CN103153036B - To working machine for circuit board - Google Patents
To working machine for circuit board Download PDFInfo
- Publication number
- CN103153036B CN103153036B CN201210526151.1A CN201210526151A CN103153036B CN 103153036 B CN103153036 B CN 103153036B CN 201210526151 A CN201210526151 A CN 201210526151A CN 103153036 B CN103153036 B CN 103153036B
- Authority
- CN
- China
- Prior art keywords
- information
- substrate
- upstream
- stop position
- sidepiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 297
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 118
- 230000033228 biological regulation Effects 0.000 claims description 4
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 78
- 230000002950 deficient Effects 0.000 abstract description 36
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000000638 solvent extraction Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 230000015654 memory Effects 0.000 description 9
- 230000005611 electricity Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Of the invention is the improvement to working machine for circuit board for carrying out operation to making some being divided into the conveying direction of circuit substrate be sequentially located in operating area to working machine for circuit board.Many chamfering substrates are divided into downstream side portion and upstream sidepiece in the conveying direction, and position from the downstream side in installation exercise region to the downstream side of many chamfering substrates that should be consistent with conveys, and shoots downstream side portion reference mark, obtains stop position error.Shooting is arranged at the defective products mark appendix of downstream side portion, and whole unit substrates are detected the presence of with defective products mark.Then, the upstream side of upstream sidepiece should be consistent with the upstream side in installation exercise region position convey many chamfering substrates when, the stop position error that will first obtain is used in the actuating quantity control of the drive motor of base board delivery device, makes the reduction of stop position error.The unit substrate with defective products mark to upstream sidepiece does not carry out the installation of the shooting of reference mark, electronic circuit component.
Description
Technical field
The present invention relates to the operation that is specified to circuit substrate to working machine for circuit board, more particularly to make circuit base
The some being divided into the conveying direction of plate is sequentially located in operating area and is pointed to the part in the operating area
Carry out operation to working machine for circuit board.
Background technology
In as a kind of electronic circuit component mounter to working machine for circuit board, patent document described as follows 1
It is described, it is stipulated that to have the installation for making suction nozzle and base plate keeping device relative movement and installed to circuit substrate electronic circuit component
Operating area.Thus, the size in the direction parallel with conveying direction of the circuit substrate conveyed by base board delivery device is i.e. long
In the case that degree is more long than the length in installation exercise region, circuit substrate exceeds from installation exercise region.Therefore, in patent document 1
In the electronic circuit component mounter of record, circuit substrate is divided into two parts in the conveying direction, from dividing for downstream
Cut part to be sequentially located in installation exercise region, so as to install electronic circuit component to each partitioning portion.In circuit substrate
On be respectively provided with two reference marks for two partitioning portions, the segmentation for being pointed in installation exercise region is shot by camera head
Two reference marks set by part, obtain the site error of the element seating portion in partitioning portion, so that precision is good
Carry out the installation of electronic circuit component.
In addition, following patent documents 2 records a screen process press and many electronic circuit component mounters are lined up
The electronic circuit component hookup wire of one row and composition.The electronic circuit that the electronic circuit component mounter is recorded with patent document 1
Component mounter is same, and the circuit substrate of the length exceeded from installation exercise region is divided into two parts in the conveying direction
To carry out the installation of electronic circuit component.But, in the electronic circuit component mounter that patent document 2 is recorded, for one
A side in two reference marks that partitioning portion is shot by camera head is set to be pre-set at the set mark of circuit substrate
Note, and the opposing party uses features such as through hole, pad, the wiring pattern instead fiducial mark in the composition of circuit substrate
Note.It is bigger than installation exercise region that the operating area of screen process press is presswork region, configurable circuit substrate entirety, therefore
Two reference marks are set only on circuit substrate.On the other hand, in electronic circuit component mounter, two set
One orientation of reference mark can be shot in installation exercise region by camera head, but the opposing party is from installation exercise region
Beyond and can not be taken.Therefore, in screen process press, be set with the reference mark set with two respectively in pairs and with both
Fixed reference mark one is located on the replacement reference mark in installation exercise region, is sent to electronic circuit component mounter and replaced
Reference mark data are used.Further it is sent to down from the electronic circuit component mounter of upstream side instead of reference mark data
Swim the electronic circuit component mounter of side and use.
Following patent documents 3 is recorded and is divided into multiple unit substrates backward by multiple electronic circuit component mounters
Many chamfering substrates install the electronic circuit component hookup wire of electronic circuit component.In the electronic circuit component hookup wire, most
In the electronic circuit component mounter of upstream, in the state of circuit substrate is by positioning finger setting, to multiple unit substrates each
Two reference marks being respectively provided with are shot, and calculate the local of the overall position deviation of circuit substrate and unit substrate
Site error.In addition, the defective products to being respectively arranged at multiple unit substrates marks appendix to shoot, detect whether have
Defective products is marked, and the unit substrate to being marked without defective products carries out the installation of electronic circuit component, not to defective products
The unit substrate of mark carries out the installation of electronic circuit component.And, from the electronic circuit component mounter of most upstream downstream
The adjacent electronic circuit component mounter delivery circuit substrate in side, with the conveying job parallelism by the local position of unit substrate
The data and defective products flag data for putting error are transferred to the adjacent electronic circuit component mounter in downstream.In the electricity in downstream
In sub-circuit component mounter, the detection of reference mark and the defective products mark of unit substrate is not carried out, but come using transferring
Data carry out the installation of electronic circuit component, the peace of electronic circuit component is not carried out to the unit substrate marked with defective products
Dress.Further downstream the electronic circuit component mounter of side transfers for local position error data and defective products flag data.
Patent document 1：Japanese Unexamined Patent Publication 2004-103828 publications
Patent document 2：Japanese Unexamined Patent Publication 2008-218538 publications
Patent document 3：Japanese Unexamined Patent Publication 2000-124676 publications
The content of the invention
The present invention is completed with above-mentioned situation as background, and its problem is, there is provided it is a kind of make circuit substrate defeated
Send some being divided on direction to be sequentially located in operating area and carry out the improvement to working machine for circuit board of operation.
Above-mentioned problem is solved by that will be formed as to working machine for circuit board, i.e. including：（a）Apparatus for work,
Operating area with regulation, the part in the operating area to circuit substrate carries out predetermined operation；（b）Substrate
Conveying device, the circuit substrate is conveyed along conveying direction, make the circuit substrate be divided on the conveying direction it is many
Individual part stops at the target stop position in the operating area successively from the part in downstream；（c）Base plate keeping device,
Fix and keep the circuit substrate of the stopping；（d）Information acquisition device, obtains from the downstream side portion of the circuit substrate for stopping
The related information of the circuit substrate, wherein the downstream side portion is the portion in downstream in some being divided into
Point；（e）Information Pull device, the substrate that the information that will be obtained by the information acquisition device is used to carry out upstream sidepiece is defeated
At least one party in the conveying of device and the operation of the apparatus for work is sent, wherein the upstream side portion is than the downstream side portion
Part in more upstream side, also, described information acquisition device includes upstream sidepiece information acquiring section, the upstream sidepiece letter
Breath obtaining section obtains upstream sidepiece information, the upstream sidepiece letter from the upstream sidepiece information recording part of record upstream sidepiece information
Breath record portion located at the base plate keeping device keep circuit substrate the downstream side portion, the upstream sidepiece information be with
The related information of the upstream sidepiece；Also, described information includes utilizing operation in portion using device, described to utilize portion to operation
The information that the upstream sidepiece information acquiring section is obtained is used for the operation that the apparatus for work is carried out to the upstream sidepiece.
