CN102962763A - Abrasive particle burying device, polishing device and polishing method - Google Patents
Abrasive particle burying device, polishing device and polishing method Download PDFInfo
- Publication number
- CN102962763A CN102962763A CN2012103201821A CN201210320182A CN102962763A CN 102962763 A CN102962763 A CN 102962763A CN 2012103201821 A CN2012103201821 A CN 2012103201821A CN 201210320182 A CN201210320182 A CN 201210320182A CN 102962763 A CN102962763 A CN 102962763A
- Authority
- CN
- China
- Prior art keywords
- die holder
- abrasive particle
- slip
- grinding die
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention provides an abrasive particle burying device, a polishing device and a polishing method. Abrasive particles are prevented from being buried unevenly and can be buried into a grinding die holder in a highly efficient manner. According to the abrasive particle burying device, slurry containing the abrasive particles is supplied to one side of a surface of the grinding die holder, and at the same time the grinding die holder is pressed by a press component through separation of the slurry, and the press component and the grinding die holder are made to slide to bury the abrasive particles contained by the slurry into the surface of the grinding die holder. The press component comprises: more than one press part; a hammer part which is arranged above the press parts and is used for pressing the press parts onto the grinding die holder; and an ultrasonic oscillator which is used for applying ultrasonic waves onto the press parts. The press parts have press surfaces equipped with a plurality of press sheets shaped like round discs, so that the press surfaces are equal in terms of length along a direction of relative sliding between the press component and the grinding die holder. Through inhibition of uneven stress of fluid, the abrasive particles are prevented from being buried unevenly into the grinding die holder.
Description
Technical field
The present invention relates to abrasive particle is imbedded the abrasive particle flush mounting of the upper surface that grinds die holder, the finishing method that possesses the burnishing device of this abrasive particle flush mounting and use this burnishing device to carry out the polishing of machined object, described grinding die holder is used for the grinding of the various machined objects such as semiconductor wafer, magnetic head, electronic component, optics.
Background technology
In the manufacturing process of semiconductor devices, magnetic head, electronic component, optics etc., utilize burnishing device to grind the surface of machined object.And, form LSI(Large Scale Integration, large scale integrated circuit on the surface of the machined object that ground) etc. device, perhaps should the surface as optical surface.
The burnishing device of grinding that is used for the surface of machined object possesses: grind die holder, it is supported to and can rotates; The slip supply member, its slip (mill liquid) that will contain abrasive particle (free abrasive) supplies to the surface of die holder; The machined object holding member, it keeps machined object and makes the surface of its contact die holder.And, make die holder rotation, and the slip that will contain abrasive particle on one side supplies between die holder and the machined object, will by machined object that machined object holding member keep press on die holder on one side, thereby the attrition process of machined object implemented.And, especially, in the high-quality situation of the surface requirements that grinding is obtained, as finishing step, in regular time before this attrition process finishes, grind while supply with the slip that does not contain abrasive particle, make by free abrasive defective and the damage that machined object causes reduced.
But, for being polished mask the machined object of the different part of hardness is arranged, when use contains the slip execution attrition process of abrasive particle, because the low part part higher than hardness of hardness is polished quickly, the abrasive particle that therefore exists in the slip focuses on the low part of hardness and the problem of local excessive ground execution grinding.Therefore, proposing has following method: abrasive particle is imbedded die holder, and the grinding die holder of the state that the part of the abrasive particle that use is imbedded is exposed grinds (for example, with reference to patent documentation 1).Described Ginding process is particularly useful in the situation to the exigent surface texture of machined object.
In order to form the grinding die holder of imbedding abrasive particle, apply the lubricant (slip) that contains abrasive particle at the grinding die holder that is for example consisted of by tin, and, with pressing component the grinding die holder is pressed one side with lubricant with the power of being scheduled on one side and make pressing component and grind the die holder slip, thereby the abrasive particle that contains in the lubricant is imbedded grinding die holder (with reference to patent documentation 1).
Implement attrition process in order like this only to use the slip that does not contain free abrasive, need to before attrition process, be about to first abrasive particle and imbed die holder, and grinding function is reduced, need regularly enforcement to imbed the operation of abrasive particle to die holder.
, exist the problem that abrasive particle from sufficient amount to the surface of grinding die holder that imbed need to expend the very long time.Therefore, propose to have the manufacturing installation (for example, with reference to patent documentation 2) of following grinding die holder: in order to shorten the time of abrasive particle being imbedded die holder, can apply ultrasonic vibration to pressing component.
Patent documentation 1: Japanese kokai publication hei 7-299737 communique
Patent documentation 2: TOHKEMY 2008-238398 communique
But, in the manufacturing installation of patent documentation 2 described existing grinding die holders, in order between pressing component and grinding die holder, to supply with efficiently slip, be formed with groove at pressing component.Therefore, pressing component applied ultrasonic vibration on one side carry out the imbedding of abrasive particle on one side, produced following problems: abrasive particle is not imbedded the surface of grinding die holder equably, has produced the local zone of imbedding the zone of too much abrasive particle and not imbedding abrasive particle.The result that the applicant studies with keen determination is, finds that the uneven cause of imbedding of described abrasive particle is that the fluid pressure of the slip pressed by pressing component is uneven.That is owing to be formed with groove at pressing component, therefore, each press surface is different with respect to the length of glide direction.Therefore, because the wedge shape effect, inequality occurs in the fluid pressure that produces along glide direction, thereby produces the inequality of imbedding of abrasive particle.
Especially, when improving hyperacoustic intensity, cavitation pitting (cavitation) occurs partly, the die holder surface sustains damage.For avoiding this situation, although want to improve ultrasonic intensity, the working strength of also having to is than the little ultrasonic intensity of value that produces cavitation pitting.Thereby, improve abrasive particle to imbed efficient just very difficult.
Summary of the invention
The present invention finishes in view of such problem just, and its purpose is both to suppress the inequality of imbedding of abrasive particle, efficiently abrasive particle is imbedded again the grinding die holder.
According to the first side of the present invention, it provides a kind of abrasive particle flush mounting, described abrasive particle flush mounting is the device of imbedding to the surface of grinding die holder for the abrasive particle that slip is contained, and described abrasive particle flush mounting possesses: pressing member, and it is used for pressing described grinding die holder; The slip supply member, it supplies to the surface of described grinding die holder for the slip that will contain abrasive particle; And sliding component, it is used for making described pressing member and described grinding die holder to slide, and described pressing member comprises: pressing component; The weight parts, it is provided in the top of described pressing component, is used for described pressing component is pressed into described grinding die holder; And ultrasonic oscillator, it is used for described pressing component is applied ultrasonic wave, and described pressing component has press surface, and described press surface is equipped with a plurality of discoid pressing tablets.
