CN207096911U - A kind of computer radiating shell - Google Patents
A kind of computer radiating shell Download PDFInfo
- Publication number
- CN207096911U CN207096911U CN201720727088.6U CN201720727088U CN207096911U CN 207096911 U CN207096911 U CN 207096911U CN 201720727088 U CN201720727088 U CN 201720727088U CN 207096911 U CN207096911 U CN 207096911U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circulation pipe
- enclosure body
- radiator
- dissipation tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of computer radiating shell,Including enclosure body and CPU processor,The CPU processor is located at the inner side of enclosure body,And CPU processor is fixedly connected in enclosure body,The upper surface of the CPU processor is connected with semiconductor refrigerating block,The upper surface of the semiconductor refrigerating block is connected with radiator,The upper surface of the radiator is connected with heat dissipation tank,The inside of the heat dissipation tank is provided with circulation pipe,Coolant is provided between the circulation pipe and heat dissipation tank,One end of the circulation pipe is connected with water circulating pump,The other end of the circulation pipe is communicated with water tank,The water tank is fixed on the inwall of enclosure body,The upper surface of the heat dissipation tank is connected with ventilation shaft,The inside of the ventilation shaft is provided with cooling fan,The utility model is reasonable in design,It is simple in construction,Perfect heat-dissipating,Efficiency high,It is worth promoting.
Description
Technical field
The utility model belongs to field of computer technology, and in particular to a kind of computer radiating shell.
Background technology
With extensive use of the computer in scientific research and engineering field, the data that can be handled machine at present and operation
Rate request more and more higher, this causes the integrated level of chip to double.From the Intel first generation microprocessors released and miniature calculating
Machine, its integrated level are about 2000 pipes/piece, and to second generation microprocessor and microcomputer, integrated level reaches 5000 pipes/piece, and one
Until in March, 1993, Intel Company formally releases that the 5th generation microprocessor is integrated to redeem oneself through being up to 3,100,000 pipes/piece.Transistor
Number dramatically increases the increase that directly results in chip power and heat dissipation capacity.And existing CPU radiating modes mainly pass through
Radiator fan is radiated, dependence be monophasic fluid forced-convection heat transfer method, these methods are only used for heat flow density
No more than 10W/cm2CPU radiating, at present it is impossible to meet the needs of cpu chip steady operation, in particular with inside
The reduction of heat-dissipating space, conventional radiating mode can not be used, therefore, it is above-mentioned to solve to invent a kind of computer radiating shell
Problem is necessary.
Utility model content
The purpose of this utility model is to provide a kind of computer radiating shell, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：A kind of computer radiating shell, including housing
Body and CPU processor, the CPU processor is located at the inner side of enclosure body, and CPU processor is fixedly connected on enclosure body
On, the upper surface of the CPU processor is connected with semiconductor refrigerating block, and the upper surface of the semiconductor refrigerating block is connected with radiating
Device, the upper surface of the radiator are connected with heat dissipation tank, and the inside of the heat dissipation tank is provided with circulation pipe, the circulation pipe and radiating
Coolant is provided between case, one end of the circulation pipe is connected with water circulating pump, and the other end of the circulation pipe is communicated with water tank,
The water tank is fixed on the inwall of enclosure body, and the upper surface of the heat dissipation tank is connected with ventilation shaft, the ventilation shaft
Inside be provided with cooling fan.
Preferably, connected between the water circulating pump and water tank by connecting tube.
Preferably, the inner homogeneous of the radiator is provided with radiating fin, and the material of the radiating fin is metallic copper.
Preferably, the outer surface of the radiator and heat dissipation tank is pasted with graphite thermal layer.
Preferably, the circulation pipe is annular circulation pipe.
Preferably, the radiator is fixed on the inwall of enclosure body by welded post.
