CN103857268A - Shield film, shield printed wiring board and method of manufacturing shield printed wiring board - Google Patents
Shield film, shield printed wiring board and method of manufacturing shield printed wiring board Download PDFInfo
- Publication number
- CN103857268A CN103857268A CN201310624903.2A CN201310624903A CN103857268A CN 103857268 A CN103857268 A CN 103857268A CN 201310624903 A CN201310624903 A CN 201310624903A CN 103857268 A CN103857268 A CN 103857268A
- Authority
- CN
- China
- Prior art keywords
- protective layer
- film
- release film
- wiring board
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a shield film, a shield printed wiring board and a method of manufacturing the shield printed wiring board. By properly controlling the adhesive force of a release film to a protective layer, unfavorable cases caused by cohesion by excessive or too small adhesive force can be prevented. The shield film (1) is formed in a way that concave-convex parts (61) are formed on the whole single face of a release film (6a); resin is coated on the face where the concave-convex parts (61) are formed of the release film across release agent layer (6b), so a protective layer (7) is formed; and an electromagnetic wave shielding layer (8) is formed on the protective layer, and after the release film (6a) is stripped from the protective layer (7), the surface roughness (Ra) of the protective layer (7) (a hardened layer 7a) is 0.2 [mu]m-1.0 [mu]m.
Description
Technical field
The manufacture method that the present invention relates to the screened film for shielding printed wiring board etc., the shielding printed wiring board that uses this screened film and shielding printed wiring board, this printed wiring board etc. is used to the devices such as computer, communication apparatus, printer, pocket telephone, video camera.
Background technology
Flexible printing wiring board (below also referred to as " FPC ") is configured to: at least one side of the flexible insulating film such as polyimide film or polyester film by adhesive or be not formed with printed circuit by adhesive, and, for example be formed with sealer by following method at the end face of this printed circuit as required, , be bonded with on the end face of this printed circuit by adhesive in flexible insulating film and this flexible insulating film with terminal for carrying circuit block and for the forming part of the terminal that is connected external substrate and be formed with accordingly opening, or, by being coated with photosensitive insulating resin and being dried, exposure, develop, the operations such as heat treatment form opening.In the electronic equipments such as the pocket telephone that develops rapidly at miniaturization, high performance, video camera, notebook personal computer, for circuit being arranged on to the FPC of use in complicated structure more.And, make full use of its good flexibility, in being connected of the movable part of printhead and so on and control part, also use flexible printing wiring board.In the electronic equipment of more use FPC, essential consideration electromagnetic wave shielding countermeasure, also starts to adopt the shielded flexible printed wiring board (hereinafter referred to as " shielding FPC ") of having implemented electromagnetic wave shielding countermeasure in device in the FPC using.
For example; FPC is by making as follows for the disclosed shielding of patent documentation 1; on the one side of release film, form coverlay (protective layer) across mould release coating resin; on the one side of this coverlay (protective layer), paste screen and form screened film; at least one side side at FPC is used conductive adhesive; paste screened film by heating, pressurization; and by screen with after being arranged on earthed circuit in FPC and being electrically connected by conductive adhesive; peel off release film, thereby form shielding printed wiring board.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2004-95566 communique
Summary of the invention
But; as mentioned above; when using in the time that the one side of release film has been coated with the coverlay (protective layer) of mould release, the bondability (peel strength) of release film and coverlay (protective layer) depends on the characteristic of mould release, is difficult to control its bondability (peel strength).Therefore; when release film is peeled off from coverlay (protective layer); there is sometimes situation excessive due to bonding force and that coverlay (protective layer) itself is damaged, or occur that release film is due to bonding force situation too small and that peel off from coverlay (protective layer) in manufacture process.
Therefore, the object of the present invention is to provide and a kind ofly can prevent the manufacture method due to the screened film of the excessive or too small bonding caused rough sledding of bonding force, shielding printed wiring board and shielding printed wiring board with respect to the bonding force of protective layer by suitable control release film.
The invention provides a kind of screened film; wherein; on the whole one side of release film, be formed with jog; thereby form protective layer across mould release coating resin on the face that is formed with this jog of this release film; and further on protective layer, be formed with electromagnetic wave shielding; described screened film is characterised in that, by above-mentioned release film, from above-mentioned protective layer is peeled off, the surface roughness of above-mentioned protective layer (Ra) is 0.2 μ m-1.0 μ m.
According to said structure, under the state being bonded together across mould release between release film and protective layer, the anchoring effect (anchor effect) producing due to the jog on release film surface and the jog of protective layer, thereby making release film bring up to liquid when screened film being immersed in operation afterwards in liquid and so on to the adhesiveness of protective layer can not enter between protective layer and release film and can prevent the degree that release film is peeled off from protective layer, the jog of above-mentioned protective layer is to form by the jog on transfer printing release film surface, and the surface roughness of this protective layer (Ra) is 0.2 μ m-1.0 μ m.In addition; in the process of the release film coating mould release to having jog, mould release is after the state that diffusion configures equably naturally and roughly; be coated with again protective layer used resin, thus make form by the jog on transfer printing release film surface, surface roughness (Ra) is the protective layer of 0.2 μ m-1.0 μ m.Thus, release film can be controlled to the degree that protective layer itself can be damaged due to excessive bonding force while peeling off release film from protective layer with respect to the adhesiveness of protective layer.Like this, owing to can suitably controlling the bonding force of release film to protective layer, the problem being produced therefore can prevent with excessive bonding force or the too small bonding release film of bonding force time.
In addition, screened film of the present invention can also have following characteristics, that is, above-mentioned release film is 1N/50mm-20N/50mm with respect to the peel strength of above-mentioned protective layer.
According to said structure, by release film is set as to 1N/50mm-20N/50mm with respect to the peel strength of protective layer, can make release film reach best with respect to the bonding force of protective layer.
In addition, screened film of the present invention can also have following characteristics, that is, after above-mentioned screened film is positioned on printed wiring board and heats, pressurize, above-mentioned release film is 1N/50mm-10N/50mm for the peel strength of above-mentioned protective layer.
According to said structure; by above-mentioned screened film is positioned on printed wiring board and heat, pressurize after above-mentioned release film be set in 1N/50mm-10N/50mm for the peel strength of above-mentioned protective layer, can make release film reach best with respect to the bonding force of protective layer.
In addition, screened film of the present invention can also have following characteristics, that is, above-mentioned electromagnetic wave shielding comprises conductive adhesive layer.
According to said structure, can make reliably earthed circuit and the electromagnetic wave shielding electrical connection of printed wiring board.
In addition, screened film of the present invention can also have following characteristics, that is, above-mentioned electromagnetic wave shielding also comprises metal level, and above-mentioned conductive adhesive layer is made up of anisotropic conductive adhesive phase.
According to said structure, because the content of electroconductive stuffing is few, therefore can make flexible good screened film.
In addition, screened film of the present invention can also have following characteristics, that is, above-mentioned conductive adhesive layer is made up of isotropic conductivity adhesive phase.
According to said structure, by only arrange conductive adhesive layer just can achieve a butt joint the grounding connection of ground circuit etc., and can make screened film there is electromagnetic shielding effect.