Preferably, pressing component is configured in not from grinding the outstanding position, use zone of die holder.
According to the second side of the present invention, a kind of burnishing device is provided, described burnishing device has: grind die holder, it is supported to the abradant surface that can rotate and have for grinding machined object; The rotary actuation member, it is used for making described grinding die holder rotation; The machined object retaining member, it is relative and be used for keeping the maintenance face of machined object that it has a described abradant surface with described grinding die holder, and described machined object retaining member is used for machined object is held in state with described grinding die holder butt; The slip supply member, it is used for optionally supplying with the slip that contains the slip of abrasive particle and do not contain abrasive particle to the surface of described grinding die holder; And abrasive particle flush mounting, it is used for pressing described grinding die holder across the slip that contains abrasive particle with pressing member, and make described pressing member and the described grinding die holder abrasive particle that described slip is contained that slides imbed the surface of described grinding die holder, the described slip that contains abrasive particle is the surface that supplies to described grinding die holder by described slip supply member, and described pressing member comprises: pressing component; The weight parts, it is provided in the top of described pressing component, is used for described pressing component is pressed on described grinding die holder; And ultrasonic oscillator, it applies ultrasonic wave to described pressing component, and described pressing component has press surface, and described press surface is equipped with a plurality of discoid pressing tablets.
According to the 3rd side of the present invention, a kind of finishing method is provided, described finishing method is the finishing method that operation technique scheme 3 described burnishing devices polish the machined object that is kept by described machined object retaining member, described finishing method comprises following operation: the first polishing process, in this first polishing process, supply with the slip that contains abrasive particle to the surface of described grinding die holder on one side, on one side press described grinding die holder and make described pressing member and abrasive particle that described grinding die holder contains in sliding described slip is imbedded the surface of described grinding die holder across the described slip that contains abrasive particle with described pressing member, and make the machined object that kept by described machining object holding device and described grinding die holder slide the surface of described machined object is polished; With the second polishing process, after implementing described the first polishing process, in this second polishing process, supply with to the surface of described grinding die holder on one side and do not contain the slip of abrasive particle, Yi Bian make the machined object that kept by described machined object retaining member and described grinding die holder slide the surface of described machined object is polished.
In the 3rd side of the present invention, between the first polishing process and the second polishing process, can implement the matting of grinding die holder for cleaning.Machined object is selected from the group that is made of sapphire, carborundum (SiC), gallium nitride (GaN) and aluminium nitride (AlN).
In the abrasive particle flush mounting of the first side of the present invention, because pressing component has press surface and described press surface is equipped with a plurality of discoid pressing tablets, therefore, can make each press surface become mutually the same length with respect to the relative sliding direction of pressing member and grinding die holder.Thereby, can either use ultrasonic vibration to promote imbedding of abrasive particle, inequality that again can suppression fluid stress can suppress abrasive particle with respect to the inequality of imbedding of grinding die holder.
And, can be from grinding the outstanding position, use zone of die holder by pressing component being configured in not, being evenly distributed of the pressure that is produced by ultrasonic vibration do not produce cavitation pitting, and therefore, the surface that can avoid grinding die holder sustains damage.
In the burnishing device of the second side of the present invention, can use the slip that contains abrasive particle and the slip that does not contain abrasive particle, can keep pressing member and machined object retaining member, therefore, can have concurrently as the function of abrasive particle flush mounting with as the function of burnishing device.And, when machined object is polished, owing to can choice for use contain the slip of abrasive particle and do not contain the slip of abrasive particle, therefore, can abrasive particle be imbedded the grinding die holder while polishing, and, can adopt respectively as required the polishing of using free abrasive and the polishing of not using free abrasive.
In the finishing method of the 3rd side of the present invention, after use contains the first polishing process that the slip of abrasive particle polishes the surface of machined object, the second polishing process that implement to use the slip that do not contain abrasive particle that the surface of machined object is polished, therefore, in the first polishing process, abrasive particle imbedded the grinding die holder.Then, in the second polishing process, polish by the grinding die holder that contains the abrasive particle of imbedding to some extent, therefore, grinding efficiency is improved.
And the matting of implement to be used for clean grinding die holder between the first polishing process and the second polishing process can reduce the defective and the damage that are caused by free abrasive, produce at machined object.
Description of drawings
Fig. 1 is the stereogram of an example of expression abrasive particle flush mounting.
Fig. 2 is the exploded perspective view of the first case of expression pressing member.
Fig. 3 is the cutaway view of the first case of expression pressing member.
Fig. 4 is the upward view of an example of the pressing tablet that possesses of expression pressing member.
Fig. 5 is the stereogram of an example of the expression rotating support member that consists of the abrasive particle flush mounting.
Fig. 6 is the key diagram of the relation of expression pressing component and the position of grinding die holder and size.
Fig. 7 is expression pressing member and grind the key diagram of the relative sliding direction of die holder when imbedding abrasive particle.
Fig. 8 is the key diagram of the relation of the existing pressing member of expression and the position of grinding die holder and size.
Fig. 9 is the upward view of the second case of expression pressing tablet.
Figure 10 is the upward view of the 3rd example of expression pressing tablet.
Figure 11 is the upward view of the 4th example of expression pressing tablet.
Figure 12 is the exploded perspective view of the second case of expression pressing member.
Figure 13 is the cutaway view of the second case of expression pressing member.
Figure 14 is the upward view of example of the pressing component of the expression second case that consists of pressing member.
Figure 15 is the key diagram of the relation of expression pressing component and the position of grinding die holder and size.
Figure 16 is the stereogram of an example of expression burnishing device.
Figure 17 is the flow chart of the step of expression finishing method 1.
Figure 18 is the flow chart of the step of expression finishing method 2.
Figure 19 is the flow chart of the step of expression finishing method 3.
Figure 20 is the chart of the working (machining) efficiency of expression finishing method 2 and finishing method 3.
