CN102951498B - Adhesives reel and reel external member - Google Patents
Adhesives reel and reel external member Download PDFInfo
- Publication number
- CN102951498B CN102951498B CN201210291451.6A CN201210291451A CN102951498B CN 102951498 B CN102951498 B CN 102951498B CN 201210291451 A CN201210291451 A CN 201210291451A CN 102951498 B CN102951498 B CN 102951498B
- Authority
- CN
- China
- Prior art keywords
- adhesive material
- reel
- material tape
- adhesives
- bond layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 423
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 423
- 239000000463 material Substances 0.000 claims abstract description 404
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 154
- 239000007767 bonding agent Substances 0.000 claims description 89
- 239000002245 particle Substances 0.000 claims description 70
- 239000011256 inorganic filler Substances 0.000 claims description 45
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 45
- 239000000203 mixture Substances 0.000 claims description 38
- 229920005992 thermoplastic resin Polymers 0.000 claims description 34
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- -1 Formic acid butanediol ester Chemical class 0.000 claims description 27
- 229920001187 thermosetting polymer Polymers 0.000 claims description 19
- 239000007870 radical polymerization initiator Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 12
- 239000007800 oxidant agent Substances 0.000 claims description 10
- 230000001590 oxidative effect Effects 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
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- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
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- 238000000605 extraction Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
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- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 claims 4
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- JSLMNNPQKHONFW-UHFFFAOYSA-N benzene naphthalene-1-carboxylic acid Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)O.C1=CC=CC=C1 JSLMNNPQKHONFW-UHFFFAOYSA-N 0.000 claims 3
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- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
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- 230000033228 biological regulation Effects 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 2
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920001290 polyvinyl ester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- QVTVDJWJGGEOGX-UHFFFAOYSA-N urea;cyanide Chemical compound N#[C-].NC(N)=O QVTVDJWJGGEOGX-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The present invention provides adhesives reel and reel external member.Described adhesives reel possesses core, in the oppositely disposed pair of side plates in the both sides of described core, and be wound in described core and there is banding substrate and the adhesive material tape of the bond layer being arranged on a face of this base material, described adhesive material tape has: for the region extended towards the direction of terminal part from the top portion of this adhesive material tape and the use portion using described bond layer, the volume of described bond layer is not used to abandon portion in specific length from this adhesive material tape terminal part, and it is arranged on described use portion and described volume abandons the end mark in the region between portion.
Description
Technical field
The present invention relates to adhesives reel, relate more specifically in core, be wound with the base material with banding
Adhesives reel with the adhesive material tape of the bond layer arranged on a face of this base material.
Background technology
Circuit connecting body is manufactured as being used for being electrically connected the circuit block with multiple electrode each other
Connecting material, use anisotropic conductive film (ACF:Anisotropic Conductive Film).Respectively
Anisotropy conducting film is a kind of at bases such as tellite, LCD glass substrate, flexible printed boards
When connecting the parts such as semiconductor element, packaging body such as IC, LSI on plate, to keep comparative electrode leading each other
Logical state and the connection material keeping the mode of adjacent electrode insulation to be each other electrically connected and be mechanically fixed
Material.In addition to anisotropic conductive film, it is known that non-conductive film (NCF:Non-Conductive film) etc. connects
Connect material.
Above-mentioned connecting material contains the bonding agent composition containing thermosetting resin etc. and is anisotropic conductive film
Time the conducting particles that coordinates as required, on the base materials such as polyethylene terephthalate film (PET film)
Be formed as membranaceous.The master of the film obtained (former anti-) is cut into banding being suitable for the width of purposes, will
It is wound in core manufacture adhesives reel (with reference to Japanese Unexamined Patent Publication 2003-34468 publication).
But as one of reason of connection reliability reducing circuit connecting body, there is the phenomenon of referred to as adhesion.Viscous
Being even a kind of time adhesive material tape under reeling condition is pulled out use, bond layer is transferred on the base material back of the body
The phenomenon in face.It is arranged on the bond layer in a face of base material because being in its uncured state so having certain journey
The mobility of degree.If by adhesives reel placement for a long time etc., sometimes will be from the end of adhesive material tape
Bonding agent is oozed out in face, and these will be adhered and be bonded in the side plate of reel.Bonding material is pulled out from reel with this state
During material strip, it some times happens that a part for bond layer is transferred on the unfavorable condition of substrate backside, bonding agent
The layer unfavorable condition that only base material is drawn out from base material stripping.
If sticked together, when a part for bond layer is transferred in substrate backside when pulling out adhesive material tape
Time, it is impossible to the bond layer of the assigned position configuration necessary amount on circuit block so that being electrically connected of connecting portion
Connect or be mechanically fixed and likely become insufficient.Additionally, when bond layer is peeled off and only base material quilt from base material
During pull-out, it has to stop production equipment and be substantially reduced productivity ratio.Circuit connecting body, semiconductor chip,
Printed circuit board (PCB)s etc. require mass-produced field etc., in order to have cost competitiveness, increase the unit interval
It is very important for producing number, it is assumed that even its impact of the dwell time of several minutes degree is very the biggest.Cause
This, expect in such field to improve adhesion (with reference to International Publication the 08/053824th, international public affairs strongly
Open No. 07/015372, Japanese Unexamined Patent Publication 2003-064322 publication, Japanese Unexamined Patent Publication 2006-218867
Publication, Japanese Unexamined Patent Publication 2009-004354 publication, Japanese Unexamined Patent Publication 11-293206 publication, Japan spy
Open 2001-284005 publication).
In patent documentation 2,3, describe the technology suppressing adhesion from the viewpoint of adhesives belt shape,
Disclose and be provided with narrow bonding of width ratio substrate width in the side end face of band in the inner side in substrate width direction
The adhesive material tape of oxidant layer.In patent documentation 4, describe the viewpoint from bonding agent composition and suppress adhesion
Technology, discloses the adhesive material tape making to be in the interim bed knife of substrate in prescribed limit.At patent literary composition
Offer in 5, describe the viewpoint from the condition of use and suppress the technology of adhesion, disclose and there is control reel temperature
The sticker of unit.In patent documentation 6, describe from the reel parts being wound with adhesive material tape
The technology of the viewpoint suppression adhesion of structure, discloses and is arranged on the rib structure of side plate and has the bonding material of electric conductivity
Material reel.In patent documentation 7, describe the technology suppressing adhesion from the viewpoint of matrix structure, disclose
The surface tension to the exterior and the interior is used to bring the material wound body as base material of excellent potential difference.At patent documentation 8
In, describe the technology suppressing adhesion from the affinity viewpoint of end mark and bonding agent.
Prior art
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2003-34468 publication
Patent documentation 2: International Publication the 08/053824th
Patent documentation 3: International Publication the 07/015372nd
Patent documentation 4: Japanese Unexamined Patent Publication 2003-064322 publication
Patent documentation 5: Japanese Unexamined Patent Publication 2006-218867 publication
Patent documentation 6: Japanese Unexamined Patent Publication 2009-004354 publication
Patent documentation 7: Japanese Unexamined Patent Publication 11-293206 publication
Patent documentation 8: Japanese Unexamined Patent Publication 2001-284005 publication
Summary of the invention
Described in above-mentioned patent documentation 2 ~ 8, although obtain practical from circuit connecting adhesive material band
Have studied the countermeasure preventing adhesion until recently from various viewpoints, but present situation is not yet to find epoch-making solution
Certainly scheme.
Then, it is an object of the invention to provide a kind of when pull out reeling condition adhesive material tape time, it is possible to
The highest level suppression bond layer is peeled off from base material and is only pulled out the bonding material of this unfavorable condition of base material
Material reel.Hereinafter, " adhesion " expression in this manual " when pulling out the adhesive material tape of reeling condition,
Bond layer only pulls out this unfavorable condition of base material from base material stripping ".
The present invention relates to following aspect:
1. an adhesives reel, it possesses core, oppositely disposed in the both sides of described core
Pair of side plates and be wound in described core and have banding substrate and be arranged on a face of this base material
The adhesive material tape of bond layer,
Described adhesive material tape has: for extend towards the direction of terminal part from the top portion of this adhesive material tape
Region and use described bond layer use portion, from this adhesive material tape terminal part in specific length not
The volume using described bond layer is abandoned portion and is arranged on described use portion and region that described volume is abandoned between portion
End mark.
2., according to the adhesives reel described in 1, described volume abandons a length of more than the 5m in portion.
3., according to the adhesives reel described in 1, described volume abandons a length of more than 5m below the 20m in portion.
4., according to the adhesives reel described in 1, described volume is abandoned a length of of portion and is wound in described core
Under the state having described adhesive material tape more than 10 circles.
5., according to the adhesives reel described in 1, described volume is abandoned a length of of portion and is wound in described core
Under the state having described adhesive material tape below above 30 circles of 10 circles.
