CN103205716A - Adsorption carrier for evaporation material for evaporation of anti-fouling film - Google Patents
Adsorption carrier for evaporation material for evaporation of anti-fouling film Download PDFInfo
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Abstract
The invention provides an adsorption carrier for an evaporation material for evaporation of an anti-fouling film. The adsorption carrier is a sintered body of metal powder, and the metal powder is one or a metal mixture of at least two selected from iron, stainless steel, copper and aluminum. The adsorption carrier provided by the invention has the advantages that the adsorption carrier does not contain impurities and can ensure that the impurities can not be produced by melting during the film plating process under high-vacuum and high-temperature conditions, and the adsorption carrier can not perform chemical reaction with the evaporation material which is adsorbed and carried by the adsorption carrier; a sintering raw material with appropriate heat conductivity can be selected according to the demands of film plating equipment, so that the uniformity of film plating is ensured; and the anti-fouling film which is obtained by using the adsorption carrier provided by the invention to perform vacuum evaporation can greatly improve the wear resistance and is better than the anti-fouling film which is obtained by evaporation by using the adsorption carrier in the prior art.
Description
Technical field
The present invention relates to the vacuum plating field, be specifically related to a kind of absorption carrier of the deposition material for the antifouling film of evaporation.
Background technology
Vacuum Coating method is the important film-forming method of a class, and it is in electronic industries such as microelectronics, electronic material and components and parts, horological industry, and optics industrys such as photographic camera have become an indispensable important technology in the building industry such as window glass.In addition, be in the new and high technology of representative with the electronics and information industry, vacuum coating technology also plays a part very important.In the Vacuum Coating method, representative have vacuum vapour deposition, ion plating method, sputter coating method and chemical vapour deposition (chemical vapor deposition, CVD) method etc.Wherein vacuum vapour deposition is the most general method of making film.This method is that the treatment chamber that substrate is housed is evacuated, and makes gas pressure intensity reach 10
-2Below the Pa, heat deposition material then, its atom or molecule are overflowed from the surface gasification, form vapour stream, incide substrate surface, the formation solid film then condenses.So vacuum vapour deposition need hold deposition material crucible, heating crucible thermal source and adhere to the substrate of the deposition material that is evaporated.In the coating process, deposition material is generally solid in early days, can be placed directly in the crucible.In recent years, along with the emerge in multitude of novel coating raw material, the form of evaporation also changes to some extent.As the antifouling (Anti-Smudge of evaporation on optical component, AS) during film, usually select for use organic compound such as organofluorine compound and silicone resin as coating raw material, need during evaporation earlier coating raw material to be dissolved in solvent to form the deposition material that exists with the organic solution state, in crucible, preset absorption carrier as the carrier of this deposition material.During evaporation, coating raw material is overflowed from absorption carrier after being heated and gasifying, and incides substrate surface and finishes plated film.
The type of the absorption carrier of deposition material mainly contains two kinds at present: 1, use porous sintered ceramic or stupalith as absorption carrier.2, steel wool is pressed into crucible and with it as absorption carrier.Above-mentioned two kinds of absorption carriers all have different separately shortcomings.Porous ceramics sintered compact impurities is more, and these impurity make the major cause of the deterioration in characteristics of deposition material just, thereby all is disadvantageous to rub resistance and the homogeneity of antifouling film; When employing is pressed into the absorption carrier that crucible makes with steel wool, the volume restrictions of its steel wool the absorbed dose of organic substance.And because the rigidity characteristics of steel wool makes its porosity difficult management.Fragmentation takes place in steel wool easily, thereby causes antifouling film spot to occur.
Summary of the invention
The objective of the invention is according to above-mentioned the deficiencies in the prior art part, a kind of absorption carrier of the deposition material for the antifouling film of evaporation is provided, this absorption carrier adopts the sinter from metal powder of porous matter, has promoted the absorption supporting effect, has avoided the deficiencies in the prior art.
