CN103926988B - Electronic installation - Google Patents
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- CN103926988B CN103926988B CN201310013110.7A CN201310013110A CN103926988B CN 103926988 B CN103926988 B CN 103926988B CN 201310013110 A CN201310013110 A CN 201310013110A CN 103926988 B CN103926988 B CN 103926988B
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- heat pipe
- heat
- housing
- transfer arm
- electronic installation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of electronic installation, including a first housing and a second housing.The first housing includes one first thermal source, one first heat pipe and a heat transfer arm, and the first heat pipe is connected to heat transfer arm, and the first heat pipe is connected to the first thermal source with one of the arm that conducts heat.The second housing is articulated in the first housing, and the second housing includes one second heat pipe, and the second heat pipe is pivotally connected and is thermally coupled in heat transfer arm.There is a cooling fluid respectively in first heat pipe, heat transfer arm and the second heat pipe.
Description
Technical field
The invention relates to a kind of electronic installation, and in particular to a kind of radiating effect preferably electronic installation.
Background technology
With progress scientific and technological now, because the function of notebook computer is increasingly healthy and strong, and its volume is less and less also just
In carrying, therefore the little by little market mainstream as consumption electronic products.In order to reduce the thickness of notebook computer, part pen
Remember the CPU of this computer low wattage of collocation and using the design of fan-free.The design of fan-free is all mostly by center
Heat is reached lower casing by the thermal source of processing unit by way of conduction, and the surface of lower casing is again by radiation and the side of convection current
Formula is with heat extraction.However, being limited to the surface area and material of lower casing, heat is more difficult to be excluded completely, and causes that lower body occurs
The situation of overheat, in some instances it may even be possible to cause system in case of system halt.
At present, also have notebook computer by the heat produced by CPU conduct to upper machine body with
Increase area of dissipation, but due to being connected in the way of being pivotally connected between the upper machine body and lower body of notebook computer, upper lower body
Heat pipe can afford rotation stress and influence its service life.Additionally, such notebook computer would generally use a pump to cooling
Fluid convection current in the heat pipe of upper lower body, rapidly to take away heat.However, this design can increase the thickness of notebook computer
And produce noise.
The content of the invention
The present invention provides a kind of electronic installation, and it has preferably radiating effect.
The present invention proposes a kind of electronic installation, including a first housing and a second housing.The first housing includes one first
Thermal source, one first heat pipe and a heat transfer arm, the first heat pipe are connected to heat transfer arm, and the first heat pipe connects with one of the arm that conducts heat
It is connected to the first thermal source.The second housing is articulated in the first housing, and the second housing includes one second heat pipe, the pivot joint of the second heat pipe and hot coupling
Together in heat transfer arm.There is a cooling fluid respectively in first heat pipe, heat transfer arm and the second heat pipe.
Based on above-mentioned, electronic installation of the invention is connected to the first thermal source, heat transfer arm heat by the first heat pipe or heat transfer arm
The first heat pipe and the second heat pipe are coupled in, the heat produced by the first thermal source is dispersed to the first housing and the second housing.By
Connected in the way of being pivotally connected between the second heat pipe and heat transfer arm, when the second housing is rotated relative to the first housing, it is possible to decrease
Second heat pipe is influenceed by rotating stress.Also, heat transfer arm carries out heat exchange also by cooling fluid, it is possible to provide preferably dissipate
Thermal effect.
It is that features described above of the invention and advantage can be become apparent, special embodiment below, and it is detailed to coordinate accompanying drawing to make
Carefully it is described as follows.
Brief description of the drawings
Fig. 1 is a kind of schematic perspective view of electronic installation of one embodiment of the invention；
Fig. 2 is the schematic perspective view of first heat pipe, heat transfer arm and the second heat pipe of the electronic installation of Fig. 1；
Fig. 3 is the partial cutaway schematic of Fig. 2；
Fig. 4 is the second heat pipe of the electronic installation of Fig. 1 relative to the schematic diagram that heat transfer arm is rotated；
Fig. 5 is a kind of front schematic view of electronic installation of another embodiment of the present invention；
Fig. 6 is the schematic perspective view of the electronic installation of Fig. 5；
Fig. 7 is the side schematic view of the electronic installation of Fig. 5.
Description of reference numerals
10：Heat-conducting medium；
100、200：Electronic installation；
110、210：The first housing；
112：First thermal source；
114：First heat pipe；
116、216：Heat transfer arm；
116a：Storage tank；
119：First casing；
120、220：The second housing；
122、222：Second heat pipe；
124：Secondary Heat Source；
126：Second casing；
128、218：Pivot.