6., according to the adhesives reel described in any one in 1 ~ 5, described bond layer is 30 DEG C cut
Cutting viscosity is below 100000Pa s.
7., according to the adhesives reel described in any one in 1 ~ 5, the width of described adhesive material tape is
0.5~3.0mm。
8. according to the adhesives reel described in any one in 1 ~ 5, described adhesive material tape a length of
More than 200m.
9. according to the adhesives reel described in any one in 1 ~ 5, described adhesive material tape a length of
More than 200m below 1000m.
10., according to the adhesives reel described in any one in 1 ~ 5, the thickness of described bond layer is
5~60μm。
11. are used for circuit according to the adhesives reel described in any one in 1 ~ 5, described adhesive material tape
Connect.
12. 1 kinds of reel external members, it possesses adhesives reel and operation instructions,
Described adhesives reel possess core, in the both sides of described core an oppositely disposed offside
Plate and be wound in described core and have banding substrate and be arranged on a face of this base material bonding
The adhesive material tape of oxidant layer,
Have described in described operation instructions and do not use from this adhesives when using described adhesive material tape
Tape terminal portion plays the described bond layer of specific length and abandons the item in portion as volume.
13. according to the reel external member described in 12, and described volume abandons a length of more than the 5m in portion.
14. according to the reel external member described in 12, and described volume abandons a length of more than 5m below the 20m in portion.
15. according to the reel external member described in 12, and described volume is abandoned a length of of portion and is wound with in described core
Under the state of described adhesive material tape more than 10 circles.
16. according to the reel external member described in 12, and described volume is abandoned a length of of portion and is wound with in described core
Under the state of described adhesive material tape below above 30 circles of 10 circles.
17. according to the reel external member described in any one in 12 ~ 16, and described bond layer is 30 DEG C cut
Cutting viscosity is below 100000Pa s.
18. according to the reel external member described in any one in 12 ~ 16, the width of described adhesive material tape are
0.5~3.0mm。
19. according to the reel external member described in any one in 12 ~ 16, described adhesive material tape a length of
More than 200m.
20. according to the reel external member described in any one in 12 ~ 16, described adhesive material tape a length of
More than 200m below 1000m.
21. according to the reel external member described in any one in 12 ~ 16, the thickness of described bond layer are
5~60μm。
22. according to the reel external member described in any one in 12 ~ 16, and described adhesive material tape is for circuit even
Connect.
Adhesives reel involved in the present invention possesses: core, in core both sides oppositely disposed
To side plate and be wound in core and have banding substrate and be arranged on a face of this base material bonding
The adhesive material tape of oxidant layer, adhesive material tape has: for from the top portion of this adhesive material tape towards terminal part
Direction extend region and use bond layer use portion, from the tape terminal portion of this adhesives regulation
The volume not using bond layer in length is abandoned portion and is arranged on use portion and volume abandons the knot in the region between portion
Bundle labelling." volume abandons portion " mentioned here though refer to be wound in core do not use and abandon bonding
The region of side, material tape terminal portion.
In the past, even if being also adopted by various method close to the part of core and avoiding sticking together.But
It is the present invention is then the opinion following according to inventor and carries out: i.e., it is contemplated that specially make close to core
Part (volume abandons portion) occur when oozing out of bonding agent, this part oozed out, the portion oozed out
Branch plays the resiliency of appropriateness so that use portion is difficult to stick together.
According to above-mentioned adhesives reel, abandon by arranging the volume of specific length in the end side of adhesive material tape
Portion, it is possible to fully suppression adhesives reel adhesion in use.About the reason that can play this effect
It is still not clear, but inventor speculates its main cause is: it is by same structure that volume abandons portion with the region that should use
(base material and bond layer) is constituted, and bond layer has the hardness of appropriateness.Speculate: by first will be by base
Material and bond layer constitute and have the volume portion of abandoning of appropriate hardness and specific length and be wound in core, then roll up
Around the region that should use, although the bond layer rolling up the portion that abandons the most also can be exuded to the outside of adhesive material tape,
But can effectively suppress the region using to stick together.It addition, compared to by the use of adhesive material tape
Portion is directly wound in the situation of core, abandons portion by winding volume in core, moreover it is possible to obtain and employ external diameter
The effect that the biggest core is identical.If using the core that external diameter is big, then smaller with use external diameter
The situation of core is compared, and more can suppress the generation of adhesion.
In the past, owing to easily producing adhesion, so the length of the adhesive material tape that can be wound on core is had
Limit, but by using said structure, the length being more capable of adhesive material tape compared with conventional goods is sizing
(such as more than 200m).
Except the length of adhesive material tape is sizing, according to the invention, it is further possible to by relatively low for viscosity and in conventional art
In easily produce the bonding agent of adhesion and be applied to bond layer.In the present invention, bond layer is at 30 DEG C
Shear viscosity is that 100000Pa s the following is preferred.As low viscous bonding agent, such as, can enumerate
Bonding agent and the bonding agent of low temperature curing type for hot radical curing type.Low temperature curing type bonding agent requires to carry
The high mobility at low temperature (such as 130 ~ 150 DEG C).As concrete example, can enumerate containing 1 minute half
The phase temperature of declining is the hot radical curing type bonding agent of the radical polymerization initiator of less than 160 DEG C.
According to the present invention, it is aqueous material at 30 DEG C that bond layer contains substantial amounts of, even mobility
The highest also is able to fully suppress adhesion.Above-mentioned hot radical curing type bonding agent contain thermoplastic resin,
It is contained in 30 DEG C of free-radical polymerised materials for aqueous free-radical polymerised material and radical polymerization
During initiator, stick together in conventional adhesives reel easy high probability.In contrast to this, at this
In the adhesives reel of invention, though the above-mentioned free-radical polymerised thing in hot radical curing type bonding agent
The content of matter is 20 ~ 80 relative to total amount 100 mass parts of thermoplastic resin and free-radical polymerised material
Mass parts, it is also possible to fully suppress adhesion.
Bond layer can also be containing thermoplastic resin, be contained in 30 DEG C of thermosettings for aqueous epoxy resin
Property material and the epoxy bonding agent of firming agent.Now, the highest in conventional adhesives reel
Stick together, but in the adhesives reel of the present invention probability, though above-mentioned in epoxy bonding agent
The content of epoxy resin is 20 ~ 80 relative to total amount 100 mass parts of thermoplastic resin and thermosets
Mass parts, it is also possible to fully suppress adhesion.
In the present invention, the inorganic filler content of bond layer can be on the basis of the volume of this bond layer
20 below volume %.By coordinating inorganic filler, the mobility of bond layer to reduce in bond layer
And adhesion can be suppressed, but according to the present invention, even if not coordinating inorganic filler in bond layer, even if or
Use level is at 20 below volume %, it is also possible to fully suppress adhesion.
The inorganic filler content of the bond layer in the present invention can also be with the quality of this bond layer as base
Below 50 accurate mass %.According to the present invention, even if mismatching inorganic filler in bond layer, or i.e.
Make use level below 50 mass %, it is also possible to fully to suppress adhesion.When using Silicon stone as inorganic filler,
Its content the following is preferred in 35 mass % on the basis of the quality of this bond layer.As inorganic filler
When using aluminium oxide, its content the following is preferred in 50 mass % on the basis of the quality of this bond layer.
According to the present invention, even if the width of adhesive material tape is 0.5 ~ 3.0mm, it is also possible to fully suppress adhesion.
The band that the band of narrow width is wide compared with width, the impact that the bonding agent at band end face oozes out relatively is wanted big, is easily sent out
Raw adhesion.Above-mentioned adhesive material tape is suitable for circuit and connects.It is as noted previously, as and can suppress by high level
Adhesion, it is possible to produce the circuit connecting body that connection reliability is excellent.Become known for the viscous of circuit connection
Connect material band costly.
The present invention provides adhesion suppressing method.That is, the adhesion suppressing method that the present invention relates to is, from bonding material
When material reel extraction adhesives brings use, do not use specific length from this adhesive material tape terminal part
Bond layer and abandon portion as volume, described adhesives reel possesses core, the most right in core both sides
The pair of side plates that installs and be wound in core and have banding substrate and be arranged on of this base material
The adhesive material tape of the bond layer on face.
The present invention provides the exchange method of adhesives reel.That is, the method is, is using the first bonding material
After material reel, it is exchanged into the second new adhesives being made up of the structure as the first adhesives reel
During reel, exchange to the second bonding material from the first adhesives reel of the adhesive material tape leaving specific length
Material reel, described first adhesives reel possess core, in core both sides an oppositely disposed offside
Plate and be wound in core and have banding substrate and the bond layer being arranged on a face of this base material
Adhesive material tape.
