CN103972203A - Circuit board structure with embedded electronic components and manufacture method thereof - Google Patents
Circuit board structure with embedded electronic components and manufacture method thereof Download PDFInfo
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- CN103972203A CN103972203A CN201310048207.1A CN201310048207A CN103972203A CN 103972203 A CN103972203 A CN 103972203A CN 201310048207 A CN201310048207 A CN 201310048207A CN 103972203 A CN103972203 A CN 103972203A
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- building brick
- electronic building
- electronic
- metal coupling
- circuit board
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Abstract
Disclosed are a circuit board structure with embedded electronic components and a manufacture method thereof. The circuit board structure comprises a substrate, the electronic components, first metal protrusions, first dielectric layers and first metal layers. The substrate is provided with first and second opposing surfaces. The electronic components are embedded in the substrate. The first acting face of each electronic component and each first electrode pad thereon are exposed from the first surface. The first protrusions are formed on the first electrode pads. The first dielectric layers are formed on the first surface of the substrate and the first acting faces of the electronic components. The first metal protrusions penetrate the first dielectric layers. The first metal layers are formed on the first dielectric layers and the first metal protrusions and contact with the first metal protrusions. The circuit board structure and the manufacture method thereof have the advantages that process steps are reduced effectively, process cost is reduced and process time is shortened.
Description
Technical field
The present invention relates to a kind of circuit board structure and method for making thereof, espespecially a kind of circuit board structure and method for making thereof that is embedded with electronic building brick.
Background technology
Along with the evolution of semiconductor packaging, except traditional routing type (wire bonding) and cover the semiconductor packaging of crystalline substance (flip chip), semiconductor device (semiconductor device) has been developed different encapsulation kenels at present, for example directly in a base plate for packaging (package substrate), be embedded into and electrically integrate an electronic building brick, this kind of packaging part can reduce the volume of overall circuit board structure and promote electrical functionality, then becomes a kind of trend of encapsulation.
Figure 1A to Fig. 1 F those shown, it is the existing circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with.
As shown in Figure 1A, provide one to there is relative first surface 10a and second surface 10b, and run through the substrate 10 of the opening 100 of this first surface 10a and second surface 10b, and be provided with the adhesive sheet 11 of these opening 100 one end of capping in this second surface 10b, and on this adhesive sheet 11 with this opening 100, multiple electronic building bricks 12 are set, this electronic building brick 12 has the first relative acting surface 12a and the second acting surface 12b, on this first acting surface 12a and the second acting surface 12b, be respectively equipped with the first electronic pads 121a and the second electronic pads 121b, and make this first acting surface 12a and on the first electronic pads 121a expose to this first surface 10a.
As shown in Figure 1B, in this first surface 10a and the upper pressing one first dielectric layer 13a of the first acting surface 12a, this first dielectric layer 13a also flows in this opening 100, to cover the side surface of this electronic building brick 12.
As shown in Figure 1 C, remove this adhesive sheet 11, so that this second acting surface 12b and on the second electronic pads 121b expose to this second surface 10b, and in this second surface 10b and the upper pressing one second dielectric layer 13b of the second acting surface 12b, and on this first dielectric layer 13a and the second dielectric layer 13b, cover respectively the first Copper Foil 14a and the second Copper Foil 14b.
As shown in Fig. 1 D, carry out brown step, and by laser burn mode to form multiple the first blind hole 130a and the second blind hole 130b that expose respectively this first electronic pads 121a and the second electronic pads 121b.
As shown in Fig. 1 E, on the hole wall of this first blind hole 130a and the second blind hole 130b, change plating and form conductive layer 15.
As shown in Fig. 1 F, electroplate and fill up metal in this first blind hole 130a and the second blind hole 130b by this conductive layer 15, to form respectively the first conductive blind hole 16a and the second conductive blind hole 16b, and then make this first Copper Foil 14a be electrically connected this second Copper Foil 14b.
But existing circuit board structure and the method for making thereof that is embedded with electronic building brick must be used laser burn, change the techniques such as copper and plating, therefore the step of integrated artistic is more, more complicated, more consuming time and cost is higher.
Therefore, how to avoid above-mentioned variety of problems of the prior art, the real problem of desiring most ardently at present solution that become.
Summary of the invention
Because the disappearance of above-mentioned prior art, main purpose of the present invention is to provide a kind of circuit board structure and method for making thereof that is embedded with electronic building brick, can effectively reduce processing step, reduces process costs and shorten the process time.
