CN103225094A - Single-sided current protection method for blind hole plate electroplating - Google Patents
Single-sided current protection method for blind hole plate electroplating Download PDFInfo
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- CN103225094A CN103225094A CN201310193431XA CN201310193431A CN103225094A CN 103225094 A CN103225094 A CN 103225094A CN 201310193431X A CN201310193431X A CN 201310193431XA CN 201310193431 A CN201310193431 A CN 201310193431A CN 103225094 A CN103225094 A CN 103225094A
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Abstract
The invention discloses a single-sided current protection method for blind hole plate electroplating, which comprises the following steps: in the base plate electroplating process, arranging a base plate between a first anode and a second anode, and ensuring that the circuit surface on the base plate communicated with the outer layer of a blind hole plate faces towards the second anode having a smaller total current and the circuit surface communicated with the inner layer of the blind hole plate faces towards the first anode having a bigger total current, wherein due to the difference of the passing currents in magnitude, the circuit surface on the base plate communicated with the inner layer of the blind hole plate corresponds to more copper ion deposits, and the formed corresponding copper layer has a thickness of 20-33um; and the current passing through the circuit surface communicated with the outer layer of the blind hole plate only accounts for 5-10% of the total current, so that the copper layer formed on the surface layer has a thickness of 3-5um. Thus, in the process of performing blind hole plate electroplating according to the invention, the single-sided current protection can meet the requirements for electroplating thicknesses of copper in the hole and copper on the surface in one step. Besides, the invention effectively satisfies the function and property of the product, shortens the flow of the processing technique, saves the cost and improves the production efficiency.
Description
Technical field
The invention belongs to the printed circuit board manufacture technology field, what be specifically related to is the electro-plating method of blind hole plate, and furtherly, what relate to is the method that adopts the single face current protection in the blind hole plate electroplating process.
Background technology
Along with electronic product develops to high-density, high precision direction, accordingly wiring board is had higher requirement, improving the effective means of wiring board density then is the quantity that reduces through hole, and blind hole accurately is set.Printed circuit board (pcb)) in making processes, can carry out the making of through hole and blind hole usually, through hole is used for realizing the interconnection of the conducting between the random layer in the multi-ply wood, and blind hole is used for realizing that the conducting between multi-ply wood mesectoderm and the sublevel interconnects.
Plating is the important process in the wiring board making processes, conventional at present plating is to apply electric current on the pcb board two sides, with the wiring board is that negative electrode moves around at two positive terminals, thereby reaches hole copper and two surperficial copper thicknesses are suitable, satisfies the purpose that product quality and performances require.
Because the blind hole in the blind hole plate is connection line plate top layer and internal layer and the hole that do not connect, it is positioned at the top layer and the bottom surface of printed-wiring board (PWB), has certain depth, is used for being connected of top layer circuit and following internal layer circuit.And in blind hole plate electroplating process, for the hole wall copper thickness (requiring usually to reach more than the 18um) that satisfies blind hole and through hole, usually need to adopt the galvanized mode of two sides gradation, promptly the one side that wiring board is not had a blind hole is electroplated once, and wiring board has the one side of blind hole to electroplate more than twice or twice, though this mode can guarantee the hole wall copper thickness of blind hole and reach requirement, but because the blind hole face has adopted twice or twice above plating, it is thick that thereby the copper layer thickness that causes wiring board blind hole face does not have the blind hole face, there is the thick inconsistent problem of blind hole plate two sides copper, and the precision of circuit depends on the copper thickness on surface during the outer-layer circuit etching, the surface copper thickness reaches the line width requirement that can't satisfy design behind the certain thickness, distortion can appear, and then influence circuit corrosive precision, cause product can not satisfy the problem of quality and performance requriements.
In order to address the above problem, at present the blind hole plate is electroplated and adopted following dual mode usually: one, adopt the different substrate of two sides copper thickness, the one side that copper thickness is thin is as the blind hole face, make blind hole, when carrying out follow-up plating, only need carry out twice or repeatedly electroplate getting final product to the thin one side of copper thickness, to guarantee the copper layer thickness unanimity on plating thick wiring board two sides, this mode need customize the special different substrate of two sides copper thickness, there is the cost problem of higher in it, and, also can cause the work flow overlong time owing to adopt repeatedly plating; Two, adopt the identical substrate of two sides copper thickness; to wherein simultaneously protecting; another side is subtracted copper to be handled; this mode is owing to need wiring board is simultaneously protected in subtracting the copper process; therefore need the flow processs of implementing a figure transfer more; there is the problem of flow process overlong time in it, and single face subtracts copper and also causes showing inhomogeneous and the homogeneity when influencing circuit etching of copper thickness easily.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of blind hole plate to electroplate the single face current protection method, when electroplating to solve present blind hole plate, the problem that existing cost of manufacture is higher and technical process is long.
