CN104480431A - Novel carrier for vacuum surface evaporation technology - Google Patents
Novel carrier for vacuum surface evaporation technology Download PDFInfo
- Publication number
- CN104480431A CN104480431A CN201410597062.5A CN201410597062A CN104480431A CN 104480431 A CN104480431 A CN 104480431A CN 201410597062 A CN201410597062 A CN 201410597062A CN 104480431 A CN104480431 A CN 104480431A
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- CN
- China
- Prior art keywords
- carrier
- film
- evaporated
- novel carrier
- evaporation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a novel carrier for a vacuum surface evaporation technology. The novel carrier is provided with stairstep tunnels with different sizes, when an evaporated ingredient is loaded by the carrier, a loading amount is improved because of multiple micropores of the carrier, and in vacuum evaporation, the evaporated ingredient can be fast diffused because of the large-scale tunnels and then be fast evaporated and deposited on the base surface so that a coating is formed.
Description
Technical field
The present invention relates to a kind of vacuum surface evaporation process carrier, specifically refer to and organic compound is loaded on this carrier, then inside vacuum evaporation equipment, adopt resistive heating or electron beam gun type of heating, allow organic compound be evaporated, base material forms overlay coating.
Background technology
Vacuum surface evaporation process is the common major way preparing functional membrane at substrate surface, and the AF film (anti-fingerprint film) being widely used in eyeglass, mobile phone and tablet personal computer display screen etc. at present also adopts this technology mode mostly.The main component of AF film is fluorine substituted hydrocarbon radical silane oxygen base class compound, after being evaporated to substrate surface, namely reacts with the hydroxyl of substrate surface, forms one deck and has hydrophobic and film that is oleophobic function, i.e. so-called AF film.
Stoste (fluorine substituted hydrocarbon radical silane oxygen base class compound) is dispersed in as on Steel Wool, metal core or indifferent oxide carrier by mode main at present, vacuum evaporation equipment adopts resistive heating or electron beam gun type of heating are evaporated by AF component, base material is formed AF film.In evaporate process, no matter being resistive heating or electron beam gun heating, is all the process that temperature raises gradually, when reaching component volatilization temperature, namely wish that component can depart from carrier as early as possible, otherwise because high temperature is by AF component breakage, thus the performance of AF film can be affected.Like this, should preferentially select the carrier of good heat conductivity as Steel Wool or metal core.
But also there is following shortcoming in the Steel Wool carrier used at present.Steel Wool carrier generally all adopts manually ball processed, repressedly to form, so carrier bulk and quality wayward, tightness degree also has very big difference, tightness degree differs the situation that not only has influence on heat conduction but also have influence on the adsorptive capacity of carrier to stoste, situation about occurring is exactly the thickness instability that each evaporation is formed, and the function of film is also unstable.
Metal core carrier is compared with Steel Wool, and volume mass is easy to control, and heat conductivility is fine, and can be made into standardized product, if but select core duct, there is very large problem.As the core selecting duct thick, be conducive to AF diffusion of components out, but because now carrier surface area is less, adsorbable AF stoste may be not enough, thus affect the performance of thickness and film.If but the core carrier adopting duct thin, although adsorbable AF component can increase, the problem brought is then that AF component not easily spreads out, thus by high temperature.
The present invention proposes to adopt the metal core carrier with step duct, has the advantage of aperture carrier and macropore carrier concurrently, is the carrier of excellent AF film and other organic film component evaporation.
Summary of the invention
The object of this invention is to provide a kind of preparation method simple, there is good heat conductivity, evaporation diffusion of components is fast, the surperficial evaporation carrier that adsorptive capacity is large.
Adopt the metal-powder of two kinds of different-grain diameter sizes (being respectively 1000 ~ 2000 orders and 100 ~ 200 orders), make core through high temperature sintering, and cut into desired shape.Metallic copper powder adopts nitrogen atmosphere, at 550 ~ 800 DEG C, forms through 5 ~ 10 hours sintering.Powder of stainless steel adopts nitrogen atmosphere, at 900 ~ 1200 DEG C, forms through 5 ~ 10 hours sintering.
Embodiment
Below by way of specific embodiment, the present invention is described in detail, but should be appreciated that the present invention is not only limited to described embodiment.
Comparative example 1: under nitrogen protection, by raw copper powder (1000 ~ 1200 order) 4g, loading height is 4mm, and internal diameter is in the mould of 5mm, and temperature control, at 600 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier A.
Comparative example 2: under nitrogen protection, by raw copper powder (100 ~ 150 order) 4g, loading height is 4mm, and internal diameter is in the mould of 5mm, and temperature control, at 600 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier B.
Embodiment 1: under nitrogen protection, by raw copper powder (1000 ~ 1200 orders and 100 ~ 150 orders) each 2g, loading height is 4mm; internal diameter is in the mould of 5mm; temperature control, at 600 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier 1.
Embodiment 2: under nitrogen protection, by raw copper powder (1500 ~ 2000 orders and 180 ~ 200 orders) each 2g, loading height is 4mm; internal diameter is in the mould of 5mm; temperature control, at 600 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier 2.
Embodiment 3: under nitrogen protection, by raw material powder of stainless steel (1000 ~ 1200 orders and 100 ~ 150 orders) each 2g, loading height is 4mm; internal diameter is in the mould of 5mm; temperature control, at 1100 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier 3.
Embodiment 4: under nitrogen protection, by raw material powder of stainless steel (1500 ~ 2000 orders and 180 ~ 200 orders) each 2g, loading height is 4mm; internal diameter is in the mould of 5mm; temperature control, at 1100 DEG C, through cooling taking-up after sintering in retort furnace in 10 hours, is carrier 4.
Above-mentioned each routine carrier is immersed AF film stoste thinner 3M hfe7200 5 minutes, blot with filter paper after taking-up and weigh, calculate carrier weightening finish and be respectively: carrier A is 0.5g, carrier B is 0.1g, and carrier 1 is 0.38g, and carrier 2 is 0.41g, carrier 3 is 0.39g, and carrier 4 is 0.42g.Visible step duct novel carriers has larger adsorptive capacity.
With the DSX of large King Company for component, with 3M hfe7200 for solvent, the solution of configuration different concns, according to above-mentioned carrier loaded amount, obtained each particle contains the deposition particle (carrier B can only obtain the particle containing 20mg DSX) of 40mg DSX, at UNIVAC, 1350 type vacuum plating units carrying out AF film evaporation to through cleaning the glass activated, found that evaporation result is as following table:
Note 1: use 0000# Steel Wool to carry out reciprocating machine friction to glass surface, add 1Kg/cm
2load, friction stroke 15cm, friction frequency 40 beats/min, reciprocating friction 2000 times.
Note 2: use rubber to carry out reciprocating machine friction to glass surface, add 500g/cm
2load, friction stroke 15cm, friction frequency 40 beats/min, reciprocating friction 2000 times.
The above results shows, the deposition particle adopting novel carriers to prepare, uses the AF film wear resisting property of rear formation better.
Although describe the present invention in conjunction with the preferred embodiments, should be appreciated that, the present invention should not be limited to these exemplary embodiments, and can carry out various amendment by those skilled in the art when not deviating from essence and the scope of the present invention.
Claims (3)
1. a novel evacuated surperficial evaporation process carrier, is characterized in that with metal being material, has the sand core structure in step duct.
2., according to metal according to claim 1, refer to metallic copper or stainless steel.
3., according to step duct according to claim 1 sand core structure, its method for making is the metal-powder of employing two kinds of different-grain diameters, forms through oversintering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410597062.5A CN104480431A (en) | 2014-10-29 | 2014-10-29 | Novel carrier for vacuum surface evaporation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410597062.5A CN104480431A (en) | 2014-10-29 | 2014-10-29 | Novel carrier for vacuum surface evaporation technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104480431A true CN104480431A (en) | 2015-04-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410597062.5A Pending CN104480431A (en) | 2014-10-29 | 2014-10-29 | Novel carrier for vacuum surface evaporation technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104480431A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1480745A (en) * | 2002-08-02 | 2004-03-10 | ������������ʽ���� | Optical element |
| CN103205716A (en) * | 2013-04-15 | 2013-07-17 | 光驰科技(上海)有限公司 | Adsorption carrier for evaporation material for evaporation of anti-fouling film |
-
2014
- 2014-10-29 CN CN201410597062.5A patent/CN104480431A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1480745A (en) * | 2002-08-02 | 2004-03-10 | ������������ʽ���� | Optical element |
| CN103205716A (en) * | 2013-04-15 | 2013-07-17 | 光驰科技(上海)有限公司 | Adsorption carrier for evaporation material for evaporation of anti-fouling film |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150401 |
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| RJ01 | Rejection of invention patent application after publication |