Specific embodiment
Fig. 1 is a kind of schematic perspective view of electronic installation of one embodiment of the invention.Fig. 1 is referred to, the present embodiment
Electronic installation 100 includes a first housing 110 and a second housing 120.In the present embodiment, electronic installation 100 is notebook
Computer, the first housing 110 is the main frame of notebook computer, and the second housing 120 is the screen of notebook computer, but electronic installation
100th, the first housing 110 is not limited system with the species of the second housing 120.
Fig. 2 is the schematic perspective view of first heat pipe, heat transfer arm and the second heat pipe of the electronic installation of Fig. 1.Fig. 3 is Fig. 2
Partial cutaway schematic.Fig. 1 to Fig. 3 is referred to, the first housing 110 includes that one first thermal source 112, one first heat pipe 114, are passed
The casing 119 of hot arm 116 and 1 first.First thermal source 112, the first heat pipe 114 and heat transfer arm 116 are located in the first casing 119.
In the present embodiment, the first thermal source 112 includes a CPU, but in other embodiments, the first thermal source 112 is alternatively to be deposited
Memory modules or hard disk etc..Heat transfer arm 116 is connected to the first thermal source 112, and the first heat pipe 114 is connected to heat transfer arm 116 and heat
It is coupled in the first casing 119.In other embodiments, the first heat pipe 114 is may also be to be connected with the first thermal source 112 with hot by first
Heat produced by source 112 takes away.
The second housing 120 includes one second heat pipe 122, a Secondary Heat Source 124, one second casing 126 and a pivot 128.
The first housing 110 is articulated on the pivot 128 of the second housing 120.Second heat pipe 122 is located at second machine with Secondary Heat Source 124
In shell 126.Second heat pipe 122 is pivotally connected and is thermally coupled in heat transfer arm 116.In the present embodiment, Secondary Heat Source 124 is the light of screen
Source (LED light bar), in other embodiments, chipset (the LED driver of Secondary Heat Source 124 or screen
Chipset), the species of Secondary Heat Source 124 is not limited system.
As shown in figure 1, in the present embodiment, the articulated section of the second heat pipe 122 and heat transfer arm 116 (namely the second heat pipe
122 pivot) set along identical axis with the pivot 128 of the second housing 120.Can be made by such configuration mode
The second housing 120 of the present embodiment is mainly relative to the action that the first housing 110 is rotated and is responsible for by pivot 128, that is,
Say, when the second housing 120 is rotated relative to the first housing 110, main force side is still pivot 128 itself, conduct heat arm 116 and the
Tangential stress caused during rotation can not be subjected between two heat pipes 122.Therefore, can effectively be lifted the second heat pipe 122 with
Reliability and pivot life-span between heat transfer arm 116.
In the present embodiment, heat transfer arm 116 is a closed cavity.The material of arm 116 of conducting heat can be metal or plastics,
Fill cooling fluid to lower the temperature in the inside of heat transfer arm 116.If the material of the arm 116 that conducts heat is metal, the inside structure of the arm 116 that conducts heat can
Such as hot plate, internal layer has capillary structure, its collocation cooling fluid can be water, by water be heated vaporization and condensed water along hair
Fine texture returns to form circulation.If the material of the arm 116 that conducts heat is plastics, cooling fluid can be ether or hydrofluoroether
(HFEs), hydrofluoroether is, for example, the Novec liquid that 3M companies are produced on the market, and it has low boiling, low capillary power, high enthalpy
Characteristic, heat is taken away by two phase changes.Certainly, the material of heat transfer arm 116 and the species of cooling fluid be not with above-mentioned
It is limitation.
Additionally, as shown in Fig. 2 first heat pipe 114 of the present embodiment and the second heat pipe 122 are respectively an enclosed ring-type
Cooling fluid is respectively filled in body, the first heat pipe 114 and the second heat pipe 122, when being heated, following for two-phase fluid just can be produced
Ring.The species of the inside structure and cooling fluid of the first heat pipe 114 and the second heat pipe 122 can as described above, but not with
This is limitation.Also, in other embodiments, the first heat pipe 114 and the second heat pipe 122 or straight tube, the first heat pipe 114 with
The shape of the second heat pipe 122 is not limited system.
In addition, in order that cooling fluid is circulated in the first heat pipe 114 and the second heat pipe 122 along specific direction, it is cold to avoid
But fluid with gasification after gas in the first heat pipe 114 and the second heat pipe 122 mixed flow and reduce radiating effect.In the present embodiment
In, the first heat pipe 114 has a different calibers at the two ends from the heat transfer contact position of arm 116, and the second heat pipe 122 with heat transfer
Two ends at the thermal coupling of arm 116 also have different calibers.