The objective of the invention is to be achieved through the following technical solutions.
A kind of blind hole plate is electroplated the single face current protection method, comprises step:
A, material is opened in copper-clad plate, it is cut into the substrate of required size;
B, with described substrate according to the graphic designs requirement, hole at correspondence position, form via, and set this substrate simultaneously for and the outer circuit surface that is communicated with of blind hole plate; Another side is the circuit surface that is communicated with the blind hole inner cord;
C, the via that aforesaid substrate is formed carry out the hole metallization processing, and forming thickness in via is the copper layer of 12～20 microinchs;
D, the substrate behind the hole metallization is placed on carries out electric plating of whole board in the electroplate liquid and handle, this step specifically comprises:
D1, the first anode parallel to each other and second anode are set in electroplate liquid, and the electrical current that the first anode is set is a total current, the electrical current of second anode is 5%～10% of a total current, and wherein said total current size is: the wide * current density of the long * substrate of substrate;
D2, be negative electrode, be placed between the first anode and second anode in the electroplate liquid with described substrate, and make with the outer circuit surface that is communicated with of blind hole plate towards second anode, the circuit surface that is communicated with the blind hole inner cord is towards the first anode;
D3, the positive pole of first motor-generator set is connected the first anode, negative pole connects substrate, the positive pole of second motor-generator set connects second anode, negative pole also connects substrate, switch on, and kept conduction time 90～120 minutes, forming thickness in the via of substrate is the hole copper of 18～25um, and with the outer circuit surface that is communicated with of blind hole plate on formation thickness be the copper layer of 3～5um; With circuit surface that the blind hole inner cord is communicated with on to form thickness be the copper layer of 20～33um;
E, the circuit surface that is communicated with the blind hole inner cord on the substrate behind the electric plating of whole board is carried out figure transfer, and the whole plate copper sheet on reservation and the outer circuit surface that is communicated with of blind hole plate;
F, aforesaid substrate is carried out etching, the corresponding line pattern that forms on substrate;
G, repeating step a～f, and the substrate correspondence that is made into carried out lamination, form multi-ply wood blind hole plate.
Preferably, the two sides copper thickness unanimity of copper-clad plate among the step a.
Preferably, step c comprises: the substrate that is drilled with via is carried out the electroless copper plating hole metallization handle, making and forming thickness in the via is the copper layer of 12～20 microinchs.
Preferably, described total current size is: the wide * current density of the long * substrate of substrate, wherein current density is 1.8 peace/square decimeters.
Preferably, step e comprises: with the corresponding dry film that pastes in substrate two sides, paste film egative film on dry film, it is exposed, develops, the line pattern correspondence on the film egative film is transferred on the substrate.
Preferably, step f comprises: the substrate after the figure transfer is moved back film, carry out alkali etching then, the copper beyond circuit and the boring is etched away, form line pattern.
The present invention compared with prior art, beneficial effect is: blind hole plate provided by the invention is electroplated the single face current protection method, when substrate is electroplated, substrate is placed between the first anode and the second anode, and make the circuit surface that is communicated with blind hole plate skin on the substrate towards the less second anode of total current, the circuit surface that will be communicated with the blind hole inner cord is towards the bigger first anode of total current, because electrical current is in different size, therefore the corresponding cupric ion deposition of the circuit surface that is communicated with the blind hole inner cord on the substrate is more, and its corresponding copper layer thickness that forms is 20～33um; And only be 5%～10% of total current owing to electric current with the outer circuit surface that is communicated with of blind hole plate, therefore, its top layer forms the thick 3～5um of being of copper, and also to bore outer through hole after the lamination to this circuit surface, and the through hole that bores is carried out hole metallization handle, make the hole copper thickness reach 20um, therefore can make the thickness of substrate outer be increased to the 20～33um identical with interior layer thickness.Hence one can see that, the present invention when the blind hole plate is electroplated, by the single face current protection, can disposable realization hole copper and the electroplating thickness requirement of table copper, effectively satisfied the function and the performance of product, shortened processing process, saved cost,
Promoted production efficiency.