In composition as described above is to working machine for circuit board, it is located in operating area in the downstream side portion of circuit substrate
In the state of obtain upstream sidepiece information.Thus, for example, making the upstream side of circuit substrate be carried out in operating area
During operation, the acquirement of upstream sidepiece information can not be carried out, it is possible to increase operating efficiency.It is located in the downstream side portion of circuit substrate
Upstream sidepiece information is obtained in the state of in operating area needs the time, but for example passes through and the information one related to downstream side portion
With obtaining, compared with the acquirement for carrying out downstream side portion information respectively and the situation of the acquirement of upstream sidepiece information, acquirement can be shortened
Time, the circuit substrate overall activity duration is shortened.Or, even if upstream side in the state of in operating area not
When can obtain upstream sidepiece information, it is also possible to obtain upstream sidepiece information, can be used in operation.
The form of invention
Below, it is considered as requiring the invention of patent right in illustration the application（Hereinafter, sometimes referred to as " can prescription
Invention ".Can prescription invention include claims record invention i.e. the present application subordinate concept invent, this Shen
The invention of the upperseat concept or other concepts that please invent）Some modes, and these modes are illustrated.Each mode and right
Requirement similarly divides into item, and items are carried sequence number, as needed, recorded in the form of the sequence number for quoting other.This
Be eventually in order to be readily appreciated that can prescription invention, be not meant to will constitute can prescription invention inscape group
Conjunction is defined in the record of the following.I.e., in order to be sufficiently accurate it may be desired to which the invention of right should refer to every subsidiary record, the note of implementation method
Load, prior art, common technical knowledge etc. explain, as long as following its explanation, other structures is further attached with every mode
Mode into key element, also have the mode that inscape is deleted from every mode can all turn into can prescription invention one
Individual mode.
In addition, in following items,（3）Equivalent to the technical scheme 1 in claims,（5）Item is equivalent to skill
Art scheme 2,（8）Equivalent to technical scheme 3,（9）Item is equivalent to technical scheme 4.
（1）It is a kind of to working machine for circuit board, including：
Apparatus for work, the operating area with regulation, the part in the operating area to circuit substrate is carried out
Predetermined operation；
Base board delivery device, the circuit substrate is conveyed along conveying direction, make the circuit substrate in the conveying direction
On the target stop position that is stopped at successively from the part in downstream in the operating area of some that is divided into；
Base plate keeping device, circuit substrate that is fixed and keeping the stopping；
Information acquisition device, is in downstream from some being divided into described in of the circuit substrate for stopping
The downstream side portion of the part of side obtains the related information of the circuit substrate；
Information Pull device, the information obtained by the information acquisition device is used for being in as than the downstream side portion
In the conveying of the base board delivery device that the upstream sidepiece of the part of more upstream side is carried out and the operation of the apparatus for work
At least one party.
For example have in working machine for circuit board electronic circuit component mounter, solder printing machine, adhesive coating machine,
Circuit substrate testing machine etc..
Circuit substrate both can in the conveying direction be divided into two parts, it is also possible to be divided into the part of more than three.
In the state of upstream sidepiece is not located at operating area, the information utilized to the upstream sidepiece can be obtained, by this
Utilize, for example, can obtain raising, the raising of workability, executableization of operation of the stop position precision of circuit substrate etc. each
Plant effect.
（2）Such as（1）Described in working machine for circuit board, wherein, described information acquisition device include upstream sidepiece letter
Breath obtaining section, the upstream sidepiece information acquiring section obtains upstream from the upstream sidepiece information recording part of record upstream sidepiece information
Sidepiece information, the downstream of the circuit substrate that the upstream sidepiece information recording part keeps located at the base plate keeping device
Portion, the upstream sidepiece information is the information related to the upstream sidepiece.
Upstream sidepiece information for example, by mark, bar code, the reading of Quick Response Code, be opened in circuit substrate hole detection
Or IC of the write-in with antenna（Integrated Circuit）Chip（For example, label chip）The reception of information obtain,
Upstream sidepiece information recording part is made up of the mark etc. of circuit substrate, the IC chip that is arranged at circuit substrate.
（3）Such as（2）Described in working machine for circuit board, wherein, described information using device include to operation utilize
Portion, the information for utilizing portion to obtain the upstream sidepiece information acquiring section to operation is used for the apparatus for work to described
The operation that trip sidepiece is carried out.
（4）Such as（2）Xiang Huo（3）Described in working machine for circuit board, wherein, the circuit substrate is divided into many after being
Many chamfering substrates of individual unit substrate, the upstream sidepiece information acquiring section includes bad unit substrate information acquiring section, described
Bad unit substrate information acquiring section obtains the bad list in the more than one unit substrate represented contained by the upstream sidepiece
The bad unit substrate information of position substrate.
It is applicable（2）And（3）The circuit substrate of the technical scheme of item may not be many chamfering substrates.But, many chamferings
Substrate exceedes operating area mostly than the size in larger, parallel with conveying direction direction, therefore is divided into the conveying direction
Some can effectively play effect of the invention in many cases come to carry out operation be effective.
Circuit substrate is many chamfering substrates and upstream sidepiece packet include bad unit substrate information not all the time must one
Rise and use, for example, circuit substrate is many chamfering substrates, and can both be adopted together with the sidepiece packet specify information containing operation of upstream
With, it is also possible to it is used together comprising stop position error obtaining section with information acquisition device.
（5）Such as（4）Described in working machine for circuit board, wherein, it is described to operation using portion include to bad unit
Base board operation prohibition unit, it is described that bad unit substrate operation prohibition unit is forbidden to represent not the bad unit substrate information
Good unit substrate carries out the operation of the apparatus for work.
Bad unit substrate has certain defect such as unfavorable condition of wiring pattern, is made even with apparatus for work
Industry, is also unusable substrate as product, by forbidding for operation, can avoid invalidly carrying out operation.
（6）Such as（3）Described in working machine for circuit board, wherein, the upstream sidepiece information acquiring section comprising obtain
The upstream sidepiece operation specify information obtaining section of operation specify information, the operation specify information is used as the upstream sidepiece information
Specify the operation that should be carried out to the upstream sidepiece；Described being included using portion to operation is performed by the work to the upstream sidepiece
The assignment enforcement division of the operation that industry specify information is specified.
（7）Such as（1）~（6）Any one of it is described to working machine for circuit board, wherein, the substrate conveying dress
Put the conveyer belt by rotating and support circuit substrate, by the control realization of the actuating quantity of the drive motor by rotating the conveyer belt
The control of fed distance of the circuit substrate control the stop position of circuit substrate；Described information acquisition device is included and stopped
Only site error obtaining section, the stop position error obtaining section shoots the described of the circuit substrate that stops at the stop position
The reference mark that downstream side portion is set, according to the shooting result, obtain actual stop position as the downstream side portion relative to
The stop position error of the error of the target stop position.