In addition, the invention provides a kind of shielding printed wiring board, wherein, matrix comprises printed circuit more than one deck, on at least one side of this matrix, be provided with screened film, this screened film is configured to: on the whole one side of release film, be formed with jog, thereby form protective layer across mould release coating resin on the face that is formed with described jog of described release film, and be formed with electromagnetic wave shielding on this protective layer, described shielding printed wiring board is characterised in that, by described release film from described protective layer is peeled off, the surface roughness (Ra) of described protective layer is 0.2 μ m-1.0 μ m.
According to said structure, the one side of matrix is formed with the shielding printed wiring board of electromagnetic wave shielding and protective layer under the state being bonded together across mould release between release film and protective layer, the anchoring effect producing due to the jog on release film surface and the jog of protective layer, thereby can by release film with respect to the adhesiveness of protective layer bring up in subsequent handling, screened film is immersed in the liquids such as plating and so in liquid do not enter between protective layer and release film and can prevent the degree that release film departs from from protective layer, the concavo-convex of described protective layer is to form by the jog on transfer printing release film surface, the surface roughness (Ra) of this protective layer is 0.2 μ m-1.0 μ m.In addition; by the jog on release film surface is set and form by the jog on transfer printing release film surface, surface roughness (Ra) is the jog of the protective layer of 0.2 μ m-1.0 μ m; thereby mould release is spread naturally in the process to release film coating mould release, therefore can make mould release in roughly spreading equably the state of configuration.Thus, the degree that release film can be controlled to release film and be stripped from from protective layer with respect to the adhesiveness of protective layer time, protective layer itself can be damaged due to excessive bonding force.Like this, owing to can suitably controlling the bonding force of release film with respect to protective layer, the problem being produced therefore can prevent with excessive bonding force or the too small bonding release film of bonding force time.
In addition, shielding printed wiring board of the present invention can also have following characteristics, that is, the matrix that comprises above-mentioned printed circuit is made up of flexible printing wiring board.
According to said structure, can make flexible good shielding printed wiring board.
In addition, shielding printed wiring board of the present invention can also have following characteristics, that is, the matrix that comprises above-mentioned printed circuit is that a band year encapsulation TAB is with.
According to said structure, can obtain softness and the good shielding printed wiring board of installation property.
In addition, the invention provides a kind of manufacture method that shields printed wiring board, it is characterized in that, comprising:
On at least one side of matrix, load screened film; wherein; described matrix comprises printed circuit more than one deck; described screened film is configured to: the whole one side of release film is formed as concaveconvex shape by hair side processing; on the face that is formed as described concaveconvex shape of described release film, be at least laminated with mould release, protective layer and electromagnetic wave shielding
On stacked direction, to after described screened film and the heating of described matrix, pressurizeing, described release film is peeled off from described protective layer, the surface roughness (Ra) that makes described protective layer is 0.2 μ m-1.0 μ m.
According to said method, under the state being bonded together across mould release between release film and protective layer, the anchoring effect producing due to the jog on release film surface and the jog of protective layer, thereby can by release film with respect to the adhesiveness of protective layer bring up in subsequent handling, make screened film be immersed in the liquids such as plating and so in liquid can not enter between protective layer and release film and can prevent the degree that release film is peeled off from protective layer, the jog of above-mentioned protective layer forms by the jog on transfer printing release film surface, the surface roughness (Ra) of this protective layer is 0.2 μ m-1.0 μ m.In addition; by the jog on release film surface is set and form by the jog on transfer printing release film surface, surface roughness (Ra) is the jog of the protective layer of 0.2 μ m-1.0 μ m; in the process to release film coating mould release, mould release is disperseed naturally, therefore can make mould release in the state of decentralized configuration equably roughly.Thus, in the time that release film is peeled off from protective layer, release film can be controlled to protective layer with respect to the adhesiveness of protective layer can be because excessive bonding force causes damaged degree itself.Like this, owing to can suitably controlling the bonding force of release film with respect to protective layer, the problem being occurred therefore can prevent with excessive bonding force or the too small bonding release film of bonding force time.
Brief description of the drawings
Fig. 1 is the key diagram of the manufacture method of the shielding FPC of present embodiment, (a) be illustrated in the state that loads screened film and heat, pressurize by forcing press on base film, (b) state of release film is being peeled off in expression, (c) represents the state after release film is stripped from.
Fig. 2 is the cross-sectional view of manufacturing the screened film using while shielding FPC, (a) is the figure that is formed electromagnetic wave shielding by adhesive phase and metal level, is (b) figure that is only formed electromagnetic wave shielding by adhesive phase.
Fig. 3 is the partial enlarged drawing of screened film in the cross-sectional view of shielding FPC.
Fig. 4 is the cross-sectional view of shielding FPC, (b), (c) be the cross-sectional view of the shielding FPC of two-sided shielding.
Fig. 5 forms the cross-sectional view that shields FPC when the protective layer of screened film is made into monolayer constructions will.
Fig. 6 is the form of having summed up the result of the evaluation test of embodiment and comparative example.
Fig. 7 is the key diagram of the test method of the evaluation test of embodiment and comparative example.
Embodiment
An example of the execution mode of shielding FPC of the present invention is described below, with reference to the accompanying drawings.Fig. 1 is the key diagram of the manufacture method of the shielding FPC of present embodiment, the cross-sectional view of the screened film that Fig. 2 uses while being this shielding of manufacture FPC.Fig. 1 (a) is illustrated in that on base film 5, to load screened film 1 rear with forcing press P(PA, PB) state of heating h the p that pressurizes.Wherein, base film 5 is configured to: comprise basilar memebrane 2, printed circuit 3 and dielectric film 4, printed circuit 3 is made up of signal circuit 3a and earthed circuit 3b and is formed on basilar memebrane 2, and printed circuit 3 is removed wherein and covered by dielectric film 4 after at least a portion of earthed circuit 3b (nonisulated portion) 3c.In addition, Fig. 3 is the partial enlarged drawing of screened film in the cross-sectional view of shielding FPC.
Here, can be bonding with adhesive between basilar memebrane 2 and printed circuit 3, also can not use adhesive and similarly engage with so-called adhesive-free type copper-clad laminated board.In addition, dielectric film 4 both can use the bonding flexible insulating film of adhesive, also can form by serial of methods such as the coating of photosensitive insulating resin, dry, exposure, development, heat treatments.In addition, base film 5 can be implemented by the following structure of suitable selection, that is: only there is the single side FPC of printed circuit at the one side of basilar memebrane, there is the double-side type FPC of printed circuit basilar memebrane two-sided, by above-mentioned FPC(flexible printing wiring board) the multilayer laminated multi-layered type FPC forming, the flexible board (Off レ Network ス ボ ー De: Japan's registered trade mark) with multi-layer part equipped section and cable portion, form rigid and flexibility substrate that the material of multilayer portion is hard material or for the TAB band etc. with carrying encapsulation.