Description of drawings
Single face current protection synoptic diagram when Fig. 1 electroplates the blind hole plate for the present invention.
Fig. 2 is the cross-sectional view of the present invention to the blind hole plate.
Fig. 3 is the cross-sectional view of the middle individual layer copper-clad plate of blind hole plate of the present invention.
Identifier declaration among the figure: the circuit surface 401, the circuit surface 402 that is communicated with the blind hole inner cord, second anode 5, first motor-generator set 6, second motor-generator set 7, blind hole 8, the via 9 that electroplate cylinder 1, electroplate liquid 2, the first anode 3, substrate 4, are communicated with blind hole plate skin.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The present invention is to provide a kind of blind hole plate and electroplate the single face current protection method, be mainly used in the present blind hole plate plating of solution and adopt two different substrates of copper thickness to produce existing substrate cost height, the problem that complete processing is long; And be used to solve present blind hole plate and electroplate the mode that adopts single face to subtract copper and produce existing flow process overlong time and single face and subtract copper to cause showing copper thickness easily inhomogeneous, the inhomogeneity problem when influencing circuit etching.
The present invention is when electroplating substrate, adopt the inconsistent mode of different anodal closure electric currents, being specially an anode is total current, another anode is 5%～10% of a total current, plating is distinguished on the different two sides of substrate, because anodic current varies in size, must make anode different with electroplate liquid ionic concn between the substrate (negative electrode), when the one side that electric current is big was electroplated, the sedimentary speed of cupric ion was faster than another side, and therefore the thickness of corresponding blind hole mesopore copper can meet the requirements of more than the 18un.
In this way, the present invention can disposable realization hole copper and the electroplating thickness requirement of table copper, has effectively satisfied the function and the performance of product, has shortened processing process, has saved cost, has promoted production efficiency.
To describe concrete technology of the present invention below:
The present invention mainly adopts following steps:
A, material is opened in copper-clad plate, it is cut into the substrate of required size;
The copper-clad plate here need not customization, the copper thickness unanimity on its two sides for copper-clad plate commonly used.
B, with described substrate according to the graphic designs requirement, hole at correspondence position, form via, and set this substrate simultaneously for and the outer circuit surface that is communicated with of blind hole plate; Another side is the circuit surface that is communicated with the blind hole inner cord;
Specifically see shown in Figure 3ly, Fig. 3 is the cross-sectional view of the middle individual layer copper-clad plate of blind hole plate of the present invention.The one side of substrate 4 is and the outer circuit surface 401 that is communicated with of blind hole plate that another side is the circuit surface 402 that is communicated with the blind hole inner cord, and the boring on the substrate 4 is via 9.
When copper-clad plate being opened material, can in copper-clad plate, hole by correspondence position (position that needs boring is as via), the hole that forms after the boring is via here.
Wherein need here the copper-clad plate two sides is set, wherein one side is set at and the outer circuit surface 401 that is communicated with of blind hole plate, promptly towards the one side on wiring board skin or top layer; Another side then is set at the circuit surface 402 that is communicated with the blind hole inner cord, promptly towards the one side of internal layer.
C, the via that aforesaid substrate is formed carry out the hole metallization processing, and forming thickness in via is the copper layer of 12～20 microinchs;
The substrate that is drilled with via is carried out the electroless copper plating hole metallization handle, making and forming thickness in the via is the copper layer of 12～20 microinchs.
D, the substrate behind the hole metallization is placed on carries out electric plating of whole board in the electroplate liquid and handle, this step specifically comprises:
D1, the first anode parallel to each other and second anode are set in electroplate liquid, and the electrical current that the first anode is set is a total current, the electrical current of second anode is 5%～10% of a total current, and wherein said total current size is: the wide * current density of the long * substrate of substrate;
Wherein current density is 1.8 peace/square decimeters, and substrate is long and the wide unit of substrate is a decimetre.