Label declaration
1: the abrasive particle flush mounting;
2: device case;
3: grind die holder;
30: surface (upper surface);
31: rotating shaft;
32: motor;
33: centre bore;
34: use the zone;
4: the slip supply member;
40: slip;
40a: abrasive particle;
41: the first slip containers;
42: the first pumps;
43a, 43b: nozzle;
44: the second slip containers;
44a: the second pump;
45: controller;
5: rotating support member;
51: cramp bar;
52: driven roller;
53: driven voller;
54: the rotary actuation member;
541: electro-motor;
542: member is in transmission connection;
6: pressing member;
60,61a: pressing component;
61: press service portion;
611,611a: press surface;
600,600a, 600b, 600c: pressing tablet;
62: vibrating body;
621: support;
622: the bottom vibrating body;
622b: bolster;
622c: external screw thread;
63: the weight parts;
633: reception hole;
634: the electrode terminal installation portion;
635a, 635b: collector ring;
65: ultrasonic oscillator;
651: piezoelectrics;
652a, 652b: electrode;
66: the top vibrating body;
67: clamp nut;
69: the alternating electromotive force supply member;
691: flexible pipe;
692: rotary connector;
70: support unit;
71: support;
710: the bolt through hole;
72: the supporting axial region;
720: the weight parts section that is rotatably assorted;
721: the oscillator installation portion;
722: the electrode terminal installation portion;
8: rubber ring;
9: burnishing device;
90: the machined object retaining member;
91: holding member;
91a: maintenance face;
92: cramp bar;
921: the first roller supports;
922: the second roller support;
93: driven roller;
94: the rotary actuation member;
941: electro-motor;
942: member is in transmission connection.
The specific embodiment
1, the structure of abrasive particle flush mounting
In abrasive particle flush mounting 1 shown in Figure 1, in device case 2, will form discoid grinding die holder 3 and be supported to and to rotate.Grind die holder 3 and is formed by metal materials such as tin, connecting rotating shaft 31 in the bottom of grinding die holder 3.Connecting the motor 32 as the rotary actuation member in the lower end of rotating shaft 31, grinding that die holder 3 is driven by motor 32 and the structure of rotating thereby form.Be formed with centre bore 33 at the central part that grinds die holder 3, the surface (upper surface) 30 of the part that the ring around centre bore 33 forms becomes uses zone 34, and described use zone 34 is actual zones of imbedding abrasive particle and grinding.
Be equipped with slip supply member 4 in the front portion of device case 2, described slip supply member 4 is supplied with slip 40 to the surface 30 of grinding die holder 3.Slip 40 can contain abrasive particle 40a, and, also can not contain abrasive particle 40a.
Be equipped with pressing member 6 above grinding die holder 3, described pressing member 6 applies the pressing force that grinds die holder 3 for abrasive particle is imbedded.As shown in Figure 2, this pressing member 6 possesses: a plurality of (being 3 in illustrated example) pressing component 60, and it is used for abrasive particle is imbedded grinding die holder 3; Weight parts 63, it is provided in the top of pressing component 60, is used for pressing component 60 is pressed on the grinding die holder; With ultrasonic oscillator 65, pressing component 60 is applied ultrasonic wave for it so that pressing component 60 vibrations.As shown in Figure 3, be provided with electrode 652a, 652b at ultrasonic oscillator 65.
As shown in Figure 2, pressing component 60 possesses vibrating body 62, applies vibration by 65 pairs of described vibrating bodies 62 of ultrasonic oscillator.Vibrating body 62 possesses discoid support 621 in the bottom, vibrating body 62 possesses up: large diameter bottom vibrating body 622, and its upper surface from support 621 extends upward; With bolster 622b, extend upward its upper end from bottom vibrating body 622.The lower surface of support 621 is bonded in by bonding agent and presses service portion 61.In addition, also can will press service portion 61 with bolt and clamp nut and be installed to support 621.
As shown in Figure 2, at the bottom vibrating body 622 chimeric rubber rings 8 that the polyurethane system of the ring-type of forming is arranged, described rubber ring 8 loads on support 621.On the other hand, ultrasonic oscillator 65 arranged in that bolster 622b is chimeric, described ultrasonic oscillator 65 loads on bottom vibrating body 622.And, to upload at ultrasonic oscillator 65 and to be equipped with top vibrating body 66, described top vibrating body 66 is in the state chimeric with bolster 622b.Be formed with external screw thread 622c in the upper end of bolster 622b, also fastening by clamp nut 67 and external screw thread 622c are screwed togather, thus ultrasonic oscillator 65 is fixed in bolster 622b.Like this, pressing service portion 61, bottom vibrating body 622, ultrasonic oscillator 65 and top vibrating body 66 becomes one and can vibrate.
As shown in Figure 2, be formed with the reception hole 633 identical with the number of pressing component 60 at weight parts 63, described reception hole 633 is used for holding pressing component 60.And, at the outstanding electrode terminal installation portion 634 that is provided with of the central part of the upper surface of weight parts 63, described electrode terminal installation portion 634 is used for common electrode is connected with all pressing component 60, is equipped with 2 collector ring 635a, 635b at the outer peripheral face of electrode terminal installation portion 634.At the electrode terminal installation portion 634 chimeric rotary connectors 692 that alternating electromotive force supply member 69 shown in Figure 1 is arranged that so consist of.And the collector ring 635a, the 635b that are provided in electrode terminal installation portion 634 are electrically connected with electrode 652a, 652b, and described electrode 652a, 652b set, consist of the electrode of each oscillator 65 separately at 3 vibrating bodies 62.
As shown in Figure 3, ultrasonic oscillator 65 is made of the piezoelectrics 651 of ring-type and electrode 652a, the 652b of ring-type that be installed in respectively the both sides plane of polarization of piezoelectrics 651.Piezoelectrics 651 are by barium titanate (BaTiO
3), lead zirconate titanate (Pb(Zr, Ti) O
3), lithium niobate (LiNbO
3), Tantalum acid lithium (LiTaO
3) etc. piezoelectric ceramics form.
As shown in Figure 4, in consisting of each pressing component 60 of pressing member 6, possess for a plurality of pressing tablets 600 that apply pressing force to grinding die holder 3 respectively pressing service portion 61.Pressing tablet 600 each free pottery form discoid, and are fixed under the state of giving prominence to downwards from press surface 611.A plurality of pressing tablets 600 form same diameter, and uniformly-spaced dispose in its mode that is centered close on the same circular arc.
As shown in Figure 1, possess rotating support member 5 at the rear side that grinds die holder 3, described rotating support member 5 is supported to pressing member 6 can rotate.Rotating support member 5 is supporting members of supporting pressing member 6, and rotating support member 5 possesses cramp bar 51, and described cramp bar 51 can along continuous straight runs moves and extends towards the top along continuous straight runs that grinds die holder 3.
Carry out illustrated shown in Figure 5 as removing pressing member 6 from abrasive particle flush mounting 1 shown in Figure 1, end at cramp bar 51 is provided with the first roller support 511 and second roller support 512, and described the first roller support 511 and second roller support 512 form from the compartment of terrain that cramp bar 51 branches out and each other keep predetermined.Be supported with driven roller 52 at the first roller support 511 in the mode that can rotate, be supported with driven voller 53 at second roller support 512 in the mode that can rotate.And, being equipped with rotary actuation member 54 at cramp bar 51, described rotary actuation member 54 is used for making driven roller 52 rotations.Rotary actuation member 54 is made of electro-motor 541 and the member 542 that is in transmission connection, and the described member 542 that is in transmission connection comprises driving-belt that the rotating shaft of the driving shaft of electro-motor 541 and driven roller 52 is coupled together in mode that can transmission etc.