In the present invention, screened film 1 uses the structure shown in Fig. 2 (a).As shown in Figure 2 (a) shows, screened film 1 has release film 6a, parting agent layer 6b and screened film main body 9.Screened film main body 9 has protective layer 7 and adhesive phase 8a; protective layer 7 by being coated with successively hard layer 7a and soft layer 7b forms on parting agent layer 6b; this hard layer 7a is made up of mar proof, the good resin of resistance to blocking; this soft layer 7b is made up of the good resin of resiliency, and above-mentioned adhesive phase 8a is arranged on the face of the contrary side of face contacting with parting agent layer 6b of protective layer 7 across metal level 8b.Here, electromagnetic wave shielding 8 is formed by adhesive phase 8a and metal level 8b, and this adhesive phase 8a is made up of conductive adhesive.In this electromagnetic wave shielding 8, by heating h, adhesive 8a ' after deliquescing flow in the insulation 4a of removal portion (with reference to figure 1(a) as the direction of arrow by pressurization p).
In addition, protective layer 7 can not be also the double-layer structural with hard layer 7a and soft layer 7b, but monolayer constructions will as shown in Figure 5.In the time adopting this monolayer constructions will, can use heat-curing resin, thermoplastic resin and electron ray curing resin etc. as the resin that forms protective layer 7.
In addition, as shown in Figure 3, release film 6a has been implemented to hair side (mat) on the surface of protective layer 7 one sides and processed.Particularly, by the one side injection fine sand at release film 6a, effects on surface is given jog 61(protuberance 61a, recess 61b), the one side of release film 6a is made to concaveconvex shape increases surface area.In addition, can exemplify the processing of sandblast hair side, the processing of corrosion hair side, the processing of coating hair side, the processing of chemical hair side and rub hair side processing etc. as hair side processing.
In addition, as shown in Figure 3, on the surface of release film 6a mono-side, be formed with the jog 71 of multiple concaveconvex shapes at the hard layer 7a that forms protective layer 7 at the whole face on this surface.This jog 71 is constituted by adjacent recess 71b and protuberance 71a's.After the one side coating parting agent layer 6b of release film 6a, be coated with hard layer 7a and form the enlarged drawing of jog 71(with reference to figure 3 along jog 61), this jog 61 forms by the one side of release film 6a is carried out to hair side processing, and this jog 71 is formed on hard layer 7a.In addition, after release film is stripped from, the surperficial surface roughness (Ra) that is provided with jog 71 of hard layer 7a is preferably 0.2 μ m-1.0 μ m, more preferably 0.2 μ m-0.6 μ m.
In addition, form the hard layer 7a of protective layer 7 and be made up of the resin with mar proof, soft layer 7b is that resin below 3,000,000,000 Pascals forms by spring rate.The mar proof of the resin of hard layer 7a is specially following, that is: the friction test method that the vibration shape frictional testing machine specifying according to JIS L0849 carries out, the quality of setting brake pad is 500 grams, make testing stand with the speed of reciprocal 30 times per minute in the time that 120mm distance is carried out horizontal reciprocating movement, even if reciprocating motion can not produce frictionally damage 1000 times yet.The spring rate of the resin of soft layer 7b is the test method of the dynamic mechanically characteristic that specifies according to JIS K7244-4, at frequency 1Hz, measure temperature range-50 DEG C to measuring under 150 DEG C, programming rate 5 DEG C of conditions per minute.Owing to needing that in subsequent handling release film 6a is peeled off from protective layer 7, therefore, after release film 6 is stripped from, the good hard layer 7a of mar proof plays the effect of protective layer, can prevent that protective layer 7 from wearing and tearing.In addition, because hard layer 7a resistance to blocking is good, so the Reflow Soldering operations in circuit-component carrying operation etc. need in the operation of heating, also not can with stick together for carrying other object of fixture, conveyer belt etc. for transmission that circuit board transmits.Owing to forming the protective layer 7 of bottom by the buffering effect of the good hardness of hard layer 7a and soft layer 7b, so, even can not produce the destructions such as be full of cracks, fracture to the upper set metal level 8b heating of the soft layer 7b of protective layer 7, pressurization yet.In addition, screened film 1 is positioned on the base film 5 that comprises printed circuit 3, working pressure machine P(PA, PB) heating h while pressurizeing p, relax the pressure transmitting to hard layer 7a by the buffering effect of soft layer 7b, therefore can prevent that the hard layer 7a of high rigidity from breaking.Can use heat-curing resin, thermoplastic resin and electron ray curing resin etc. as the resin of hard layer, soft layer.
In addition; on the one side of release film 6a, be coated with after parting agent layer 6b; parting agent layer 6b is in the state of decentralized configuration equably roughly naturally; the hard layer 7a of coating protective layer 7, the jog of release film 6a 61 is transferred to hard layer 7a and forms surface roughness (Ra) is that the protective layer 7(of 0.2 μ m-1.0 μ m is with reference to the enlarged drawing of figure 3).
In addition, as long as the relative protective layer 7 of parting agent layer 6b is for having the layer of fissility, there is no particular limitation, for example, can use the PET film after melamine mould release or the acrylic acid mould release that has been coated with silicon class or non-silicon class.In addition; hair side processing is carried out on the surface that the maximum of parting agent layer 6b thickness is preferably compared release film 6a and the concavo-convex height that forms is thin (because in the time that the thickness of parting agent layer 6b exceedes concavo-convex height; concavo-convex in fact disappearance, release film 6a becomes and is difficult to control with respect to the peel strength of protective layer 7).In addition, as the method that forms hard layer 7a and soft layer 7b on the one side at release film 6a, preferably adopt rubbing method, but also can use lamination, extruding and the impregnating cambial method except rubbing method.
In addition, when release film 6a is peeled off from the hard layer 7a of protective layer 7, release film 6a is with respect to protective layer 7(hard layer 7a) peel strength, under heating h, the state of pressurization before p, be preferably set to 1N/50mm-20N/50mm.In addition, release film 6a is with respect to protective layer 7(hard layer 7a) peel strength under heating h, the state of pressurization after p, be preferably set to 1N/50mm-10N/50mm, be more preferably set as 1N/50mm-4N/50mm.
Change by jog 61(protuberance 61a, recess 61b in the fabrication stage according to application target) form surface roughness or kind, the quantity of mould release; can increase the amplitude of release film 6a with respect to the bonding strength (peel strength) of protective layer 7; and the control (adjustment) that can make bonding strength becomes easily, above-mentioned jog 61(protuberance 61a, recess 61b) form by release film 6a being carried out to above-mentioned hair side processing.
And, after the nonisulated 3c of portion of adhesive 8a ' and earthed circuit 3b and insulation division 4 are fully bonding, as shown in Fig. 1 (b), from forcing press P, take out formed shielded flexible printed wiring board 10, in the time that the release film 6a of screened film 1 is peeled off to f together with parting agent layer 6b, obtain the surface at hard layer 7a shown in Fig. 1 (c) and be provided with the shielding FPC10 ' of jog 71.
As shown in Figure 2 (a) shows, because the thickness of screened film 1 has only increased the thickness of release film 6a compared with screened film main body 9, thus be easy to strike out predetermined size, and fitly severing, also easy with respect to the location of base film 5.In addition, when heating, pressurization, buffering effect increases by release film 6a, has delayed the transmission of pressure, and therefore adhesive 8a ' easily flow in the insulation 4a of removal portion.Therefore, because adhesive 8a ' is fully bonding with the surface of the nonisulated 3c of portion of earthed circuit 3b, so the excellent conductivity connecting.In addition, if release film 6a and parting agent layer 6b are together peeled off, can obtain simply thin and there is flexible shielding FPC10 '.In addition, screened film 1 also can be for rigid circuit board.