Specifically, in the present embodiment, have respectively with the pipe diameter size of the second heat pipe 122 by the first heat pipe 114
Change, law is made great efforts according to white, has larger pressure at Large Diameter Pipeline, and causes cooling fluid toward pressure smaller (pipe with small pipe diameter)
Direction is flowed, therefore, cooling fluid just can automatically form circulation without extra in the first heat pipe 114 with the second heat pipe 122
Use pump.Consequently, it is possible to the bulk shape of electronic installation 100 can be more frivolous, the generation of noise can be also avoided.
Fig. 3 is referred to, in the present embodiment, heat transfer arm 116 includes a storage tank 116a, a part for the second heat pipe 122
Positioned at storage tank 116a.One heat-conducting medium 10 is filled between this part of storage tank 116a and the second heat pipe 122.Heat-conducting medium
10 can be thermal grease or oil, but the species of heat-conducting medium 10 is not limited system.
In the present embodiment, the heat transfer produced by the first thermal source 112 is to the arm 116 that conducts heat then past through the arm 116 that conducts heat
First heat pipe 114 is passed with the second heat pipe 122 and gone, because the first heat pipe 114 is thermally coupled in the first casing 119, in the first heat pipe 114
On heat will reach the first casing 119 and be discharged in the way of radiating with convection current, its position is probably bottom surface or keyboard
Place etc..
Also, because the second heat pipe 122 is thermally coupled in the second casing 126, the heat being transferred on the second heat pipe 122 also can
The second casing 126 is transferred to, then heat is discharged in the way of radiating with convection current by the second casing 126.The electronics of the present embodiment
Device 100 carries out the radiating of large area by using the first casing 119 and the second casing 126, with the situation of fan-free
Good radiating effect can still be kept.Certainly, the present embodiment can also be applied to the device of fan, to strengthen integral heat sink effect
Really.
Further, since the LCD screen of high-res turns into current main flow, the LCD screen of high-res along with compared with
Power consumption high, will certainly cause LCD screen temperature in itself to rise, and the life-span of LCD screen can be with temperature rising
Successively decrease.In general, LCD screen (namely position of Secondary Heat Source 124) at chipset or light source might have it is higher
Temperature, therefore the two positions are easier to heterochromatic phenomenon occur.In the present embodiment, can be by the path of the second heat pipe 122
By Secondary Heat Source 124, the heat produced by Secondary Heat Source 124 increases screen life to reduce screen temperature in itself
And reduce the generation of bright spot.
Fig. 4 is the second heat pipe of the electronic installation of Fig. 1 relative to the schematic diagram that heat transfer arm is rotated.As can be seen from Figure 4, make
When the LCD screen of electronic installation 100 is closed to main frame by user, two heat pipes remain to each work independently and take away heat.
Fig. 5 is a kind of front schematic view of electronic installation of another embodiment of the present invention.Fig. 6 is the electronic installation of Fig. 5
Schematic perspective view.Fig. 7 is the side schematic view of the electronic installation of Fig. 5.Refer to Fig. 5 to Fig. 7, the electronic installation 200 of Fig. 5 with
The Main Differences of the electronic installation 100 of Fig. 1 are that the pivot 218 of the electronic installation 200 of Fig. 5 is located at the first housing 210, second
The pivot 218 that body 220 is articulated in the first housing 210 is rotated with relative to the first housing 210.That is, in Figure 5, pivot
Axle 218 is located at relatively low position.
In order that the second housing 220 is still to be responsible for by pivot 218 relative to the action that the first housing 210 is rotated, and cause
Tangential stress caused during rotation can not be subjected between the heat transfer heat pipe 222 of arm 216 and second, and extends the second heat pipe 222
With the rotation life-span between heat transfer arm 216.In the present embodiment, pivot 218 and the pivot of the second heat pipe 222 are still same
Center, that is, in Figure 5 the pivot of second heat pipe 122 of the pivot of the second heat pipe 222 compared to Fig. 1 be located at compared with
Low position.Because the position of pivot 218 changes, the heat transfer arm 216 and the external form of the second heat pipe 222 of the present embodiment also change therewith
Become.But above-mentioned configuration has no effect on the electronic installation 200 of the present embodiment such as the efficiency and characteristic that above describe, that is to say, that this
The electronic installation 200 of embodiment can also provide good radiating effect and can avoid noise.