Technique effect of the present utility model and advantage：The computer radiating shell, by being set in the inside of enclosure body
Semiconductor refrigerating block, another side that can quickly by the heat transfer on CPU processor to semiconductor refrigerating block, semiconductor
The another side and radiator of cold-making block, the inside of radiator are provided with multiple radiating fins, and radiating fin transfers heat to radiating
In case, and the circulation pipe by being set in the inside of heat dissipation tank, the heat of a part can be taken in water tank, in heat dissipation tank
Upper surface set ventilation shaft and cooling fan, a part of heat can be taken out of enclosure body, the utility model design
Rationally, it is simple in construction, perfect heat-dissipating, efficiency high, it is worth promoting.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is cooling fan structural representation of the present utility model；
Fig. 3 is circulation pipe structural representation of the present utility model.
In figure：1 enclosure body, 2 CPU processors, 3 semiconductor refrigerating blocks, 4 radiators, 5 radiating fins, 6 heat dissipation tanks, 7
Coolant, 8 circulation pipes, 9 cooling fans, 10 ventilation shafts, 11 graphite thermal layers, 12 water circulating pumps, 13 water tanks, 14 welded posts.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model provides a kind of computer radiating shell as Figure 1-3, including at enclosure body 1 and CPU
Device 2 is managed, the CPU processor 2 is located at the inner side of enclosure body 1, and CPU processor 2 is fixedly connected in enclosure body 1, institute
The upper surface for stating CPU processor 2 is connected with semiconductor refrigerating block 3, and the upper surface of the semiconductor refrigerating block 3 is connected with radiator
4, the upper surface of the radiator 4 is connected with heat dissipation tank 6, and the inside of the heat dissipation tank 6 is provided with circulation pipe 8, the circulation pipe 8 with
Coolant 7 is provided between heat dissipation tank 6, one end of the circulation pipe 8 is connected with water circulating pump 12, the other end of the circulation pipe 8
Water tank 13 is communicated with, the water tank 13 is fixed on the inwall of enclosure body 1, and the upper surface of the heat dissipation tank 6 is connected with ventilation
Pipeline 10, the inside of the ventilation shaft 10 are provided with cooling fan 9.
Further, connected between the water circulating pump 12 and water tank 13 by connecting tube.
Further, the inner homogeneous of the radiator 4 is provided with radiating fin 5, and the material of the radiating fin 5 is metal
Copper.
Further, the outer surface of the radiator 4 and heat dissipation tank 6 is pasted with graphite thermal layer 11.
Further, the circulation pipe 8 is annular circulation pipe.
Further, the radiator 4 is fixed on by welded post 14 on the inwall of enclosure body 1.
Operation principle：The computer radiating shell, in use, passing through the semiconductor system set in the inside of enclosure body 1
Cold piece 3, another side that can quickly by the heat transfer on CPU processor 2 to semiconductor refrigerating block 3, semiconductor refrigerating block 3
Another side be connected with radiator 4, the inside of radiator 4 is provided with multiple radiating fins 5, and radiating fin 5 transfers heat to scattered
In hot tank 6, and the circulation pipe 8 by being set in the inside of heat dissipation tank 6, the heat of a part can be taken in water tank 13,
In the ventilation shaft 10 and cooling fan 9 that the upper surface of heat dissipation tank 6 is set, a part of heat can be taken out of enclosure body 1, should
Utility model is reasonable in design, simple in construction, perfect heat-dissipating, efficiency high, is worth promoting.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Progress equivalent substitution, all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc.,
It should be included within the scope of protection of the utility model.
Claims (6)
1. a kind of computer radiating shell, including enclosure body (1) and CPU processor (2), it is characterised in that：The CPU processing
Device (2) is located at the inner side of enclosure body (1), and CPU processor (2) is fixedly connected in enclosure body (1), the CPU processing
The upper surface of device (2) is connected with semiconductor refrigerating block (3), and the upper surface of the semiconductor refrigerating block (3) is connected with radiator
(4), the upper surface of the radiator (4) is connected with heat dissipation tank (6), and the inside of the heat dissipation tank (6) is provided with circulation pipe (8), institute
State and coolant (7) is provided between circulation pipe (8) and heat dissipation tank (6), one end of the circulation pipe (8) is connected with water circulating pump
(12), the other end of the circulation pipe (8) is communicated with water tank (13), and the water tank (13) is fixed on the inwall of enclosure body (1)
On, the upper surface of the heat dissipation tank (6) is connected with ventilation shaft (10), and the inside of the ventilation shaft (10) is provided with cooling fan
(9)。
A kind of 2. computer radiating shell according to claim 1, it is characterised in that：The water circulating pump (12) and water tank
(13) connected between by connecting tube.
A kind of 3. computer radiating shell according to claim 1, it is characterised in that：The inside of the radiator (4) is equal
Even to be provided with radiating fin (5), the material of the radiating fin (5) is metallic copper.
A kind of 4. computer radiating shell according to claim 1, it is characterised in that：The radiator (4) and heat dissipation tank
(6) outer surface is pasted with graphite thermal layer (11).
A kind of 5. computer radiating shell according to claim 1, it is characterised in that：The circulation pipe (8) is followed for annular
Endless tube.
A kind of 6. computer radiating shell according to claim 1, it is characterised in that：The radiator (4) passes through welding
Post (14) is fixed on the inwall of enclosure body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720727088.6U CN207096911U (en) | 2017-06-21 | 2017-06-21 | A kind of computer radiating shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720727088.6U CN207096911U (en) | 2017-06-21 | 2017-06-21 | A kind of computer radiating shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207096911U true CN207096911U (en) | 2018-03-13 |
Family
ID=61553049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720727088.6U Expired - Fee Related CN207096911U (en) | 2017-06-21 | 2017-06-21 | A kind of computer radiating shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207096911U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108897390A (en) * | 2018-06-25 | 2018-11-27 | 合肥利元杰信息科技有限公司 | A kind of main frame of radiating dustproof |
| CN110580090A (en) * | 2018-06-07 | 2019-12-17 | 湖南涉外经济学院 | Automatic change computer constant temperature equipment |
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| CN112128562A (en) * | 2020-10-12 | 2020-12-25 | 罗威 | Computer strutting arrangement |
-
2017
- 2017-06-21 CN CN201720727088.6U patent/CN207096911U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110580090A (en) * | 2018-06-07 | 2019-12-17 | 湖南涉外经济学院 | Automatic change computer constant temperature equipment |
| CN108897390A (en) * | 2018-06-25 | 2018-11-27 | 合肥利元杰信息科技有限公司 | A kind of main frame of radiating dustproof |
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| CN111447809B (en) * | 2020-05-13 | 2023-10-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| CN112128562A (en) * | 2020-10-12 | 2020-12-25 | 罗威 | Computer strutting arrangement |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207096911U (en) | A kind of computer radiating shell | |
| WO2017036283A1 (en) | Semiconductor refrigerating device for circulation cooling system | |
| TW201223382A (en) | A cabinet of server | |
| CN206193668U (en) | High -efficient heat abstractor of CPU module | |
| US11137175B2 (en) | Composite water-cooling radiator structure | |
| CN108153401A (en) | A kind of computer server radiator | |
| CN107678524A (en) | A kind of chip-cooling system | |
| JP3068892U (en) | CPU heat dissipation device | |
| CN108827003A (en) | A kind of electric stove environmental-protection cooling device | |
| CN206022349U (en) | A kind of heat pipe type phase-change heat radiating device | |
| CN107509362A (en) | A kind of Phase cooling type electronic cabinet | |
| TWM586876U (en) | Composite water-cooled drain structure | |
| CN108489303A (en) | A kind of heat sink arrangement with thermal insulation layer | |
| CN113703550A (en) | Hybrid liquid cooling device | |
| CN107357397A (en) | A kind of novel C PU radiators | |
| CN108227883A (en) | A kind of huge computer servers radiator | |
| CN207487103U (en) | A kind of radiator | |
| CN212781928U (en) | High-efficient heat abstractor of big data server | |
| CN210168376U (en) | Data center water-cooling heat dissipation rack | |
| CN209768050U (en) | liquid metal heat abstractor and electronic equipment | |
| CN207637093U (en) | A kind of server radiating system | |
| CN207424799U (en) | A kind of large server heat radiating device special | |
| CN221705850U (en) | Recyclable condenser capable of avoiding continuous temperature rise of cooling liquid | |
| CN213847412U (en) | Circulating cooling device of data center | |
| CN218601765U (en) | Built-in liquid cooling structure of Internet of things server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180313 Termination date: 20180621 |