Return Fig. 1 and go on to say, abrasive particle flush mounting 1 possesses alternating electromotive force supply member 69, and described alternating electromotive force supply member 69 is used for supplying with alternating electromotive force to electrode 652a, the 652b of oscillator shown in Figure 3 65.Alternating electromotive force supply member 69 is for example exported, and frequency is that 16～100kHz, voltage are the alternating electromotive force of 20～200V.From the alternating electromotive force of this alternating electromotive force supply member 69 outputs by be provided in the distribution (not shown) in the flexible pipe 691 and be provided in flexible pipe 691 end rotary connector 692 and supply to oscillator 65 from collector ring 635a, 635b shown in Figure 3 by distribution 682a, 682b.
As shown in Figure 6, each pressing component 60 is positioned at the top in the use zone 34 of grinding die holder 3.That is, form at the range content of the width 34a that uses zone 34 and received the state of all press surfaces of pressing service portion 61 611.As the width 34a that uses zone 34 during for 120mm for example, the diameter of pressing component 60 is for example about 115mm.And, each pressing component 60 be centered close to the concentric circular arc of the external diameter of weight parts 63 on.
2, the elemental motion of abrasive particle flush mounting
For abrasive particle being imbedded die holder 3, as shown in Figure 1, the pressing component 60 that consists of pressing member 6 is loaded in the surface 30 of grinding die holder 3, the outer peripheral face of weight parts 63 is contacted with driven voller 53 with the driven roller 52 of rotating support member 5.Then, cramp bar 51 is moved along the arrow directions X, make pressing component 60 be positioned at the top of using zone 34.In addition, pressing member 6 also can become the structure that the position is fixed and do not move, and in this case, suitably sets the size of pressing component 60, so that pressing component 60 can not stretch out from using zone 34.
And, the rotary connector 692 of alternating electromotive force supply member 69 is chimeric with electrode terminal installation portion 634 shown in Figure 3.Then, the driving by electro-motor 32 makes grinds die holder 3 along the rotating speed rotation of the direction shown in the arrow 3a among Fig. 1 with for example 30～60rpm, and the slip 40 that will contain abrasive particle 40a supplies to the surface 30 of grinding die holder 3 from slip supply member 4.
Then, the driving of the electro-motor 541 by consisting of rotating support member 5 makes driven roller 52 along the direction rotation shown in the arrow 52a.Like this, because driven roller 52 contacts with the outer peripheral face of weight parts 63, therefore, pressing component 60 is along the rotating speed rotation of the direction shown in the arrow 60a with for example 15～30rpm.Like this, grind die holder 3 rotations and make pressing component 60 rotations by making, the slip that contains abrasive particle 40a 40 of supplying with to the surface 30 of grinding die holder 3 enters between the press surface 611 of pressing service portion 61 and the surface 30 of the grinding die holder 3.
And, apply alternating electromotive force from alternating electromotive force supply member 69 to the electrode 652a, the 652b that consist of ultrasonic oscillator 65.Like this, piezoelectrics 651 carry out ultrasonic vibration, press service portion 61 and carry out along the vertical direction ultrasonic vibration.
Like this, enter as described above the press surface 611 of the pressing component 60 that carries out ultrasonic vibration and grind under the state between the surface 30 of die holder 3 at the slip 40 that contains abrasive particle 40a, when making pressing member 6 and grinding die holder 3 slip, press on the surface 30 of grinding die holder 3 by the press surface 611 of the pressing component 60 abrasive particle 40a that slip is contained, thereby abrasive particle is imbedded the surface 30 of grinding die holder 3.Because pressing component 60 is pressed abrasive particle 40a with the whole face of the press surface 611 of circle, therefore, can efficiently abrasive particle 40a be imbedded the surface 30 of grinding die holder 3.
In Fig. 1, the direction of rotation of the grinding die holder 3 that represents with arrow 3a and the direction of rotation of the pressing component 60 that represents with arrow 60a are identical directions, grind die holder 3 and the relative glide direction of pressing component 60 and be the direction of arrow X ' shown in Figure 7.And owing to form circle as the lower surface of the pressing tablet 600 of press surface, therefore, the lower surface of pressing tablet 600 is fixed with the relative sliding distance on the surface 30 of grinding die holder 3, and is irrelevant with sliding position.Therefore, fix with the pressure that slip 40 between the press surface 611 produces grinding die holder 3, with the location independent on the grinding die holder 3, thus inequality that can suppression fluid stress.Thereby, can abrasive particle 40a be imbedded surface 30 integral body of grinding die holder 3 with the ultrasonic intensity of equalization, can suppress the inequality of imbedding of abrasive particle.And, by using ultrasonic wave, can efficiently abrasive particle be imbedded surface 30.
When applying ultrasonic wave abrasive particle imbedded the surface 30 of grinding die holder 3, suppose to press as illustrated in fig. 8 the words that the press surface 611 ' of service portion 61 ' stretches out from grinding die holder 3, the distribution of the pressure that is produced by ultrasonic vibration can not reach even at the whole face of press surface 611 ', but become high and the generation cavitation pitting at local pressure, because this cavitation pitting sustains damage the part on the surface 30 of grinding die holder 3.But, as shown in Figure 6, because pressing component 60 is configured in not from the use zone 34 of grinding die holder 3 to the side-prominent position of periphery, therefore, the distribution of the pressure that is produced by ultrasonic vibration becomes evenly, can not produce cavitation pitting, the surperficial 30a that therefore, can avoid grinding die holder 3 sustains damage.
3, the modification of pressing tablet
In pressing component 60, as long as the sliding distance of diverse location is fixed, also can replace Fig. 4 and the service portion 61 of pressing shown in Figure 7, that uses Fig. 9 for example～shown in Figure 11 presses service portion 61a～61c.Compare with example shown in Figure 7 with Fig. 4, the service portion 61a that presses shown in Figure 9 makes pressing tablet 600 be positioned at the outer circumferential side of press surface 611a, and the periphery of the periphery of pressing tablet 600 and press surface 611a is tangent.And, shown in Figure 10 press the pressing tablet 600b that service portion 61b constitutes ring-type and equally spaced be configured to circular-arc.By in each pressing tablet 600b, being formed centrally circular groove 601, near the maximum pressure in center of pressing tablet 600b is reduced.And the service portion 61c that presses shown in Figure 11 constitutes, and each pressing tablet 600c has the press surface 602 of the minor diameter of a plurality of circles, form shallow slot 603 around described press surface 602, and described pressing tablet 600c is configured to equally spaced circular-arc.