The object of the invention realizes being realized by following technical scheme:
A kind of absorption carrier of the deposition material for the antifouling film of evaporation, it is characterized in that: described absorption carrier is the sintered compact of metal-powder, described metal-powder is the metal mixture of a kind of in chosen from Fe, stainless steel, copper, the aluminium or at least two kinds.
The particle diameter of described metal-powder is 1 μ m-100 μ m.
The preferable particle size of described metal-powder is 1 μ m-10 μ m.
Described metal mixture is the mixture of iron powder and copper powder.Wherein copper powder accounts for 25%-35% of mixture weight per-cent, and all the other are iron powder.The particle diameter of described copper powder is not more than the particle diameter of described iron powder.
The porosity of described sintered compact is 40%-70%.
The thermal conductivity of described sintered compact is 1W/m.K-200W/m.K.
Described sintered compact is round pie.
A kind of production method of absorption carrier is characterized in that: described method be with as the metal-powder of raw material with 0ton/cm
2--15ton/cm
2Pressure compacting, pass through the sintered compact behind the sintering of 0.5h--5h again, this sintered compact is porous plastid, is described absorption carrier.
Advantage of the present invention is:
1, absorption carrier provided by the invention itself is free from foreign meter; Fusing point is more than 400 ℃, can guarantee under the high vacuum hot conditions, can not melt in the coating process produce impurity and not with the deposition material generation chemical reaction of absorption carrying;
2, use absorption carrier provided by the invention, because different metals or the raw material of metal mixture have different thermal conductivities, so thermal conductivity can be selected, difference according to filming equipment requires to select the suitable absorption carrier of thermal conductivity, the velocity of evaporation of the Coating Materials that is adsorbed carrying can be controlled, thereby the homogeneity of plated film can be guaranteed;
3, use absorption carrier provided by the invention to carry out the resulting antifouling film of vacuum evaporation, crocking resistance increases substantially, and is far superior to the antifouling film that absorption carrier evaporation of the prior art comes out.
Description of drawings
Fig. 1 is the profile synoptic diagram of absorption carrier of the present invention;
Fig. 2 is the crucible synoptic diagram that takes up absorption carrier of the present invention;
Fig. 3 is the device synoptic diagram of the antifouling film of vacuum evaporation;
Fig. 4 is that the mixture with iron and copper is that the absorption carrier made of raw material is at the section photo of microscopically.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail:
The absorption carrier of the deposition material for the antifouling film of evaporation provided by the invention obtains by the following method: at first select suitable raw material, be processed into Powdered after, with 0ton/cm
2--15ton/cm
2Pressure tamp, under suitable temperature, pass through the sintering of 0.5h--5h then, resulting sintered compact is porous plastid, the present invention utilizes the character of its porous plastid, deposition material is carried out physical carrier absorption, at last will be with the sintered compact cutting forming that obtains, heat conducting homogeneity during usually for evaporation, the shape effects of no corner angle can be better than the shape that corner angle are arranged, therefore corner angle are more few more favourable on the whole, Fig. 1 has illustrated the profile of absorption carrier of the deposition material for the antifouling film of evaporation of the present invention, because will be placed in the high thermal environment and use, heating surface is more smooth, heating surface area is more big, and the homogeneity of being heated is more good, so the heating surface of absorption carrier is preferably circle, so the minimum round pie of the preferred corner angle of the shape of present embodiment absorption carrier.
The absorption carrier of the deposition material for the antifouling film of evaporation provided by the invention is the sintered compact that is formed by the powder as the single metal of raw material or metal mixture.For the powder of raw materials for sintering, need have physical strength height, thermotolerance height, reactive character such as weak.A kind of as in the excellent chosen from Fe of single metal of raw material, stainless steel, copper, the aluminium in the absorption carrier provided by the invention, metal mixture is preferably the mixture of iron and copper.Above metal is the physical strength height, the material that fusing point is high, and not can with deposition material generation chemical reaction, can guarantee the purity of plated film.