Above-mentioned " shooting of the reference mark that downstream side portion is set " can both be kept filling in the circuit substrate for stopping by substrate
Carried out after putting holding, it is also possible to carried out before holding.
（8）Such as（7）Described in working machine for circuit board, wherein, described information using device include stop position miss
Difference uses portion, and the stop position error for obtaining is used the stop position error institute of the circuit substrate using portion
State the driving of the upstream sidepiece to the base board delivery device of the conveying of the target stop position in the operating area
In the control of the actuating quantity of motor.
The stop position error of upstream sidepiece can be produced because of a variety of causes, for these reasons, it may appear that be produced and electricity
The situation of the stop position error that the fed distance of base board is directly proportional, occur unrelated with fed distance and produce constant stopping
The situation of site error.Even if in addition, circuit substrate conveying from downstream side portion to assigned position when, can also produce stop position
Error is put, but in conveying of the upstream sidepiece to assigned position, does not also produce the stop position error of same cause sometimes.Cause
This, it is generally desirable to, by by the stopping of downstream side portion the reason for stop position error is occurred using portion according to stop position error
Site error is used in the control of the actuating quantity of the drive motor of the conveying of upstream sidepiece, makes the stop position of upstream sidepiece
Error reduction.
By the use of stop position error, the stop position error in the operating area of upstream sidepiece can be reduced.By
This can obtain following effect：For example, the site error reduction of the reference mark that the upstream sidepiece of circuit substrate is set, in shooting
When device carries out the shooting of reference mark, reference mark is not easily disconnected from the visual field, easily shoot, or reference mark from shoot center
Deviation reduction, the position of reference mark obtains precision and improves.In addition, in the case of stop position error is king-sized, according to reason
Say job position in the head moving device moving range that should be at enabling operation head mobile departing from can moving range, just
The state of affairs that operation can not possibly be carried out can occur, or, even if it is not the so serious state of affairs that homework precision decline can also occur, but
The present invention can avoid the generation of that state of affairs.
In addition, above-mentioned " target stop position " both can be in the case where operating area be transported to and will be upper by downstream side portion
Trip sidepiece is transported to identical in the case of operating area, it is also possible to different.
In addition, as drive motor, it is preferred to use the accurate control of the achievable rotation amount such as impulse motor, servo motor
Motor, but it is not essential, by the control of common ac motor or the actuation time of dc motor, it is also possible to control
Actuating quantity processed.For example, be also can using the displacement of circuit substrate as ribbon conveyer translational speed and drive motor
The product of actuation time is obtained, and this drive motor has the advantages that cheap but opposite one side, it is difficult to control exactly
The displacement of circuit substrate processed.Changing a kind of view is exactly, it may also be said to which this invention is just especially effective in this case.
（9）Such as（8）Described in working machine for circuit board, wherein, the stop position error is using portion comprising simple
Addition operation division, the simple addition operation division by with the symbol of the stop position error it is positive and negative in turn obtained from be worth it is right
The actuating quantity answered and institute from the upstream sidepiece of the circuit substrate to the conveying of the assigned position in the operating area
The actuating quantity for stating drive motor is added.
Such as（8）It is described, it is generally desirable to which that the occurrence cause of the stop position error according to circuit substrate uses downstream
The stop position error in portion, but the stop position error of downstream side portion actually occurs already, it is therefore desirable that at least mistake
Difference is cancelled in conveying of the upstream sidepiece to assigned position.
Brief description of the drawings
Fig. 1 be denoted as can prescription invention implementation method electronic circuit component mounter plan；
Fig. 2 is the side view of the installation unit for representing the erecting device for constituting above-mentioned electronic circuit component mounter；
Fig. 3 is the frame of the composition for conceptually representing the control device being controlled to above-mentioned electronic circuit component mounter
Figure；
Fig. 4 is to represent putting down for many chamfering substrates that electronic circuit component is provided with above-mentioned electronic circuit component mounter
Face figure；
Fig. 5（a）It is to represent that above-mentioned many chamfering substrates stop at the plan of the state of first object stop position, Fig. 5（b）
It is to represent that above-mentioned many chamfering substrates stop at the plan of the state of the second target stop position；
Fig. 6 is the substrate conveying-element of the RAM storages of the control computer for representing the main body for constituting above-mentioned control device
The flow chart of set-up routine；
Fig. 7 is LED and resistor are provided with the electronic circuit component mounter for be denoted as other embodiment many
The plan of chamfering substrate；
Fig. 8（a）It is the plan of the state that many chamfering substrates for representing shown in Fig. 7 stop at first object stop position,
Fig. 8（b）It is to represent that many chamfering substrates stop at the plan of the state of the second target stop position.
Description of reference numerals
40 circuit substrates（Many chamfering substrates）
150 unit substrates
162nd, 164 partitioning portion
184 defective products are marked
Chamfering substrate more than 200
202 unit substrates
222 downstream side portions
224 upstream sidepieces
Specific embodiment
Below, referring to the drawings pair can several implementation methods of invention of prescription illustrate.In addition, in order to be sufficiently accurate it may be desired to right
Invention in addition to following implementation methods, can also by above-mentioned (form of invention) items described in the way of based on, to be based on
The knowledge of those skilled in the art implements the mode of various changes to implement.
Fig. 1 is denoted as the electronic circuit component mounter of embodiment of the present invention.This electronic circuit component mounter has
It is standby：It is support 10, base board delivery device 12, base plate keeping device 14, the loader formula of fitting machine main body as working rig main body
Component supplying apparatus 16, pellet type element supplying device 18, apparatus for work are erecting device 20, reference mark camera head 22
（Reference picture 2）, element camera head 24 and control device 26（Reference picture 3）.
In the present embodiment, base board delivery device 12 is made up of ribbon conveyer, comprising：Respectively rotatably it is held in
A pair of ring-type conveyer belts 32 of side frame 30（What is represented in Fig. 2 is the frame 30 and conveyer belt 32 of side）With band whirligig 34
（Reference picture 3）.Band whirligig 34 possesses：Driving source is drive motor 36, the multiple rollers around extension conveyer belt 32（It is not shown）, electricity
Its both side edges portion of base board 40 is supported from below by conveyer belt 32 respectively, defeated with flat-hand position by the rotation of conveyer belt 32
Send.In the present embodiment, drive motor 36 is that impulse motor is constituted by a kind of electronic rotation motor as electro-motor,
The fed distance of circuit substrate 40 is controlled by the control that its actuating quantity is rotation amount, circuit substrate 40 is stopped at arbitrarily
Position.As drive motor, it is also possible to replace impulse motor using the servo motor with encoder.
As shown in figure 1, circuit substrate 40 is substrate by substrate detection apparatus to the feeding of this electronic circuit component mounter
Sensor 44 is sent into detect.In the present embodiment, substrate sends into sensor 44 by as a kind of of non-contact sensor
Photoelectric sensor is that transmission-type photoelectric sensor is constituted, comprising illuminating part 46 and light accepting part 48.Illuminating part 46 and light accepting part 48 that
This is respectively arranged at a pair of ends in upstream side on the conveying direction of circuit substrate 40 of side frame 30 opposite to each other, in electricity
The width of base board 40（It is orthogonal with conveying direction in a plane parallel with a kind of mounted face as the scope of operation
Direction）On to be separated by ground opposite, in the state of the light of light accepting part 48, export ON signals, in the state of not light, output
OFF signal.
