CN103923585A - Conductive adhesive composition and conductive adhesive membrane - Google Patents
Conductive adhesive composition and conductive adhesive membrane Download PDFInfo
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- CN103923585A CN103923585A CN201410133006.6A CN201410133006A CN103923585A CN 103923585 A CN103923585 A CN 103923585A CN 201410133006 A CN201410133006 A CN 201410133006A CN 103923585 A CN103923585 A CN 103923585A
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- epoxy resin
- adhesive composition
- electrically conducting
- weight
- conducting adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 95
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 94
- 239000000203 mixture Substances 0.000 title claims abstract description 73
- 239000012528 membrane Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000003822 epoxy resin Substances 0.000 claims abstract description 47
- 239000002245 particle Substances 0.000 claims abstract description 30
- 239000004952 Polyamide Substances 0.000 claims abstract description 22
- 229920001971 elastomer Polymers 0.000 claims abstract description 22
- 239000000806 elastomer Substances 0.000 claims abstract description 22
- 229920002647 polyamide Polymers 0.000 claims abstract description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 91
- 239000002904 solvent Substances 0.000 claims description 33
- 229920003987 resole Polymers 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000002313 adhesive film Substances 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 18
- 229920000800 acrylic rubber Polymers 0.000 claims description 17
- 229920000058 polyacrylate Polymers 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 13
- -1 glycidyl ester Chemical class 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 claims description 4
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 4
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 4
- 150000002989 phenols Chemical class 0.000 claims description 4
- 150000001412 amines Chemical group 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims description 2
- WKJICCKTDQDONB-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)cyclohexane-1-carboxylic acid Chemical class OC(=O)C1CCCCC1C(=O)OCC1OC1 WKJICCKTDQDONB-UHFFFAOYSA-N 0.000 claims description 2
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 2
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- 150000001896 cresols Chemical class 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 229940015043 glyoxal Drugs 0.000 claims description 2
- 150000004678 hydrides Chemical class 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 150000002829 nitrogen Chemical class 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 235000019198 oils Nutrition 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 235000012424 soybean oil Nutrition 0.000 claims description 2
- 239000003549 soybean oil Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 239000005007 epoxy-phenolic resin Substances 0.000 abstract 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 33
- 238000002156 mixing Methods 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 21
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 241000555268 Dendroides Species 0.000 description 17
- 230000008859 change Effects 0.000 description 15
- 239000011888 foil Substances 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 14
- 239000002131 composite material Substances 0.000 description 13
- 229910052736 halogen Inorganic materials 0.000 description 13
- 150000002367 halogens Chemical group 0.000 description 13
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical class ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 244000061456 Solanum tuberosum Species 0.000 description 2
- 235000002595 Solanum tuberosum Nutrition 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- LZDOYVMSNJBLIM-UHFFFAOYSA-N 4-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=C(O)C=C1 LZDOYVMSNJBLIM-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical group NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LCDFWRDNEPDQBV-UHFFFAOYSA-N formaldehyde;phenol;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1 LCDFWRDNEPDQBV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000206 moulding compound Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The invention provides a conductive adhesive composition. The conductive adhesive composition comprises the following components: A, 15-55 parts by weight of polyamide elastomer; B, 15-55 parts by weight of acrylic acid elastomer; C, 30-70 parts by weight of epoxy resin and/or phenolic resin; D, 0.001-1 part by weight of curing accelerator; E, 30-100 parts by weight of conductive particles, wherein the total weight of A, B and C is 100 parts by weight. The invention also provides a conductive adhesive membrane. By adopting two special thermoplastic elastomers, epoxy resin and/or phenolic resin and conductive particles in a special structure, the conductive adhesive and the conductive adhesive membrane which have good bonding strength, heat resistance, conductivity, mobility resistance and operability can be obtained.
Description
Technical field
The present invention relates to a kind of electrically conducting adhesive composition and conductive adhesive film, belong to electroconductive binder technical field.
Background technology
In being connected of the electrode film of touch panel and bonding, the various film substrates of junctor, generally use chloroprene class conductive adhesive (as No. 2004-143219, Japanese Patent Laid-Open).The type conductive adhesive has if product surface is without just sticky, the advantage that under short-term conditions, energy normal temperature is preserved.