4, the structure modify of pressing member example
Also can replace Fig. 2 and pressing member 6 shown in Figure 3, use Figure 12 and pressing member 6a shown in Figure 13.This pressing member 6a has: pressing component 61a, and it is used for the contained abrasive particle of slip that supplies to the surface 30 of grinding die holder 3 is pressed; With support unit 70, it is used for supporting pressing component 61a.Pressing component 61a is formed discoid by pottery, have press surface 611a at the lower surface of pressing component 61a, has installed surface 612a at the upper surface of the side opposite with press surface 611a of pressing component 61a.
For example shown in Figure 14, at press surface 611a, discoid pressing tablet 600a is configured on the double circular arc.Pressing tablet 600a is outstanding downwards with respect to press surface 611a.
As shown in figure 12, support unit 70 has: support 71, and it is by the installed surface 612a of bonding agent assembling pressing component 61a; With supporting axial region 72, it erects setting from support 71.Support 71 forms than large discoid of pressing component 61a external diameter, and support 71 equally spaced is provided with 4 bolt through holes 710 by circular-arc at peripheral part.
Supporting axial region 72 possesses: the large diameter weight parts section 720 that is rotatably assorted, and its upper surface from support 71 extends upward; Oscillator installation portion 721, it extends upward from the be rotatably assorted upper end of section 720 of weight parts, and is less than the be rotatably assorted diameter of section 720 of weight parts; With electrode terminal installation portion 722, it forms less than oscillator installation portion 721 diameters, and electrode terminal installation portion 722 extends upward from the upper end of oscillator installation portion 721.
The be rotatably assorted outer circumferential side of section 720 of the weight parts 73 that formed ring-type by stainless steel and other metal materials and weight parts is rotatably assorted.Weight parts 73 are formed with the hole 730 that is rotatably assorted at central portion, the described hole 730 of being rotatably assorted is used for being rotatably assorted with the weight parts section 720 that is rotatably assorted, at the lower surface of weight parts 73, be formed with 4 internal thread holes 731 in the position corresponding with 4 bolt through holes 710 of being located at support 71.Be rotatably assorted and load the upper surface of support 71 by will be rotatably assorted hole 730 and the weight parts section 720 that is rotatably assorted, and connecting bolt 64 is run through by bolt through hole 710 and with internal thread hole 731 from the downside of support 71 screw togather, thereby the weight parts 73 that will so consist of are installed on support 71.
As shown in figure 13, the periphery at electrode terminal installation portion 722 is equipped with 2 collector ring 681a, 681b.This collector ring 681a, 681b are connected with electrode 652a, the 652b of formation ultrasonic oscillator 65 with 682b by distribution 682a.
In Figure 12 and pressing member 6a shown in Figure 13, as shown in figure 14, because the lower surface of pressing tablet 600a forms circle, therefore, the lower surface of pressing tablet 600a is fixed with the sliding distance that grinds die holder 3 and is irrelevant with sliding position.Therefore, with the location independent that grinds on the die holder 3, can imbed abrasive particle 40a to upper surface 30 integral body of grinding die holder 3 grinding pressure fixing that die holder 3 and slip 40 between the pressing component 61a produce with uniform ultrasonic intensity.
And as shown in figure 15, because all pressing tablet 600a are positioned at the inboard in the use zone 34 of grinding die holder 3, therefore, the distribution of the pressure that is produced by ultrasonic vibration reaches evenly, can not produce cavitation pitting, and the surface 30 that can avoid grinding die holder 3 sustains damage.
5, the burnishing device that possesses the abrasive particle flush mounting
Burnishing device 9 shown in Figure 16 is to form at abrasive particle flush mounting shown in Figure 11 additional machined object retaining member 90, and it can carry out abrasive particle to the grinding of imbedding and grinding 3 pairs of machined objects of die holder (polishing) of grinding die holder 3.In addition, in burnishing device 9, to being marked with the symbol identical with Fig. 1 with position that abrasive particle flush mounting 1 shown in Figure 1 similarly consists of, and description is omitted.
Machined object retaining member 90 possesses and forms columned holding member 91.Lower surface at holding member 91 has for the maintenance face 91a that keeps machined object.Maintenance face 91a namely faces on surface 30 with the abradant surface that grinds die holder 3, the machined object of the maintenance face of being maintained at 91a can be held in the state with surface 30 butts that grind die holder 3.
Machined object retaining member 90 possesses the cramp bar 92 that can along continuous straight runs moves.End at cramp bar 92 is provided with the first roller support 921 and second roller support 922, and described the first roller support 921 and second roller support 922 form from the compartment of terrain that cramp bar 92 branches out and each other keep predetermined.Be supported with driven roller 93 at the first roller support 921 in the mode that can rotate, be supported with driven voller (not shown) at second roller support 922 in the mode that can rotate.And, being equipped with rotary actuation member 94 at cramp bar 92, described rotary actuation member 94 is used for making driven roller 93 rotations.Rotary actuation member 94 is made of electro-motor 941 and the member 942 that is in transmission connection, and the described member 942 that is in transmission connection comprises driving-belt that the rotating shaft of the driving shaft of electro-motor 941 and driven roller 93 is coupled together in mode that can transmission etc.
6, the polishing of machined object
Next, the action of the burnishing device 9 when using burnishing device shown in Figure 16 9 to carry out the polishing of machined object describes.When the polishing of machined object, machined object, for example wafer W are remained on the maintenance face 91a of machined object retaining member 90.At this moment, so that the face that is polished of wafer W face with the surface 30 of grinding die holder 3.Then, the outer peripheral face of the holding member 91 that consists of machined object retaining member 90 is contacted with driven voller with driven roller 93, and cramp bar 92 is moved along direction shown in the arrow X, thereby wafer W is positioned to grind the top in the use zone 34 of die holder 3.
Like this, after being supported on driven roller 93 and driven voller with the wafer W location and with machined object retaining member 90, between the surface 30 of grinding die holder 3 and wafer W, supply with slip from slip supply member 4 on one side, make with electro-motor 32 on one side and grind die holder 3 along direction rotation shown in the arrow 3a, and, electro-motor 941 makes driven roller 93 rotations, thereby makes holding member 91 along direction rotation shown in the arrow 91b.Like this, abrasive particle 40a and slip that the lower surface that the conduct of wafer W that is installed in the lower surface of holding member 91 is polished face is embedded in the surface 30 of grinding die holder 3 grind.