Though base plate keeping device 14 omits diagram, possesses the supporting member of supporting circuit substrate 40 from below and by circuit
The secure component that the both side edges portion parallel with conveying direction of substrate 40 fastens respectively, electronics electricity is installed to circuit substrate 40 with it
The mounted face of circuit component is fixed and keeps as horizontal posture.In the present embodiment, by base board delivery device 12
The conveying direction of circuit substrate 40 be set to X-direction, by the quilt with the circuit substrate 40 for being held in base plate keeping device 14
The parallel plane of mounting surface is that in the horizontal plane and orthogonal direction of X-direction is set to Y direction.
As shown in figure 1, loader formula component supplying apparatus 16 are the dresses that electronic circuit component is supplied by multiple loaders 50
Put.Multiple loaders 50 position the multiple loader maintaining parts for being held in the loader holding station 52 set by support 10 respectively,
Set along the state of the straight line parallel with X-direction with each component feeding portion.Pellet type element supplying device 18 is
By multiple pallets 54（Diagram has one in Fig. 2）Supply the device of electronic circuit component.Component supplying apparatus 16,18 are in X-axis side
Set up in the part corresponding with the central portion of substrate transport path of support 10, substrate conveying is arranged in the Y-axis direction
The both sides of device 12.Aforesaid substrate holding meanss 14 are arranged at midway, the support 10 and component feeding of substrate transport path
Device 16,18 corresponding parts.
As shown in figure 1, erecting device 20 includes a kind of mounting head 60 and head moving device 62 as operation head.Intrinsic safety
The structure of assembling device 20 is roughly the same with what Unexamined Patent 6-291490 publications were recorded, structure and the Unexamined Patent 4- of mounting head 60
It is roughly the same that No. 372199 publications are recorded, and is briefly described herein.
As shown in Fig. 2 mounting head 60 is mainly included：Mounting head main body 70；In leading section to adsorbable holding electronic circuit
The component holding members of element 72 are that suction nozzle 74 is kept and holding that is rotatable and being liftably held in mounting head main body 70
Part holding member is suction nozzle retainer 76, with drive motor 78 lifts as driving source the retainer that suction nozzle retainer 76 is lifted
Device 80, make the support whirligig that suction nozzle retainer 76 rotates about the axis thereof with drive motor (not shown) as driving source
82.Suction nozzle 74 is connected with negative pressure source (not shown), and electronic circuit component 72 is adsorbed by negative pressure.
Head moving device 62 makes mounting head 60 to in the quilt with the circuit substrate 40 for being held in base plate keeping device 14
During cross one another both direction is both direction mutually orthogonal in the present embodiment in the parallel plane of mounting surface
The direction movement of the composition of at least one party.X-direction is a direction in mutually orthogonal both direction, and Y direction is another
One direction, as shown in figure 1, head moving device 62 possesses X-direction mobile device 90 and Y direction mobile device 92.X-axis side
Be arranged at support 10 to mobile device 90, comprising movable member it is a kind of i.e. as moving parts X-axis sliding part 94, make X-axis
The X-axis sliding part drive device 96 that sliding part 94 is moved along X-direction.Y direction mobile device 92 is arranged at X-axis sliding part
94, comprising Y-axis sliding part 98, make the Y-axis sliding part drive device 100 that Y-axis sliding part 98 moves along Y direction.
X-axis, Y-axis sliding part drive device 96,100 are respectively drive motor 102,104 and feed screw comprising driving source
Mechanism 106,108.Feed screw mechanism 106,108 includes externally threaded item and the nut for mutually screwing togather respectively, in this embodiment party
In formula, ball screw framework is set to.In addition, as drive motor 102,104, using the servo motor for for example carrying encoder.
Mounting head 60 is arranged at Y-axis sliding part 98, is moved in the horizontal direction by head moving device 62, to across component supplying apparatus
16th, 18 each component feeding portion and the moving area of base plate keeping device 14 are as the installation exercise region of regulation operating area
（Reference picture 1）Interior optional position movement.Head moving device 62 be make mounting head 60 and base plate keeping device 14 along be held in
One kind of the relative movement device of the parallel direction relative movement in the mounted face of the circuit substrate 40 of base plate keeping device 14, phase
Both can be using the device for making base plate keeping device and operation head both sides all move to mobile device, it would however also be possible to employ only make substrate
The device of holding meanss movement.
Said reference mark camera head 22 is that CCD camera is constituted by image pick-up device, as shown in Fig. 2 being arranged at Y-axis sliding part
98.Reference mark camera head 22 is together moved with mounting head 60 by head moving device 62, can be shot positioned at installation exercise
The surface comprising mounted face or optional position above of the circuit substrate 40 in region.Head moving device is also shooting
Device mobile device.As image pick-up device, it is also possible to use CMOS cameras.
Said elements camera head 24 possesses CCD camera（It is not shown）And guiding device（In Fig. 1, only diagram has composition
The speculum 110 of guiding device）, it is respectively arranged at the base board delivery device 12 and component supplying apparatus 16,18 of X-axis sliding part 94
Between part.
As shown in figure 3, above-mentioned control device 26 is constituted based on control computer 120, via driving circuit 122,
Driving source of various devices of this electronic circuit component mounter etc. is constituted to the grade of drive motor 36 to be controlled.Calculated in control
Be connected with the input/output interface of machine 120 substrate feeding sensor 44, to being taken the photograph by reference mark camera head 22 and element
Pattern process computer 130, the driving horse of X-axis sliding part drive device 96 processed as the data that the shooting of device 24 is obtained
Up to the encoder 132 of 102 grade settings（In Fig. 3, typically diagram has one）Deng.In addition, in the RAM of control computer 120
It is stored with for the various journeys that electronic circuit component is installed to circuit substrate 40 based on the interior routine represented with Fig. 6 flow charts
Sequence and data etc..
In this electronic circuit component mounter, as in conceptual view in figure 4, the circuit substrate of electronic circuit component is installed
40 is, for example, many chamfering substrates that multiple unit substrates are divided into after electronic circuit is made.After, circuit substrate 40 is claimed
It is many chamfering substrates 40.Many chamfering substrates 40 shown in Fig. 4 are divided into four unit substrates 150.These unit substrates 150
Size and circuit pattern（Wiring pattern）It is identical, retain the periphery of many chamfering substrates 40 and in many chamfering substrates 40 and conveying side
To being respectively provided with two respectively on parallel direction and width.
Many chamfering substrates 40 are set to the length of the size i.e. length than installation exercise region in the direction parallel with conveying direction
It is long and shorter than 2 times of its length.Thus, many chamfering substrates 40 exceed from installation exercise region in the conveying direction, therefore fall more
Angular substrate 40 is divided into two parts 162,164 in the conveying direction, and electronics electricity is carried out to each partitioning portion 162,164
The installation of circuit component.One length of unit substrate 150 is shorter than the length in installation exercise region, and many chamfering substrates 40 are with unit base
Plate 150 is divided into the part of equalization for unit.After, according to circumstances, will in the conveying direction be located at the part in downstream
I.e. partitioning portion 162 is referred to as downstream side portion 162, is that partitioning portion 164 is referred to as upstream sidepiece 164 by the part of upstream side.