But, due to environmental problem and to the requirement of security, improving in recent years, conductive adhesive strong request is Halogen caking agent.In addition, chloroprene class conductive adhesive in the past, according to purposes, from the viewpoint of bonding strength or thermotolerance, operability etc., may not meet the demands, and particularly as the adhesive composite for substrate bonding, has the problem of thermotolerance deficiency.Therefore there is contriver propose all good Halogen conductive adhesive compositions of bonding strength, thermotolerance, operability.As patent CN101978016B discloses a kind of adhesive composite, the adhesive composite to the application of conductive adhesive using for being suitable for substrate bonding, its bonding strength, thermotolerance, operability etc. are compared all good with existing chloroprene class caking agent.
Yet, in recent years, be accompanied by the electronicss such as mobile telephone large screen hastily, corresponding, the signal of touch panel is drawn narrow and smallization of bond area that circuit is connected with flexible printed board, the bonding strength of caking agent is required also to require at least on an equal basis in the past or higher, so the further raising of the bonding strength of caking agent becomes the task of top priority.
In addition, follow the variation of electronic products, the base material of touch panel, wiring material be variation also, therefore also requires caking agent can tackle these various materials.
In addition, miniaturization, lightweight along with electronic machine, printed-wiring board (PWB) is from one side, the two-sided two-sided and multilayer development to high-density, the general silver conductive adhesive of the many employings of conducting of traditional double panel two sides circuit, but can there is transport phenomena due to silver-colored in a humid environment, thereby the reliability of lowering apparatus, so the ability of resisting to migration of electrically conducting adhesive also just seems particularly important.
Summary of the invention
Defect in view of above-mentioned prior art existence, the object of the invention is to propose a kind of electrically conducting adhesive composition and conductive adhesive film, adhesive composite is Halogen adhesive composite, can have all good features of bonding strength to various materials, thermotolerance, electroconductibility, anti-transport property, operability, conductive adhesive film can be suitable for substrate bonding.
Object of the present invention is achieved by the following technical programs:
A kind of electrically conducting adhesive composition, comprise following component: A. polyamide elastomer 15-55 weight part, B. acrylic elastomer 15-55 weight part, C. epoxy resin and/or resol 30-70 weight part, D. promote solidifying agent 0.001-1 weight part, E. conducting particles 30-100 weight part, wherein, the total amount of A, B and C is 100 weight parts.
In above-mentioned electrically conducting adhesive composition, preferred, in A. polyamide elastomer, disperseed above-mentioned B. acrylic elastomer and C. epoxy resin or/and resol forms phase separation structure.
In above-mentioned electrically conducting adhesive composition, preferably, described polyamide elastomer is solvent soluble polyether ester amides (PEEA), preferred, described polyamide elastomer be fusing point at 80 ℃-135 ℃, melt index is the solvent soluble polyether ester amides of 5g/10min-100g/10min (190 ℃, 21.18N).Elastomeric film-forming properties is very poor, makes its filming very difficult, and now by selecting the polyether ester amides of solvent soluble, film-forming properties is greatly improved, and filming just becomes and is easy to.And PEEA contributes to improve the bonding strength to the ITO (tin indium oxide) of polyimide, nickel-Jin plating Copper Foil, touch panel and silver paste etc.
In above-mentioned electrically conducting adhesive composition, preferred, described polyamide elastomer is amine value below 20, acid number below 20, imported comprise-NH
2and/or-the solvent soluble polyether ester amides of C00H functional group.By importing suitable functional group according to adhering objects such as metal, resins, can realize the further raising of bonding strength.Preferably import amine value below 20, the polyether ester amides resin of acid number below 20 is because if import functional group in the degree more than this, likely causes the bonding strength under moisture-proof environment, the unfavorable situations such as reduction of bonding reliability.
In above-mentioned electrically conducting adhesive composition, can use the commercially available product of PEEA: comprise TPAE series (solvent soluble grade, polyether ester amides type) polyether ester amides that T & K TOKA (strain) produces, but be not limited to this.Can select to comprise TPAE-12, TPAE-31, TPAE-32, the TPAE-826 of TPAE series, one or more combination in PA-200, PA-201 according to purposes.