The circuit board structure that is embedded with electronic building brick of the present invention comprises: substrate, and it has relative first surface and second surface; Electronic building brick, it has the first relative acting surface and the second acting surface, on this first acting surface and the second acting surface, be respectively equipped with the first electronic pads and the second electronic pads, and this electronic building brick is embedded in this substrate, and make this electronic building brick the first acting surface and on the first electronic pads expose to this first surface; The first metal coupling, it is formed on this first electronic pads; The first dielectric layer, it is formed on the first surface of this substrate and the first acting surface of this electronic building brick, and this first metal coupling runs through this first dielectric layer; And the first metal layer, it is formed on this first dielectric layer and the first metal coupling, and contacts this first metal coupling.
The present invention also provides a kind of method for making of the circuit board structure that is embedded with electronic building brick, it comprises: electronic building brick is embedded in having the substrate of relative first surface and second surface, this electronic building brick has the first relative acting surface and the second acting surface, on this first acting surface and the second acting surface, be respectively equipped with the first electronic pads and the second electronic pads, and make this electronic building brick the first acting surface and on the first electronic pads expose to this first surface; On this first electronic pads, form the first metal coupling; And in the first surface of this substrate and the first acting surface upper caldding layer of this electronic building brick folded the first dielectric layer and the first metal layer, this first metal coupling runs through this first dielectric layer, and contacts this first metal layer.
As from the foregoing, because the present invention need not use laser burn, change the techniques such as copper and plating, and then make the step of integrated artistic less, simplification, save time and cost lower.
Brief description of the drawings
Figure 1A to Fig. 1 F those shown is the existing circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with.
Fig. 2 A to Fig. 2 G those shown is the circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with of the present invention.
Symbol description
10,20 substrates
10a, 20a first surface
10b, 20b second surface
100,200 openings
11,21 adhesive sheets
12,22 electronic building bricks
12a, 22a the first acting surface
12b, 22b the second acting surface
121a, 221a the first electronic pads
121b, 221b the second electronic pads
13a, 24a the first dielectric layer
13b, 24b the second dielectric layer
130a the first blind hole
130b the second blind hole
14a the first Copper Foil
14b the second Copper Foil
15 conductive layers
16a the first conductive blind hole
16b the second conductive blind hole
23a the first metal coupling
23b the second metal coupling
25a the first metal layer
25b the second metal level
2 circuit board structures.
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, the personage who is familiar with this skill can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, appended graphic the illustrated structure of this specification, ratio, size etc., all contents in order to coordinate specification to disclose only, for personage's understanding and the reading of being familiar with this skill, not in order to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", " end ", " in " and the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the present invention without essence.
Fig. 2 A to Fig. 2 G those shown, it is the circuit board structure of electronic building brick and the cutaway view of method for making thereof of being embedded with of the present invention.
As shown in Figure 2 A, provide one to there is relative first surface 20a and second surface 20b, and run through the substrate 20 of the opening 200 of this first surface 20a and second surface 20b, and be provided with the adhesive sheet 21 of these opening 200 one end of capping in this second surface 20b, and on this adhesive sheet 21 with this opening 200, multiple electronic building bricks 22 are set, this electronic building brick 22 has the first relative acting surface 22a and the second acting surface 22b, on this first acting surface 22a and the second acting surface 22b, be respectively equipped with the first electronic pads 221a and the second electronic pads 221b, and make this first acting surface 22a and on the first electronic pads 221a expose to this first surface 20a, this electronic building brick 22 can be electric capacity, and this electric capacity can be monolithic ceramic capacitor (Multi-layer CeramicCapacitor, be called for short MLCC).
As shown in Figure 2 B, form the first metal coupling 23a of for example silver paste in the upper printing of this first electronic pads 221a, and heating makes its sclerosis, wherein, this first metal coupling 23a connects the top width that the bottom width that is placed in the first electronic pads 221a is greater than this first metal coupling 23a.
As Fig. 2 C, shown in Fig. 2 D, in the first surface 20a of this substrate 20 and the first acting surface 22a upper caldding layer of this electronic building brick 22 folded the first dielectric layer 24a and the first metal layer 25a, this first dielectric layer 24a also flows in this opening 200, to cover the side surface of this electronic building brick 22, this stacked the first dielectric layer 24a and the first metal layer 25a can be gum Copper Foil, this first metal coupling 23a runs through this first dielectric layer 24a, and contact this first metal layer 25a, and remove this adhesive sheet 21, so that this second acting surface 22b and on the second electronic pads 221b expose to this second surface 20b.