The selection of raw material particle size size will take into account the absorption load-carrying properties and prevent that impurity from entering the problem of this two aspect of absorption carrier.Particle diameter is excessive, and as greater than 100 μ m the time, impurity such as dust easily enter in the absorption carrier, thereby causes antifouling film quality to descend; Particle diameter can cause being difficult to absorption and carry a deposition material during less than 1 μ m, and namely deposition material is difficult to be injected in the absorption carrier.The particle diameter of the single raw metal of the present invention is 1-100 μ m, preferred 1-10 μ m; Particle diameter as the iron of main material in the metal mixture is 1-100 μ m, preferred 1-10 μ m.Such particle size range can guarantee under the situation of the absorption load-carrying properties that do not influence absorption carrier, prevents that farthest impurity such as dust from entering in the absorption carrier, improves the quality of antifouling film.
The thermal conductivity of absorption carrier has determined speed that absorption carrier heats up and heat in the speed of absorption carrier internal diffusion, therefore directly has influence on the velocity of evaporation of deposition material.The thermal conductivity of absorption carrier is more little, and deposition material is heated more slow, and velocity of evaporation is more slow; Otherwise thermal conductivity is more big, and deposition material is heated more fast, and then velocity of evaporation is more fast.In coating process, as shown in Figure 3, coated basal plate is fixed on the support of vacuum chamber top, and in order to increase the homogeneity of plated film, support at the uniform velocity or with certain velocity variations rule rotates under the effect of driving mechanism.The speed of rotation of support is that the model of looking film coating apparatus, the type and size of substrate etc. are set.The velocity of evaporation of deposition material needs and the speed of rotation of support matches, and velocity of evaporation is too fast or slow excessively, all can influence the homogeneity of plated film and the performance of antifouling film.Absorption carrier provided by the invention can be according to the demand of filming equipment, selects the suitable raw material of thermal conductivity, and the velocity of evaporation of the thermal conductivity control deposition material by absorption carrier is with the speed of rotation of ligand board mount.Because can control the velocity of evaporation that absorption is carried on deposition material in the absorption carrier, therefore can improve homogeneity and the crocking resistance of formed antifouling film.The thermal conductivity of absorption carrier provided by the invention is 1 W/m.K-200 W/m.K, can satisfy most of evaporated devices to the demand of velocity of evaporation.The present invention requires to select the suitable sintered compact of thermal conductivity according to the difference of filming equipment, the homogeneity of the antifouling film that evaporation comes out and stability can both be than the antifouling film that uses absorption carrier evaporation of the prior art effective, see the experimental data in Fig. 5 and the Biao 3-table 8 for details.
The porosity of absorption carrier has determined adsorption time and the adsorptive capacity of deposition material.Porosity is too small, and absorption carrier is slow to the rate of adsorption of deposition material, adsorptive capacity is little, has so both influenced production efficiency, again may be because to be adsorbed the amount of deposition material of carrying too small and can not satisfy the plated film requirement; Porosity is excessive, sneaks into impurity such as dust at first easily, and secondly the effectively year absorption property of absorption carrier can descend.The porosity of absorption carrier provided by the invention is 40%-70%, can satisfy the requirement to carrying adsorptive capacity and rate of adsorption during plated film, can guarantee its carrying absorption property again.Fig. 4 is that the absorption carrier made of raw material is at the section photo of microscopically for porosity 60.7% with the mixture of iron and copper, can see the hole of 1 μ m-30 μ m among the figure, this absorption carrier carrying absorption evaporation amount of solution can account for 60.7% of its volume, under the influence that is not heated principal element such as vaporization, the ratio that the evaporation solution of the absorption of carrying accounts for the supporting body volume is no less than 50%.Absorption carrier carrying adsorption effect therefore of the present invention is relatively good, and the performance of the antifouling film that evaporation comes out is more effective than the antifouling film that uses absorption supporting body evaporation of the prior art, sees and show the experimental data in the 1-table 6 for details.
Hold the crucible of absorption carrier of the present invention during the antifouling film of evaporation, the performance that does not gasify in the time of need having under low vacuum state heating.In addition, hindering deposition material to be carried the material of absorption can not be as the material of crucible.The present invention when evaporation, copper crucible preferably.As shown in Figure 2, in order to cooperate the profile of absorption carrier of the present invention, the shape of crucible is the bottom surface sealing, the oblate column of upper opening, but the shape of opening is not must be circular.
Fig. 3 has illustrated the evaporation coating device of the antifouling film of evaporation that uses among the present invention to comprise vacuum chamber 20, vapor pipe 21 and vacuum pump 22.By vapor pipe 21 and vacuum pump 22, the air in the vacuum chamber 20 can be discharged, during plated film, the pressure of vacuum chamber 20 inside is 10
-2Pa-10
-5About Pa.Be provided with pair of electrodes 23 in vacuum chamber 20 inside, be connected with independent current source 24 in vacuum chamber 20 outer setting.Resistive heating boat 25 is being set on the power pack of electrode 23, and resistive heating boat 25 is electrically connected with electrode 23.On resistive heating boat 25, place the crucible that carries absorption carrier of the present invention.Heating source also can not make and be heated by resistive boat and use electron beam irradiation crucible instead, needs to select to have the vacuum chamber of electron beam illuminating device this moment.Coated basal plate is fixed on the support 26 that is arranged on vacuum chamber 20 tops, during evaporation, absorption carrier provided by the invention is heated, and contains the organic substance that the antifouling film of the formation that is immersed in this absorption carrier uses and is evaporated out, is formed uniformly antifouling film at coated basal plate.
After evaporation finishes, the antifouling film that uses absorption carrier evaporation provided by the invention and the antifouling film that uses other prior art absorption carrier evaporations have been carried out friction resisting power test comparison.Testing method is: at different types of absorption carrier, adopt identical filming equipment, substrate, deposition material, water droplet number to carry out the contrast test of the antifouling film of evaporation, obtain different water droplet contact angles.The water droplet contact angle is the contact angle on water droplet and antifouling film surface, is used for weighing the hydrophilic power of antifouling film, and wetting ability is reacted the height of antifouling film surface quality.The water droplet contact angle is more big, for antifouling film, can make exactly and drop on its surperficial greasy dirt, dirt, the automatic landing of meetings such as dust and the globule or be eliminated clean at an easy rate; On the contrary, the water droplet contact angle is more little, greasy dirt, dirt, and meetings such as dust and the globule are easier to be attached on the antifouling film and to be not easy and remove.When the water droplet contact angle was spent less than 100, the effect of antifouling film can not satisfy mainstream demand in the market.The antifouling film that comes out with absorption carrier evaporation of the prior art, when just evaporation was finished, the water droplet contact angle also can meet the demands, yet because the problem of coating quality, the rub resistance of antifouling film is poor, along with the increase of duration of service, antifouling film is rubbed off gradually, loses effectiveness.So prove the quality of antifouling film quality, the antifouling film that can not only finish firm evaporation is measured, and after also needing antifouling film repeatedly rubbed, measures the number of degrees of its water droplet contact angle.Through after the repeated friction, still can remain on more than 100 degree as the water droplet contact angle, the infringement that can prove antifouling film and be subjected to because of friction is little, then the quality height of antifouling film.
The friction resisting power test result of the antifouling film of use prior art absorption carrier evaporation is as shown in the table:
Table 1
Table 1 is the antifouling film friction testing of the absorption carrier evaporation that adopts prior art table as a result, recorded the water droplet contact angle through 0-6000 antifouling films in friction back in the table, as can be seen the antifouling film that uses different types of prior art absorption carrier evaporation is carried out identical friction number of times (from 0 to 6000 time), during the antifouling film friction to 6000 of high density steel silk flosssilk wadding absorption carrier evaporation time, its water droplet contact angle can't meet the demands; During the antifouling film friction to 2000 of low density steel silk flosssilk wadding absorption carrier evaporation time, its water droplet contact angle just can't meet the demands.During the antifouling film friction to 4000 of steel wool (stainless steel) absorption carrier evaporation time, its water droplet contact angle can't meet the demands.