D2, be negative electrode, be placed between the first anode and second anode in the electroplate liquid with described substrate, and make with the outer circuit surface that is communicated with of blind hole plate towards second anode, the circuit surface that is communicated with the blind hole inner cord is towards the first anode;
D3, the positive pole of first motor-generator set is connected the first anode, negative pole connects substrate, the positive pole of second motor-generator set connects second anode, negative pole also connects substrate, switch on, and kept conduction time 90～120 minutes, forming thickness in the via of substrate is the hole copper of 18～25um, and with the outer circuit surface that is communicated with of blind hole plate on formation thickness be the copper layer of 3～5um; With circuit surface that the blind hole inner cord is communicated with on to form thickness be the copper layer of 20～33um;
Specifically referring to shown in Figure 1, the single face current protection synoptic diagram when Fig. 1 electroplates the blind hole plate for the present invention.In electroplating cylinder 1 electroplate liquid 2 is arranged, the described first anode 3 and second anode 5 are arranged at respectively in the electroplate liquid 2, and the first anode 3 is connected with the positive pole of first motor-generator set 6, and second anode 5 is connected with the positive pole of second motor-generator set 7.When needs are electroplated, substrate 4 is placed between the first anode 3 and the second anode 5, substrate 4 as negative electrode, and is connected with the negative pole of first motor-generator set 6, second motor-generator set 7 respectively.
The electrical current size of the first anode 3 is set by first motor-generator set, 6 correspondences then, and it is set to total current, total current size herein is: the wide * current density of the long * substrate of substrate (current density is 1.8 peace/square decimeters); The electrical current size that second anode 5 is set by second motor-generator set 7 is 5%～10% of total current.
When substrate 4 is placed between the first anode 3 and the second anode 5, need make the circuit surface 402 that is communicated with the blind hole inner cord on the substrate 4 towards the first anode 3; The circuit surface 401 that is communicated with blind hole plate skin is towards second anode 5.
After above-mentioned steps is finished, then control first motor-generator set 6, second motor-generator set 7 is switched on according to the above-mentioned electric current that size is set simultaneously, and kept this plating mode 90～120 minutes, forming thickness in the via 9 of substrate 4 is the hole copper of 18～25um, and with the outer circuit surface 401 that is communicated with of blind hole plate on formation thickness be the copper layer of 3～5um; With circuit surface 402 that the blind hole inner cord is communicated with on to form thickness be the copper layer of 20～33um.
Carry out lamination afterwards, on the outer circuit surface 401 that is communicated with of blind hole plate, bore outer through hole after the lamination, and the through hole that bores is carried out hole metallization handle, make the hole copper thickness reach 20um, and the corresponding thickness that also can make substrate outer is increased to the 20～33um identical with interior layer thickness.
E, the circuit surface that is communicated with the blind hole inner cord on the substrate behind the electric plating of whole board is carried out figure transfer, and the whole plate copper sheet on reservation and the outer circuit surface that is communicated with of blind hole plate;
With the corresponding dry film that pastes in substrate two sides, and with circuit surface that the blind hole inner cord is communicated with on dry film on subsides film egative film, it is exposed, develops, the line pattern correspondence on the film egative film is transferred on substrate and the circuit surface that the blind hole inner cord is communicated with; Another side then is whole plate copper sheet.
F, aforesaid substrate is carried out etching, the corresponding line pattern that forms on substrate;
Substrate after the figure transfer is moved back film, carry out alkali etching then, the copper beyond circuit and the boring is etched away, form line pattern.
G, repeating step a～f, and the substrate correspondence that is made into carried out lamination, form multi-ply wood blind hole plate.
Wherein made multi-ply wood blind hole plate specifically can be referring to shown in Figure 2, and Fig. 2 is the cross-sectional view of the present invention to the blind hole plate.Be example with six laminates among the present invention, its corresponding L2, L3, the corresponding inner plating that forms of L4, L5 form the blind hole plate then with behind L1, the L6 lamina rara externa lamination, and the corresponding blind hole 8 that forms are three rank blind holes, and its correspondence is passed L1, L2, L3.