Basilar memebrane 2 and dielectric film 4 are all made up of engineering plastics.For example, can exemplify the resins such as polypropylene, crosslinked polyethylene, polyester, polybenzimidazoles, polyimides, polyimide amide, Polyetherimide, polyphenylene sulfide (PPS).In the time that thermal endurance is not too required, preferably use cheap polyester film, in the time requiring flame resistance, can use polyphenylene sulfide film, in the time further requiring thermal endurance, preferably use polyimide film.
In addition, in the above-described embodiment, use metal level 8b and adhesive phase 8a as electromagnetic wave shielding 8, but as mentioned above in the time using isotropic conductivity adhesive as adhesive phase 8a, also can be for omitting the structure of metal level 8b.
As electroconductive stuffing can use carbon, silver, copper, nickel, scolding tin, aluminium, on copper powder silver-plated silver-colored copper-clad filler, and on resin balls or glass marble etc. the filler after plating, or the mixture of these fillers.Because silver-colored price is high, copper is deficiency, aluminium deficiency aspect moisture-proof reliability aspect heat-resisting reliability, and scolding tin is difficult to obtain enough conductivity, therefore preferably uses less expensive and there is silver-colored copper-clad filler or nickel good conductivity and that reliability is high.
The electroconductive stuffings such as metallic stuffing are affected by shape of filler etc. also the mixing ratio of resin of binding property, but in the time using silver-colored copper-clad filler, with respect to resin of binding property 100 weight portions, preferably use the silver-colored copper-clad filler of 10-400 weight portion, more preferably use the silver-colored copper-clad filler of 20-150 weight portion.In the time exceeding 400 weight portion, the adhesiveness of earthed circuit (Copper Foil) 3b is reduced to the flexible variation of shielding FPC10 '.In addition, in the time being less than 10 weight portion, conductivity significantly reduces.In addition, in the time using nickel filler, with respect to resin of binding property 100 weight portions, preferably use the nickel filler of 40-400 weight portion, more preferably use the nickel filler of 100-350 weight portion.In the time exceeding 400 weight portion, the adhesiveness of earthed circuit (Copper Foil) 3b is reduced to the flexible variation of shielding FPC10 '.In addition, in the time being less than 40 weight portion, conductivity significantly reduces.The shape of the electroconductive stuffings such as metallic stuffing can be any shape in spherical, needle-like, fibrous, laminar or dendroid.
As previously mentioned, in the time having mixed the electroconductive stuffings such as metallic stuffing, the thickness of adhesive phase 8a is 3 μ m-25 μ m left and right.In addition, in the time of mixed conductivity filler not, the thickness of adhesive phase 8a is 1 μ m-10 μ m.Therefore, the thickness of electromagnetic wave shielding 8 can be reduced, and thin shielding FPC10 ' can be made.
Can exemplify aluminium, copper, silver, gold etc. as the metal material that forms metal level 8b.Also can suitably select metal material according to desired shielding character, but the problem being easily oxidized while contact with air due to copper existence, and golden is expensive, preferably uses the silver that cheap aluminium or reliability are high.Suitably select thickness according to desired shielding character and flexibility, but general preferred settings thickness is 0.01 μ m-1.0 μ m.In the time that thickness is less than 0.01 μ m, shield effectiveness is insufficient, otherwise, flexible variation in the time that thickness exceedes 1.0 μ m.Have vacuum evaporation, sputter, CVD method, MO(metallorganic as the formation method of metal level 8b) and plating etc., if but consider production, preferably use vacuum evaporation, can obtain cheap and stable metal film.In addition, metal level is not limited to metal film, also can use metal forming.
The screened film 1 ' that Fig. 2 (b) represents is with the difference of the middle screened film 1 of Fig. 2 (a); in the screened film 1 ' representing at Fig. 2 (b); thereby the electromagnetic wave shielding 8 ' being only made up of adhesive phase 8a in the one side setting of protective layer 7 forms main film body 9 ', and this adhesive phase 8a is formed by the conductive adhesive that has mixed electroconductive stuffing.Because the conductance of metal level 8b compared with adhesive phase 8a is high, therefore, be provided with metal level 8b as Fig. 2 (a) in the situation that, use the necessity of isotropic conductivity adhesive low, therefore, can reduce the thickness of electromagnetic wave shielding 8.In addition, the structure of electromagnetic wave shielding 8 is not limited to this, preferably uses conductivity and flexible good material.
Fig. 4 is the cross-sectional view of the shielding FPC that obtains in a manner described.Shielding FPC of the present invention also comprises screened film main body 9 ' certainly, and it has replaced the screened film main body 9 of Fig. 1 (c), and the adhesive phase 8a only being formed by conductive adhesive like that according to Fig. 2 (b) forms electromagnetic wave shielding 8 '.In addition, various materials or the formation method of formation screened film main body 9 ' also comprise various forms as mentioned above.
In addition, be not limited to one side FPC, also comprise the two-sided FPC of Fig. 4 (b) and Fig. 4 (c) and so on.In the two-sided shielding FPC10A of Fig. 4 (b), for realizing the connection between adhesive phase 8a and earthed circuit 3b, and be respectively arranged with the insulation 4a of removal portion and the insulation 2a ' of removal portion at the upper and lower dielectric film 4 of earthed circuit 3b and basilar memebrane 2 ', be connected with adhesive phase 8a at the nonisulated 3c of portion of the upper and lower surface of earthed circuit 3b.Here basilar memebrane 2 ', printed circuit 3(signal circuit 3a and earthed circuit 3b) and dielectric film 4 form base film 5 '.
The two-sided shielding FPC10B of Fig. 4 (c) is same with the example of Fig. 4 (b), be respectively arranged with the insulation 4a of removal portion and the insulation 2a ' of removal portion at the upper and lower dielectric film 4 of earthed circuit 3b and basilar memebrane 2 ', and in earthed circuit 3b, be provided with through hole 3d ', and as earthed circuit 3b ', adhesive phase 8a enters into this through hole 3d ' from two sides, at interface, S place converges.And earthed circuit 3b ' is connected with adhesive phase 8a with through hole inner surface 3c ' at the nonisulated 3c of portion of its end face.Here, basilar memebrane 2 ', printed circuit 3 ' (signal circuit 3a ' and earthed circuit 3b ') and dielectric film 4 form base film 5 ' '.
Embodiment
The result of the evaluation experimental that embodiments of the invention are carried out then, is described together with comparative example.
(about test film)
Use the comparative example 1,2 shown in Fig. 6 and there is screened film 1(release film 6a, parting agent layer 6b, protective layer 7, electromagnetic wave shielding 8(conductive adhesive layer 8a, the metal level 8b of the feature of recording in embodiment 1-18)); in addition, each test film is the rectangular shape of length 200mm, width 50mm.