As shown in Figure 2 E, form the second metal coupling 23b of for example silver paste in the upper printing of this second electronic pads 221b, and heating makes its sclerosis, wherein, this second metal coupling 23b connects the top width that the bottom width that is placed in the second electronic pads 221b is greater than this second metal coupling 23b.
As shown in Fig. 2 F, Fig. 2 G, in the second surface 20b of this substrate 20 and the second acting surface 22b upper caldding layer of this electronic building brick 22 folded the second dielectric layer 24b and the second metal level 25b, this second metal coupling 23b runs through this second dielectric layer 24b, and contact this second metal level 25b, and then make this first metal layer 25a be electrically connected this second metal level 25b, so far complete the circuit board structure 2 that is embedded with electronic building brick of the present invention.
The present invention also provides a kind of circuit board structure 2 that is embedded with electronic building brick, comprising: substrate 20, and it has relative first surface 20a and second surface 20b; Electronic building brick 22, it is embedded in this substrate 20, and make this electronic building brick 22 the first acting surface 22a and on the first electronic pads 221a expose to this first surface 20a; The first metal coupling 23a, it is formed on this first electronic pads 221a; The first dielectric layer 24a, it is formed at the first surface 20a of this substrate 20 and the first acting surface 22a of this electronic building brick 22 is upper, and this first metal coupling 23a runs through this first dielectric layer 24a; And the first metal layer 25a, be formed at this first dielectric layer 24a and the first metal coupling 23a upper, and contact this first metal coupling 23a.
In the circuit board structure 2 that is embedded with electronic building brick of the present invention, this substrate 20 has the opening 200 that runs through this first surface 20a and second surface 20b, this electronic building brick 22 is arranged in this opening 200, the second acting surface 22b of relative the first acting surface 22a of this electronic building brick 22 and on the second electronic pads 221b expose to this second surface 20b, and also comprise the second metal coupling 23b, the second dielectric layer 24b and the second metal level 25b, this second metal coupling 23b is formed on this second electronic pads 221b, this second dielectric layer 24b is formed on the second surface 20b of this substrate 20 and the second acting surface 22b of this electronic building brick 22, this second metal coupling 23b runs through this second dielectric layer 24b, this second metal level 25b is formed on this second dielectric layer 24b and the second metal coupling 23b, and contact this second metal coupling 23b.
In the present embodiment, this first metal coupling 23a is formed by silver paste, and this electronic building brick 22 is electric capacity, and this electric capacity is monolithic ceramic capacitor (Multi-layer Ceramic Capacitor is called for short MLCC).
In sum, than prior art, because the present invention need not use laser burn, change the techniques such as copper and plating, so make the step of integrated artistic less, simplification, save time and cost lower.
Above-described embodiment is only in order to illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all can, under spirit of the present invention and category, modify to above-described embodiment.Therefore the scope of the present invention, should be as listed in claims.
Claims (12)
1. a circuit board structure that is embedded with electronic building brick, comprising:
Substrate, it has relative first surface and second surface;
Electronic building brick, it has the first relative acting surface and the second acting surface, on this first acting surface and the second acting surface, be respectively equipped with the first electronic pads and the second electronic pads, and this electronic building brick is embedded in this substrate, and make this electronic building brick the first acting surface and on the first electronic pads expose to this first surface;
The first metal coupling, it is formed on this first electronic pads, and wherein, this first metal coupling connects the top width that the bottom width that is placed in the first electronic pads is greater than this first metal coupling;
The first dielectric layer, it is formed on the first surface of this substrate and the first acting surface of this electronic building brick, and this first metal coupling runs through this first dielectric layer; And
The first metal layer, it is formed on this first dielectric layer and the first metal coupling, and contacts this first metal coupling.
2. the circuit board structure that is embedded with electronic building brick according to claim 1, it is characterized in that, this substrate has the opening that runs through this first surface and second surface, this electronic building brick is arranged in this opening, the second acting surface of this electronic building brick and on the second electronic pads expose to this second surface, and also comprise the second metal coupling, the second dielectric layer and the second metal level, this second metal coupling is formed on this second electronic pads, wherein, this second metal coupling connects the top width that the bottom width that is placed in the second electronic pads is greater than this second metal coupling, this second dielectric layer is formed on the second surface of this substrate and the second acting surface of this electronic building brick, this second metal coupling runs through this second dielectric layer, this second metal level is formed on this second dielectric layer and the second metal coupling, and contact this second metal coupling.
3. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this first metal coupling is formed by silver paste.