In above-mentioned electrically conducting adhesive composition, preferred, described acrylic elastomer be bonding the high-molecular-weight propylene acid resin of carboxylic group (weight-average molecular weight of resin is conventionally 5,000 to 5,000, in 000 scope, preferably from 10,000 to 1,000,000.), wherein the weight percent content of carboxyl is 2%-6%.Acrylic resin is used in electrically conducting adhesive, can obtain the product with good especially anti-transport property, if resin-bonded carboxylic group, so when it is used in conductive adhesive agent, in being hot bonding process, tackiness agent can show good mobility, wetting property is better, thereby makes bonding finer and closely, closely sealed, and making does not have space on material surface, bonding strength is higher, and conductivity is more excellent.Preferably the weight percent content of carboxyl is 2%-6%, and Halogen electrically conducting adhesive composition will have better mobility and thermotolerance so, and caking agent also has better stability.
The optional commercially available product of above-mentioned acrylic elastomer, comprise that 03-72-23(contains carboxy acrylic resinoid, Kyodo Chemical Co., Ltd. manufacture), SG-708-6T, SG-700AS, WS-023(are containing carboxy acrylic resinoid, NagaseChemteX Corporation manufactures), but be not limited to this.
In above-mentioned electrically conducting adhesive composition, preferred, described epoxy resin is one or more the combination in dihydroxyphenyl propane, Bisphenol F type halogen-free epoxy resin and hydride thereof.
Halogen-free epoxy resin refers to and in molecular structure, does not comprise for example halogen atom of bromine, but in each molecule, preferably comprises the on average epoxy resin of at least 2 epoxy group(ing).In this epoxy resin, can also in skeleton, introduce siloxanes, carbamate, polyimide or polyamide structure etc.In addition, also can in skeleton, introduce phosphorus atom, sulphur atom or nitrogen-atoms etc.
In above-mentioned electrically conducting adhesive composition, preferably, described epoxy resin comprises one or more the combination in epoxy resin, the epoxy resin based on glycidyl ester, the epoxy resin based on glycidyl amine and the linear aliphatic family epoxy resin based on glycidyl ether; The described epoxy resin based on glycidyl ether comprises phenol novolac epoxy resins and/or cresylol novolac epoxy; The described epoxy resin based on glycidyl ester comprises hexahydrophthalic acid glycidyl esters and/or dimeracid glycidyl ester; The described epoxy resin based on glycidyl amine comprises triglycidyl group isocyanuric acid ester and/or four glycidyl group diaminodiphenyl-methane; Described linear aliphatic family epoxy resin comprises epoxidized polybutadiene and/or epoxidised soybean oil; Preferred, described epoxy resin comprises one or more the combination in bisphenol A epoxide resin, bisphenol F epoxy resin, phenol novolac epoxy resins and cresylol novolac epoxy.
Above-mentioned epoxy resin can be selected commercially available product: comprise trade(brand)name Epikote 828 (Japan Epoxy Resins Co., Ltd. manufacture, per molecule epoxy radix: 2), Epiclon 830S (Dainippon Ink and Chemicals, Incorporated manufactures, 2) and Epikote 517 (Japan Epoxy Resins Co. per molecule epoxy radix:, Ltd. manufacture, per molecule epoxy radix: 2), and weight-average molecular weight is 1000 or higher epoxy resin, comprise EOCN103S (Nippon Kayaku Co., Ltd. manufacture, per molecule epoxy radix: be at least 2) and YL7175-1000 (Japan Epoxy Resins Co., Ltd. manufacture, per molecule epoxy radix: 2), but be not limited to this.
In above-mentioned electrically conducting adhesive composition, preferred, described resol comprises resole and/or novolac resin.Resol can be used separately, or being used in combination with two or more different resins.In the present invention, by mixed phenol urea formaldehyde, make elastomerics component three-dimensional cross-linked, improve thermotolerance.Resol is the resin with tridimensional network, conventionally uses phenol and formaldehyde synthetic as raw material, and the molecular weight of described phenolic acid resin, softening temperature and OH equivalent have no particular limits;
Described resole prepares by following raw materials according: comprise phenol, and dihydroxyphenyl propane, p-tert-butylphenol, octyl phenol and other phenols, described other phenols comprises alkylphenol, p-phenyl phenol and cresols.