The PET of release film 6a in embodiment 1-18 is implemented to hair side processing, in embodiment 1-12, use the processing of sandblast hair side, in embodiment 13 and embodiment 16, use the processing of corrosion hair side, in embodiment 14 and embodiment 17, use the processing of coating hair side, in embodiment 15 and embodiment 18, use and rub hair side processing.In addition, in setting comparative example 1,2, the PET of release film 6a is the transparent type without hair side processing.
In addition, use contact pin type surfagauge to measure the surface roughness (Ra(μ m)) in comparative example 1,2 and embodiment 1-18.The method is slided and along with the concavo-convex of body surface moves up and down, measures the movement of this probe at body surface by probe, measures thus the roughness of body surface.
In addition, about the kind of mould release 6b, in comparative example 1, embodiment 1-8 and embodiment 13-15, use melamine mould release (category-A type), in comparative example 2, embodiment 9-12 and embodiment 16-18, use acrylic acid mould release (category-B type), bonding amount is unified respectively for 1.2g/m
2.In addition, the method for measurement of the bonding amount of this parting agent layer is as follows: first use infrared ray Moisture Meter to measure the solid content concentration of mould release; Then,, after coating mould release, use mould release use amount divided by processing capacity m
2, obtain the bonding amount of Wet.Then, obtain the bonding amount of Dry by the solid content concentration of the bonding amount of Wet and mould release, the bonding amount of the mould release using bonding this Dry amount in this experiment.
(1) disbonded test of release film being peeled off from protective layer
(test method)
During before punching press, the peel strength of (before heating, pressurization) is measured, on the surface of the conductive adhesive layer 8a of the screened film 1 of comparative example 1,2 and embodiment 1-18, stick two-sided tape, by the one side of this two-sided tape and testing machine (PALMEK PFT-50S peel strength tester processed) the base fixed mask film 1 that is bonded together.Then, as shown in Figure 7, the end of the release film 6a of screened film 1 is arranged on the chuck of testing machine, measures the peel strength of release film 6a with respect to protective layer 7.Here, as shown in Figure 7, as stripping conditions, peel angle is set as 170 °, and the peeling rate of setting the release film 6a being produced by chuck is 1000mm/min.And, carry out 5 tests, calculate the mean value of minimum value of the peel strength value of each gained as the value (N/50mm) of peel strength.
On the other hand, during after punching press, the peel strength of (after heating, pressurization) is measured, working pressure machine is crimped on the surface heat of the conductive adhesive layer 8a of the screened film 1 of comparative example 1,2 and embodiment 1-18 the polyimide surface side of the copper-clad laminated board with polyimide surface and copper foil surface.Preferably setting pressure as the thermo-compressed condition in forcing press is now 2-5MPa, and temperature is 140-180 DEG C, and the time is 3-60 minute.In this is measured, using 170 DEG C as design temperature, by load-carrying under 0.5MPa 60 seconds, afterwards, under 3MPa, thermo-compressed was carried out in load-carrying for 180 seconds.
Then, in thermo-compressed the copper foil surface side sticking two-faced adhesive tape band of the copper-clad laminated board after screened film 1, as shown in Figure 7, by the one side of this two-sided tape with test board (PALMEK PFT-50S peel strength tester processed) fixed mask film 1 is bonded together.Calculate peel strength value (N/50mm) to measure with the peel strength before above-mentioned punching press the mode that illustrated test method is identical afterwards.
(2) evaluation method
The evaluation method of the disbonded test that release film is peeled off from above-mentioned protective layer is described.In the disbonded test of release film, in the time that the peel strength value before punching press is less than 1N/50mm, be evaluated as "×".If the peel strength value before punching press is 1-20N/50mm, and the value of peel strength after punching press is 1-10N/50mm, is evaluated as " zero (individual pen) ".Here; the condition of evaluating as "○"; why the peel strength value before punching press is set as to 1-20N/50mm; because if peel strength value is less than 1N/50mm; in the time that screened film 1 is immersed in liquid, release film can be peeled off from protective layer, on the other hand, if the value of peel strength is greater than 20N/50mm; release film is excessively strong with respect to the bonding force of protective layer, in the time that release film is peeled off, even can peel together with protective layer and cause protective layer breakage.In addition; the condition of evaluating as "○"; why the peel strength value after punching press is set as to 1-10N/50mm; because if peel strength value is less than 1N/50mm; after punching press, release film can naturally be peeled off from diaphragm sometimes, on the other hand, if peel strength value is greater than 10N/50mm; operability variation (when release film is peeled off from protective layer, not using more strength cannot successfully peel off) when release film being peeled off from protective layer by people or manufacturing installation.And then, on the basis of condition of evaluating "○", in the screened film after punching press, if the peel strength value after punching press is 1-4N/50mm, be evaluated as " ◎ (two circle) ", can more successfully peel release film.
The comparative example 1,2 of above-mentioned explanation and result of the test, the judgement of embodiment 1-18 have been shown in Fig. 6.
According to the result of the disbonded test of the screened film shown in Fig. 6, judge known, for using comparative example 1, the screened film 1 of the PET transparent type without hair side processing in 2, before punching press, peel strength after punching press is all little than 1N/50mm, even so (comparative example 1 uses melamine mould release to the kind of change mould release, comparative example 2 uses acrylic acid mould release), in the time that screened film 1 is immersed in liquid release film 6a likely from protective layer 7 peel off or after punching press release film 6a likely from protective layer 7, naturally peel off, on the other hand, for PET having been carried out to hair side processing in embodiment 1-18, (embodiment 1-12 is the processing of sandblast hair side, embodiment 13 and embodiment 16 are the processing of corrosion hair side, embodiment 14 and embodiment 17 are the processing of coating hair side, embodiment 15 and embodiment 18 rub hair side processing) after screened film 1, because the peel strength before punching press is 1-20N/50mm, peel strength after punching press is 1-10N/50mm, even so change kind (embodiment 1-8 and the embodiment 13-15 use melamine mould release of mould release, embodiment 9-12 and embodiment 16-18 use acrylic acid mould release), release film 6a does not peel off from protective layer 7 in screened film 1 is immersed in liquid time or after punching press.In other words, can not be controlled peel strength even if the kind of known change mould release is coated on the release film 6a without hair side processing, in screened film 1 is immersed in liquid time, liquid can be immersed between release film 6a and protective layer 7.
In addition, known according to the peel strength value of embodiment 1-8, by changing the roughness of hair side processing, , 1.00 μ m → 0.352, μ m → 0.489, μ m → 0.679, μ m → 0.853 μ m → 0.253, μ m → 0.308 μ m → 0.200 μ m, peel strength reduces in the following manner, , before punching press: 9.92N/50mm after 19.87N/50mm(punching press) before → punching press: 5.67N/50mm after 9.48N/50mm(punching press) before → punching press: 4.89N/50mm after 7.12N/50mm(punching press) before → punching press: 3.50N/50mm after 4.97N/50mm(punching press) before → punching press: 2.78N/50mm after 3.42N/50mm(punching press) before → punching press: 1.52N/50mm after 2.18N/50mm(punching press) before → punching press: 1.15N/50mm after 1.55N/50mm(punching press) before → punching press: 1.00N/50mm after 1.12N/50mm(punching press).Hence one can see that, by changing the roughness of hair side processing, can control peel strength.In addition, also draw same conclusion (reducing peel strength value by the roughness value that reduces hair side processing) referring to the result of the embodiment 9-12 that has changed mould release kind.