In sum; the production method of blind hole plate of the present invention; need not to adopt and buy the mode that substrate that two copper thicknesses do not wait or employing single face subtract copper and realize; only need be when blind hole be electroplated; substrate is implemented the single face protective current to get final product; the present invention had both satisfied the thickness requirement of blind hole hole copper, had realized substrate two surfaces control table copper thickness selectively again.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a blind hole plate is electroplated the single face current protection method, it is characterized in that, comprises step:
A, material is opened in copper-clad plate, it is cut into the substrate of required size;
B, with described substrate according to the graphic designs requirement, hole at correspondence position, form via, and set this substrate simultaneously for and the outer circuit surface that is communicated with of blind hole plate; Another side is the circuit surface that is communicated with the blind hole inner cord;
C, the via that aforesaid substrate is formed carry out the hole metallization processing, and forming thickness in via is the copper layer of 12～20 microinchs;
D, the substrate behind the hole metallization is placed on carries out electric plating of whole board in the electroplate liquid and handle, this step specifically comprises:
D1, the first anode parallel to each other and second anode are set in electroplate liquid, and the electrical current that the first anode is set is a total current, the electrical current of second anode is 5%～10% of a total current, and wherein said total current size is: the wide * current density of the long * substrate of substrate;
D2, be negative electrode, be placed between the first anode and second anode in the electroplate liquid with described substrate, and make with the outer circuit surface that is communicated with of blind hole plate towards second anode, the circuit surface that is communicated with the blind hole inner cord is towards the first anode;
D3, the positive pole of first motor-generator set is connected the first anode, negative pole connects substrate, the positive pole of second motor-generator set connects second anode, negative pole also connects substrate, switch on, and kept conduction time 90～120 minutes, forming thickness in the via of substrate is the hole copper of 18～25um, and with the outer circuit surface that is communicated with of blind hole plate on formation thickness be the copper layer of 3～5um; With circuit surface that the blind hole inner cord is communicated with on to form thickness be the copper layer of 20～33um;
E, the circuit surface that is communicated with the blind hole inner cord on the substrate behind the electric plating of whole board is carried out figure transfer, and the whole plate copper sheet on reservation and the outer circuit surface that is communicated with of blind hole plate;
F, aforesaid substrate is carried out etching, the corresponding line pattern that forms on substrate;
G, repeating step a～f, and the substrate correspondence that is made into carried out lamination, form multi-ply wood blind hole plate.
2. blind hole plate according to claim 1 is electroplated the single face current protection method, it is characterized in that the two sides copper thickness unanimity of copper-clad plate among the step a.
3. blind hole plate according to claim 1 is electroplated the single face current protection method, it is characterized in that step c comprises: the substrate that is drilled with via is carried out the electroless copper plating hole metallization handle, making and forming thickness in the via is the copper layer of 12～20 microinchs.
4. blind hole plate according to claim 1 is electroplated the single face current protection method, and it is characterized in that described total current size is: the wide * current density of the long * substrate of substrate, wherein current density is 1.8 peace/square decimeters.
5. blind hole plate according to claim 1 is electroplated the single face current protection method; it is characterized in that step e comprises:, on dry film, paste film egative film with the corresponding dry film that pastes in substrate two sides; it is exposed, develops, the line pattern correspondence on the film egative film is transferred on the substrate.
6. blind hole plate according to claim 1 is electroplated the single face current protection method, it is characterized in that step f comprises: the substrate after the figure transfer is moved back film, carry out alkali etching then, the copper beyond circuit and the boring is etched away, form line pattern.
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| CN201310193431.XA CN103225094B (en) | 2013-05-20 | 2013-05-20 | The guard method of a kind of blind hole plate plating single-sided current |
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| CN201310193431.XA CN103225094B (en) | 2013-05-20 | 2013-05-20 | The guard method of a kind of blind hole plate plating single-sided current |
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Cited By (4)
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| CN108668468A (en) * | 2017-03-31 | 2018-10-16 | 北大方正集团有限公司 | The processing method and multilayer daughter board in circuit board one-side electroplating hole |
| CN113748231A (en) * | 2019-06-14 | 2021-12-03 | 株式会社荏原制作所 | Plating method, plating device, and non-volatile storage medium storing program |
| CN114959820A (en) * | 2022-05-25 | 2022-08-30 | 景旺电子科技(龙川)有限公司 | Manufacturing method of flexible circuit board with fine circuit and flexible circuit board |
| WO2024131825A1 (en) * | 2022-12-22 | 2024-06-27 | 通威太阳能（成都）有限公司 | Solar cell and preparation method therefor, electroplating apparatus, and electroplating system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105297096B (en) * | 2015-11-30 | 2017-12-19 | 中国华能集团公司 | A kind of electroplanting device and electro-plating method of two-sided electro-deposition xenogenesis coating |
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| CN113748231A (en) * | 2019-06-14 | 2021-12-03 | 株式会社荏原制作所 | Plating method, plating device, and non-volatile storage medium storing program |
| CN114959820A (en) * | 2022-05-25 | 2022-08-30 | 景旺电子科技(龙川)有限公司 | Manufacturing method of flexible circuit board with fine circuit and flexible circuit board |
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| CN103225094B (en) | 2015-09-09 |
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