As shown in figure 4, in the periphery 170 for being not provided with unit substrate 150 of many chamfering substrates 40, to downstream side portion 162
And upstream sidepiece 164 is respectively provided with multiple such as two reference marks 172,174 respectively.Such as Fig. 5（a）It is shown, two reference marks
172 are respectively arranged in the state of the downstream side of many chamfering substrates 40 and the downstream side in installation exercise region are consistent：Week
One corner of the end of downstream side of edge 170 and periphery 170 in the part in installation exercise region relative to above-mentioned
One corner of end of downstream side and the part that is separated by the diagonal directions.In addition, such as Fig. 5（b）It is shown, two reference marks
174 are respectively arranged in the state of the upstream side of many chamfering substrates 40 and the upstream side in installation exercise region are consistent：Week
One corner of the upstream-side-end of edge 170 and periphery 170 in the part in installation exercise region relative to upstream
One corner of side end and the part that is separated by the diagonal directions.Can also respectively in downstream side portion 162, the sidepiece of upstream
Two positions being separated by the diagonal directions in 164 set reference mark.
In addition, two corners being separated by the diagonal directions respectively in four unit substrates 150 are respectively equipped with benchmark
Mark 176.After, reference mark 172 is referred to as downstream side portion reference mark 172, reference mark 174 is referred to as upstream sidepiece base
Fiducial mark note 174, unit substrate reference mark 176 is referred to as by reference mark 176.
The part that is also included in downstream side portion 162 in the periphery 170 of many chamfering substrates 40, many chamfering substrates 40
End on conveying direction positioned at downstream is provided with defective products mark appendix 182.Defective products mark is to represent unit substrate 150
It is the mark of the information of bad unit substrate, the unit substrate 150 that circuit pattern generates unfavorable condition is additional to, in this implementation
In mode, the instruction of the installation exercise for not implementing electronic circuit component to the unit substrate 150 is sent.Therefore, defective products mark
The quantity of appendix 182 is identical with unit substrate 150, and four are provided with many chamfering substrates 40 shown in Fig. 4.Four defective products
Mark appendix 182 position respectively in periphery 170 and it is corresponding with unit substrate 150, two of which with set
In two correspondences of unit substrate 150 of upstream sidepiece 164, the defective products mark for adding thereon represents the unit of upstream sidepiece 164
Substrate 150 is bad unit substrate.
Before many chamfering substrates 40 are admitted to this electronic circuit component mounter, four unit substrates 150 are examined respectively
The unfavorable condition that electronic circuit is formed with the presence or absence of electronic circuit component can not be installed is looked into, if there is that unfavorable condition,
Then by the additional defective products mark 184 of operator.As shown in figure 5, for example being carried out to defective products mark appendix 182 by operator
Coloring or stickup seal carry out additional defective products mark 184.Due to by attached to defective products mark by reference mark camera head 22
Plus portion 182 is shot to detect defective products mark 184, therefore so that the contrast between the surface of many chamfering substrates 40 is big
The mode that the picture for outwardly obtaining defective products mark 184 of many chamfering substrates 40 can be clearly distinguishable from is set.In addition, defective products
Mark appendix 182 is set to the teat or recessed recess that for example the overall surface from many chamfering substrates 40 protrudes, so that operation
The defective products mark Appendage Task that person is carried out becomes easy, and is attached on the position of setting exactly.
Conveying and electronic circuit component based on the substrate conveying and element set-up routine shown in Fig. 6 to many chamfering substrates 40
Installation illustrate.
First, step 1 is performed（After, referred to as S1.Other steps are also identical）, base board delivery device 12 is acted, from
The device of upstream side（It is not shown）Many chamfering substrates 40 are sent into electronic circuit component mounter.Sensor 44 is sent into by substrate
Detection signal be changed into OFF signal from ON signals, detect the downstream side of many chamfering substrates 40, and then, by from OFF signal
It is changed into ON signals, detects overall being admitted in base board delivery device 12 of many chamfering substrates 40 and be in and supported by ribbon conveyer
State.Many chamfering substrates 40 by from the substrate integrally send into position be transported to downstream side should with installation exercise region under
Swim the consistent position of side and stop（Reference picture 5（a））.Should be with installation exercise region by the downstream of many chamfering substrates 40
Side consistent position in downstream is referred to as first object stop position.Position is integrally sent into from substrate and is stopped to first object is stopped at
The fed distance of many chamfering substrates 40 untill position is from the substrate test position and installation for being provided with substrate feeding sensor 44
The distance between downstream side of operating area subtracts the distance obtained by the length of many chamfering substrates 40, and the distance is scaled
The umber of pulse of drive motor 36 and preset, for the control of drive motor 36.
After stopping, S2 is performed, many chamfering substrates 40 are kept by base plate keeping device 14.Next, performing S3, make
Reference mark camera head 22 is moved, and two downstream side portion reference marks 172 are shot respectively.Photographed data is by image
Reason computer 130 is processed, and obtains mechanical coordinate of two downstream side portion reference marks 172 relative to electronic circuit component mounter
Each position data.Two X-axis of downstream side portion reference mark 172, each position error of Y direction are calculated, bag is calculated
Rotational position errors containing many chamfering substrates 40（Around the site error that the axis at a right angle with mounted face rotates）In interior position
Put error.
In addition, two average values of the site error of each X-direction of downstream side portion reference mark 172 are calculated, as
The actual stop position of many chamfering substrates 40 is stop position error relative to the error of first object stop position, is added positive and negative
Symbol and be stored in control computer 120 RAM set stop position error memory.Here, in the conveying direction, by under
Trip side is set to just, upstream side is set to bear.Therefore, if the actual stop position of many chamfering substrates 40 is than in predetermined design
Stop position is more biased against downstream in the conveying direction, then stop position error is on the occasion of if being biased against upstream side, becoming negative
Value.Stop position error memory constitutes memory cell.Other memories are similarly.Alternatively, it is also possible to by two downstream side portions
The site error of the X-direction of the side in reference mark 172 is set to the stop position error of many chamfering substrates 40.In S3,
The stopping of the site error of the downstream side portion reference mark 172 calculated by pattern process computer 130 and many chamfering substrates 40
Site error is read into control computer 120.
In addition, based on two each position errors of downstream side portion reference mark 172, work is also set with addition to mechanical coordinate
It is the operation coordinate of the virtual coordinates dreamed up on circuit substrate, the action related to downstream side portion 162 below is indicated, made
Industry is indicated by specifying the position in the operation coordinate to carry out.Thus, in the action and operation being instructed to, downstream side portion
Site error on 162 mechanical coordinate is eliminated.
Next, performing S4, reference mark camera head 22 is moved, the complete of appendix 182 is marked to four defective products
Portion is shot.After shooting, perform S5, on four wholes of unit substrate 150, obtain respectively unit substrate it is good/it is bad
Information.First, image procossing is carried out to photographed data by pattern process computer 130, to four defective products mark appendix 182
Detect whether that, with defective products mark 184, its result is read in by control computer 120.And, if marked with defective products
184, then mark the position of appendix 182 to determine bad unit substrate by the defective products with defective products mark 184
150, the data and expression for determining bad unit substrate 150 are the data storages of bad unit substrate in control computer 120
Unit substrate that RAM is set is good/flame memory.If defective products mark appendix 182 is not marked with defective products
184, it is determined that be that the data of good unit substrate 150 and the data storage of the good unit substrate of expression are good in unit substrate
Good/flame memory.It is set to herein, a side of two unit substrates 150 of upstream sidepiece 164 is bad unit substrate
150, it is attached defective products mark 184 with the corresponding defective products of bad unit substrate 150 mark appendix 182.