4. the circuit board structure that is embedded with electronic building brick according to claim 1, is characterized in that, this electronic building brick is electric capacity.
5. the circuit board structure that is embedded with electronic building brick according to claim 4, is characterized in that, this electric capacity is monolithic ceramic capacitor.
6. a method for making that is embedded with the circuit board structure of electronic building brick, it comprises:
Electronic building brick is embedded in having the substrate of relative first surface and second surface, this electronic building brick has the first relative acting surface and the second acting surface, on this first acting surface and the second acting surface, be respectively equipped with the first electronic pads and the second electronic pads, and make this electronic building brick the first acting surface and on the first electronic pads expose to this first surface;
On this first electronic pads, form the first metal coupling; And
In the first surface of this substrate and the first acting surface upper caldding layer of this electronic building brick folded the first dielectric layer and the first metal layer, this first metal coupling runs through this first dielectric layer, and contacts this first metal layer.
7. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 6, it is characterized in that, this substrate has the opening that runs through this first surface and second surface, this second surface is provided with the adhesive sheet of this opening one end of capping, this electronic building brick be arranged on this adhesive sheet with this opening in, and after covering this first dielectric layer and the first metal layer, also comprise and remove this adhesive sheet, so that the second acting surface of this electronic building brick and on the second electronic pads expose to this second surface, and form the second metal coupling on this second electronic pads, and in the second surface of this substrate and the second acting surface upper caldding layer of this electronic building brick folded the second dielectric layer and the second metal level, this second metal coupling runs through this second dielectric layer, and contact this second metal level.
8. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 6, is characterized in that, this first metal coupling is formed by silver paste.
9. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 6, is characterized in that, after forming this first metal coupling, also comprises this first metal coupling of heating.
10. the method for making of the circuit board structure that is embedded with electronic building brick according to claim 6, is characterized in that, this electronic building brick is electric capacity.
The method for making of 11. circuit board structures that are embedded with electronic building brick according to claim 10, is characterized in that, this electric capacity is monolithic ceramic capacitor.
The method for making of 12. circuit board structures that are embedded with electronic building brick according to claim 6, is characterized in that, the first dielectric layer that this is stacked and the first metal layer are gum Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310048207.1A CN103972203A (en) | 2013-02-06 | 2013-02-06 | Circuit board structure with embedded electronic components and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310048207.1A CN103972203A (en) | 2013-02-06 | 2013-02-06 | Circuit board structure with embedded electronic components and manufacture method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103972203A true CN103972203A (en) | 2014-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310048207.1A Pending CN103972203A (en) | 2013-02-06 | 2013-02-06 | Circuit board structure with embedded electronic components and manufacture method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106653619A (en) * | 2015-10-30 | 2017-05-10 | 英飞凌科技股份有限公司 | Method for producing power semiconductor module |
| CN108155156A (en) * | 2014-11-19 | 2018-06-12 | 日月光半导体制造股份有限公司 | Semiconductor package and its manufacturing method |
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| JP2003218282A (en) * | 2002-01-18 | 2003-07-31 | Ibiden Co Ltd | Semiconductor element built-in board and multi-layer circuit board |
| US20070190686A1 (en) * | 2006-02-13 | 2007-08-16 | Advanced Semiconductor Engineering, Inc. | Method of fabricating substrate with embedded component therein |
| CN100345279C (en) * | 2001-01-19 | 2007-10-24 | 松下电器产业株式会社 | Component built-in module and method of manufacturing the same |
| TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
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2013
- 2013-02-06 CN CN201310048207.1A patent/CN103972203A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100345279C (en) * | 2001-01-19 | 2007-10-24 | 松下电器产业株式会社 | Component built-in module and method of manufacturing the same |
| JP2003218282A (en) * | 2002-01-18 | 2003-07-31 | Ibiden Co Ltd | Semiconductor element built-in board and multi-layer circuit board |
| TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
| US20070190686A1 (en) * | 2006-02-13 | 2007-08-16 | Advanced Semiconductor Engineering, Inc. | Method of fabricating substrate with embedded component therein |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155156A (en) * | 2014-11-19 | 2018-06-12 | 日月光半导体制造股份有限公司 | Semiconductor package and its manufacturing method |
| CN106653619A (en) * | 2015-10-30 | 2017-05-10 | 英飞凌科技股份有限公司 | Method for producing power semiconductor module |
| CN106653619B (en) * | 2015-10-30 | 2020-03-10 | 英飞凌科技股份有限公司 | Method for producing a power semiconductor module |
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Application publication date: 20140806 |
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