In burnishing device 9, can use respectively accordingly the slip that contains the slip of abrasive particle 40a and do not contain abrasive particle 40a with purpose.For example, can make by the controller 45 that utilizes slip supply member 4 the some runnings among the first pump 42 or the second pump 44a control to the slip of surface 30 supplies of grinding die holder 3 whether contain abrasive particle 40a.Below, use the example of the step that burnishing device 9 polishes with reference to the flowchart text of Figure 17～19.
(1) finishing method 1
As shown in figure 17, initial, abrasive particle is imbedded the surperficial 30(step S11 that grinds die holder 3).In step S11, pressing component 60 is loaded in the surface 30 of grinding die holder 3, by rotating support member 5 supporting pressing members 6.On the other hand, at machined object retaining member 90, holding member 91 is in the state of unloading.
Then, make and grind die holder 3 along the direction rotation shown in the arrow 3a, and, supply with to the surface 30 of grinding die holder 3 from slip supply member 4 and to contain abrasive particle 40a(free abrasive) slip 40, and, make driven roller 52 along direction rotation shown in the arrow 52a, make pressing component 60 along direction rotation shown in the arrow 60a.And, apply alternating electromotive force from alternating electromotive force supply member 69, make pressing component 60 produce ultrasonic vibration.Like this, the slip 40 that contains abrasive particle 40a enters the press surface 611 of pressing component 60 and grinds between the surface 30 of die holder 3, thereby abrasive particle 40a is imbedded the surface 30 of grinding die holder 3.In addition, as slip 40, use such as hydrocarbon ils, ethylene glycol etc.
As previously mentioned, by forming circle as the lower surface of the pressing tablet 600 of press surface, owing to grinding die holder 3 and the pressure fixing of pressing slip 40 generations between the service portion 61, therefore, can suppress the inequality of imbedding of abrasive particle.
Then, remain in the contained sludge (grinding the processing powders of die holder 3 and pressing tablet 600 etc.) of the slip 40 that grinds on the die holder 3, abrasive particle 40a and slip 40 in order to remove, for example, while the cleaning fluid of illustrated nozzle ejection high pressure cleans grinding die holder 3 by making grinding die holder 3 rotate never.Then, after this, illustrated nozzle carries out drying processing (step S12) to grinding die holder 3 ejection pressure-airs while make grinding die holder 3 rotate never.
Like this, under the state after abrasive particle being imbedded the surface 30 of grinding die holder 3 and having been cleaned surface 30, carry out the polishing (step S13) of machined object.When grinding, as shown in figure 16, keep machined object, for example wafer W at the maintenance face 91a of holding member 91.Then, make holding member 91 contact and be supported with driven voller with driven roller 93, wafer W is loaded in the surface 30 of grinding die holder 3, and cramp bar 92 is moved along directions X, thus, wafer W is positioned at the use zone 34 on the surface 30 of grinding die holder 3.
Like this, load behind the use zone 34 of grinding die holder 3 in wafer W, the slip that do not contain abrasive particle is supplied between the surface 30 of grinding die holder 3 and the wafer W from slip supply member 4 polish.Cleaning by step S12, removed in step S11 and to have used and remain in the abrasive particle (free abrasive) on the surface 30 of grinding die holder 3, therefore, when grinding, can access the good machined surface less than the grinding marks such as scratch that caused by free abrasive, the surface roughness of wafer W is improved.
(2) finishing method 2
As shown in figure 18, initial, use the slip that contains abrasive particle to carry out the polishing of wafer.At first, as shown in figure 16, keep pressing member 6 by rotating support member 5, and, will keep the holding member 91 of wafer W to remain in machined object retaining member 90, pressing member 6 and wafer W are loaded in the use zone 34 of grinding die holder 3,
Then, make and grind die holder 3 along arrow 3a direction rotation shown in Figure 16, and, make pressing member 6 along arrow 60a direction rotation, make holding member 91 along arrow 91b direction rotation, make between the press surface 611 of the surface 30 of grinding die holder 3 and pressing member 6 and slide, and, make described surperficial 30 with the wafer W slip.At this moment, apply alternating electromotive force and make pressing component 61 produce ultrasonic vibration from alternating electromotive force supply member 69.And, will contain abrasive particle 40a(free abrasive) slip supply between the surface 30 of grinding die holder 3 and the wafer W and between the press surface 611 of this surface 30 and pressing member 6 from slip supply member 4.Like this, by the abrasive particle of imbedding the surface 30 of grinding die holder 3 and the abrasive particle (free abrasive) of supplying with from slip supply member 4 wafer W is polished, and the free abrasive member 6 that is pressed is pressed and is embedded in the surperficial 30(step S21 that grinds die holder 3, the first polishing process).
Next, the slip that does not contain abrasive particle 40a is supplied between the surface 30 and wafer W of grinding die holder 3 from slip supply member 4, make the grinding die holder 3 of rotation and the wafer W of rotation slide to carry out the grinding of wafer W.At this moment, can apply alternating electromotive force from alternating electromotive force supply member 69 and make pressing component 61 produce ultrasonic vibration, also can not make pressing component 61 produce ultrasonic vibration.Like this, because residual free abrasive and the abrasive particle (bonded-abrasive) of imbedding the surface 30 of grinding die holder 3 grind on the surface 30 of grinding die holder 3 by using at step S21, therefore, compare with the above-mentioned finishing method 1 of removing free abrasive by cleaning, grinding efficiency improves (step S22, the second polishing process).
Chemical Mechanical Polishing) etc. also there is the chemically mechanical polishing by CMP(in this method after this: in the situation of the further finishing step that carries out, not and wafer is not had in the situation that high-quality requires in the degree that adopts the method for only being ground by above-mentioned bonded-abrasive, it is effective method, has following advantage: the process time that can shorten CMP, even do not append the polishing process that is undertaken by little abrasive particle, compare with the grinding of being undertaken by free abrasive, also high-quality machined surface can be accessed, process cost can be reduced.
(3) finishing method 3
In above-mentioned finishing method 2, owing to the grinding of in step S22, carrying out being realized by free abrasive, thereby may produce defective and the damage that be caused by free abrasive at the machined surface of wafer W.Therefore, make in hope in the situation of described defective or damage minimizing, as shown in figure 19, polishing (the step S31 that is being undertaken by the slip that contains abrasive particle, the first polishing process) with polishing (the step S33 that is undertaken by the slip that does not contain abrasive particle, the second polishing process) between, carries out the matting (step S32) that the surface 30 of grinding die holder 3 is cleaned.There are the methods such as following in matting: the liquid that will not contain abrasive particle is sprayed onto the method on the surface 30 of grinding die holder 3; With the grinding pad of wafer or the Porous method by the surface 30 that is pressed in lap seat 3; With the scraping blade with rubber system residue is rejected to the method for grinding outside the die holder 3, as long as select according to desired quality.If implement to clean, owing to promoted the discharge of free abrasive, although therefore the grinding efficiency of step S33 is lower than step S22, improved the crudy of wafer W.In addition, step S31 is by the method implementation same with step S21, and step S33 is by the method implementation same with step S22.
As mentioned above, in finishing method 2 and finishing method 3, while supplying with in the polishing that the slip that do not contain abrasive particle carries out, owing to can suppress the reduction of working (machining) efficiency, the volume of the part that therefore can remove by the processing that not affected by free abrasive has increased.That is, the area change of the grinding marks that produces in the time of can removing the polishing of using free abrasive.Thereby, can increase the diameter of the machined object of wafer shape.Especially, carrying out sapphire, SiC(carborundum), the GaN(gallium nitride), the AlN(aluminium nitride) etc. be effective in the situation of polishing of hard substrate.
[embodiment 1]
Figure 20 shows the AlTiC(aluminium titanium carbon to using in the magnetic head) the block grinding efficiency of in following two kinds of situations, grinding: use burnishing device 9 of the present invention and carry out the situation of polishing by above-mentioned finishing method 2 and finishing method 3; And there is not abrasive particle to imbed the common burnishing device of function and above-mentioned finishing method 2 and finishing method 3 similarly carry out the polishing that realized by the slip that does not contain abrasive particle after being polished by the slip that contains abrasive particle situation in use.
As can be known, finishing method 2,3 no matter, all the grinding efficiency than the situation of using common burnishing device is high to use the situation of burnishing device 9 of the present invention.This be because, imbed in the burnishing device 9 of function having abrasive particle, in the polishing of using free abrasive, abrasive particle is imbedded the surface 30 of grinding die holder 3, improved the efficient of not using the polishing of abrasive particle.
And, if compare finishing method 2 and finishing method 3, as can be known, no matter be the situation of using any device, all frequently the grinding efficiency of finishing method 3 is high for finishing method 2.This be because, very large by cleaning the ratio of removing free abrasive in finishing method 3, therefore, the corresponding reduction of grinding efficiency.
And, find that also in 4 methods, in the situation of using burnishing device 9 of the present invention and polishing by finishing method 2, grinding efficiency is the highest.
Claims (6)
1. abrasive particle flush mounting, described abrasive particle flush mounting are used for the abrasive particle that slip is contained and imbed the surface of grinding die holder, and described abrasive particle flush mounting is characterised in that,
Described abrasive particle flush mounting possesses:
Pressing member, described pressing member is used for pressing described grinding die holder;
Slip supply member, described slip supply member are used for supplying with the slip that contains abrasive particle to the surface of described grinding die holder; And
Sliding component, described sliding component are used for making described pressing member and described grinding die holder to slide,
Described pressing member comprises: pressing component; The weight parts, described weight parts are provided in the top of described pressing component, are used for described pressing component is pressed on described grinding die holder; And ultrasonic oscillator, described ultrasonic oscillator is used for described pressing component is applied ultrasonic wave,
Described pressing component has press surface, and described press surface is equipped with a plurality of discoid pressing tablets.
2. abrasive particle flush mounting as claimed in claim 1 is characterized in that,
Described pressing component is configured in the position of not giving prominence to from the use zone of described grinding die holder.
3. a burnishing device is characterized in that,
Described burnishing device possesses:
Grind die holder, described grinding die holder has for the abradant surface that grinds machined object, and described grinding die holder is supported to and can rotates;
Rotary actuation member, described rotary actuation member are used for making described grinding die holder rotation;
The machined object retaining member, described machined object retaining member has maintenance face, the described abradant surface of described maintenance face and described grinding die holder is relative and be used for keeping machined object, described machined object retaining member to be used for machined object is held in state with described grinding die holder butt;
Slip supply member, described slip supply member are used for supplying with the slip that contains the slip of abrasive particle and do not contain abrasive particle to the surface selectivity ground of described grinding die holder; And
The abrasive particle flush mounting, described abrasive particle flush mounting is pressed described grinding die holder with pressing member across slip, described slip is to utilize described slip supply member to supply to the slip that contains abrasive particle on the surface of described grinding die holder, and, described pressing member and described grinding die holder are slided, the abrasive particle that described slip is contained is imbedded the surface of described grinding die holder
Described pressing member comprises: pressing component; The weight parts, described weight parts are provided in the top of described pressing component, are used for described pressing component is pressed on described grinding die holder; And ultrasonic oscillator, described ultrasonic oscillator is used for described pressing component is applied ultrasonic wave,
Described pressing component has press surface, and described press surface is equipped with a plurality of discoid pressing tablets.
4. finishing method, described finishing method right to use require the burnishing device described in 3 that the machined object that is kept by described machined object retaining member is polished, and described finishing method is characterised in that,
Described finishing method comprises following operation:
The first polishing process, in this first polishing process, the slip that will contain abrasive particle on one side supplies to the surface of described grinding die holder, press described grinding die holder with described pressing member across the described slip that contains abrasive particle on one side, and, make described pressing member and the described grinding die holder abrasive particle that described slip is contained that slides imbed the surface of described grinding die holder, and, make the machined object that kept by described machined object retaining member and described grinding die holder slide the surface of described machined object polished;
The second polishing process, in this second polishing process, after implementing described the first polishing process, the slip that will not contain on one side abrasive particle supplies to the surface of described grinding die holder, makes on one side to be slided by the machined object of described machined object retaining member maintenance and described grinding die holder the surface of described machined object is polished.
5. finishing method as claimed in claim 4 is characterized in that,
Between described the first polishing process and described the second polishing process, also comprise matting, in this matting, clean described grinding die holder.