Above-mentioned resole can also be selected commercially available product, comprises the PR-1440M of Nikanol (Fu Du company (Fudow Corp.) production), Shonof
tM((the Showa High Polymer Co of Zhao He polymer company,. Ltd.) produce) CKM-1634, CKM-1282, CKM-983, CKM-912, the PR-14170 of Sumilite Resin (Sumitomo phenoplast company (Sumitomo Bakelite) production), the TD-2266 of Phenolite (large Japanese ink company (Danippon Ink) produces) and the GP-2900 of BKS Resin (Georgia-Pacific Ocean resin company (Georgia-Pacific Resin) produces), but be not limited to this.
Described novolac resin selects to comprise novolac resin CKM-2620 (production of Zhao He polymer company), HP-210 (production of Fu Du company), PR-50235A (production of Sumitomo phenoplast company) and TD-2645 (Japanese ink company produces greatly), but be not limited to this.
In above-mentioned electrically conducting adhesive composition, preferably, described promotion solidifying agent comprises one or more the combination in glyoxal ethyline, 1-Methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecyl imidazole, 2-phenyl-4-methylimidazole.
In above-mentioned electrically conducting adhesive composition, preferred, described conducting particles is the unsetting silver-plated copper powder conducting particles of median size 1 μ m-50 μ m.
The present invention adds the electroconductive particles such as metal powder, can give excellent electroconductibility.Electroconductive particle can be selected from the metal powders such as copper, silver, lead, zinc, iron, nickel, or on aforementioned metal powder or synthetic resin moulding compound or glass powder the particle of plated nickel, gold and silver, copper.Conventional conducting particles mostly is Au, Ag, the metal-powder such as Cu, Ni that resistivity is lower, and best additive is Au powder, but expensive.The price of Ag is lower, but can produce ELECTROMIGRATION PHENOMENON under direct current (DC) bias effect, causes short circuit, affects work-ing life.Cu, Ni low price can not produce migration under electric field, but the copper oxide film that easily oxidation formation one deck insulate in air has increased resistivity, and usage degree is very low.
And the granularity of conducting particles and shape also have a direct impact the conductivity of conductive resin and bonding strength.The conductive effect of the filler that granularity is large is better than the filler that granularity is little, but can cause the reduction of bonding strength simultaneously.Filler conductivity and the bonding strength of unsetting (sheet, dendroid, potato shape, needle-like or fibrous etc.) are better than Ball-type packing.
Therefore, preferred, use the silver-plated copper powder conducting particles of unsetting (sheet, dendroid, potato shape, needle-like or fibrous etc.), anti-copper oxidation effectiveness is good, and resistance stabilization and resistivity are low, compares silver-colored electrically conducting adhesive, cost decreases, and heat-proof aging is effective.
Silver-plated copper powder conducting particles is selected from commercially available CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces), 2L3(sheet, Fukuda Metal Foil & POwder Co., Ltd. produces), ACAX-2(dendroid, Mitsu Mining & Smelting Co., Ltd produces), ACAX-3(dendroid, Mitsu Mining & Smelting Co., Ltd produces), but be not limited to this.Consumption can be according to the purposes adjustment of electrically conducting adhesive composition.
In above-mentioned electrically conducting adhesive composition, preferred, said composition also comprises solvent, the 10wt%-50wt% that the solid component content in composition is the composition solution that uses dissolution with solvents and obtain; Described solvent is one or more nitrogen class or the amide solvent of combination comprising in acetone, butanone, methyl ethyl ketone, N-Methyl pyrrolidone, hexane, heptane, decane, toluene, dimethylbenzene, hexanaphthene and solvent oil, and/or isophorone.The consumption of solvent is to make the solid component concentration of adhesive composite reach 10-50wt%.When solid component concentration is less than 10wt%, can not guarantee coating thickness, when being greater than 50wt%, it is too high that viscosity becomes, printing difficulty.
In above-mentioned electrically conducting adhesive composition, preferred, described solvent is methyl ethyl ketone.