Next, performing S6~S10, two unit substrates 150 included to downstream side portion 162 carry out electronic circuit unit
The installation of part.Electronic circuit component is preset to the erection sequence of these unit substrates 150, in S6, first to installing
The unit substrate 150 of electronic circuit component read unit substrate it is good/flame, based on the information for reading, in S7, carry out
Unit substrate 150 whether be bad unit substrate judgement.If not bad unit substrate, then S7 is "No", performs S8, by
Two unit substrate reference marks 176 of reference mark camera head 22 pair shoot, and calculate and are set in unit substrate 150
The each position error of element seating portion.The site error includes X-axis, each position error of Y direction and rotational position errors.
Next, performing S9, electronic circuit component is installed in the element seating portion of unit substrate 150.Mounting head 60 is led to
Cross head moving device 62 to move, electronic circuit component is taken out from a side of component supplying apparatus 16,18, be installed on unit substrate
150 element seating portion.The installation action of electronic circuit component is it is well known that omitting the description.After installation, S is performed
10, the judgement of the installation for being made whether to have carried out electronic circuit component to the whole unit substrates 150 contained by downstream side portion 162.
If do not completed, the judgement of S10 is "No", and the execution of routine returns to S6.If unit substrate 150 is bad unit base
Plate, then the result of determination of S7 is "Yes", skips S8, S9, performs S 10.For bad unit substrate 150, forbid and do not carry out list
The shooting of position substrate fiducials mark 176 and the installation exercise of electronic circuit component.
If two unit substrates 150 are performed with S6~S9, the judgement of S10 reforms into "Yes", performs S11, releases base
The holding of plate holding meanss chamfering substrate 40 more than 14 pairs.And, many chamfering substrates 40, and conveying are conveyed by base board delivery device 12
To the upstream side of many chamfering substrates 40 should be consistent with the upstream side in installation exercise region position and stop（Reference picture 5
（b））.Position that should be consistent with the upstream side in installation exercise region by the upstream side of many chamfering substrates 40 is referred to as the second mesh
Mark stop position.Fed distance now is obtained by subtracting the length in installation exercise region from the length of many chamfering substrates 40
Distance.The distance can obtain in design, is scaled the number of drive pulses of drive motor 36 and presets.The setting drives
Umber of pulse is corrected based on the stop position error of the first object stop position of many chamfering substrates 40 obtained in S3.Stop
Site error is scaled the number of drive pulses of motor 36, if its symbol will be for just, being added in setting number of drive pulses will
Symbol becomes the value of negative gained, if symbol is negative, plus the value that symbol is become positive gained in setting number of drive pulses,
Drive motor 36 is come with thus obtained umber of pulse, the stop position error of many chamfering substrates 40 can be reduced.
After the stopping of many chamfering substrates 40, S12 is performed, many chamfering substrates 40 are kept by base plate keeping device 14.And
And, S13 is performed, reference mark camera head 22 is moved, upstream side reference mark 174 is shot, calculate upstream sidepiece 164
Site error, sets as the working space of Virtual Space to upstream sidepiece 164.At this time it is also possible to be based on the downstream for first obtaining
The position deviation of the Y direction of side reference mark 172, the position to the Y direction of reference mark camera head 22 is modified.
Next, performing S14~S18 in the same manner as S6~S10, the unit substrate of the unit substrate 150 contained by upstream sidepiece 164 is carried out
The shooting of reference mark 176, the calculating of the site error of element seating portion and the installation of electronic circuit component.On the unit
Substrate 150, by the execution of S4 and S5 have been achieved with unit substrate it is good/flame, shooting unit substrate reference mark
Before 176, from unit substrate it is good/flame memory read unit substrate it is good/flame, for the judgement of S15.
Here, the side in two unit substrates 150 contained by upstream sidepiece 164 is bad unit substrate, the judgement of S15
Become "Yes", skip S16, S17, do not carry out the shooting of unit substrate reference mark 176 and the installation of electronic circuit component.If
S14~17 are performed to whole unit substrates 150, then S18 becomes "Yes", perform S19, release the holding of many chamfering substrates 40
And send out.
Explanation more than, in the present embodiment, defective products mark appendix 182 constitutes upstream sidepiece information note
Record portion.In addition, the part of the execution S3 of control computer 120 constitutes stop position error obtaining section, the part of S4 and S5 is performed
It is bad unit substrate information acquiring section to constitute upstream sidepiece information acquiring section, and they are with the isomorphism of reference mark camera head 22 1
Into information acquisition device.In addition, the part of the execution S11 of control computer 12 constitutes the list using portion as stop position error
Pure addition operation division, perform S14, S15 part constitute as to operation utilize portion to bad unit substrate operation prohibition unit,
The configuration information of control computer 120 utilizes device.
In addition, in the above-described embodiment, it is different with the target stop position of upstream sidepiece 164 in downstream side portion 162, but
Can be with identical.For example, the target stop position of upstream portion 164 is set into side downstream should be with the downstream in installation exercise region
The consistent position in end.In addition, target stop position is not limited to the end position consistent with the end of operating area of partitioning portion
Put, as long as the partitioning portion for carrying out operation is integrally located at the position in operating area.
Based on Fig. 7 and Fig. 8 and to install multiple light emitting diodes on circuit substrate（Hreinafter referred to as LED）Situation
As a example by be that the implementation method of the information different from bad unit substrate information is illustrated to upstream sidepiece information.
LED has the multiple advantage such as efficiency high, long lifespan, cheap, and multiple can be installed on one piece of circuit substrate, and
Backlight and backlight, headlamp, one of vehicle as the instrument display of the display and vehicle of television set, computer etc.
As ligthing paraphernalia etc. light source.But, in current production technology, it is difficult to manufacture brightness can precision keep constant well
LED, it is considered to which it is multiple brightness degrees to divide LED, is respectively mounted in multiple regions of one piece of circuit substrate or one piece of circuit substrate
The LED of same brightness degree, by controlling the supply electric current to these LED by resistor, makes the overall brightness of light-emitting area equal
It is even.
For example, many chamfering substrates 200 shown in Fig. 7 connected by frame section 204 by the unit substrate 202 that multiple is grown crosswise and
Into.Many chamfering substrates 200 cut off frame section 204 and are divided into many LED strips after, are assembled into personal computer use
The backlight of display, the brightness degree of LED206 can also be different between LED strip, but requirement is in a LED strip
Identical.And, it is provided with the surface of constituent parts substrate 202：Brightness degree is the same from multiple LED206 and is mounted to a row
Electronic circuit component installation region is LED installation regions 210, installs the electronic circuit unit of the i.e. resistor of other electronic circuit components
Part installation region is resistor installation region 212, information recording area or information additional areas i.e. bar code printing region 214.
In many chamfering substrates 200, LED installation regions 210 are arranged at the central portion of the length direction of unit substrate 202, resistor
Installation region 212 and bar code printing region 214 are respectively arranged at the both sides of the length direction of LED installation regions 210.