The concrete outcome of the friction resisting power test of the antifouling film that the absorption carrier evaporation of each embodiment obtains among use the present invention is as follows:
Embodiment 1
It is the sintered compact that raw material forms that present embodiment is selected with single metallic iron.The fusing point of metallic iron is 1535 ℃, and sintering temperature is 1000 ℃-1500 ℃.Can not react with deposition material.And have good ductility and thermal conductivity, cheap, be suitable for industrial production in batches.
Table 2
Table 2 is the antifouling film friction testing of the absorption carrier evaporation that adopts present embodiment table as a result, recorded the water droplet contact angle of 0-27000 antifouling films in friction back, as can be seen after the antifouling film friction to 17000 of adopting the present embodiment absorption carrier time, the water droplet contact angle of its antifouling film also meets the demands, and its friction number of times is considerably beyond the friction number of times of the antifouling film of the absorption carrier evaporation of above-mentioned prior art.
Embodiment 2
It is the sintered compact that raw material forms that present embodiment is selected with the single metal material stainless steel.Stainless steel is that iron and chromium are the alloy of principal element, also is divided into different types of stainless steel because containing nickel, Tan, Molybdenum, Titanium, Columbium, selenium etc.On the whole, the fusing point height of stainless material, sintering temperature is 1000 ℃-1350 ℃, the intensity height is of many uses.
Table 3
Table 3 is the antifouling film friction testing of the absorption carrier evaporation that adopts present embodiment table as a result, recorded the water droplet contact angle of 0-34000 antifouling films in friction back, as can be seen after the antifouling film friction to 29000 of adopting the present embodiment absorption carrier time, the water droplet contact angle of its antifouling film also meets the demands, and its friction number of times is considerably beyond the friction number of times of the antifouling film of the absorption carrier evaporation of prior art.
Embodiment 3
It is the sintered compact that raw material forms that present embodiment is selected with single metallic copper.The fusing point of metallic copper is about 1083 ℃, is lower than iron and stainless fusing point, and for being the sintered compact that raw material obtains with copper, sintering temperature is relatively low, be 500 ℃-1050 ℃, so sintering process is simple relatively.
Table 4
Table 4 is the antifouling film friction testing of the absorption carrier evaporation that adopts present embodiment table as a result, recorded the water droplet contact angle of 0-37000 antifouling films in friction back, as can be seen after the antifouling film friction to 26000 of adopting the present embodiment absorption carrier time, the water droplet contact angle of its antifouling film also meets the demands, and the increase along with the number of times that rubs thereafter, the variation of water droplet contact angle is very little, and its friction number of times is also considerably beyond the friction number of times of the antifouling film of the absorption carrier evaporation of prior art.
Embodiment 4
It is the sintered compact that raw material forms that present embodiment is selected with single metallic aluminium.660 ℃ of the fusing points of metallic aluminium, 200 ℃-650 ℃ of sintering temperatures have good ductility and thermal conductivity, and processing characteristics is good.
Table 5
Table 5 is the antifouling film friction testing of the absorption carrier evaporation that adopts present embodiment table as a result, recorded the water droplet contact angle of 0-27000 antifouling films in friction back, as can be seen after the antifouling film friction to 16000 of adopting the present embodiment absorption carrier time, the water droplet contact angle of its antifouling film also meets the demands, and the increase along with the number of times that rubs thereafter, the variation of water droplet contact angle is very little, and its friction number of times is also considerably beyond the friction number of times of the antifouling film of the absorption carrier evaporation of prior art.
Embodiment 5
It is that raw material carries out sintering that present embodiment is selected the mixture with iron and copper.Using metal mixture to carry out sintering, is to being the further improvement that raw material carries out sintering with single metal, because the characteristic of different metal is different, combines and uses the weak point that can overcome when carrying out sintering with single metal.Selecting a kind of metal during sintering for use is major ingredient, and another kind of metal is auxiliary material.As the metal-powder of auxiliary material, be the complementary materials of major ingredient, need the particle diameter ratio major ingredient little.In the sinter molding operation, for the shape that prevents major ingredient is not damaged, the hardness of auxiliary material need be lower than major ingredient, and fusing point is lower than major ingredient.And for production that can be a large amount of, use the material better than major ingredient lubricating property more favourable.The major ingredient that the absorption carrier that present embodiment provides uses is iron, and auxiliary material is copper.The hardness of copper is lower than iron, and fusing point is about 1083.4 ℃, is lower than the fusing point of iron.And the lubricating property of copper powder is better.To be that particle diameter is the powder of 1-10 μ m as the ironworking of main material before the sintering, metallic copper be processed into particle diameter less than the powder of iron, mixes in proportion.
The ratio of iron copper mixture be copper powder account for weight percent 25%-35%, all the other are iron powder.Iron powder does not react with the deposition material that the antifouling film of formation is used, the intensity height, and price is cheap; But because the iron powder fusing point of simple substance is higher, need the temperature more than 1000 ℃ just can carry out sintering, and sintering temperature can be down to 700 ℃-900 ℃ after adding a certain amount of copper powder, so just can improve the difficulty of processing of sintered compact.If but selected the copper powder of weight percent greatly, could therefore raise the cost, because the price of copper powder is higher than iron powder.Therefore present embodiment at first is to consider that it can be reduced to expected value with sintering temperature to the selection of copper powder weight percent, and next considers that this proportioning can be so that difficulty of processing and cost be moderate.Carry out sintering with metal mixture, compared with carrying out sintering with single metallic substance, more easy to the control of porosity, sintering condition is simpler, is fit to volume production.
Table 6
Table 6 is the antifouling film friction testing of the absorption carrier evaporation that adopts present embodiment table as a result, recorded the water droplet contact angle of 0-27000 antifouling films in friction back, as can be seen after the antifouling film friction to 19000 of adopting the present embodiment absorption carrier time, the water droplet contact angle of its antifouling film also meets the demands, and its friction number of times is also considerably beyond the friction number of times of the antifouling film of the absorption carrier evaporation of prior art.
Shown in table 2-table 6, adopt the absorption carrier of various embodiments of the present invention to carry out evaporation as can be seen, after the friction of the antifouling film that obtains about through 20,000 times, can also keep the water droplet contact angle can satisfy the requirement of antifouling film.The antifouling film various absorption carriers of the prior art before everyways such as homogeneity and rub resistance superorder far away that use absorption carrier evaporation of the present invention to go out have significant lifting to the quality of antifouling film.
Sintering temperature determines that according to requiring for the porosity of sintered compact and the requirement of heat conductivity selects, sintering temperature is that raw material passes through sintering, reaches the temperature that porosity requires when the porous plastid of 40-70% in above-described embodiment.
The above only is embodiments of the invention, and is in order to limit the scope of the present invention, not all within claim scope of the present invention, any modification of doing, is equal to replacement, improvement etc., all should be protected.
Claims (10)
1. absorption carrier that is used for the deposition material of the antifouling film of evaporation, it is characterized in that: described absorption carrier is the sintered compact of metal-powder, a kind of in described metal-powder chosen from Fe, stainless steel, copper, the aluminium or at least two kinds.
2. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 1, it is characterized in that: the particle diameter of described metal-powder is 1 μ m-100 μ m.
3. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 2, it is characterized in that: the preferable particle size of described metal-powder is 1 μ m-10 μ m.
4. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 1, it is characterized in that: described metal-powder is the mixture of iron powder and copper powder.
5. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 4, it is characterized in that: wherein copper powder accounts for 25%-35% of mixture weight per-cent, and all the other are iron powder.
6. according to the absorption carrier of claim 4 or 5 described a kind of deposition materials for the antifouling film of evaporation, it is characterized in that: the particle diameter of described copper powder is not more than the particle diameter of described iron powder.
7. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 1, it is characterized in that: the porosity of described sintered compact is 40%-70%.
8. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 1, it is characterized in that: the thermal conductivity of described sintered compact is 1W/m.K-200W/m.K.
9. the absorption carrier of a kind of deposition material for the antifouling film of evaporation according to claim 1, it is characterized in that: described sintered compact is round pie.
10. production method as the described a kind of absorption carrier of claim 1-9 is characterized in that: described method be with as the metal-powder of raw material with 0ton/cm
2--15ton/cm
2Pressure compacting, pass through the sintered compact behind the sintering of 0.5h--5h again, this sintered compact is porous plastid, is described absorption carrier.
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|---|---|---|---|---|
| CN104480431A (en) * | 2014-10-29 | 2015-04-01 | 苏州东杏表面技术有限公司 | Novel carrier for vacuum surface evaporation technology |
| CN104513950A (en) * | 2014-10-29 | 2015-04-15 | 苏州东杏表面技术有限公司 | Method for rapidly preparing wear-resistant anti-fouling membrane |
| WO2015051604A1 (en) * | 2013-10-12 | 2015-04-16 | 深圳市华星光电技术有限公司 | Vapor deposition device |
| CN107400861A (en) * | 2017-09-21 | 2017-11-28 | 深圳市华格纳米科技有限公司 | One kind automation continous way thermal resistance evaporation coating apparatus |
| JP2020196936A (en) * | 2019-06-04 | 2020-12-10 | 株式会社日立製作所 | Method of molding anisotropic composite material and die using anisotropic composite material |
| CN114622169A (en) * | 2022-04-27 | 2022-06-14 | 华天慧创科技（西安）有限公司 | Antifouling film coating device and antifouling film coating method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05215905A (en) * | 1991-02-27 | 1993-08-27 | Hoya Corp | Optical member with water repellent thin film and its manufacture |
| JP2001131608A (en) * | 1999-11-05 | 2001-05-15 | Sanyo Special Steel Co Ltd | Manufacturing method of sintered filter |
| CN1480745A (en) * | 2002-08-02 | 2004-03-10 | ������������ʽ���� | Optical element |
| JP2006336109A (en) * | 2006-06-22 | 2006-12-14 | Toppan Printing Co Ltd | Method for forming stain preventable thin film |
| JP2008107836A (en) * | 2002-03-18 | 2008-05-08 | Hoya Corp | Process for producing optical member and thin film |
| CN101573320A (en) * | 2006-12-29 | 2009-11-04 | 株式会社晓星 | Method and apparatus for the purification of high-purity 2,6-naphthalene dicarboxylic acid |
| US20100040801A1 (en) * | 2006-09-29 | 2010-02-18 | Takeshi Mitsuishi | Vapor deposition material, process for producing optical member or plastic lens for spectacle with use thereof, and plastic lens for spectacle |
| CN102836997A (en) * | 2011-06-22 | 2012-12-26 | 烟台龙源电力技术股份有限公司 | Metal powder sintered porous body and preparation method thereof |
-
2013
- 2013-04-15 CN CN201310128539.0A patent/CN103205716B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05215905A (en) * | 1991-02-27 | 1993-08-27 | Hoya Corp | Optical member with water repellent thin film and its manufacture |
| JP2001131608A (en) * | 1999-11-05 | 2001-05-15 | Sanyo Special Steel Co Ltd | Manufacturing method of sintered filter |
| JP2008107836A (en) * | 2002-03-18 | 2008-05-08 | Hoya Corp | Process for producing optical member and thin film |
| CN1480745A (en) * | 2002-08-02 | 2004-03-10 | ������������ʽ���� | Optical element |
| JP2006336109A (en) * | 2006-06-22 | 2006-12-14 | Toppan Printing Co Ltd | Method for forming stain preventable thin film |
| US20100040801A1 (en) * | 2006-09-29 | 2010-02-18 | Takeshi Mitsuishi | Vapor deposition material, process for producing optical member or plastic lens for spectacle with use thereof, and plastic lens for spectacle |
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