In adhesive composite of the present invention, can further add as required other compositions that use in adhesive composite, i.e. cementability imparting agent (tackifier), stablizer, oxidation inhibitor, filler, toughener, pigment, defoamer etc.
Adhesive composite of the present invention is by coordinating adhesive composite component to disperse to prepare with mixing roll.
The present invention also provides a kind of use conductive adhesive film that above-mentioned electrically conducting adhesive composition prepares.
Above-mentioned conductive adhesive film is by adhesive composite being coated on the supports such as interleaving paper to become the thickness of regulation, after dry, from this support, peel off and obtain: by the Halogen electrically conducting adhesive composition of above-mentioned 10-50wt% solid component concentration, use the coating equipments such as coating machine, be coated in uniformly the surface of the supports such as interleaving paper or stripping film, dry through drying plants such as baking ovens, 80 ℃-160 ℃ of drying temperatures, time of drying 2-8 minute, except desolventizing and form the Halogen electrically conducting adhesive composition layer of semicure state, Halogen electrically conducting adhesive composition layer is peeled off from supports such as interleaving paper or stripping films, obtain Halogen conductive adhesive film.
The thickness of Halogen conductive adhesive film can suitably be selected according to purposes, is generally 10 μ m-60 μ m.
Outstanding effect of the present invention is:
By adopting 2 kinds of special thermoplastic elastomers, the conducting particles of epoxy resin and/or resol and special tectonic can access all good electrically conducting adhesive and conductive adhesive films of bonding strength to various materials, thermotolerance, electroconductibility, anti-transport property, operability.
Accompanying drawing explanation
Fig. 1 is the structural representation front view of the sample of adhesive film bonding FPC and PTF;
Fig. 2 is the structural representation side-view of the sample of adhesive film bonding FPC and PTF, is also the structural representation of the sample of 90 degree stripping strengths mensuration;
Fig. 3 is the structural representation of the sample of the adhesive film bonding FPC that uses of resistance measurement and PTF.
Embodiment
Below just accompanying drawing in conjunction with the embodiments, is described in further detail the specific embodiment of the present invention, so that technical solution of the present invention is easier to understand, grasp, but the present invention is not limited thereto.Experimental technique described in following embodiment, if no special instructions, is ordinary method; Described reagent and material, if no special instructions, all can obtain from commercial channels.
Embodiment 1
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 15 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 15 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 50 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 20 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.5 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 50 weight parts; Solvent methyl ethyl ketone (MEK) 225 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 2
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 55 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 15 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 30 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.4 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 100 weight parts; Solvent methyl ethyl ketone (MEK) 300 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 3
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 15 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 55 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 30 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.05 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 40 weight parts; Solvent methyl ethyl ketone (MEK) 210 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 4
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 50 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 20 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 30 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.1 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 70 weight parts; Solvent methyl ethyl ketone (MEK) 255 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 5
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 20 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 40 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 40 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.15 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 80 weight parts; Solvent methyl ethyl ketone (MEK) 270 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 6
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 25 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 25 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 25 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 25 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Embodiment 7
The present embodiment provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 20 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 20 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 30 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 30 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.3 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 30 weight parts; Solvent methyl ethyl ketone (MEK) 195 weight parts.
Within under the condition that the electrically conducting adhesive composition of the present embodiment is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 1
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 50 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 25 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 25 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 2
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 50 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 25 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 25 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 3
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 45 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 40 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 15 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: Cu-HWQ5 μ m(is spherical, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 4
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 45 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 40 weight parts; Resol: CKM-1282(Japan Zhao He polymer company produces) 15 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 5
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: in weight part, and polyamide elastomer: TPAE-32 (the T & K TOKA of Co., Ltd. production) 20 weight parts; Acrylic elastomer: SG-708-6T(is containing carboxy acrylic resinoid, and NagaseChemteX Corporation manufactures production) 20 weight parts; Epoxy resin: Epikote 828 (Japan Epoxy Resins Co., Ltd. manufactures, per molecule epoxy radix: 2) 60 weight parts; Promotor: 2E4MZ(Japan four countries change into Co., Ltd. and produce) 0.2 weight part; Conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 10 weight parts; Solvent methyl ethyl ketone (MEK) 165 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
Comparative example 6
This comparative example provides a kind of electrically conducting adhesive composition, comprises following component: chloroprene class caking agent 100 weight parts, and conducting particles: CE-1110(dendroid, Fukuda Metal Foil & POwder Co., Ltd. produces) 60 weight parts; Solvent methyl ethyl ketone (MEK) 240 weight parts.
Within under the condition that the electrically conducting adhesive composition of this comparative example is is 100rpm by planet mixing roll at room temperature, rotating speed mixing 3 hours, prepare.
By embodiment 1-7, the electrically conducting adhesive composition that comparative example 1-6 obtains is made conductive adhesive film: then measure its contact resistance, 90 degree stripping strengths, thermotolerance, anti-migrate attribute, punching operation, testing method is with reference to patent CN201080001113.3.Result is as shown in table 1.
Its method of preparing conductive adhesive film is as follows:
By above-mentioned Halogen electrically conducting adhesive composition, use the coating equipments such as coating machine, be coated in uniformly the surface of the supports such as interleaving paper or stripping film, dry through drying plants such as baking ovens, 120 ℃ of drying temperatures, 4 minutes time of drying, except desolventizing and form the Halogen electrically conducting adhesive composition layer of semicure state, Halogen electrically conducting adhesive composition layer is peeled off from supports such as interleaving paper or stripping films, obtained Halogen conductive adhesive film.
Wherein, for embodiment 2,4,6 and comparative example 1,3,5, adhesive composite is coated with into the film of 40 μ m, for embodiment 1,3,5,7 and comparative example 2,4,6, adhesive composite is coated with into adhesive film and this adhesive film is placed between flexible printing substrate (FPC) and polymer thick film substrate (PTF), (number in the figure 1 is flexible printing substrate as depicted in figs. 1 and 2, label 2 is polymer thick film substrate, label 3 is adhesive film), at 150 ℃-170 ℃ of crimping temperature, pressure 40kgf/cm
230min pressurizes under condition.Described flexible printing substrate is manufactured by ニ Star カ Application industry (strain), and it is configured to: polyimide 25 μ m/ Copper Foil 18 μ m, and electrode plating Ni3 μ m/Au0.3 μ m, pitch is 3mm, electrode wide (L) is 10mm; Described polymer thick film substrate is manufactured by east beautiful (strain), and it is configured to: polyethylene terephthalate (PET) 188 μ m, and silver paste 10 μ m are coated with resist on silver paste, and pitch is 3mm.
Its method of measuring 90 degree stripping strengths is as follows: as shown in Figure 2, with tensile testing machine (ミ ネ べ ア (strain) manufactures, PT-200N), the maximum value when being determined at draw speed 50mm/min, direction of delaminate 90 degree and peeling off, rupture.
Its method of measuring contact resistance is as follows: as shown in Figure 3, between the terminal in FPC/PTF test with the FPC end of sample, with low ohmmeter, (HI OKI manufactures, direct current mode, 3227 ミ リ オ ー system Ha イ テ ス タ), measure respectively the contact resistance between a-b, b-c, c-d, obtain mean value.
It is as follows that it measures stable on heating method: in 80 ℃ of maintenances, after 1000 hours, measure 90 degree stripping strengths.If be less than 5N/cm, be designated as *, for sample more than 5N/cm, further at 105 ℃, keep, after 1000 hours, similarly carrying out 90 degree stripping tests, more than 5N/cm, be designated as zero if, if be less than 5N/cm, be designated as △.
Its method of measuring anti-transport property is as follows: use sample in 60 ℃ FPC/PTF test as shown in Figure 3,95%RH, kept after 1000 hours, measured contact resistance.If resistance change rate, below 50%, is designated as zero, if resistance change rate, between 50%-100%, is designated as △, if resistance change rate more than 100%, be designated as *.
Its method of measuring punching operation is as follows: and use contact heating type stamping machine ((strain) bridge is made manufacturing, HBM-10), and 150 ℃-170 ℃ of crimping temperature, pressure 40kgf/cm
2pressurization 30min carries out crimping, visual, observes resin flows, space, bubble etc., by following standard, evaluates.Zero: punching operation is good, △: common, *: bad.