Many chamfering substrates 200 are with the length direction posture parallel with conveying direction that its length direction is unit substrate 202
Conveying, and conveyed with the posture that bar code printing region 214 is in downstream.And, many chamfering substrates 200 are in conveying direction
On be divided into：Each bar code printing region 214 and LED installation regions 210 comprising whole unit substrates 202 are in interior and ratio peace
The small partitioning portion in dress operating area be downstream side portion 222 and comprising resistor installation region 212 interior and than installation exercise area
The small partitioning portion in domain is upstream sidepiece 224.
LED206 is printed on an electricity to the installation and bar code of LED installation regions 210 to bar code printing region 214
Carried out in sub-circuit component mounter.Therefore, electronic circuit component mounter is same with above-mentioned electronic circuit component mounter, bag
Containing erecting device and reference mark camera head, and comprising print head.Print head of the print head for example with ink-jet printer is same
Sample, from nozzle spray ink droplet and in record subject material printing word, figure, symbol etc., can together be moved with mounting head
Optional position in horizontal plane.In addition, mounting head is as the mounting head that for example JP 2006-261325 publications are recorded,
Electronic circuit component is installed by more than three suction nozzles.
In addition, LED206 is supplied by loader.One loader keeps the LED206 of multiple same brightness grades,
Carry multiple loaders in loader holding station, but the brightness degree of LED206 that keeps of these loaders also mutual not phase sometimes
Together.Being contained in the memory ram of the control computer of the control device of electronic circuit component mounter makes the loader of each loader
The brightness degree of the holding position of holding station and the LED206 supplied by each loader sets up corresponding brightness degree-feed each other
Device holding position corresponding data.
Resistor is carried out to resistor installation region 212 in other electronic circuit component mounters.The electronics
In addition to not possessing print head, remaining is constituted installs circuit element fitting machine with the electronic circuit component of the installation for carrying out LED206
Machine is same, and resistor is supplied by loader.One loader keeps multiple resistance value identical resistors, is protected in loader
The mutually different multiple loaders of resistance value that platform carries the resistor for having kept are held, the brightness degree for LED206 is accurate
Have the estimated various resistors that may require that.Being contained in the memory ram of control computer makes the loader holding station of each loader
Holding position and the resistance value of the resistor supplied by each loader set up corresponding resistance value-loader holding position each other
Data.
Many chamfering substrates 200 are first fed into the electronic circuit component mounter with print head, are transported to many chamfering substrates
200 downstream side should be consistent with the downstream side in installation exercise region position and stop（Reference picture 8（a））.Should be consistent
Position be first object stop position.After stopping, each LED installation regions 210 of the LED206 to multiple unit substrates 202 is carried out
Installation.The LED206 of same brightness grade is installed in a unit substrate 202, on a unit substrate 202, whenever
The installation of LED206 terminates, and the bar code of the information comprising brightness degree is all represented in the printing of bar code printing region 214.
It is installed on the loader holding station of the loader of the brightness degree based on suction nozzle taking-up LED206 of the LED206 of unit substrate 202
Holding position and brightness degree-loader holding position data are obtained.
If terminated to the installation of the LED206 of whole unit substrates 202 and the printing of bar code, many chamfering substrates 200
It is sent to other electronic circuit component mounters resistor is installed.The first same mesh when now, first to be installed with LED
Mark stop position conveys many chamfering substrates 200 for target stop position and stops it.And, by reference mark camera head
Shoot the bar code for being printed in each bar code printing region 214 of whole unit substrates 202, the letter that acquirement is represented by bar code
Breath.Thus, whole unit substrates 202 are obtained with the brightness degree of the LED206 for being installed on LED installation regions 210 respectively, in control
In computer processed, resistance value corresponding with each brightness degree is calculated, in order to realize the resistance value, generating should install for setting
In one or more resistors and its resistor of installation site of each resistor installation region 212 of multiple unit substrates 202
Installation data.
Many chamfering substrates 200 are conveyed after the shooting of each bar code of whole unit substrates 202, and are transported to many
The upstream side of chamfering substrate 200 should be consistent with the upstream side in installation exercise region position and stop（Reference picture 8（b））.
It is the second target stop position that this answers consistent position.And, based on resistor installation data, in multiple unit substrates 202
Each resistor installation region 212 is installed by more than one resistor.It is bright obtained by the bar code of downstream side portion 222 by being arranged at
Degree class information is used for the installation of the resistor of upstream sidepiece 224, and in the present embodiment, installing electronic circuit component information is
The information of brightness degree information or the resistance value obtained based on its brightness degree information realizes the electricity of its resistance value
The information of the combination of resistance device and the installation site of each resistor is upstream sidepiece information, in the erecting device of control computer,
The part that resistor is installed on unit substrate 202 is constituted based on the upstream sidepiece information portion is utilized to operation.And, brightness etc.
Any information in the information of the installation site of the combination and each resistor of level information, the information of resistance value and resistor can all be recognized
For be specify resistor installation exercise operation specify information one kind, in the reference mark camera head of control computer
In, it is believed that the bar code to being printed in bar code printing region 214 is shot and is obtained brightness for being represented by bar code etc.
The letter of the installation site of the combination and each resistor of the part, the part of the information of acquirement resistance value and acquirement resistor of level information
It is upstream sidepiece operation specify information obtaining section that any portion in the part of breath constitutes upstream sidepiece information acquiring section, in control
In the erecting device of computer, the part that unit substrate 202 is installed on by the resistor that the operation specify information is specified can be recognized
To be assignment enforcement division.
According to present embodiment, can concurrently be carried out to unit substrate in different electronic circuit component mounters
The installation of 202 LED206 and the installation of resistor, it is possible to increase the production efficiency of LED strip.In many chamfering substrates 200, though
Omit diagram, but be again provided with reference mark with above-mentioned implementation method, carry out element seating portion the calculating of site error,
Amendment and the acquirement of stop position error, utilization, the description thereof will be omitted.
In addition, can also be adjacent in the conveying direction to the reference mark that multiple partitioning portions of circuit substrate set respectively
Partitioning portion between share.
Claims (4)
1. a kind of to working machine for circuit board, it is characterised in that including：
Apparatus for work, the operating area with regulation, the part in the operating area to circuit substrate makes a reservation for
Operation；
Base board delivery device, the circuit substrate is conveyed along conveying direction, makes dividing on the conveying direction for the circuit substrate
The some being cut into stops at the target stop position in the operating area successively from the part in downstream；
Base plate keeping device, the circuit substrate that is fixed and keeping stopping；
Information acquisition device, the information related to the circuit substrate is obtained from the downstream side portion of the circuit substrate for stopping, its
Described in downstream side portion be the part in downstream in some being divided into；And
Information Pull device, the information that will be obtained by the information acquisition device is used for by the base board delivery device to upstream sidepiece
At least one party in the conveying that carries out and the operation carried out to upstream sidepiece by the apparatus for work, wherein the upstream side portion is
Than the part that the downstream side portion is in more upstream side；
Described information acquisition device include upstream sidepiece information acquiring section, the upstream sidepiece information acquiring section from record upstream side
The upstream sidepiece information recording part of portion's information obtains upstream sidepiece information, wherein upstream side portion information recording part is located at described
The downstream side portion of the circuit substrate that base plate keeping device keeps, the upstream sidepiece information is related to the upstream sidepiece
Information；
It is described that portion is utilized to operation by the upstream sidepiece information also, described information includes utilizing operation in portion using device
The information that obtaining section is obtained is used for the operation carried out to the upstream sidepiece by the apparatus for work.