In addition, referring to adopting the embodiment 1-8 of melamine mould release and adopting the embodiment 9-12 of acrylic acid mould release known, compared with adopting the situation of melamine mould release, in the situation that adopting acrylic acid mould release, the peel strength value after peel strength value and punching press before punching press is high.In addition, use the processing of corrosion hair side referring to embodiment 13(, surface roughness 0.418 μ m, melamine mould release) use the processing of corrosion hair side with embodiment 16(, surface roughness 0.418 μ m, acrylic acid mould release) relatively, embodiment 14(uses the processing of coating hair side, surface roughness 0.362 μ m, melamine mould release) use the processing of coating hair side with embodiment 17(, surface roughness 0.362 μ m, acrylic acid mould release) relatively, embodiment 15(uses and rubs hair side processing, surface roughness 0.245 μ m, melamine mould release) use and rub hair side processing with embodiment 18(, surface roughness 0.245 μ m, acrylic acid mould release) relatively, all known compared with adopting the situation of melamine mould release, in the situation that adopting propylene mould release, peel strength value after peel strength value and punching press before punching press is high.Hence one can see that, also can control peel strength value by the kind that changes mould release.
In addition, referring to embodiment 1-18, the known scope when surface roughness within the scope of 0.2 μ m-1 μ m time, is evaluated as "○" in judgement.This be because, in the time that surface roughness value is less than 0.2 μ m, can not forms and be enough to bring into play the concavo-convex of anchoring effect degree on the surface of protective layer (hard layer), can not control the peel strength of release film with respect to protective layer.On the other hand, in the time that the value of surface roughness is greater than 1.0 μ m, due to concavo-convex the realized anchoring effect strong (bonding force grow) on protective layer (hard layer) surface, when release film is peeled off from protective layer, even there is the problem that protective layer all peels.
In addition, for the screened film 1 of embodiment 1-18, in the time that release film 6a is peeled off from protective layer 7, can not damage protective layer self and peel off release film 6a, also just mean and do not use unnecessary power just can successfully peel off release film 6a.
In addition, in embodiment 4-8, embodiment 12-18, in judgement, be evaluated as " ◎ ".Thus, known when the peel strength value after punching press is between 1-4N/50mm in the situation that, in the time peeling off release film from protective layer, can more successfully peel release film.
As mentioned above; in the screened film 1 of present embodiment; on the whole one side of release film 6a, be formed with jog 61; thereby by forming protective layer 7 across parting agent layer 6b coating resin on the face that is formed with jog 61 at this release film 6a; and be formed with electromagnetic wave shielding 8 on this protective layer 7; when protective layer 7 has been peeled off release film 6a, protective layer 7(hard layer 7a) surface roughness (Ra) be 0.2 μ m-1.0 μ m.According to above-mentioned structure, be bonded under the state on protective layer 7 by parting agent layer 6b at release film 6a, due to jog 61 and the protective layer 7(hard layer 7a on release film 6a surface) anchoring effect that produces of jog 71 on surface, thereby by release film 6a with respect to the adhesiveness of protective layer 7 bring up in subsequent handling, screened film 1 is immersed in liquid and so in liquid can not enter between protective layer 7 and release film 6a and prevent the degree that release film 6a peels off from protective layer 7, the jog 71 on above-mentioned protective layer 7 surfaces is to form by the jog 61 on transfer printing release film 6a surface, the surface roughness (Ra) of protective layer 7 is 0.2 μ m-1.0 μ m.In addition; by jog 61 and the protective layer 7(hard layer 7a on release film 6a surface are set) surperficial jog 71; the mould release being coated on the release film 6a with jog 61 in the process to release film 6a coating mould release disperses naturally; therefore can form and make the roughly parting agent layer 6b of the state of decentralized configuration equably of mould release; the jog 71 on these protective layer 7 surfaces forms by the jog 61 on transfer printing release film 6a surface, and the surface roughness (Ra) of this protective layer 7 is 0.2 μ m-1.0 μ m.Thus, release film 6a can be controlled at release film 6a is peeled off to Shi Buhui because excessive bonding force makes the damaged degree of protective layer 7 own from protective layer 7 with respect to the adhesiveness of protective layer 7.Like this, owing to can suitably controlling the bonding force of release film with respect to protective layer 7, the problem being produced therefore can prevent with excessive bonding force or the too small bonding release film 6a of bonding force time.
In addition, in the screened film 1 of present embodiment, establish the scope that release film 6a is 1N/50mm-20N/50mm with respect to the peel strength of protective layer 7.Can make thus release film 6a more suitable with respect to the bonding force of protective layer 7.
In addition, the screened film 1 of present embodiment, establishes the scope that after base film 5 is heated, pressurizeed, release film 6a is 1N/50mm-10N/50mm with respect to the peel strength of protective layer 7.Can make thus release film 6a more suitable with respect to the bonding force of protective layer 7.
In addition, in the screened film 1 of present embodiment, by comprise conductive adhesive layer 8a in electromagnetic wave shielding 8, can make reliably earthed circuit 3b and electromagnetic wave shielding 8 be electrically connected.
In addition, in the screened film 1 of present embodiment, by also comprise metal level 8b in electromagnetic wave shielding 8, and use anisotropic conductive adhesive in conductive adhesive layer 8a, can reduce the content of electroconductive stuffing, make flexible good screened film.
In addition, in the screened film 1 of present embodiment, by use isotropic conductivity adhesive in conductive adhesive layer 8a, just can carry out the grounding connection to earthed circuit 3b thereby conductive adhesive layer 8a is only set, and can keep electromagnetic shielding effect.
In addition; in the present embodiment; shielding printed wiring board 10 is configured to: base film 5 comprises printed circuit 3 more than one deck; on at least one side of base film 5, be provided with screened film 1; when protective layer 7 has been peeled off release film 6a, protective layer 7(hard layer 7a) surface roughness (Ra) be in the scope of 0.2 μ m-1.0 μ m.Wherein, screened film 1 is configured to: on the whole one side of release film 6a, be formed with jog 61; by forming protective layer 7 across parting agent layer 6b coating resin on the face that is formed with jog 61 at this release film 6a, and form electromagnetic wave shielding 8 on this protective layer 7.Thus; for the shielded flexible printed wiring board 10 on the one side at base film 5 with electromagnetic wave shielding 8 and protective layer 7; owing to can suitably controlling the bonding force of release film 6a with respect to protective layer 7, the problem being produced therefore can prevent with excessive bonding force or the too small bonding release film 6a of bonding force time.
In addition, the shielded flexible printed wiring board 10 of present embodiment, because the base film 5 that comprises printed circuit 3 is made up of flexible printing wiring board, so can make flexible good shielded flexible printed wiring board 10.
In addition, the shielded flexible printed wiring board 10 of present embodiment, because the base film 5 that comprises printed circuit 3 can be served as band year encapsulation TAB band, therefore can obtain softness and the good shielding printed wiring board 10 of installation property.