From table 1, the bonding strength of conductive adhesive film, thermotolerance, electroconductibility, anti-transport property, punching operation are all good.
As can be seen here, the present invention is by adopting 2 kinds of special thermoplastic elastomers, and the conducting particles of epoxy resin and/or resol and special tectonic can access all good electrically conducting adhesive and conductive adhesive films of bonding strength to various materials, thermotolerance, electroconductibility, anti-transport property, operability.
Table 1
。
Claims (10)
1. an electrically conducting adhesive composition, comprise following component: A. polyamide elastomer 15-55 weight part, B. acrylic elastomer 15-55 weight part, C. epoxy resin and/or resol 30-70 weight part, D. promote solidifying agent 0.001-1 weight part, E. conducting particles 30-100 weight part, wherein, the total amount of A, B and C is 100 weight parts.
2. electrically conducting adhesive composition according to claim 1, it is characterized in that: described polyamide elastomer is solvent soluble polyether ester amides, preferably, described polyamide elastomer be fusing point at 80 ℃-135 ℃, the solvent soluble polyether ester amides that melt index is 5g/10min-100g/10min.
3. electrically conducting adhesive composition according to claim 2, is characterized in that: described polyamide elastomer is amine value below 20, acid number below 20, imported comprise-NH
2and/or-the solvent soluble polyether ester amides of COOH functional group.
4. electrically conducting adhesive composition according to claim 1, it is characterized in that: described acrylic elastomer the has been bonding high-molecular-weight propylene acid resin of carboxylic group, wherein the weight percent content of carboxyl is 2%-6%, the weight-average molecular weight of high-molecular-weight propylene acid resin is generally 5000 to 5000000, and preferably from 10000 to 1000000.
5. electrically conducting adhesive composition according to claim 1, is characterized in that: described epoxy resin is one or more the combination in dihydroxyphenyl propane, Bisphenol F type halogen-free epoxy resin and hydride thereof; Preferably, described epoxy resin comprises one or more the combination in epoxy resin, the epoxy resin based on glycidyl ester, the epoxy resin based on glycidyl amine and the linear aliphatic family epoxy resin based on glycidyl ether; The described epoxy resin based on glycidyl ether comprises phenol novolac epoxy resins and/or cresylol novolac epoxy; The described epoxy resin based on glycidyl ester comprises hexahydrophthalic acid glycidyl esters and/or dimeracid glycidyl ester; The described epoxy resin based on glycidyl amine comprises triglycidyl group isocyanuric acid ester and/or four glycidyl group diaminodiphenyl-methane; Described linear aliphatic family epoxy resin comprises epoxidized polybutadiene and/or epoxidised soybean oil; Preferred, described epoxy resin comprises one or more the combination in bisphenol A epoxide resin, bisphenol F epoxy resin, phenol novolac epoxy resins and cresylol novolac epoxy.
6. electrically conducting adhesive composition according to claim 1, it is characterized in that: described resol comprises resole and/or novolac resin, preferably, the raw material of described resole comprises phenol, dihydroxyphenyl propane, p-tert-butylphenol, octyl phenol and other phenols, described other phenols comprises alkylphenol, p-phenyl phenol and cresols.
7. electrically conducting adhesive composition according to claim 1, is characterized in that: described promotion solidifying agent comprises one or more the combination in glyoxal ethyline, 1-Methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecyl imidazole and 2-phenyl-4-methylimidazole.
8. electrically conducting adhesive composition according to claim 1, is characterized in that: described conducting particles is the unsetting silver-plated copper powder conducting particles of median size 1 μ m-50 μ m.
9. electrically conducting adhesive composition according to claim 1, is characterized in that: said composition also comprises solvent, the 10wt%-50wt% that the solid component content in composition is the composition solution that uses dissolution with solvents and obtain; Described solvent is one or more nitrogen class or the amide solvent of combination comprising in acetone, butanone, methyl ethyl ketone, N-Methyl pyrrolidone, hexane, heptane, decane, toluene, dimethylbenzene, hexanaphthene and solvent oil, and/or isophorone.
10. the conductive adhesive film preparing with the electrically conducting adhesive composition described in claim 1-9 any one.
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-
2014
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Application publication date: 20140716 |