2. as claimed in claim 1 to working machine for circuit board, wherein,
The circuit substrate is divided into many chamfering substrates of multiple unit substrates after being,
The upstream sidepiece information acquiring section includes bad unit substrate information acquiring section, and the bad unit substrate information is obtained
Portion obtains the bad unit substrate letter of the bad unit substrate in more than one unit substrate represented contained by the upstream sidepiece
Breath；
It is described that operation is included to bad unit substrate operation prohibition unit using portion, it is described to bad unit substrate operation prohibition unit
Forbid the operation carried out to the bad unit substrate that the bad unit substrate information is represented by the apparatus for work.
3. as claimed in claim 1 or 2 to working machine for circuit board, wherein,
The base board delivery device supports circuit substrate by the conveyer belt for rotating, and the driving of conveyer belt rotation is made by control
The actuating quantity of motor controls the fed distance of the circuit substrate, thus controls the stop position of circuit substrate,
Described information acquisition device also includes stop position error obtaining section, and the stop position error obtaining section shoots and stops at
The reference mark that the downstream side portion of the circuit substrate of the stop position is set, and should according to shooting result acquirement conduct
The actual stop position of downstream side portion relative to the error of the target stop position stop position error,
Described information also uses portion using device including stop position error, and the stop position error is using portion to the work
Target stop position in industry region conveys the institute of the base board delivery device of the upstream sidepiece of the circuit substrate
Using the acquired stop position error in the control of the actuating quantity for stating drive motor.
4. as claimed in claim 3 to working machine for circuit board, wherein,
The stop position error using portion include simple addition operation division, the simple addition operation division will with make the stopping
The symbol of site error it is positive and negative in turn obtained from be worth corresponding actuating quantity and defeated to the assigned position in the operating area
The actuating quantity of the drive motor of the upstream sidepiece of the circuit substrate is sent to be added.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-268226 | 2011-12-07 | ||
| JP2011268226A JP6022763B2 (en) | 2011-12-07 | 2011-12-07 | Circuit board working machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103153036A CN103153036A (en) | 2013-06-12 |
| CN103153036B true CN103153036B (en) | 2017-06-09 |
Family
ID=48550821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210526151.1A Active CN103153036B (en) | 2011-12-07 | 2012-12-07 | To working machine for circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6022763B2 (en) |
| CN (1) | CN103153036B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5220179B2 (en) * | 2011-12-09 | 2013-06-26 | 株式会社ソディック | Wire electric discharge machine |
| WO2015132905A1 (en) * | 2014-03-05 | 2015-09-11 | 富士機械製造株式会社 | Traceability information management system and traceability information management method for component mounting line |
| CN105934091A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Assembled circuit board |
| KR102484442B1 (en) * | 2016-12-08 | 2023-01-02 | 한화정밀기계 주식회사 | Chip Mounter |
| WO2018207260A1 (en) * | 2017-05-09 | 2018-11-15 | 株式会社Ｆｕｊｉ | Substrate working machine |
| EP3912442B1 (en) * | 2019-01-17 | 2024-04-24 | Jabil Inc. | Apparatus, system, and method of providing radial section identification for pick and place |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140999A (en) * | 1997-07-18 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting method on multiply formed boards |
| JP2002026595A (en) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Device and method for mounting electronic part |
| CN101071156A (en) * | 2006-05-11 | 2007-11-14 | 鸿骐昶驎科技股份有限公司 | Multi-connecting board bad-product detecting device and method |
| CN101621893A (en) * | 2008-07-02 | 2010-01-06 | 欣兴电子股份有限公司 | Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board |
| CN101647333A (en) * | 2007-04-03 | 2010-02-10 | 松下电器产业株式会社 | Method for mounting component |
| CN102340979A (en) * | 2010-07-15 | 2012-02-01 | 富士机械制造株式会社 | Method and device for controlling board stopping position and method for controlling board mounting position |
-
2011
- 2011-12-07 JP JP2011268226A patent/JP6022763B2/en active Active
-
2012
- 2012-12-07 CN CN201210526151.1A patent/CN103153036B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140999A (en) * | 1997-07-18 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Electronic component mounting method on multiply formed boards |
| JP2002026595A (en) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | Device and method for mounting electronic part |
| CN101071156A (en) * | 2006-05-11 | 2007-11-14 | 鸿骐昶驎科技股份有限公司 | Multi-connecting board bad-product detecting device and method |
| CN101647333A (en) * | 2007-04-03 | 2010-02-10 | 松下电器产业株式会社 | Method for mounting component |
| CN101621893A (en) * | 2008-07-02 | 2010-01-06 | 欣兴电子股份有限公司 | Process and equipment thereof for manufacturing imprint dividing board of defective subboard of circuit board |
| CN102340979A (en) * | 2010-07-15 | 2012-02-01 | 富士机械制造株式会社 | Method and device for controlling board stopping position and method for controlling board mounting position |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6022763B2 (en) | 2016-11-09 |
| CN103153036A (en) | 2013-06-12 |
| JP2013120853A (en) | 2013-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103153036B (en) | To working machine for circuit board | |
| US7488283B2 (en) | Circuit-substrate-related-operation performing apparatus, and method of supplying constituent element to the apparatus | |
| JP5751584B2 (en) | Electronic component mounting equipment | |
| JP5292163B2 (en) | Electronic circuit component mounting system | |
| US10420262B2 (en) | Feeder management device | |
| JP4887347B2 (en) | Board work system | |
| CN106717142B (en) | Electronic component mounting system | |
| US20140052289A1 (en) | Mounting apparatus, method of disposing members, and method of manufacturing substrate | |
| WO2009125550A1 (en) | Electronic part mounting apparatus, and trial application device for viscous substance | |
| JP6219838B2 (en) | Component mounter | |
| US10863657B2 (en) | Electronic component mounting method | |
| JP4317351B2 (en) | Circuit board management method and electronic circuit production system | |
| JP6193994B2 (en) | Component mounter | |
| JP5739754B2 (en) | Electronic circuit component rise prevention method and electronic circuit manufacturing system | |
| JP5756713B2 (en) | Substrate processing apparatus, substrate processing system | |
| JPH10209688A (en) | Component mounting apparatus | |
| JP4527131B2 (en) | Mounting machine | |
| CN104185412B (en) | Mounting device, conveyer belt and control method | |
| JP4950738B2 (en) | Printed circuit board assembly method and installation program creation program | |
| JP7386754B2 (en) | Component mounting machine | |
| JP5791422B2 (en) | Component mounting machine and component mounting line | |
| US20120246928A1 (en) | Mounting apparatus, electronic component placement method, and substrate manufacturing method | |
| WO2016203637A1 (en) | Component-mounting system | |
| CN109997426B (en) | Working machine | |
| JP6039742B2 (en) | Electronic circuit component mounting method and electronic circuit component mounting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Aichi Japan vertical city Patentee after: Fuji Corporation Address before: Aichi Japan vertical city Patentee before: Fuji Machinery Manufacturing Co., Ltd. |