In addition, in the manufacture method of the shielded flexible printed wiring board 10 of present embodiment, on at least one side of the base film 5 that comprises printed circuit 3 more than one deck, configure screened film 1, this screened film 1 forms by least stacked parting agent layer 6b, protective layer 7 and electromagnetic wave shielding 8 on the surface that is formed with jog 61 of release film 6a, and above-mentioned release film 6a is processed and on whole one side, is formed with jog 61 by hair side; After screened film 1 and base film 5 being heated, pressurizeed on stacked direction, release film 6a is peeled off from protective layer 7, the surface roughness (Ra) that makes protective layer 7 is 0.2 μ m-1.0 μ m.According to said method, owing to can suitably controlling the bonding force of release film 6a with respect to protective layer 7, the problem producing therefore can prevent due to excessive bonding force or the too small bonding release film 6a of bonding force time.
Description of reference numerals
1,1 ': screened film;
2,2 ': basilar memebrane;
2a ': insulation removal portion
3,3 ': printed circuit;
3a, 3a ': signal circuit;
3b, 3b ': earthed circuit;
3c, 3c ': nonisulated portion;
3d ': through hole;
4: dielectric film;
4a: insulation removal portion;
5,5 ', 5 ' ': base film;
6a: release film;
6b: parting agent layer;
7: protective layer;
7a: hard layer;
7b: soft layer;
8,8 ': electromagnetic wave shielding;
8a: adhesive phase;
8a ': adhesive;
8b: metal level;
9,9 ': screened film main body;
10: shielded flexible printed wiring board;
10 ': shielding FPC;
10A: two-sided shielding FPC;
10B: two-sided shielding FPC;
11: metal forming;
12: resin of binding property layer;
71: jog;
71a: protuberance;
71b: recess;
S: interface
Claims (10)
1. a screened film wherein, is formed with jog on the whole one side of release film; thereby form protective layer across mould release coating resin on the face that is formed with described jog of described release film; and being formed with electromagnetic wave shielding on this protective layer, described screened film is characterised in that
By described release film, from described protective layer is peeled off, the surface roughness of described protective layer (Ra) is 0.2 μ m-1.0 μ m.
2. screened film according to claim 1, is characterized in that,
Described release film is 1N/50mm-20N/50mm with respect to the peel strength of described protective layer.
3. screened film according to claim 1 and 2, is characterized in that,
After described screened film is positioned on printed wiring board and heats, pressurize, described release film is 1N/50mm-10N/50mm with respect to the peel strength of described protective layer.
4. screened film according to claim 1 and 2, is characterized in that,
Described electromagnetic wave shielding comprises conductive adhesive layer.
5. screened film according to claim 4, is characterized in that,
Described electromagnetic wave shielding also comprises metal level,
Described conductive adhesive layer is made up of anisotropic conductive adhesive phase.
6. screened film according to claim 4, is characterized in that,
Described conductive adhesive layer is made up of isotropic conductivity adhesive phase.
7. a shielding printed wiring board; wherein; matrix comprises printed circuit more than one deck; on at least one side of this matrix, be provided with screened film; this screened film is configured to: on the whole one side of release film, be formed with jog; thereby on the face that is formed with described jog of described release film, form protective layer across mould release coating resin, and be formed with electromagnetic wave shielding on this protective layer
Described shielding printed wiring board is characterised in that,
By described release film, from described protective layer is peeled off, the surface roughness of described protective layer (Ra) is 0.2 μ m-1.0 μ m.
8. shielding printed wiring board according to claim 7, is characterized in that,
The matrix that comprises described printed circuit is made up of flexible printing wiring board.
9. shielding printed wiring board according to claim 7, is characterized in that,
The matrix that comprises described printed circuit is that a band year encapsulation TAB is with.
10. a manufacture method that shields printed wiring board, is characterized in that,
On at least one side of matrix, load screened film; wherein; described matrix comprises printed circuit more than one deck; described screened film is configured to: the whole one side of release film is formed as concaveconvex shape by hair side processing; on the face that is formed as described concaveconvex shape of described release film, be at least laminated with mould release, protective layer and electromagnetic wave shielding
On stacked direction, to after described screened film and the heating of described matrix, pressurizeing, described release film is peeled off from described protective layer, the surface roughness (Ra) that makes described protective layer is 0.2 μ m-1.0 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012259458A JP2014112576A (en) | 2012-11-28 | 2012-11-28 | Shield film |
| JP2012-259458 | 2012-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103857268A true CN103857268A (en) | 2014-06-11 |
| CN103857268B CN103857268B (en) | 2018-04-06 |
Family
ID=50864315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310624903.2A Active CN103857268B (en) | 2012-11-28 | 2013-11-28 | Screened film, shielding printed wiring board and the manufacture method for shielding printed wiring board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014112576A (en) |
| KR (2) | KR101961234B1 (en) |
| CN (1) | CN103857268B (en) |
| TW (1) | TWI535340B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105120643A (en) * | 2015-06-30 | 2015-12-02 | 保定乐凯新材料股份有限公司 | Thermoplastic electromagnetic wave shielding film used for rapid processing |
| CN105407624A (en) * | 2014-09-04 | 2016-03-16 | 信越聚合物株式会社 | Electromagnetic wave shielding film and method for manufacturing flexibility printing distribution board with the same |
| CN105451529A (en) * | 2014-09-19 | 2016-03-30 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and manufacturing methods thereof |
| CN105555010A (en) * | 2014-10-28 | 2016-05-04 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and methods for manufacturing the same |
| CN107306476A (en) * | 2016-04-20 | 2017-10-31 | 信越聚合物株式会社 | Electromagnetic shielding film and the printing distributing board with electromagnetic shielding film |
| CN110177448A (en) * | 2018-02-20 | 2019-08-27 | 拓自达电线株式会社 | Electromagnetic shielding film |
| CN112586096A (en) * | 2018-07-06 | 2021-03-30 | 拓自达电线株式会社 | Adhesive film for printed circuit substrate |
| CN113141702A (en) * | 2020-01-17 | 2021-07-20 | 广东生益科技股份有限公司 | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component |
| TWI768219B (en) * | 2018-07-06 | 2022-06-21 | 日商拓自達電線股份有限公司 | Adhesive film for printed wiring board |
| CN114690928A (en) * | 2020-12-30 | 2022-07-01 | 京东方科技集团股份有限公司 | Touch display device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102232050B1 (en) | 2013-11-27 | 2021-03-24 | 제이엔씨 주식회사 | Photocurable inkjet ink |
| KR101850809B1 (en) * | 2014-06-02 | 2018-04-20 | 다츠다 덴센 가부시키가이샤 | Electroconductive adhesive film, printed circuit board, and electronic device |
| JP6381117B2 (en) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film |
| WO2016088381A1 (en) * | 2014-12-05 | 2016-06-09 | タツタ電線株式会社 | Electromagnetic wave shielding film |
| KR20160103502A (en) | 2015-01-20 | 2016-09-01 | (주)창성 | Electromagnetic wave shielding sheet and manufacturing method of the same |
| JP6715150B2 (en) * | 2016-09-29 | 2020-07-01 | 信越ポリマー株式会社 | Electromagnetic wave shield film, method for producing electromagnetic wave shield film, and method for producing printed wiring board with electromagnetic wave shield film |
| JP6898127B2 (en) * | 2017-03-28 | 2021-07-07 | 信越ポリマー株式会社 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
| JP6978994B2 (en) * | 2018-02-20 | 2021-12-08 | タツタ電線株式会社 | Transfer film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003103682A (en) * | 2001-09-28 | 2003-04-09 | Keiwa Inc | Laminated sheet |
| JP2007294996A (en) * | 2007-07-06 | 2007-11-08 | Tatsuta System Electronics Kk | Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board |
| JP2009277980A (en) * | 2008-05-16 | 2009-11-26 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding adhesive film and method of manufacturing the same |
| CN102792790A (en) * | 2010-03-11 | 2012-11-21 | 大自达电线股份有限公司 | Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11208193A (en) * | 1998-01-26 | 1999-08-03 | Dainippon Printing Co Ltd | Transfer sheet |
| JP4201548B2 (en) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM |
| JP4319167B2 (en) * | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method |
| JP5457745B2 (en) * | 2008-07-15 | 2014-04-02 | サン・トックス株式会社 | Base film |
| JP5144433B2 (en) * | 2008-08-28 | 2013-02-13 | 古河電気工業株式会社 | Chip protection film |
-
2012
- 2012-11-28 JP JP2012259458A patent/JP2014112576A/en active Pending
-
2013
- 2013-11-22 KR KR1020130142971A patent/KR101961234B1/en active IP Right Grant
- 2013-11-28 TW TW102143396A patent/TWI535340B/en active
- 2013-11-28 CN CN201310624903.2A patent/CN103857268B/en active Active
-
2019
- 2019-03-13 KR KR1020190028724A patent/KR20190030669A/en active Search and Examination
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003103682A (en) * | 2001-09-28 | 2003-04-09 | Keiwa Inc | Laminated sheet |
| JP2007294996A (en) * | 2007-07-06 | 2007-11-08 | Tatsuta System Electronics Kk | Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board |
| JP2009277980A (en) * | 2008-05-16 | 2009-11-26 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding adhesive film and method of manufacturing the same |
| CN102792790A (en) * | 2010-03-11 | 2012-11-21 | 大自达电线股份有限公司 | Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407624A (en) * | 2014-09-04 | 2016-03-16 | 信越聚合物株式会社 | Electromagnetic wave shielding film and method for manufacturing flexibility printing distribution board with the same |
| CN105407624B (en) * | 2014-09-04 | 2018-05-01 | 信越聚合物株式会社 | The manufacture method of electromagnetic shielding film and flexible printed wiring board with it |
| CN105451529A (en) * | 2014-09-19 | 2016-03-30 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and manufacturing methods thereof |
| CN105451529B (en) * | 2014-09-19 | 2018-07-10 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
| CN110662347A (en) * | 2014-10-28 | 2020-01-07 | 信越聚合物株式会社 | Electromagnetic wave shielding film, flexible printed wiring board, and method for producing same |
| CN105555010A (en) * | 2014-10-28 | 2016-05-04 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and methods for manufacturing the same |
| CN108848609B (en) * | 2014-10-28 | 2021-02-26 | 信越聚合物株式会社 | Electromagnetic wave shielding film, flexible printed wiring board, and method for producing same |
| CN108848609A (en) * | 2014-10-28 | 2018-11-20 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
| CN105120643A (en) * | 2015-06-30 | 2015-12-02 | 保定乐凯新材料股份有限公司 | Thermoplastic electromagnetic wave shielding film used for rapid processing |
| CN107306476B (en) * | 2016-04-20 | 2019-06-18 | 信越聚合物株式会社 | Electromagnetic shielding film and printing distributing board with electromagnetic shielding film |
| CN107306476A (en) * | 2016-04-20 | 2017-10-31 | 信越聚合物株式会社 | Electromagnetic shielding film and the printing distributing board with electromagnetic shielding film |
| CN110177448A (en) * | 2018-02-20 | 2019-08-27 | 拓自达电线株式会社 | Electromagnetic shielding film |
| CN112586096A (en) * | 2018-07-06 | 2021-03-30 | 拓自达电线株式会社 | Adhesive film for printed circuit substrate |
| TWI768219B (en) * | 2018-07-06 | 2022-06-21 | 日商拓自達電線股份有限公司 | Adhesive film for printed wiring board |
| CN112586096B (en) * | 2018-07-06 | 2024-06-11 | 拓自达电线株式会社 | Adhesive film for printed wiring substrate |
| CN113141702A (en) * | 2020-01-17 | 2021-07-20 | 广东生益科技股份有限公司 | Insulating sheet, printed circuit board comprising insulating sheet, semiconductor device and embedded component |
| CN114690928A (en) * | 2020-12-30 | 2022-07-01 | 京东方科技集团股份有限公司 | Touch display device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101961234B1 (en) | 2019-03-22 |
| KR20190030669A (en) | 2019-03-22 |
| TWI535340B (en) | 2016-05-21 |
| TW201422066A (en) | 2014-06-01 |
| CN103857268B (en) | 2018-04-06 |
| JP2014112576A (en) | 2014-06-19 |
| KR20140068761A (en) | 2014-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103857268A (en) | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board | |
| JP4201548B2 (en) | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM | |
| KR101243030B1 (en) | Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board | |
| US8648261B2 (en) | Printed circuit board | |
| CN104582246B (en) | Electromagnetic shielding film and the flexible printed circuit board with electromagnetic shielding film | |
| CN104797420B (en) | Stacked film and shielding printed wiring board | |
| TW201742544A (en) | Shielding film for printed wiring board and printed wiring board | |
| JP6303597B2 (en) | Manufacturing method of electronic component module | |
| KR20100125617A (en) | Electric and elastic contact terminal | |
| JP4295794B2 (en) | Shield flexible printed wiring board | |
| JP6237732B2 (en) | Manufacturing method of electronic component module | |
| JP6349250B2 (en) | Shield printed wiring board | |
| JP2003086907A (en) | Shielded flexible printed wiring board | |
| JP2011049175A (en) | Connection method and connection structure for electronic component | |
| TWI422301B (en) | Wiring board | |
| TWI601456B (en) | A printing circuit board and the application | |
| JP6180499B2 (en) | Shield film, shield printed wiring board, and method for manufacturing shield printed wiring board | |
| JP6180500B2 (en) | Shield film, shield printed wiring board, and method for manufacturing shield printed wiring board | |
| JP6775083B2 (en) | Substrate for mounting electronic components and its manufacturing method | |
| JP2008124029A (en) | Connecting member | |
| JPWO2007058108A1 (en) | Anisotropic conductive adhesive | |
| JP6451801B1 (en) | Electromagnetic shielding film used for manufacturing method of electromagnetic shielding electronic device and manufacturing method of electromagnetic shielding electronic device | |
| JP6286273B2 (en) | Shield film, shield printed wiring board, and method for manufacturing shield printed wiring board | |
| JP6583455B2 (en) | Manufacturing method of electronic component module | |
| JP4427374B2 (en) | Printed wiring board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |