dissipation device and an electronic apparatus, the heat dissipation device includes: the heat conducting fin is connected with the circuit board to guide heat generated by the circuit board; and one end of the radiating fin is connected with the heat conducting fin, and the radiating fin extends to the air duct to radiate heat. The heat dissipation device and the electronic equipment lead the heat of the circuit board out to the heat dissipation fins through the heat conducting fins, and the heat dissipation fins extend to the air duct, so that the heat of the heat dissipation fins can be dissipated quickly, and the heat dissipation efficiency of the heat dissipation device is improved.
Description
Technical Field
The utility model belongs to the electronic equipment field. In particular to a heat dissipation device and an electronic device.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
Along with the rapid development of electronic products, the integration degree of electronic equipment is higher and higher, and the heat dissipation requirement is highlighted. At present, conventional heat dissipation means such as graphite sheet heat dissipation, copper sheet heat dissipation and the like commonly used generally attach a heat dissipation sheet to a chip or a circuit board (PCBA), and some heat conduction silica gel is adopted at the bottom of the PCBA to conduct heat to an outer shell, so that the function is single and the structure is simple.
However, for the conditions of large number of electronic devices with large heat productivity, high temperature and difficult heat dissipation, it is difficult to directly guide the heat to the housing to meet the requirement of the current electronic equipment on the heat dissipation capability.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a heat dissipation device and an electronic apparatus for improving the heat dissipation performance of the electronic apparatus.
A heat dissipation device, comprising:
the heat conducting fin is connected with the circuit board to guide heat generated by the circuit board;
and one end of the radiating fin is connected with the heat conducting fin, and the radiating fin extends to the air duct to radiate heat.
Preferably, the heat conducting sheet is made of an aluminum material.
Preferably, the side surface of the heat conducting sheet is filled with heat conducting silicone grease or heat conducting silicone.
Preferably, the heat sink is provided with a grid for dissipating heat.
Preferably, the heat sink is attached to a middle portion of the heat conductive sheet.
Preferably, the heat conducting fin is attached to the circuit board, and an included angle between the heat radiating fin and the heat conducting fin is larger than 0 and extends to the air duct.
An electronic device comprises a shell and a circuit board, wherein the shell is provided with an air inlet and an air outlet, an air duct for air flow to pass through is formed between the air inlet and the air outlet, the circuit board is arranged in the shell, and the electronic device also comprises the heat dissipation device, wherein the heat conduction sheet is connected to the circuit board, and the heat dissipation sheet is connected to the heat conduction sheet and is positioned in the air duct between the air inlet and the air outlet.
Preferably, the heat sink is perpendicular to the heat conductive sheet and is located in the air duct.
Preferably, the heat conducting fin is attached to the circuit board, and the heat sink is connected to the heat conducting fin and extends to the air duct through the circuit board.
Preferably, the heat conducting sheet is fixed to the circuit board by a fixing member which is connected to the heat conducting sheet through the circuit board.
Compared with the prior art, the heat dissipation device and the electronic equipment lead the heat of the circuit board out to the heat dissipation fins through the heat conducting fins, and the heat dissipation fins extend to the air duct, so that the heat of the heat dissipation fins can be dissipated quickly, and the heat dissipation efficiency of the heat dissipation device is improved.
Furthermore, the heat dissipation device and the electronic equipment are particularly suitable for the situations that electronic devices generating heat on the circuit board are more, the heat dissipation is difficult, and the effect of directly guiding the heat to the shell is not ideal.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a schematic structural diagram of a heat dissipation device.
Fig. 2 is a schematic structural diagram of the electronic device.
Description of the main elements
The following detailed description of the invention will be further described in conjunction with the above-identified drawings.
Detailed Description
In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be described in detail with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, and the described embodiments are merely some embodiments, rather than all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In various embodiments of the present invention, for convenience of description and not limitation, the term "connected" as used in the specification and claims of the present invention is not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
Fig. 1 is a schematic structural diagram of a heat dissipation device 10. As shown in fig. 1, the heat dissipating device 10 includes a heat conducting sheet 11 and a heat dissipating sheet 12, the heat conducting sheet 11 is used for guiding heat to the heat dissipating sheet 12, and the heat dissipating sheet 12 is used for dissipating heat.
The heat conducting sheet 11 is substantially in the shape of a sheet, and the heat conducting sheet 11 is made of a material with a high heat conductivity coefficient, for example, an aluminum material. In the present embodiment, the heat conducting sheet 11 includes two heat conducting portions with a large area and a connecting portion connecting the two heat conducting portions, and both the heat conducting portions and the connecting portion can be connected to the circuit board 20 to guide heat generated by the circuit board 20. In some preferred embodiments, the position of the heat conducting portion may be reasonably set according to the heat generation amount of the electronic component of the circuit board 20, so that the electronic component with larger heat generation amount is close to the heat conducting portion to facilitate rapid heat guiding of the electronic component. Preferably, the side surface of the heat conducting sheet 11 is filled with heat conducting silicone grease or heat conducting silicone, and the heat conducting sheet 11 is attached to the circuit board 20, so that the heat conducting sheet 11 can be sufficiently contacted with the circuit board 20 to guide the heat of the circuit board 20.
The heat sink 12 is substantially in the shape of a plate, one end of which is connected to the heat conducting fin 11, and the heat sink 12 extends to the air duct to dissipate heat. The heat sink 12 is provided with a grid 121 for heat dissipation, and the air flow of the air duct can accelerate the heat dissipation of the heat sink 12 through the grid 121 of the heat sink 12. The heat sink 12 is connected to the middle region of the heat conducting fin 11, especially to the connecting portion of the heat conducting fin 11, so that the heat in each region of the heat conducting fin 11 can be rapidly transferred to the heat sink 12 for dissipation. In this embodiment, the bottom of the heat sink 12 is connected to the heat conducting fin 11, the included angle between the heat sink 12 and the heat conducting fin 11 of the heat conducting fin 11 is greater than 0 and extends to the air duct, and preferably, the included angle between the heat sink 12 and the heat conducting fin 11 is 90 degrees, that is, the heat sink 12 is perpendicular to the heat conducting fin 11, so that the heat sink 12 is parallel to the cross section of the air duct and has the largest effective heat dissipation area.
Fig. 2 is a schematic structural diagram of the electronic device. As shown in fig. 2, the electronic apparatus includes a housing, a circuit board 20, and the heat sink 10 described above. The housing is used for accommodating the circuit board 20 and the heat dissipation device 10, and the heat dissipation device 10 is used for helping the circuit board 20 dissipate heat.
The shell is internally provided with a cavity, the side wall of the shell is provided with an air inlet and an air outlet, and air flow can enter the cavity in the shell from the air inlet and flow out from the air outlet. The passage through which the air flows from the air inlet to the air outlet is called an air duct for the air to pass.
The circuit board 20 is disposed in the housing, and electronic components, such as a power chip, a processing chip, a capacitor, a resistor, and the like, are disposed on the circuit board. The electronic components inevitably generate heat in the working process, if the heat cannot be dissipated in time, the performance of the electronic components is seriously affected, and even the electronic components may be burnt.
The heat conducting sheet 11 of the heat dissipation device 10 is attached to the side surface of the circuit board 20 through heat conducting silicone grease or heat conducting silicone adhesive. In order to improve the firmness of the heat conducting strip 11, the heat dissipating device 10 further includes 1 or more connecting members 13, the connecting members 13 may be screws, the circuit board 20 is provided with through holes 111 corresponding to the screws, the heat conducting strip 11 is provided with threaded holes corresponding to the screws, so that the connecting members 13 can pass through the through holes 111 of the circuit board 20 and be in threaded connection with the heat conducting strip 11, thereby firmly connecting the heat conducting strip 11 to the circuit board 20, and fully contact the circuit board 20 through the heat conducting silicone grease or the heat conducting silicone grease, that is, the contact area between the heat conducting strip 11 and the circuit board 20 is increased, so that the heat generated by the circuit board 20 can be rapidly guided to the heat conducting strip 11. In some embodiments, a heat dissipation fan (not shown) is disposed in the housing to accelerate the air flow in the air duct, so as to more rapidly carry away the heat of the heat dissipation fins 12.
During operation, the heat of the circuit board 20 can be conducted to the heat conducting fins 11 through the heat conducting silicone grease or the heat conducting silicone, and then transferred to the heat dissipation fins 12, so that the heat of the heat dissipation fins 12 is taken away by the air flow of the air duct to improve the heat dissipation efficiency of the heat dissipation device 10.
The heat dissipation device 10 and the electronic device lead the heat of the circuit board 20 out to the heat dissipation sheet 12 through the heat conduction sheet 11, and the heat dissipation sheet 12 extends to the air duct, so that the heat of the heat dissipation sheet 12 can be dissipated quickly, and the heat dissipation efficiency of the heat dissipation device 10 is improved.
Further, the heat dissipating device 10 and the electronic apparatus described above are particularly suitable for cases where many electronic components generate heat on the circuit board 20, heat dissipation is difficult, and the effect of directly guiding heat to the housing is not satisfactory, and by guiding heat to the heat dissipating fins 12, it is not necessary to occupy a large space in the area of the circuit board 20, and a good heat dissipating effect is obtained.
In the several embodiments provided in the present disclosure, it should be understood that the disclosed structures and components may be implemented in other ways. It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. The terms first, second, etc. are used to denote names, but not any particular order.
The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the same, and although the present invention has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A heat dissipating device, comprising:
the heat conducting fin is connected with the circuit board to guide heat generated by the circuit board;
and one end of the radiating fin is connected with the heat conducting fin, and the radiating fin extends to the air duct to radiate heat.
2. The heat dissipating device of claim 1, wherein the heat conducting sheet is made of an aluminum material.
3. The heat dissipating device of claim 1, wherein the side surface of the heat conducting sheet is filled with heat conducting silicone grease or heat conducting silicone gel.
4. The heat dissipating device of claim 1, wherein said heat sink is provided with a grid for dissipating heat.
5. The heat dissipating device of claim 4, wherein said heat sink is attached to a middle portion of said heat conducting fin.
6. The heat dissipating device of claim 1, wherein the heat conducting strip is attached to the circuit board, and an included angle between the heat sink and the heat conducting strip is greater than 0 and extends to the air duct.
7. An electronic device comprising a housing and a circuit board, wherein the housing has an air inlet and an air outlet, an air duct is formed between the air inlet and the air outlet, and the circuit board is disposed in the housing, and the electronic device further comprises the heat dissipation device as claimed in any one of claims 1 to 6, wherein the heat conductive sheet is connected to the circuit board, and the heat dissipation plate is connected to the heat conductive sheet and located in the air duct between the air inlet and the air outlet.
8. The electronic device of claim 7, wherein the heat sink is positioned perpendicular to the heat conductive sheet and in the air channel.
9. The electronic device of claim 8, wherein the thermal pad is attached to the circuit board, and the heat sink is coupled to the thermal pad and extends across the circuit board and into the air channel.
10. The electronic device according to claim 9, further comprising a connector that is connected to the heat conductive sheet through the circuit board to fix the heat conductive sheet to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020483769.4U CN211580514U (en) | 2020-04-03 | 2020-04-03 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020483769.4U CN211580514U (en) | 2020-04-03 | 2020-04-03 | Heat dissipation device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580514U true CN211580514U (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020483769.4U Active CN211580514U (en) | 2020-04-03 | 2020-04-03 | Heat dissipation device and electronic equipment |
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| CN (1) | CN211580514U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112754652A (en) * | 2020-12-31 | 2021-05-07 | 仕若普科技(深圳)有限公司 | Air duct heat dissipation assembly and depilating instrument |
-
2020
- 2020-04-03 CN CN202020483769.4U patent/CN211580514U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112754652A (en) * | 2020-12-31 | 2021-05-07 | 仕若普科技(深圳)有限公司 | Air duct heat dissipation assembly and depilating instrument |
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