In sum, electronic installation of the invention is connected to the first thermal source, heat transfer arm heat by the first heat pipe or heat transfer arm
The first heat pipe and the second heat pipe are coupled in, the heat produced by the first thermal source is dispersed to the first housing and the second housing.By
Connected in the way of being pivotally connected between the second heat pipe and heat transfer arm and the pivot between the first housing and the second housing is coaxial, when
When the second housing is rotated relative to the first housing, undertaking both rotations by the pivot between the first housing and the second housing should
Power, and reduce the second heat pipe is influenceed by rotating stress.Also, heat transfer arm carries out heat exchange also by cooling fluid, can carry
For preferably radiating effect.Additionally, the first heat pipe and the second heat pipe have different pipes from the two ends at heat transfer arm thermal coupling
Footpath, position cooling fluid in the inner is circulated by white effort law, without additionally pump is used, is effectively reached power saving and is reduced
Effect of noise.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
Pipe has been described in detail with reference to foregoing embodiments to the present invention, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (8)
1. a kind of electronic installation, it is characterised in that including：
One first housing, including one first thermal source, one first heat pipe and a heat transfer arm, first heat pipe are connected to the heat transfer arm,
And one of first heat pipe and the heat transfer arm are connected to first thermal source；And
One second housing, is articulated in the first housing, and the second housing includes one second heat pipe, second heat pipe pivot joint and hot coupling
Together in the heat transfer arm, wherein：
Have a cooling fluid, and the heat transfer arm in first heat pipe, the heat transfer arm and second heat pipe respectively has this cold in
But a closed cavity of fluid, first heat pipe has a different calibers at the two ends from the heat transfer arm contact position, and this
Two heat pipes have different calibers from the two ends at the heat transfer arm thermal coupling, and first heat pipe is respectively one with second heat pipe
Ring-type body.
2. electronic installation according to claim 1, it is characterised in that the first housing or the second housing include a pivot
Axle, the heat transfer arm includes a storage tank, and the part of second heat pipe is located at the storage tank, the part of second heat pipe with should
Pivot is coaxial.
3. electronic installation according to claim 2, it is characterised in that a heat conducting medium filling in the storage tank and this second
Between the part of heat pipe.
4. electronic installation according to claim 1, it is characterised in that the cooling fluid includes water, and first heat pipe, should
Heat transfer arm and second heat pipe include a capillary structure respectively.
5. electronic installation according to claim 1, it is characterised in that the cooling fluid includes ether or hydrofluoroether.
6. electronic installation according to claim 1, it is characterised in that the second housing also includes a Secondary Heat Source, and should
Second heat pipe contact is in the Secondary Heat Source.
7. electronic installation according to claim 6, it is characterised in that first thermal source includes a CPU, should
Secondary Heat Source includes a chipset or a light source.
8. electronic installation according to claim 1, it is characterised in that the first housing and the second housing include respectively
First casing and one second casing, first heat pipe are thermally coupled in first casing and second machine respectively with second heat pipe
Shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310013110.7A CN103926988B (en) | 2013-01-14 | 2013-01-14 | Electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310013110.7A CN103926988B (en) | 2013-01-14 | 2013-01-14 | Electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103926988A CN103926988A (en) | 2014-07-16 |
| CN103926988B true CN103926988B (en) | 2017-06-30 |
Family
ID=51145243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310013110.7A Active CN103926988B (en) | 2013-01-14 | 2013-01-14 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103926988B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107643815A (en) * | 2017-11-10 | 2018-01-30 | 山东超越数控电子股份有限公司 | A kind of fan-free laptop heat-dissipation system |
| CN110134214A (en) * | 2019-05-29 | 2019-08-16 | 英业达科技有限公司 | Portable electronic devices |
| CN111273754A (en) * | 2020-03-25 | 2020-06-12 | 合肥联宝信息技术有限公司 | Heat dissipation component |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718282A (en) * | 1995-08-30 | 1998-02-17 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
| US5847925A (en) * | 1997-08-12 | 1998-12-08 | Compaq Computer Corporation | System and method for transferring heat between movable portions of a computer |
| US6493226B1 (en) * | 1999-11-11 | 2002-12-10 | International Business Machines Corporation | Radiation structure for electronic equipment and computer apparatus |
| CN1455953A (en) * | 2001-11-12 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN2735423Y (en) * | 2004-06-22 | 2005-10-19 | 上海环达计算机科技有限公司 | Radiating structure of notebook computer |
| CN1936769A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Note-book type computer |
-
2013
- 2013-01-14 CN CN201310013110.7A patent/CN103926988B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718282A (en) * | 1995-08-30 | 1998-02-17 | Intel Corporation | Heat pipe exchanger system for cooling a hinged computing device |
| US5847925A (en) * | 1997-08-12 | 1998-12-08 | Compaq Computer Corporation | System and method for transferring heat between movable portions of a computer |
| US6493226B1 (en) * | 1999-11-11 | 2002-12-10 | International Business Machines Corporation | Radiation structure for electronic equipment and computer apparatus |
| CN1455953A (en) * | 2001-11-12 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN2735423Y (en) * | 2004-06-22 | 2005-10-19 | 上海环达计算机科技有限公司 | Radiating structure of notebook computer |
| CN1936769A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Note-book type computer |
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| Publication number | Publication date |
|---|---|
| CN103926988A (en) | 2014-07-16 |
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