6. such as claim 4 or 5 described finishing methods, it is characterized in that,
Described machined object is selected from the group that is made of sapphire, carborundum, gallium nitride and aluminium nitride.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011190641A JP5808201B2 (en) | 2011-09-01 | 2011-09-01 | Abrasive grain embedding device, lapping device, and lapping method |
| JP2011-190641 | 2011-09-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102962763A true CN102962763A (en) | 2013-03-13 |
| CN102962763B CN102962763B (en) | 2016-08-17 |
Family
ID=47793352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210320182.1A Active CN102962763B (en) | 2011-09-01 | 2012-08-31 | Abrasive particle flush mounting, burnishing device and finishing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5808201B2 (en) |
| CN (1) | CN102962763B (en) |
| MY (1) | MY169975A (en) |
| TW (1) | TWI579105B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108930112A (en) * | 2017-05-29 | 2018-12-04 | 丰田纺织株式会社 | Particle immersion system |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6267916B2 (en) * | 2013-10-08 | 2018-01-24 | 株式会社ディスコ | Charging device |
| JP6434266B2 (en) | 2013-12-17 | 2018-12-05 | 富士紡ホールディングス株式会社 | Lapping resin surface plate and lapping method using the same |
| CN112892809B (en) * | 2021-02-05 | 2023-01-24 | 惠州大唐伟业电子有限公司 | Ultrasonic machining device for optical glass |
| JP7238053B1 (en) | 2021-08-30 | 2023-03-13 | 直江津電子工業株式会社 | Work polishing device, polishing auxiliary device and work manufacturing method |
| JP7240078B1 (en) | 2021-08-30 | 2023-03-15 | 直江津電子工業株式会社 | Workpiece polishing device and polishing auxiliary device |
| CN114247939B (en) * | 2021-12-24 | 2023-01-06 | 大连理工大学 | Gear no-load integral immersion type chemical mechanical coupling surface polishing method |
| CN115042086B (en) * | 2022-07-15 | 2023-11-28 | 江苏科沛达半导体科技有限公司 | High-precision semiconductor wafer outer diameter grinding device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07299737A (en) * | 1994-04-28 | 1995-11-14 | Matsushita Electric Ind Co Ltd | Polishing method |
| CN1216727A (en) * | 1997-10-31 | 1999-05-19 | 株式会社日立制作所 | Lapping method |
| JP2001232558A (en) * | 2000-02-24 | 2001-08-28 | Matsushita Electric Ind Co Ltd | Polishing method |
| JP2004330338A (en) * | 2003-05-06 | 2004-11-25 | Shin Etsu Chem Co Ltd | Workpiece polishing device and workpiece polishing method |
| US20040237414A1 (en) * | 2003-05-26 | 2004-12-02 | Kazumasa Ohnishi | Manufacture of lapping board |
| JP2007067166A (en) * | 2005-08-31 | 2007-03-15 | Matsushita Electric Ind Co Ltd | Chemomechanical polishing method of sic substrate |
| CN100522480C (en) * | 2005-01-14 | 2009-08-05 | 株式会社理光 | Surface polishing method and apparatus thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0392264A (en) * | 1989-09-04 | 1991-04-17 | Hitachi Ltd | High-accuracy lapping method and device for composite material |
| JPH11213367A (en) * | 1998-01-28 | 1999-08-06 | Citizen Watch Co Ltd | Grinding method for floating surface of thin film magnetic head |
| JP4121086B2 (en) * | 2001-12-27 | 2008-07-16 | 富士通株式会社 | Abrasive embedding tool for lapping machine |
| JP5209378B2 (en) * | 2008-06-06 | 2013-06-12 | 株式会社ディスコ | Wrap equipment |
| JP5024305B2 (en) * | 2009-02-04 | 2012-09-12 | 住友電気工業株式会社 | Polishing method of GaN substrate |
-
2011
- 2011-09-01 JP JP2011190641A patent/JP5808201B2/en active Active
-
2012
- 2012-08-06 TW TW101128269A patent/TWI579105B/en active
- 2012-08-08 MY MYPI2012003579A patent/MY169975A/en unknown
- 2012-08-31 CN CN201210320182.1A patent/CN102962763B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07299737A (en) * | 1994-04-28 | 1995-11-14 | Matsushita Electric Ind Co Ltd | Polishing method |
| CN1216727A (en) * | 1997-10-31 | 1999-05-19 | 株式会社日立制作所 | Lapping method |
| JP2001232558A (en) * | 2000-02-24 | 2001-08-28 | Matsushita Electric Ind Co Ltd | Polishing method |
| JP2004330338A (en) * | 2003-05-06 | 2004-11-25 | Shin Etsu Chem Co Ltd | Workpiece polishing device and workpiece polishing method |
| US20040237414A1 (en) * | 2003-05-26 | 2004-12-02 | Kazumasa Ohnishi | Manufacture of lapping board |
| CN100522480C (en) * | 2005-01-14 | 2009-08-05 | 株式会社理光 | Surface polishing method and apparatus thereof |
| JP2007067166A (en) * | 2005-08-31 | 2007-03-15 | Matsushita Electric Ind Co Ltd | Chemomechanical polishing method of sic substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108930112A (en) * | 2017-05-29 | 2018-12-04 | 丰田纺织株式会社 | Particle immersion system |
| US10974274B2 (en) | 2017-05-29 | 2021-04-13 | Toyota Boshoku Kabushiki Kaisha | Device for impregnating particles into a non-woven fabric |
Also Published As
| Publication number | Publication date |
|---|---|
| MY169975A (en) | 2019-06-19 |
| TWI579105B (en) | 2017-04-21 |
| TW201318768A (en) | 2013-05-16 |
| JP2013052455A (en) | 2013-03-21 |
| JP5808201B2 (en) | 2015-11-10 |
| CN102962763B (en) | 2016-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102962763A (en) | Abrasive particle burying device, polishing device and polishing method | |
| CN201244770Y (en) | Polishing pad regulator and chemical mechanical device equipped therewith | |
| US6263605B1 (en) | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor | |
| US6325709B1 (en) | Rounded surface for the pad conditioner using high temperature brazing | |
| US7052371B2 (en) | Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk | |
| EP0566258A1 (en) | Improved slurry polisher using ultrasonic agitation | |
| US8025555B1 (en) | System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system | |
| US6409580B1 (en) | Rigid polishing pad conditioner for chemical mechanical polishing tool | |
| AU5148198A (en) | Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad | |
| US6039635A (en) | Surface polishing apparatus including a dresser | |
| US11980997B2 (en) | Dressing apparatus and polishing apparatus | |
| CN114310627A (en) | Polishing pad and polishing equipment for polishing silicon wafer | |
| CN112476227A (en) | Chemical mechanical polishing device | |
| KR20170014396A (en) | A polishing pad for curve polishing | |
| US10974366B2 (en) | Conditioning wheel for polishing pads | |
| US6514127B2 (en) | Conditioner set for chemical-mechanical polishing station | |
| US6796885B2 (en) | Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therfor | |
| WO2019131846A1 (en) | Grinding method and grinding device | |
| KR20160145810A (en) | Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning | |
| CN105636743B (en) | Method for machining polishing member and method for correcting polishing member | |
| US7534166B2 (en) | Chemical mechanical polishing apparatus | |
| JPH0416311B2 (en) | ||
| JP6231334B2 (en) | Thin plate substrate grinding method and grinding apparatus used therefor | |
| US20140154955A1 (en) | Systems and Methods for Stripping and/or Finishing Wood Surfaces | |
| KR200419418Y1 (en) | Polishing pad conditioner with shaped abrasive patterns and channels |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |