CN103064248A - Manufacturing method of film pattern and baseplate structure - Google Patents
Manufacturing method of film pattern and baseplate structure Download PDFInfo
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- CN103064248A CN103064248A CN2011103219394A CN201110321939A CN103064248A CN 103064248 A CN103064248 A CN 103064248A CN 2011103219394 A CN2011103219394 A CN 2011103219394A CN 201110321939 A CN201110321939 A CN 201110321939A CN 103064248 A CN103064248 A CN 103064248A
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- thinfilm pattern
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Abstract
The invention discloses a manufacturing method of a film pattern and a baseplate structure. The manufacturing method of the film pattern comprises the following steps of: providing a first medium base material, forming a releasing film on the first medium base material, and forming a film on the releasing film; carrying out a photoetching manufacturing process on the film so as to form the film pattern, and providing a temporary storage base material and a joint layer; jointing the joint layer between the temporary storage base material and the film pattern, and transferring the film pattern and the releasing film to the temporary storage base material; then, providing a second medium base material and an adhesive layer, pasting the adhesive layer between the releasing film and the second medium base material; and transferring the film pattern and the releasing film on the second medium base material.
Description
Technical field
The present invention relates to a kind of film producing process, and particularly relate to a kind of method for making and board structure of Thinfilm pattern.
Background technology
Traditionally; when utilizing thin film technique to make electronic component or wire; usually meeting is according to the characteristic of element or the wire of manufacturing; the manufacture crafts such as the film forming that utilization is sequentially carried out, photoresist coating, etching; film is formed the Thinfilm pattern with given shape, so just can reach specific function.The method for making of common Thinfilm pattern is to utilize gold-tinted photoetching making technique first with the pattern definition of photoresist out, then under the covering of photoresist pattern, film is carried out wet etching, so that pattern is passed on the film, can finish the making of Thinfilm pattern.If the structure that multilayer film are stacking then need be carried out multiple tracks gold-tinted photoetching making technique, finished necessary rete.
Yet traditional gold-tinted photoetching making technique only can be applied on the glass substrate that does not carry out in advance borehole.If be applied on the glass substrate that carries out in advance borehole, the material that uses in new method for making and the manufacture craft of certainly will will reappraising, and the demand that relevant operation need further be considered properties of materials and whether meet volume production, for traditional gold-tinted photoetching making technique, not only increase the complexity of manufacture craft, and increase the cost of developing material.
Summary of the invention
The object of the present invention is to provide a kind of method for making of Thinfilm pattern, utilize temporary mode that the Thinfilm pattern of moulding is made on the pretreated media substrate, again Thinfilm pattern is transferred on temporary base material or another media substrate, to finish the transfer step of Thinfilm pattern.The method for making of above-mentioned Thinfilm pattern can be used the step of script gold-tinted photoetching making technique and the material that originally uses, to reduce the cost of developing material.
According to an aspect of the present invention, propose a kind of method for making of Thinfilm pattern, comprise the following steps.One first medium base material is provided, is formed with a release film on the first medium base material.Form a film on release film.Film is carried out photoetching making technique, to form a Thinfilm pattern.One temporary base material and a knitting layer is provided.Be engaged between temporary base material and the Thinfilm pattern with knitting layer.Divert film pattern and release film are to temporary base material.Then, provide a second medium base material and an adhesive coating.Be attached between release film and the second medium base material with adhesive coating.Divert film pattern and release film are to the second medium base material.
According to a further aspect in the invention, propose a kind of method for making of Thinfilm pattern, comprise the following steps.One first medium base material is provided, is formed with a release film on the first medium base material.Form a film on release film.Film is carried out photoetching making technique, to form a Thinfilm pattern.One second medium base material and an adhesive coating are provided.Be attached between release film and the second medium base material with adhesive coating.Divert film pattern and release film are to the second medium base material.
According to a further aspect in the invention, propose a kind of board structure, comprise a media substrate, a Thinfilm pattern, a release film and an adhesive coating.Little link substrate comprises a plurality of base board units, and has respectively borehole zone between these a little base board units.Thinfilm pattern is disposed on these a little base board units.Release film is disposed at Thinfilm pattern therewith between a little base board units, and covers each borehole zone.Adhesive coating engages therewith a little base board units of release film.
For there is better understanding above-mentioned and other aspect of the present invention, preferred embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below:
Description of drawings
Figure 1A～Fig. 1 F is the process flow diagram of method for making of the Thinfilm pattern of one embodiment of the invention;
Fig. 2 is the vertical view of little link glass substrate;
Fig. 3 A～Fig. 3 C is the process flow diagram of method for making of the Thinfilm pattern of one embodiment of the invention.
The main element symbol description
100: the first medium base material
110: release film
118: film
120: Thinfilm pattern
130: temporary base material
140: knitting layer
150: the second medium base material
152: base board unit
154: the borehole zone
160: adhesive coating
170: little link glass substrate
172: base board unit
174: the borehole zone
176: little point of contact
178: the substrate rim charge
Embodiment
The method for making of the Thinfilm pattern of the present embodiment is to form a release film in media substrate, makes required Thinfilm pattern with gold-tinted photoetching making technique again on release film, for example is monofilm layer structure or multiple film layer structure.If Thinfilm pattern monofilm layer structure, rete can be a metallic diaphragm, an organic film or an inorganic film.If Thinfilm pattern multiple film layer structure, required rete can be the structure that at least one metallic diaphragm, at least one organic film and/or at least one inorganic film form, the present invention is not as limit.The present embodiment can be applicable in the film producing process of contact panel, and can be applicable in the fields such as Organic Light Emitting Diode, thin film transistor (TFT), flexible display, colored filter and flexible display.
Below be to propose at least one embodiment to be elaborated, embodiment in order to as the example explanation, is not the scope in order to limit wish protection of the present invention only.
The first embodiment
The method for making of the Thinfilm pattern of one embodiment of the invention comprises step (1)～step (6).Step (1) provides a first medium base material 100, is formed with a release film 110 on the first medium base material 100.Step (2) forms a film 118 on release film 110, and film is carried out photoetching making technique, to form a Thinfilm pattern 120.Step (3) provides temporary base material 130 and a knitting layer 140, and is engaged between temporary base material 130 and the Thinfilm pattern 120 with knitting layer 140.Step (4) divert film pattern 120 and release film 110 are to temporary base material 130.Step (5) provides a second medium base material 150 and an adhesive coating 160, and is attached between release film 110 and the second medium base material 150 with adhesive coating 160.Step (6) divert film pattern 120 and release film 110 are to second medium base material 150.
Please refer to Figure 1A～Fig. 1 F, it illustrates the process flow diagram according to the corresponding above-mentioned steps (1) of the method for making of the Thinfilm pattern of one embodiment of the invention～step (6).In Figure 1A, be formed with a release film 110 on the first medium base material 100.Release film 110 for example is pi (polyimide) or polyethylene terephthalate (PET), and its composition surface is coated with mould release, makes joint capacity between release film 110 and the first medium base material 100 less than release stripping ability.Release film 110 can be transmittance greater than 80% rete, and its thickness is about 2～3 microns, but thickness can be according to the demand increase and decrease of reality, and the present invention is not limited this.In addition, release film 110 can carry out non-destructive by mechanical external force with first medium base material 100 and separates.
In Figure 1B, film 118 for example is formed on the release film 110 with physical vaporous deposition or chemical vapour deposition technique, and its material can be metal, organic polymer, mineral compound or its combination.The present embodiment can sequentially carry out the gold-tinted photoetching making techniques such as film forming, photoresist coating, etching according to the characteristic of element or the wire of manufacturing, so that film 118 is formed the Thinfilm pattern 120 with given shape.Thinfilm pattern 120 can be monofilm layer structure or multiple film layer structure.If multiple film layer structure (seeing Fig. 3 A) then need be carried out multiple tracks gold-tinted photoetching making technique, to finish necessary rete.
In Fig. 1 C, knitting layer 140 is engaged between temporary base material 130 and the Thinfilm pattern 120.In one embodiment, if the joint capacity between knitting layer 140 and the Thinfilm pattern 120 is greater than the joint capacity between release film 110 and the first medium base material 100, as long as bestow a mechanical external force on temporary base material 130 or first medium base material 100 and when both are separated from each other, Thinfilm pattern 120 will separate with first medium base material 100 with release film 110, and be transferred on the temporary base material 130, shown in Fig. 1 D.
Specifically, first medium base material 100 can be soft base material (for example plastic cement), and temporary base material 130 can be hard substrate (for example glass).Thinfilm pattern 120 can be transferred to by soft first medium base material 100 the temporary base material 130 of hard, its way is as follows: utilize a mobile platform to drive roller (not illustrating), and soft first medium base material 100 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft first medium base material 100 energy roll extrusion are on the temporary base material 130 of hard.So, the mechanical external force that the knitting layer 140 on the temporary base material 130 is bestowed during by the roller roll extrusion and being bonded with each other with Thinfilm pattern 120, and Thinfilm pattern 120 separates with first medium base material 100 by mechanical external force with release film 110 and is transferred on the temporary base material 130.
In another embodiment, first medium base material 100 can be hard substrate (for example glass), and temporary base material 130 can be soft base material (for example plastic cement).Thinfilm pattern 120 can be transferred to soft temporary base material 130 by the first medium base material 100 of hard, its way is as follows: utilize a mobile platform to drive roller (not illustrating), and soft temporary base material 130 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft temporary base material 130 energy roll extrusion are on the first medium base material 100 of hard.So, the mechanical external force that the knitting layer 140 on the temporary base material 130 is bestowed during by the roller roll extrusion and being bonded with each other with Thinfilm pattern 120, and Thinfilm pattern 120 separates with first medium base material 100 by mechanical external force with release film 110 and is transferred on the temporary base material 130.
Then, in Fig. 1 E, adhesive coating 160 is attached between release film 110 and the second medium base material 150.In one embodiment, above-mentioned knitting layer 140 can be water-soluble colloid, and its viscosity can reduce because hydrone is moistening afterwards.Adhesive coating 160 can increase by the mode of photopolymerization or heat cross-linking its viscosity.Therefore, if the tackability between adhesive coating 160 and the release film 110 is greater than the knitting layer 140 after moistening and the joint capacity between the temporary base material 130, as long as bestow a mechanical external force on temporary base material 130 or second medium base material 150 and when both are separated from each other, Thinfilm pattern 120 will separate with temporary base material 130 with release film 110, and be transferred on the second medium base material 150, shown in Fig. 1 F.
Specifically, second medium base material 150 can be soft base material (for example plastic cement), and temporary base material 130 can be hard substrate (for example glass).Thinfilm pattern 120 can be transferred to by the temporary base material 130 of hard soft second medium base material 150, its way is as follows: utilize a mobile platform to drive another roller (not illustrating), and soft second medium base material 150 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft second medium base material 150 energy roll extrusion are on the temporary base material 130 of hard.So, the mechanical external force that adhesive coating 160 on the release film 110 is bestowed during by the roller roll extrusion and being bonded with each other with second medium base material 150, and Thinfilm pattern 120 separates with temporary base material 130 by mechanical external force with release film 110 and is transferred on the second medium base material 150.
In another embodiment, second medium base material 150 can be hard substrate (for example glass), and temporary base material 130 can be soft base material (for example plastic cement).Thinfilm pattern 120 can be transferred to by soft temporary base material 130 the second medium base material 150 of hard, and its way is as follows: utilize a mobile platform to drive roller (not illustrating), and soft temporary base material 130 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft temporary base material 130 energy roll extrusion are on the second medium base material 150 of hard.So, the mechanical external force that adhesive coating 160 on the release film 110 is bestowed during by the roller roll extrusion and being bonded with each other with second medium base material 150, and Thinfilm pattern 120 separates with temporary base material 130 by mechanical external force with release film 110 and is transferred on the second medium base material 150.
In the above-described embodiments, second medium base material 150 can be employed little link glass substrate in the manufacture craft of advanced touch technology (Advanced touch technology).Please refer to Fig. 2, it illustrates the vertical view of little link glass substrate 170.Little link glass substrate 170 carries out the manufacture craft of borehole in advance, to form a plurality of base board units 172.Each base board unit 172 only is connected with the substrate rim charge 178 of little point of contact 176 with the periphery in borehole zone 174.Based on above-mentioned, the Thinfilm pattern 120 that the present embodiment can be finished script gold-tinted photoetching making technique is transferred on the glass substrate 170 that carries out in advance borehole, and Thinfilm pattern 120 uses material originally to meet the demand of manufacture craft, and then reduces the cost of developing material.
Referring again to the board structure shown in Fig. 1 F, it comprises a media substrate 150, a Thinfilm pattern 120, a release film 110 and an adhesive coating 160.Media substrate 150 is little link substrate, and it comprises a plurality of base board units 152, and has respectively a borehole zone 154 between these a little base board units 152.Thinfilm pattern 120 is disposed on each base board unit 152, and release film 110 is disposed at Thinfilm pattern 120 therewith between a little base board units 152, and covers each borehole zone 154.Adhesive coating 160 engages release film 110 and each base board unit 152.In follow-up manufacture craft, these a little base board units 152 can be by splitting or cutting and each self-separation.
The second embodiment
Please refer to Fig. 3 A～Fig. 3 C, it illustrates the process flow diagram according to the method for making of the Thinfilm pattern of one embodiment of the invention.In Fig. 3 A, its step provides a first medium base material 200 such as the step (1) of the first embodiment, be formed with a release film 210 on the first medium base material 200, and step (2) forms a film 218 on release film 210, and film 218 carried out photoetching making technique, to form a Thinfilm pattern 220.Different from the first embodiment is that in Fig. 3 B, the present embodiment provides a second medium base material 250 and an adhesive coating 260, and is attached between Thinfilm pattern 220 and the second medium base material 250 with adhesive coating 260.Then, in Fig. 3 C, divert film pattern 220 and release film 210 are to second medium base material 250.
In one embodiment, first medium base material 200 can be soft base material (for example plastic cement), and second medium base material 250 can be hard substrate (for example glass).Thinfilm pattern 220 can be transferred to by soft first medium base material 200 the second medium base material 250 of hard, its way is as follows: utilize a mobile platform to drive roller (not illustrating), and soft first medium base material 200 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft first medium base material 200 energy roll extrusion are on the second medium base material 250 of hard.So, the mechanical external force that adhesive coating 260 on the second medium base material 250 is bestowed during by the roller roll extrusion and being bonded with each other with Thinfilm pattern 220, and Thinfilm pattern 220 separates with first medium base material 200 by mechanical external force with release film 210 and is transferred on the second medium base material 250.
In another embodiment, first medium base material 200 can be hard substrate (for example glass), and second medium base material 250 can be soft base material (for example plastic cement).Thinfilm pattern 220 can be transferred to by the first medium base material 200 of hard soft temporary base material 230, its way is as follows: utilize a mobile platform to drive roller (not illustrating), and soft second medium base material 250 is rotated with roller on the circumferential surface of roller.By the effect of roller, soft second medium base material 250 energy roll extrusion are on the first medium base material 200 of hard.So, the mechanical external force that adhesive coating 260 on the second medium base material 250 is bestowed during by the roller roll extrusion and being bonded with each other with Thinfilm pattern 220, and Thinfilm pattern 220 separates with first medium base material 200 by mechanical external force with release film 210 and is transferred on the second medium base material 250.
The characteristic of relevant release film 210, Thinfilm pattern 220 and adhesive coating 260, related elements has been described among the first embodiment, does not repeat them here.
In addition, second medium base material 250 can be employed little connection glass substrate in the manufacture craft of advanced touch technology (Advanced touch technology), as shown in Figure 2.The Thinfilm pattern 220 that the present embodiment can be finished script gold-tinted photoetching making technique is transferred on the glass substrate that carries out in advance borehole, and Thinfilm pattern 220 uses material originally to meet the demand of manufacture craft, and then reduces the cost of developing material.
In sum, though disclosed the present invention in conjunction with above preferred embodiment, it is not to limit the present invention.Be familiar with in the technical field of the invention this operator, without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations.Therefore, protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (11)
1. the method for making of a Thinfilm pattern comprises:
One first medium base material is provided, is formed with a release film on this first medium base material;
Form a film on this release film;
This film is carried out photoetching making technique, to form a Thinfilm pattern;
One temporary base material and a knitting layer is provided;
Be engaged between this temporary base material and this Thinfilm pattern with this knitting layer;
Shift this Thinfilm pattern and this release film to keeping on the base material;
One second medium base material and an adhesive coating are provided;
Be attached between this release film and this second medium base material with this adhesive coating; And
Shift this Thinfilm pattern and this release film to this second medium base material.
2. the method for making of Thinfilm pattern as claimed in claim 1, wherein this Thinfilm pattern comprises monofilm layer structure or multiple film layer structure, and this Thinfilm pattern has at least one rete, and this at least one rete comprises metallic diaphragm, organic film, inorganic film or its combination.
3. the method for making of Thinfilm pattern as claimed in claim 1, wherein this Thinfilm pattern by this soft first medium base material be transferred to hard should temporary base material, should be transferred to this soft second medium base material by temporary base material by hard again.
4. the method for making of Thinfilm pattern as claimed in claim 3, wherein when this soft first medium base material roll extrusion is on the temporary base material of hard, this knitting layer and this Thinfilm pattern on should temporary base material be bonded with each other, and this Thinfilm pattern and this release film separate with this first medium base material and be transferred to hard should temporary base material on.
5. the method for making of Thinfilm pattern as claimed in claim 4, wherein when this soft second medium base material roll extrusion is on the temporary base material of being somebody's turn to do of hard, this adhesive coating and second medium base material on this release layer are bonded with each other, and this Thinfilm pattern and this release film separate with temporary base material and be transferred on this second medium base material.
6. the method for making of Thinfilm pattern as claimed in claim 1, wherein this Thinfilm pattern by this first medium base material of hard be transferred to soft should temporary base material, again by soft this second medium base material that should temporary base material be transferred to hard.
7. the method for making of Thinfilm pattern as claimed in claim 6, wherein when this soft temporary base material roll extrusion is on this first medium base material of hard, this knitting layer and this Thinfilm pattern on should temporary base material be bonded with each other, and this Thinfilm pattern and this release film separate with this first medium base material and be transferred on this temporary base material.
8. the method for making of Thinfilm pattern as claimed in claim 7, wherein when this soft temporary base material roll extrusion is on this second medium base material of hard, this adhesive coating and second medium base material on this release layer are bonded with each other, and this Thinfilm pattern and this release film separate with this temporary base material and be transferred on this second medium base material.
9. the method for making of a Thinfilm pattern comprises:
One first medium base material is provided, is formed with a release film on this first medium base material;
Form a film on this release film;
This film is carried out photoetching making technique, to form a Thinfilm pattern;
One second medium base material and an adhesive coating are provided;
Be attached between this release film and this second medium base material with this adhesive coating; And
Shift this Thinfilm pattern and this release film to this second medium base material.
10. the method for making of Thinfilm pattern as claimed in claim 9, wherein this Thinfilm pattern is transferred to this second medium base material of hard by this soft first medium base material, or is transferred to this soft second medium base material by this first medium base material of hard.
11. a board structure comprises:
Media substrate comprises a plurality of base board units, and has respectively borehole zone between those base board units;
Thinfilm pattern is disposed on those base board units;
Release film is disposed between this Thinfilm pattern and those base board units, and covers respectively this borehole zone; And
Adhesive coating engages this release film and those base board units.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103219394A CN103064248A (en) | 2011-10-21 | 2011-10-21 | Manufacturing method of film pattern and baseplate structure |
| CN201410242822.0A CN103984205B (en) | 2011-10-21 | 2011-10-21 | The production method and board structure of Thinfilm pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103219394A CN103064248A (en) | 2011-10-21 | 2011-10-21 | Manufacturing method of film pattern and baseplate structure |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410242822.0A Division CN103984205B (en) | 2011-10-21 | 2011-10-21 | The production method and board structure of Thinfilm pattern |
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| CN103064248A true CN103064248A (en) | 2013-04-24 |
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| CN2011103219394A Pending CN103064248A (en) | 2011-10-21 | 2011-10-21 | Manufacturing method of film pattern and baseplate structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777941A (en) * | 2015-05-06 | 2015-07-15 | 信利光电股份有限公司 | Touch screen preparation method |
| CN109289533A (en) * | 2018-11-02 | 2019-02-01 | 东莞东阳光科研发有限公司 | A kind of membrane for water treatment preparation method and applications of micro-patterning |
| CN110726427A (en) * | 2019-10-28 | 2020-01-24 | 青岛歌尔微电子研究院有限公司 | Dustproof structure and manufacturing method thereof |
| CN113219796A (en) * | 2020-01-21 | 2021-08-06 | 新应材股份有限公司 | Removing method, laminate, forming method, polyimide resin, and stripping liquid |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW464991B (en) * | 1999-04-12 | 2001-11-21 | Nitto Denko Corp | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames |
| JP2003209342A (en) * | 2002-01-16 | 2003-07-25 | Hitachi Cable Ltd | Circuit board and method for manufacturing the same |
| US20040250417A1 (en) * | 2003-06-12 | 2004-12-16 | Arneson Michael R. | Method, system, and apparatus for transfer of dies using a die plate |
| JP2007266414A (en) * | 2006-03-29 | 2007-10-11 | Seiko Epson Corp | Transfer method of object to be transferred employing temporarily transferring substrate, manufacturing method of thin-film device, and electronic equipment |
| CN101340779A (en) * | 2007-07-04 | 2009-01-07 | 三星电机株式会社 | Carrier and method for manufacturing printed circuit board |
-
2011
- 2011-10-21 CN CN2011103219394A patent/CN103064248A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW464991B (en) * | 1999-04-12 | 2001-11-21 | Nitto Denko Corp | Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames |
| JP2003209342A (en) * | 2002-01-16 | 2003-07-25 | Hitachi Cable Ltd | Circuit board and method for manufacturing the same |
| US20040250417A1 (en) * | 2003-06-12 | 2004-12-16 | Arneson Michael R. | Method, system, and apparatus for transfer of dies using a die plate |
| JP2007266414A (en) * | 2006-03-29 | 2007-10-11 | Seiko Epson Corp | Transfer method of object to be transferred employing temporarily transferring substrate, manufacturing method of thin-film device, and electronic equipment |
| CN101340779A (en) * | 2007-07-04 | 2009-01-07 | 三星电机株式会社 | Carrier and method for manufacturing printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777941A (en) * | 2015-05-06 | 2015-07-15 | 信利光电股份有限公司 | Touch screen preparation method |
| CN109289533A (en) * | 2018-11-02 | 2019-02-01 | 东莞东阳光科研发有限公司 | A kind of membrane for water treatment preparation method and applications of micro-patterning |
| CN110726427A (en) * | 2019-10-28 | 2020-01-24 | 青岛歌尔微电子研究院有限公司 | Dustproof structure and manufacturing method thereof |
| CN113219796A (en) * | 2020-01-21 | 2021-08-06 | 新应材股份有限公司 | Removing method, laminate, forming method, polyimide resin, and stripping liquid |
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