The present invention provides the extraction method of adhesive material tape.That is, the method is to extract out from adhesives reel to glue
The method connecing material band, does not use the bond layer of specific length from this adhesive material tape terminal part and by it
Abandon portion as volume, described adhesives reel possess core, in core both sides an oppositely disposed offside
Plate and be wound in core and have banding substrate and the bond layer being arranged on a face of this base material
Adhesive material tape.
The present invention provides the manufacture method of adhesives reel.That is, the adhesives reel that the present invention relates to
Manufacture method is the manufacture method of any of the above-described kind of adhesives reel, possesses characteristic based on adhesive material tape
Determine to roll up the operation of the specific length in the portion of abandoning.As the characteristic of adhesive material tape, such as, can enumerate bonding
The length and width of material band and the thickness of bond layer, composition and shear viscosity etc..
And then, the present invention provides a kind of and arranges end during manufacturing any of the above-described kind of adhesives reel
The method of labelling, wherein, characteristic based on adhesive material tape determines to roll up the specific length in the portion of abandoning, and is using
The region that portion and volume are abandoned between portion arranges end mark.
The present invention provides a kind of reel external member possessing adhesives reel.That is, the reel set that the present invention relates to
Part has adhesives reel and operation instructions, and described adhesives reel possesses core, in core both sides
Oppositely disposed pair of side plates and be wound in core and have banding substrate and be arranged on this base material
A face on the adhesive material tape of bond layer, have described in described operation instructions and using bonding material
The bond layer of specific length from this adhesive material tape terminal part is not used to abandon as volume during material strip
The item in portion.
The present invention provides a kind of packaging possessing above-mentioned adhesives reel and being accommodated with this adhesives reel
The package body of bag.
The present invention provides a kind of package body external member possessing adhesives reel.That is, the packaging that the present invention relates to
Body external member possesses adhesives reel, operation instructions and is accommodated with the packaging bag of adhesives reel,
Described adhesives reel possesses core, at the oppositely disposed pair of side plates in core both sides and winding
In core and there is banding substrate and the adhesives of bond layer being arranged on a face of this base material
Carry, have described in described operation instructions and do not use from this adhesives tape terminal when using adhesive material tape
Portion plays the bond layer of specific length and abandons the item in portion as volume.
The present invention provides a kind of package body assembly possessing one or more adhesives reel.That is, the present invention
The package body assembly related to possesses one or more adhesives reel, is accommodated with one of adhesives reel
Or multiple packaging bag, the containing box being accommodated with whole packaging bag and operation instructions, described adhesives
Reel possesses core, in the oppositely disposed pair of side plates in core both sides and be wound in core and have
The adhesive material tape of the bond layer having banding substrate and be arranged on a face of this base material, described use is said
Have described in bright book and do not use specific length from this adhesive material tape terminal part when using adhesive material tape
Described bond layer and abandon the item in portion as volume.
In the present invention, it can be more than 5m that volume abandons the length in portion, it is also possible to be wound with in core bonding
Under the state of material band more than 10 circles.It addition, in the present invention, volume abandon the length in portion can be 5m with
Upper below 20m, it is also possible to more than 10 circles 30 circles when being to be wound with adhesive material tape in core
Below.It addition, in the present invention, the length of adhesive material tape can be more than 200m below 1000m.
It addition, in the present invention, operation instructions can also be accommodated in the inside of packaging bag.It addition, at this
In invention, operation instructions can be paster (sticker), can be pasted onto on adhesives reel.Separately
Outward, in the present invention, operation instructions can be paster, can be pasted onto in packaging bag.
It addition, in the present invention, operation instructions can also be accommodated in the inside of containing box.It addition, at this
In invention, operation instructions can be paster, and is pasted onto on containing box.It addition, in the present invention, make
The word of following item can also be recorded by printing on containing box by description and be formed as with containing box
Integrally, described item is not for using regulation from this adhesive material tape terminal part long when using adhesive material tape
The bond layer of degree and abandon the item in portion as volume.
According to the present invention, when pulling out the adhesive material tape of reeling condition, it is possible to the highest level suppression
Bond layer is peeled off from base material.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the embodiment schematically showing the adhesives reel that the present invention relates to.
Fig. 2 is the schematic sectional view of the structure representing adhesives reel shown in Fig. 1.
Fig. 3 is the front view of the medial surface of the side plate schematically showing adhesives reel shown in Fig. 1.
Fig. 4 is the schematic sectional view of the example representing anisotropic conductive band.
Fig. 5 is to represent the schematic sectional view at the end mark configuration of adhesives reel shown in Fig. 1.
Fig. 6 is the schematic sectional view of an example of the circuit connecting body that indication circuit electrode is connected to each other.
Fig. 7 is the schematic sectional view of an example of the manufacture method of indication circuit connector.
Fig. 8 is the axonometric chart of another embodiment schematically showing the adhesives reel that the present invention relates to.
Fig. 9 is the schematic sectional view of the structure representing adhesives reel shown in Fig. 8.
Figure 10 is to represent the schematic sectional view at the end mark configuration of adhesives reel shown in Fig. 8.
Figure 11 is the axonometric chart of the packed state schematically showing adhesives reel.
Figure 12 is the schematic sectional view of another example representing anisotropic conductive band.
Figure 13 is the schematic sectional view of another example representing anisotropic conductive band.
Detailed description of the invention
Hereinafter, referring to the drawings while describing the preferred embodiment of the present invention in detail.Here, at accompanying drawing
Explanation in same key element enclose same symbol, the repetitive description thereof will be omitted.And, for convenience of accompanying drawing, accompanying drawing
Dimension scale with illustrated may not be consistent.
Adhesives reel 10 shown in Fig. 1 possesses the core 1 of tubular and at the direction of principal axis of core 1
The oppositely disposed pair of side plates in both sides 2.As in figure 2 it is shown, wind on the outside F1 of core 1
Anisotropic conductive band (adhesive material tape) 5, constitute wound body.Anisotropic conductive band 5 is according to viscous
Connect oxidant layer 8 to roll up towards the mode facing to outside being formed without bond layer of core 1 side and base material 6
It is wound in core 1.When wound body, the surface of bond layer 8 with volume inside anisotropy
The base material 6 of conductive strips 5 contacts.Core 1 has the external diameter of such as 50 ~ 160mm degree.
From the point of view of easily taking care of from proper alignment multiple adhesives reel, side plate 2 is preferably provided at
The axial both ends of core 1 but it also may the part that side plate 2 is arranged to core 1 is penetrated side plate
2 and from the lateral surface of side plate 2 highlight.
As it is shown on figure 3, side plate 2 possesses on the medial surface F2 adjacent with anisotropic conductive band 5 from face
F2 protuberance and by the edge of through hole 2a with the rib structure portion 2b of radiated entends.By arranging rib structure portion
2b, even if being oozed out bonding agent by the end face of anisotropic conductive band 5, glues owing to can fully reduce bonding agent
The area being bonded on side plate 2, so abandoning portion 5b with volume described later together can effectively suppress adhesion.
Here, from the viewpoint of height suppression adhesion further, have rib structure portion 2b's exemplified with side plate 2
Side plate 2 but it also may use the side plate 2 without rib structure portion 2b.
Here, as shown in Figure 1, 2, adhesives reel 10 has the rotation that can be inserted into compression bonding apparatus 25
The axis hole 10a of axle 25a, this axis hole 10a is provided with the notch part chimeric with the protuberance being arranged on rotary shaft
10b.Simply, when adhesives reel 10 is arranged on the rotary shaft of compression bonding apparatus, if idle running can be prevented
Structure, it is possible to use the structure beyond notch part 10b.As the reel portion possessing core 1 and side plate 2
Part, it is possible to use plastic molded article etc..
As shown in Figure 4, anisotropic conductive band 5 possesses the base material 6 of banding and on a face of base material 6
The bond layer 8 formed.It addition, as it is shown in figure 5, anisotropic conductive band 5 has use portion 5a, volume
Abandoning portion 5b and end mark EM, described use portion 5a is to extend to terminal part 5c direction from top portion 5d
Region and use bond layer 8, described volume abandon portion 5b be from terminal part 5c in specific length not
Using the part of bond layer 8, described end mark EM is arranged on use portion 5a and volume is abandoned between portion 5b
Region.
Distance from the terminal part 5c of anisotropic conductive band 5 to end mark EM, i.e. volume abandons portion 5b
Length (length L1 of Fig. 5) be preferably more than 5m, more preferably 5 ~ 20m, more preferably
5 ~ 15m, most preferably 5 ~ 10m.By making volume abandon a length of more than the 5m of portion 5b, it is possible to the most anti-
Stick together, on the other hand, by making volume abandon a length of of portion 5b when only using adhesives reel 10
Below 20m, it is possible to suppression does not uses and the amount of discarded bond layer 8.According to same reason, volume is abandoned
Portion 5b's is a length of, be preferably core 1 is wound with anisotropic conductive band 5 10 circles with
On, more preferably 10 ~ 30 circles, more preferably 13 ~ 20 circle, most preferably 15 ~ 20 circles.
The position of configuration end mark EM is preferably (such as each to different according to the characteristic of anisotropic conductive band 5
Property the length and width of conductive strips 5 and the thickness of bond layer 8, composition and shear viscosity etc.) come
Determine.The manufacture method of adhesives reel 10 possesses: characteristic based on anisotropic conductive band 5 determines
Volume abandons the length of portion 5b, abandons the region between portion 5b at use portion 5a and volume and arranges end mark EM's
Operation.Determine to roll up the length abandoning portion 5b by characteristic based on anisotropic conductive band 5, from bonding
When material reel 10 pulls out anisotropic conductive band 5, it is possible to the highest level suppression bond layer 8
Peel off from base material 6.
End mark EM is arranged on bond layer 8 and has the color different from bond layer 8 is excellent
Choosing.Different color mentioned here refers to from this three attributes phase of the color of form and aspect, chroma and lightness
The color differentiated mutually, and then also include metallochrome, iridescent.As for end mark EM, each batching
Configure with the state being sandwiched between core 1 and bond layer 8 during anisotropy conductive strips 5, and close
It is connected to bond layer 8 paste.The shape of end mark EM is not particularly limited, usually rectangle.
End mark EM can be the material with resin as main component, specifically can enumerate logical as constituent material
Normal acrylic resin, PET etc..Here, end mark EM can be only fitted on base material 6, now,
Preferably there is the color different from base material 6.Here, end mark can be the form pasting above-mentioned resin,
Can also be the form part that coating, ink etc. are coated with bond layer 8, base material 6 such as painting,
Or the form of pattern, word can also be to confer to.It addition, work as color and the base material 6 of bond layer 8
Color not it is also possible to arrange the part that there is not bond layer 8 on base material 6, this part is made
For end mark.
The anisotropic conductive band 5 with end mark EM can be suitably used for Automated electronic parts
Assemble.The anisotropic conductive band 5 connection between electronic unit, when exposing end mark EM,
Then detector just will detect that end mark EM, notice should not re-use remaining anisotropic conductive band 5
(volume abandons portion 5b) and new adhesives reel 10 should be replaced to.Length (Fig. 5 of end mark EM
Length L2) be preferably 5cm ~ 1m, more preferably 5 ~ 50cm, more preferably 5 ~ 30cm.Logical
Crossing a length of more than the 5cm making end mark EM, above-mentioned detector can substantially and securely end of identification
Labelling EM, on the other hand, by being below 1m, it is possible to suppression does not uses and discarded bonding agent
The amount of layer 8.
The length of anisotropic conductive band 5 is preferably 100 ~ 1000m, more preferably 200 ~ 1000m, enters
One step is preferably 200 ~ 500m, the most preferably 250 ~ 500m, particularly preferably 300 ~ 500m.
In the past owing to being susceptible to adhesion, so the length to the anisotropic conductive band 5 that can be wound on core 1
Restricted, but abandon portion 5b by arranging the volume of specific length in the terminal part 5c side of anisotropic conductive band 5,
Anisotropic conductive band 5 longer for goods than ever can be wound in core 1.
The width of anisotropic conductive band 5 is preferably 0.5 ~ 30mm, more preferably 0.5 ~ 3.0mm, enters one
Step is preferably 0.5 ~ 2.0mm, particularly preferably 0.5 ~ 1.0mm.In the past owing to being susceptible to adhesion, so
Limited width system to the anisotropic conductive band 5 that can be wound on core 1, but by leading in anisotropy
The volume that the electric terminal part 5c side with 5 arranges specific length abandons portion 5b, it is possible to by narrower for goods width than ever
Anisotropic conductive band 5 be wound on core 1.Here, about the width of base material 6, preferably with thereon
The width of the bond layer 8 formed is identical or wider than the width of bond layer 8.About bond layer 8
Width, adjust according to use.
About the thickness of bond layer 8, fit according to the kind etc. of the bonding agent composition used and bonded object
Preferably select, preferably 5 ~ 100 μm, more preferably 5 ~ 60 μm, more preferably 10 ~ 40 μm.
In the past, owing to being susceptible to adhesion, so to anisotropic conductive band 5 viscous that can be wound on core 1
Connect the finite thickness system of oxidant layer 8, but regulation is set by the terminal part 5c side at anisotropic conductive band 5
The volume of length abandons portion 5b, can wind thicker the having of conventional goods of ratio such as 30 ~ 100 μm degree thickness
The anisotropic conductive band 5 of bond layer 8.Here, the thickness of base material 6 is preferably 4 ~ 200 μm degree,
More preferably 20 ~ 100 μm.
About base material 6, it is possible to use by such as polyethylene terephthalate, poly-naphthalenedicarboxylic acid ethylene glycol
Ester, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-acetate, poly-
Carbonic ester, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polrvinyl chloride, poly-inclined chloroethene
The various plastic tapes that alkene, synthetic rubber system, liquid crystal polymer etc. are formed.Certainly, the material of base material 6 is constituted
It is not limited to this.It addition, base material 6 is owing to peeling off from bond layer 8 when using adhesive material tape, so also
It is usable in having carried out, with the bearing surface etc. of bond layer 8, the base material that the demoulding processes.And then, it is also possible to be by
Selected from the material of two or more mixing of above-mentioned material, or the material by above-mentioned film multiple stratification.
Bonding agent composition 8a as bond layer 8, it is possible to generally applicable by heat, light display curable
Material, it is possible to use epoxy bonding agent or radical-curable bonding agent.Maybe can use polyurethane,
The thermoplastic adhesives such as polyvinyl ester.Thermostability after connecting, from the viewpoint of excellent moisture resistance, preferably
Use cross-linking material.Wherein, from solidifying the short time and working continuously property is good, cementability molecular structure
The features such as excellence consider, preferably comprise the epoxy resin into thermosetting resin bonding as the epoxy of main constituent
Agent.It addition, radical-curable bonding agent is compared with epoxy bonding agent, there is curable between low-temperature short-time
The features such as excellence, suitably can select according to purposes.It addition, it be also possible to use pressure-sensitive bonding agent.
Epoxy bonding agent such as contains the thermosets such as epoxy resin and firming agent.Additionally, generally according to
Need to coordinate thermoplastic resin, coupling agent, filler etc..
As above-mentioned epoxy resin, such as, can enumerate bisphenol A type epoxy resin, bisphenol F type epoxy tree
Fat, bisphenol-s epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin,
Bisphenol A novolac type epoxy resin, bisphenol F phenolic type epoxy resin, alicyclic epoxy resin,
Glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type epoxy resin, isocyanide
Urea acid ester type epoxy resin, aliphatic chain epoxy resin etc..These epoxy resin also can, be added by halogenation
Hydrogen also may be used.In addition, it is possible to by acryloyl group or methylacryloyl addition at the side chain of epoxy resin.Permissible
By these independent a kind or two or more is applied in combination.
As above-mentioned firming agent, if can cured epoxy resin; be not particularly limited, such as can enumerate cloudy from
The catalyst type firming agent of sub-polymerism, the catalyst type firming agent of cationically polymerizable, polyaddition type firming agent
Deng.Wherein, excellent from rapidly-curable, be not required to consider chemical equivalent from the viewpoint of, preferred anionic
Or the catalyst type firming agent of cationically polymerizable.
As the catalyst type firming agent of above-mentioned anion or cationically polymerizable, such as, can enumerate imidazoles
System, hydrazides system, boron trifluoride-amine complex, salt (aromatic series sulfonium salt, aromatic diazonium salt, fat
Race's sulfonium salt etc.), amine acid imide, diaminomaleonitrile, tripolycyanamide and derivant, polyamine salt, double cyanogen
Amine etc., it is possible to use the modifier etc. of these materials.As above-mentioned polyaddition type firming agent, example can be enumerated
Such as many amines, polythiol, polyphenol, anhydride etc..
By the polymer substances such as these epoxy curing agent polyurethane series, Polyester, the metal such as nickel, copper
Thin film, the coatings such as inorganic matter such as calcium silicates and the latent curing agent of microencapsulation, during owing to can extend use
Between, so being preferred.By independent for above-mentioned firming agent a kind or two or more is applied in combination.
The use level of above-mentioned firming agent is relative to thermosets and the thermoplastic resin that coordinates as required
Total amount 100 mass parts is usually 0.05 ~ 20 mass parts degree.
Radical-curable bonding agent such as contains free-radical polymerised material and radical polymerization initiator.And
And, coordinate thermoplastic resin, coupling agent, filler etc. generally according to needs.
As above-mentioned free-radical polymerised material, such as if having the functional group being polymerized by free radical
Material, can use with no particular limitation.Specifically, such as acrylate can be enumerated (also to include
Corresponding methacrylate, the most identical) compound, acryloxy (also include the methyl-prop of correspondence
Alkene acyloxy, the most identical) compound, maleimide compound, citraconimide resin, Na Dike
The free-radical polymerised material such as imide resin.These free-radical polymerised materials can be with monomer or oligomer
State use, it is possible to and with monomer and oligomer.
As aforesaid propylene ester compound, such as acrylic acid methyl ester., ethyl acrylate, propylene can be enumerated
Isopropyl propionate, Isobutyl 2-propenoate, ethylene glycol diacrylate, diethyleneglycol diacrylate, three hydroxyl first
Base propane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxyl-1,3-two acryloxy propane, 2,2-
Two [4-(acryloyl-oxy ylmethoxy) phenyl] propane, 2,2-bis-[4-(acryloxy polyethoxy) phenyl]
Propane, acrylic acid dicyclopentenyl ester (dicyclopentenyl acrylate), acrylic acid tricyclodecyl ester
(tricyclodecanyl acrylate), three (acrylyl oxy-ethyl) isocyanuric acid ester, carbamate propylene
Acid esters etc..Alternatively, it is also possible to the most suitably use the polymerization inhibitor such as hydroquinone, methyl ether hydroquinone type.
And, from improving from the viewpoint of thermostability, the free-radical polymerised material such as preferred acrylate compound is extremely
Contain the substituent groups such as a kind of dicyclopentenyl, tricyclodecyl, triazine ring less.
Free-radical polymerised material beyond aforesaid propylene ester compound, can use such as international aptly
Compound described in No. 2009/063827 is disclosed.These can individually or two or more combination makes by a kind
With.
As above-mentioned radical polymerization initiator, decompose generation if for example being by heating or illumination free
The compound of free radical, can use with no particular limitation.Specifically, can enumerate such as peroxide,
Azo etc..Such firming agent, can according to as the connection temperature of purpose, the Connection Time, can
The use time (potlife) etc. suitably select.
As radical polymerization initiator, more specifically there may be mentioned diacyl peroxide, peroxidating two carbon
Acid esters, peroxyester, ketal peroxide, dialkyl peroxide, hydrogen peroxide, silicyl peroxidating
Thing etc..Wherein, preferably peroxyester, dialkyl peroxide, hydrogen peroxide, silicyl peroxide
Deng, more preferably can obtain the peroxyester of high response.These radical polymerization initiators, such as, can fit
Preferably use the compound described in International Publication the 2009/063827th.These can by a kind individually or 2 kinds
Combination of the above uses.
The use level of above-mentioned radical polymerization initiator is commonly angled relative to free-radical polymerised material and according to need
Total amount 100 mass parts of thermoplastic resin to be coordinated is 0.1 ~ 10 mass parts degree.
The thermoplastic resin coordinated as required in these epoxy bonding agents and radical-curable bonding agent,
It it is the material that such as easily bonding agent is given film property.As these thermoplastic resins, such as, can enumerate
Phenoxy resin, vinyl-formal resin, polystyrene resin, polyvinyl butyral resin, poly-
Ester resin, polyamide, xylene resin, polyurethane resin, polyester urethane resin, phenol resin,
Terpene phenol resin etc..These thermoplastic resins, such as, can suitably use International Publication the 2009/063827th
Compound described in number.Wherein, from the angle that cementability, the compatibility, thermostability, mechanical strength etc. are excellent
Degree sets out, preferably phenoxy resin.1 kind can be used singly or two or more kinds in combination by these.
About the use level of this thermoplastic resin, when being matched with epoxy bonding agent, relative to thermoplastic resin
Total amount 100 mass parts of fat and thermosets, usually 5 ~ 80 mass parts degree.Additionally, certainly
With in base curing type bonding agent during thermoplastic resin, the use level of thermoplastic resin is relative to thermoplastic resin
Total amount 100 mass parts of fat and free-radical polymerised material is usually 5 ~ 80 mass parts degree.
In the present embodiment, specific length is set by the terminal part 5c side at anisotropic conductive band 5
Volume abandon portion 5b, can by relatively low for ratio of viscosities and with conventional technology be susceptible to adhesion bonding agent application
In bond layer.Bond layer 8 is below 100000Pa s the shear viscosity of 30 DEG C.This viscosity
More preferably 1000 ~ 50000Pa s, more preferably 1000 ~ 30000Pa s.As low viscous bonding
Agent composition 8a, can enumerate the material of the bonding agent into hot radical curing type and low temperature curing type.Make
For its concrete example, can enumerate containing 1 minute half life temperature is the radical polymerization initiation of less than 160 DEG C
The hot radical curing type bonding agent of agent.About 1 minute half life temperature, more preferably 60 ~ 140 DEG C,
More preferably 60 ~ 120 DEG C.As such firming agent, peroxidating hexahydro terephthaldehyde can be enumerated
Acid di-t-butyl ester (1 minute half life temperature: 142 DEG C, chemical medicine Akzo Co., Ltd. HTP-65W (business
The name of an article)), substituted benzoyl peroxide (1 minute half life temperature: 131.1 DEG C, Japan oils and fats strain formula
Commercial firm's system, NYPER BMT (trade name)), dilauroyl peroxide (1 minute half life temperature: 116.4 DEG C,
NOF Corp's system, PEROYL L (trade name)) etc..
As other examples of low viscous bonding agent composition 8a, can enumerate containing thermoplastic resin, be contained in
30 DEG C is free-radical polymerised material and the radical polymerization initiator of aqueous free-radical polymerised material
Hot radical curing type bonding agent.Above-mentioned free-radical polymerised material in hot radical curing type bonding agent
Content, total amount 100 mass parts preferably with respect to thermoplastic resin and free-radical polymerised material is
20 ~ 80 mass parts.This content is more preferably 30 ~ 80 mass parts, more preferably 40 ~ 80 mass parts.
Bonding agent composition 8a can also be containing thermoplastic resin, be contained in 30 DEG C for aqueous epoxy resin
The epoxy bonding agent of thermosets and firming agent.Now, the above-mentioned ring in epoxy bonding agent
The content of epoxy resins, total amount 100 mass parts preferably with respect to thermoplastic resin and thermosets is
20 ~ 80 mass parts.This content is more preferably 30 ~ 80 mass parts, more preferably 40 ~ 80 mass parts.
Here, when IC chip being arranged on glass substrate, flexible printed board (FPC), from suppression
From the viewpoint of warpage by substrate produced by the linear expansion coefficient difference of IC chip and substrate, preferably will play
Relax the components matching of internal stress effect in bonding agent composition.Specifically, preferably in bonding agent composition
Coordinate acrylic rubber, elastomer components.Alternatively, it is also possible to use as in International Publication the 98/44067th
Radical-curable bonding agent described in number.
As conducting particles 8b, can enumerate the such as metallic such as Au, Ag, Ni, Cu, scolding tin,
Carbon etc..In addition it is also possible to be with dielectric glass, pottery, plastics etc. as core, coating on this core
Above-mentioned metal, the film of carbon or the particle of metallic.Conducting particles 8b, if with plastics as core
Conducting particles, hot molten metal particle, then have morphotropism when heating pressurization.Therefore, can when connecting
To increase the contact area between electrode and conducting particles 8b, connection reliability can be improved.It addition, lead
Charged particle 8b can also be to be coated with the particle of silver copper on the metallic being such as made up of.It addition, make
For conducting particles 8b, it is possible to use as described in Japanese Unexamined Patent Publication 2005-116291 publication, have
The metal dust of the shape that many fine metallics connect with chain.Alternatively, it is also possible to use as Japan
Described in JP 2008-135734 publication, have bossed conducting particles.
Furthermore, it is also possible to the surface being added on conducting particles 8b is coated with the exhausted of macromolecule resin etc. further
Edge particle.By adding insulating properties particle, when increasing the overall use level of particle, can suppress as each to
The short circuit that opposite sex conductive strips produce due to interparticle contact when using, can improve between adjacent circuit electrode
Insulating properties.Here, it is possible to by a kind of particle selected from insulating properties particle and conducting particles individually or 2 kinds of particles
It is applied in combination.Conducting particles and the mean diameter of insulating properties particle, from making dispersibility and the good sight of electric conductivity
From the point of view of Dian, preferably 1 ~ 18 μm, more preferably 2.0 ~ 10 μm.
The use level of conducting particles 8b, is not particularly limited, and on the basis of whole bonding agent compositions, is preferably
0.1 ~ 30 volume %, more preferably 0.1 ~ 10 volume %, more preferably 0.5 ~ 5 volume %.By making
The use level of conducting particles 8b is at 0.1 more than volume %, it is possible to fully realize excellent electric conductivity, the opposing party
Face, by 30 below volume %, can abundant suppression circuit when using as anisotropic conductive band
It is short-circuited.
In order to reduce the mobility of bond layer 8, in bonding agent composition 8a, sometimes coordinate inorganic filler.
About inorganic filler, such as if the inorganic compound of solids shape, then it is not particularly limited.As nothing
The object lesson of machine filler material, can enumerate such as aluminium hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate,
Calcium silicates, magnesium silicate, calcium oxide, magnesium oxide, aluminium oxide, aluminium nitride, aluminium borate whisker, boron nitride,
The Silicon stone such as crystalline silica, noncrystalline Silicon stone, sb oxide etc..Inorganic filler can by a kind individually or 2 kinds with
On be applied in combination.
In the present embodiment, specific length is set by the terminal part 5c side at anisotropic conductive band 5
Volume abandon portion 5b, even if bond layer 8 is mismatched inorganic filler, or with the volume of bond layer 8 be
Benchmark use level is at 20 below volume %, it is also possible to fully suppress adhesion.The content of inorganic filler is more preferably
It is 0 ~ 15 volume %, more preferably 0 ~ 10 volume %.
Even if it addition, making the content of the inorganic filler on the basis of the quality of bond layer 8 is 50 mass %
Hereinafter, adhesion can be also adequately suppressed.The content of inorganic filler is more preferably 0 ~ 40 mass %, further
It is preferably 0 ~ 30 mass %.Owing to the proportion of inorganic filler is different according to kind, so quality criteria
Content preferably is set as suitably being worth according to the inorganic filler used.Such as, when inorganic filler is Silicon stone,
Even if making the content on the basis of the quality of bond layer 8 is below 35 mass %, it is possible to fully suppression is viscous
Even.Silica content is more preferably 0 ~ 30 mass %, more preferably 0 ~ 20 mass %.Inorganic filler is
During aluminium oxide, even if making the content on the basis of the quality of bond layer 8 is below 50 mass %, it is possible to
Fully to suppress adhesion.Alumina content is more preferably 0 ~ 40 mass %, the most preferably 0 ~ 30 matter
Amount %.
Although the content of above-mentioned inorganic filler easily calculates when coordinating, but by the state estimating of adhesive material tape
Time, such as can be measured by following method.
(1) crucible measured will be used for, put into (air ring in the electric furnace being warmed up to 700 DEG C of temperature in advance
Under border), heat 45 minutes.
(2) temperature of electric furnace is recalled to room temperature, to the quality of the crucible of taking-up from electric furnace in exsiccator
Weigh rapidly.Here, in the mensuration of this inorganic filler content, the quality of crucible etc. is to use balance
(Shimadzu Seisakusho Ltd.'s precision electronic balance, UW series) is measured to arithmetic point 3 figure place (0.001g) and is
Only.
(3) on balance place crucible, load in this crucible about 1g by adhesive material tape obtain bonding
Oxidant layer.Here, this weighing be 23 ± 3 DEG C, 50 ± 10%RH, carry out under 1 atmospheric pressure.
(4) will be equipped with the crucible of bond layer as (1), with heating by electric cooker 45 minutes.By this
Heating, bond layer becomes ash.
(5) temperature of electric furnace is recalled to room temperature, crucible and the quality of ash to taking-up from electric furnace,
Exsiccator quickly weighs by the method as (2), (3).
(6) from the matter being deducted the crucible obtained by (2) by the quality of the crucible obtained (5) and ash
Amount, calculates the quality of ash.This ash should contain inorganic filler and conducting particles (metal ingredient).
(7) kind of conducting particles (metal ingredient) contained by ash and content, use ICP luminescence spectrometer
Analytic process calculates respectively.Now, the mixed acid of ash Fluohydric acid. and nitric acid is decomposed as test liquid.Right
(Shimadzu makes by ICP emission spectrophotometer for metal species contained in this test liquid and content thereof
Made ICP-AES etc.) carry out quantitative analysis.Above-mentioned mixed acid is with 1:1 by Fluohydric acid., nitric acid and water: 1
Mass mixing obtain.Deduct by this ICP luminescence spectrometer from the quality of the ash obtained by above-mentioned (6)
The quality of the conducting particles (metal ingredient) that analytic process calculates, as the quality of inorganic filler.
(8) content of the inorganic filler on the basis of volume is tried to achieve as follows.That is, take out from crucible
Ash proportion and heating front attachment oxidant layer proportion, with dry type gravimeter, (Shimadzu Seisakusho Ltd.'s dry type is close
Degree meter AccuPyc Ι Ι 1340 series) it is measured, deduct from ash by ICP ICP Atomic Emission Spectrophotometer method
The Theoretical specific gravity of the metal of detection and content, calculate the volume % of the inorganic filler relative to former bond layer.
For making adhesives reel 10, such as, first the painting work liquid containing bonding agent composition is coated on
Base material film is (as base material, it is possible to use foregoing various materials, such as polyethylene terephthalate
Ester film) first-class and make the master (former anti-) of anisotropic conductive film.By this master (former anti-) to be suitable for
Width in purposes is cut into banding.In this cutting, it is possible to use such as Japanese Unexamined Patent Publication 2003-285293
Cutter sweep number described in publication.By the anisotropic conductive band 5 becoming Rack is wound on volume
In the core of disk component, adhesives reel 10 can be manufactured.
In order to anisotropic conductive band 5 being wound in the core of reel parts, preferably by anisotropic conductive
The beginning (terminal part 5c) of band is fixed on core and winds.This fixing means can use known
Method, such as fixed by adhesion zone, sticker.In addition it is also possible to core arrange securing member,
Notch part and fix.Wherein, from the viewpoint of operability, adhesion zone is preferably used or sticker is fixed.It addition,
Can also be via as described in International Publication the 2010/098354th and International Publication 2010/110094
Terminate to bring winding anisotropic conductive band 5.Material for this bundling article is not particularly limited, permissible
Use the various materials illustrated with the material of base material 6.
(circuit connecting body)
Below, illustrate the bond layer 8 of adhesives reel 10 of the present embodiment is used as circuit
Connecting material and the circuit connecting body that manufactures.Circuit connecting body 100 shown in Fig. 6, possesses mutually opposing
First circuit block 30 and second circuit parts 40, at the first circuit block 30 and second circuit parts 40
Between, it is provided with the connecting portion 50a connecting them.
First circuit block 30 possess circuit substrate 31 and on the interarea 31a of circuit substrate 31 shape
The circuit electrode 32 become.Second circuit parts 40 possess circuit substrate 41 and at circuit substrate 41
The circuit electrode 42 formed on interarea 41a.
As the object lesson of circuit block, can enumerate semiconductor chip (IC chip), resistance chip,
The chip parts etc. such as capacitor chip.These circuit blocks possess circuit electrode, and be generally configured with multiple (extremely
Few two or more) circuit electrode.As the object lesson of other circuit blocks connecting foregoing circuit parts,
Can enumerate there is the flexible-belt of metal wiring, flexible printed circuit board, evaporation have indium tin oxide (ITO)
The wiring substrate such as glass substrate.By using the anisotropic conductive band from adhesives reel 10 pull-out
5, circuit block effectively and can be connected with high connecting reliability each other.Thus, present embodiment relates to
Anisotropic conductive band 5 be suitable for possessing the chip part of multiple fine connection terminal (circuit electrode) and exist
COG on wiring substrate installs (Chip On Glass) or COF installs (Chip On Flex).
The surface of each circuit electrode 32,42 is by selected from gold, silver, stannum, ruthenium, rhodium, palladium, osmium, iridium, platinum
1 kind of composition with indium tin oxide (ITO), it is possible to be made up of two or more.And, circuit electrode 32,
The material on 42 surfaces, may be the same or different in whole circuit electrodes.
Connecting portion 50a possesses solidfied material 8A and the dispersion of the bonding agent composition 8a being contained in bond layer 8
In conducting particles 8b therein.And, in circuit connecting body 100, opposed circuit electrode 32 and circuit
Electrode 42 electrically connects via conducting particles 8b.
Therefore, the connection resistance between circuit electrode 32,42 is decreased sufficiently, can carry out circuit electrode 32,
Electrical connection good between 42.It addition, solidfied material 8A has electrical insulating property, it can be ensured that adjacent circuit electricity
Pole insulating properties each other.Thus, the flowing of the electric current between circuit electrode 32,42 can be made to become smooth and easy, can
To give full play to the function that circuit has.
(manufacture method of circuit connecting body)
Then, the manufacture method about circuit connecting body 100 is described.Fig. 7 is by circuit connecting body manufacturer
The process chart that one embodiment of method is represented by diagrammatic cross-sectional view.By anisotropic conductive in present embodiment
Bond layer 8 heat cure with 5, final manufacture circuit connecting body 100.
First, the rotary shaft in attachment means (not shown) installs adhesives reel 10.Bonding from this
Material reel 10 pulls out anisotropic conductive band 5 according to making bond layer 8 mode downward.Will be each
Anisotropy conductive strips 5 cut into specific length, are loaded in (Fig. 7 (a)) on the interarea 31a of circuit block 30.
Then, pressurize to the direction of the arrow A and B of Fig. 7 (a), bond layer 8 is temporarily fixed to
First circuit block 30(Fig. 7 (b)).Pressure now, if not bringing damage to circuit block
Scope, then be not particularly limited, it is often preferred that 0.1 ~ 30.0MPa.It addition, heat while pressurizeing also
Can, heating-up temperature is the temperature not making the substantive solidification of bond layer 8.Heating-up temperature is preferably generally
50~100℃.These heating and pressurization preferably scope at 0.1 ~ 2 second are carried out.
After base material 6 peels off, as shown in Fig. 7 (c), by second circuit parts 40 with by second circuit electrode
42 are loaded on bond layer 8 towards the mode of the first circuit block 30 side.Then, caking agent
Layer 8 while pressurizeing overall to the arrow A and B direction of Fig. 7 (c).Heating-up temperature now is bonding agent
The temperature curable for bonding agent composition 8a of layer 8.Heating-up temperature is preferably 60 ~ 180 DEG C, more preferably
70 ~ 170 DEG C, more preferably 80 ~ 160 DEG C.By making heating-up temperature more than 60 DEG C, it is possible to fully
Improve curing rate, by below 180 DEG C, it is possible to fully suppress the carrying out of less desirable side reaction.Add
The heat time is preferably 0.1 ~ 180 second, more preferably 0.5 ~ 180 second, more preferably 1 ~ 180 second.
It is solidified to form connecting portion 50a by bonding agent composition 8a, the circuit shown in Fig. 6 can be obtained
Connector 100.Condition of contact suitably selects according to use, bonding agent composition and circuit block.This
In, as the bonding agent composition of bond layer 8, when using the material solidified by light, for bonding
Oxidant layer 8 suitably irradiates active ray, energy-ray.As active ray, can enumerate ultraviolet,
Visible ray, infrared ray etc..As energy-ray, electron ray, X-ray, gamma-rays, micro-can be enumerated
Ripple etc..
According to present embodiment, specific length is set by the terminal part 5c side at anisotropic conductive band 5
Volume abandon portion 5b, when pull-out is wound on the anisotropic conductive band 5 of reel parts, can be with high
Level suppression bond layer 8 is peeled off from base material 6.
This concludes the description of the preferred embodiment of the present invention, but the present invention is not limited to above-mentioned embodiment.
The present invention is without departing from carrying out various deformation in the range of its main idea.
Such as, in the above-described embodiment, exemplified with according to bond layer 8 towards core 1 side (inner side)
And anisotropic conductive band 5 is wound by the mode facing to outside being formed without bond layer of base material 6
Situation in core 1, but the direction of anisotropic conductive band 5 can also be direction in contrast to this.Figure
Adhesives reel 20 shown in 8 and Fig. 9 according to base material 6 be formed without bond layer facing to volume
Core 1 side (inner side) and bond layer 8 are wound with anisotropy towards the mode in outside in core 1 and lead
Electricity band 5.
The anisotropic conductive band 5 of adhesives reel 20 also has from terminal part 5c in specific length
The volume not using bond layer 8 abandons portion 5b, abandons the region between portion 5b at use portion 5a and volume and arranges
There is end mark EM.The distance of the terminal part 5c of anisotropic conductive band 5 to end mark EM is i.e. rolled up
The length (length L3 of Figure 10) abandoning portion 5b is preferably more than 5m, more preferably 5 ~ 20m, enters one
Step is preferably 5 ~ 15m, most preferably 5 ~ 10m.By making volume abandon the length of portion 5b at more than 5m, energy
Enough it is substantially prevented from sticking together, on the other hand, by making volume abandon portion 5b when using adhesives reel 20
Length at below 20m, it is possible to suppression does not uses and the amount of discarded bond layer 8.From same reason
By considering, volume is abandoned the length of portion 5b and is preferably the state being wound with anisotropic conductive band 5 in core 1
Under 10 enclose more than, more preferably 10 ~ 30 circle, more preferably 13 ~ 20 circle, most preferably 15 ~ 20
Circle.
According to adhesives reel 20, as above-mentioned adhesives reel 10, by joining in assigned position
Put end mark EM, and according to base material 6 towards core 1 side and bond layer 8 towards the mode in outside
Core 1 winds anisotropic conductive band 5, it is possible to be reliably suppressed the generation of adhesion further.About
The reason of more preferable effect indefinite is obtained by making anisotropic conductive band 5 opposite direction wind, but this
A person of good sense is presumed as follows.I.e. it is believed that region (use portion 5a) should be used at anisotropic conductive band 5,
Bonding agent oozes out from the end face of bond layer 8 and adheres and be bonded in side plate 2, at pull-out anisotropic conductive
When carrying 5, bond layer 8 can be held up than bond layer 8 closer to the base material 6 of core 1 side (inner side),
So the power to be peeled off between bond layer 8 and the base material 6 of the anisotropic conductive band 5 of pull-out does not acts as
With, and little from the impact of the part being bonded on side plate 2, it is possible to realize suppression adhesion.
It addition, now, bond layer 8 is exposed to the periphery of the wound body of anisotropic conductive band 5, in order to
This part is made not polluted by dust etc., it is also possible to use following countermeasure as required.Such as, for each to different
Property conductive strips 5 last part (winding terminate part), remove the bond layer on base material 6 in advance
8 and remaining white part is set, by being wound on wound body, be possible to prevent bond layer 8 to expose.Or
Remaining white part can not also be set at base material 6, but the band preparing other (can illustrate the thing as base material
Matter), it is attached at the end of base material 6 and is wound on wound body.Than that described above, it is also possible to pass through
Adhesives reel 20 is put in bag preserve and from the pollution from external environment condition.
Figure 11 is the figure of the packed state representing adhesives reel.Package body 90 shown in Figure 11 possesses
Adhesives reel 20 and receive its packaging bag 80.Packaging bag 80 is such as by polyethylene, polypropylene
Or polyethylene terephthalate etc. is constituted.When packaging, in the insert port 81 of sealing bags 80
Air in the most preferably packaging bag 80 is removed in suction.It addition, in order to prevent from outside invading air, excellent
Such as sealer etc. is selected to seal airtight by the insert port 81 of packaging bag 80.Now, it is expected to from the beginning of packaging
The dampness that stage beginning starts in packaging bag 80 just tails off, and prevents from being externally entering air.It addition, it is logical
The inner face crossing packaging bag 80 touches with adhesives reel 20, it is possible to prevent because of vibration when carrying or conveying
Cause foreign body that the inner face of packaging bag 80 produces with the mantle friction of adhesives reel 20, for bonding
The damage of the lateral surface of the side plate 2 of material reel 20.Here, packaging bag 80 preferably has transparency, with
Can also be able to confirm from packaging bag 80 to be pasted onto the internal goods name of adhesives reel 20, lot number,
The various information such as shelf-life.Now, owing to each of adhesives reel 20 can be confirmed from packaging bag 80
Kind of information, so being expected to prevent to be mixed into defective goods, effectively carrying out sorting operations.Additionally, it is preferred that use
By heat and the material of pressure contiguity.Additionally, it is preferred that with the breach for Kaifeng.Now, by with
For the breach in Kaifeng, Kaifeng operation during use becomes easy.Here, replace adhesives reel 20,
Adhesives reel 10 can also be accommodated in packaging bag 80.
It addition, in the above-described embodiment exemplified with have be provided with in assigned position end mark EM each to
The adhesives reel 10,20 of opposite sex conductive strips 5, but as long as can be from anisotropic conductive band 5
Terminal part 5c rises and as volume, specific length is abandoned portion 5b, then need not be arranged by end mark EM
In anisotropic conductive band 5.That is, in addition to being not provided with end mark EM, have with viscous in extraction
Connect material reel 10 or 20 mutually isostructural adhesives when bringing use, it is also possible to do not use from this bonding
Material tape terminal portion plays the bond layer of specific length and abandons portion as volume.Such as, do not have in use
After the first adhesives reel of end mark EM, exchange to the second new adhesives volume that structure is identical
During dish, it is also possible to exchange to second from the first adhesives reel of the adhesive material tape leaving specific length and glue
Connect material reel.
In order to connect terminal part and the winding of the anisotropic conductive band 5 being wound on the first adhesives reel
In the top portion of the anisotropic conductive band 5 of the second adhesives reel, by connected to each other for these parts one
Rise or paste with adhesion zone etc..At the end of the use of the first adhesives reel, can will wind
Anisotropic conductive band 5 on this reel cuts off from midway, the volume portion of abandoning, or, it is also possible to it is retracted to always
Finally.When anisotropic conductive band 5 is retracted to last always, it is also possible to anisotropic conductive will be used for
With 5 and the connection of core 1 bundling article (adhesion zone) for reel bonding with second had each to different
The connection in the top portion of property conductive strips 5.Or, it is also possible in the anisotropy that the second bonding reel is had
The top portion of conductive strips 5 arranges leader tape (adhesion zone), this leader tape is used for reel bonding with first and is had
The connection of terminal part of anisotropic conductive band 5.Leader tape is for the top by anisotropic conductive band 5
Portion 5d is pasted on specific place (the such as outside of side plate 2) and fixes.
When adhesives reel does not has end mark, preferably abandoning portion about volume described in operation instructions
Information and be supplied to user.That is, it is supplied to user, described reel external member as reel external member
It is not make not having the adhesives reel of end mark and recording when using this adhesive material tape
Abandon the item in portion as volume with the bond layer of specific length from this adhesive material tape terminal part
Operation instructions are as a set of.Alternatively, it is also possible to by comprise not there is end mark adhesives reel,
Record and do not use the viscous of from this adhesive material tape terminal part specific length when using this adhesive material tape
Connect oxidant layer and abandon the operation instructions of the item in portion as volume and be accommodated with the bag of adhesives reel
The package body external member of pack is supplied to user.Alternatively, it is also possible to not there is of end mark by comprising
Or multiple adhesives reel, be accommodated with one or more packaging bags of adhesives reel, be accommodated with all
The containing box of packaging bag, record and do not use from this adhesive material tape terminal part when using adhesive material tape
The bond layer of specific length and abandon the package body assembly of the operation instructions of the item in portion as volume and carry
Supply user.As containing box, such as, can use the chest formed by Concha Arcae paperboard or by resin
The chest etc. formed.Certainly, even if adhesives reel has end mark, these reel external members,
Package body external member and package body assembly are also effective.
Operation instructions can also be accommodated in the inside of packaging bag.It addition, operation instructions can be paster,
Can be pasted onto on adhesives reel.It addition, operation instructions can be paster, packaging can be pasted onto
On bag.
Operation instructions can also be accommodated in the inside of containing box.It addition, operation instructions can be paster,
And be pasted onto on containing box.It addition, operation instructions can also record as follows by printing on containing box
The word of item and form as one with containing box, described item is not for using from this when using adhesive material tape
Adhesive material tape terminal part plays the bond layer of specific length and abandons the item in portion as volume.
Here, it is also possible to consideration will record and not use from this adhesive material tape eventually when using adhesive material tape
End is played the bond layer of specific length and is abandoned data or the description of the item in portion as volume, with above-mentioned
Adhesives reel, reel external member, package body, package body external member or package body assembly separate and are supplied to
User.
It addition, in the above-described embodiment, lead exemplified with anisotropy as circuit connecting adhesive material band
Electricity band 5 but it also may bond layer 8 is made up of bonding agent composition 8a and does not contains conducting particles 8b's
Non-conducting tape is wound in core 1 and makes adhesives reel, it is possible to use ratio anisotropic conductive band
Be combined with more conducting particles 8b, not there are anisotropic conductive strips.The present invention could be applicable to
The various electronic material adhesive films such as the adhesive film of die bond film, silverskin, semiconductor wafer processing.It addition,
The present invention could be applicable to the electrode on connection solar battery cell and current collection weld tabs line, replacement scolding tin
Conducting film (with reference to International Publication the 07/125903rd).
It addition, in the above-described embodiment, there is exemplified with employing the situation of the side plate 2 of rib structure portion 2b,
But in addition can also use the side plate without rib structure portion 2b.As this, not there is rib structure portion
Side plate, because being susceptible to adhesion than the above-mentioned side plate with rib structure portion, so by the application present invention,
Can fully suppress adhesion.
And then, in the above-described embodiment, exemplified with bond layer 8 by one layer of situation constituted, but also may be used
Base material 6 arranges multilamellar.Such as, the adhesive material tape 15A shown in Figure 12 (a) possesses multiple structure
Bond layer 18.Bond layer 18 is by not containing conducting particles non-containing layer 18a of conducting particles and containing
The conducting particles having conducting particles contains layer 18b and constitutes.Here, as conducting particles non-containing layer 18a and
Conducting particles contains the bonding agent composition of layer 18b, it is possible to use with the bonding agent composition of above-mentioned bond layer 8
Identical material.
If being used as circuit connection material by the bond layer 18 of above-mentioned two-layer structure, engaging circuit
Parts each other time, can fully suppress conducting particles on the circuit electrode with bonding agent product flows as cause
The minimizing of number.It is thus possible, for instance IC chip is installed by COG or COF install be connected on substrate
Time, the number of conducting particles in the metal bump of IC chip can be substantially ensured that.Now, preferably according to
The face possessing metal bump and conducting particles non-containing layer 18a that make IC chip abut, it addition, make to pacify
Substrate and the conducting particles of dress IC chip contain the mode that layer 18b abuts, placement of adhesives layer 18.
Adhesive material tape 15B shown in Figure 12 (b) is from the stripping being more reliably prevented from bond layer 8
Viewpoint is provided with the situation of adhering agent layer 9a between base material 6 and bond layer 8.Shown in Figure 12 (c)
Adhesive material tape 15C be the viewpoint of property layer again on bond layer 8 to be pasted for circuit block from improving
Fold the situation of adhering agent layer 9b.It addition, from more effectively suppressing adhesion and protecting bond layer 8
Viewpoint considers, it is also possible to as shown in figure 13 in the surface layer superimposition with base material 6 opposition side of adhesive material tape 16
Epiphragma 13.Material as such coverlay 13 is not particularly limited, such as, can use as base material
The material that the material of 6 illustrates.
Hereinafter, further describe in embodiment about the present invention, but the invention is not restricted to this.For reality
Execute the adhesives reel involved by example and comparative example and be carried out as follows evaluation.
(1) for or without the evaluation sticked together
The adhesives reel of making is positioned over level the temperature chamber (relative humidity of temperature 30 DEG C
40 ~ 60%) interior 24 hours.Then Tensilon(trade name, Co., Ltd.'s A&D system are used) with 1m/
Minute speed from adhesives reel pull out adhesive material tape.By until pulling out the phase till end mark
Between situation about not sticking together be designated as "None", the situation of generation is designated as " having ".
(2) mensuration of shear viscosity
In the manufacturing process of adhesives reel, lamination 15 adhesives films bond layer (thickness:
40 μm), thus make the bond layer of thickness about 0.6mm, be cut into 1cm × 1cm size and as sample,
Measure the shear viscosity of bond layer.Shear viscoelasticity determinator (TA instrument is employed in this mensuration
Company's system, trade name: ARES).Its result, the shear viscosity of 30 DEG C of bond layer is 1 × 104Pa·s。
Here, condition determination is as follows.
Measure frequency: 10Hz
Atmosphere: under nitrogen
Temperature range: 0 DEG C ~ 150 DEG C
Programming rate: 10 DEG C/min
Probe footpath: 8mm
Specimen size: 10mm × 10mm
Sample thickness: about 0.6mm
Mensuration deflection: 1.0%
(embodiment 1)
[the raw-material preparation of bonding agent composition]
For making bonding agent composition, prepare following raw material.
50g is had thermoplastic phenoxy resin (Union Carbide Corporation's system, trade name: PKHC,
Weight average molecular weight: 45000), it is dissolved in toluene (boiling point 110.6 DEG C) and ethyl acetate (boiling point 77.1 DEG C)
With 1:1(mass ratio) in the mixed solvent that mixes, it is modulated into the phenoxy resin of solid constituent 40 mass %
Solution.
Prepare as free-radical polymerised material, 30 DEG C be aqueous urethane acrylate (newly
Chemical industry Co., Ltd. of middle village system, trade name: UA-512, weight average molecular weight: 2800) and at 30 DEG C be
(chemical industry Co., Ltd. of Xin Zhong village system, trade name: DCP, weight average divides aqueous dimethylacrylate
Son amount: 332).
As the firming agent (free-radical generating agent) of the free free radical of generation, prepare dilauroyl peroxide (day
This oils and fats Co., Ltd. system, trade name: PEROYL L, 1 minute half life temperature 116.4 DEG C, weight average divides
Son amount: 399).
[making of adhesives film]
Use the raw material prepared as stated above, make adhesives film by the following method.
For phenoxy resin solution 40 mass parts, coordinate the aqueous urethane acrylates of 40 mass parts
Ester, the aqueous dimethylacrylate of 20 mass parts, the free-radical generating agent of 4 mass parts and obtain mixed liquor.
For this mixed liquor, the nikel powder (conducting particles) and the mean diameter that coordinate mean diameter to be 5 μm are 0.5 μm
Cab-O-sil (inorganic filler), obtain mixed liquor is dispersed with the coating fluid of nikel powder and Cab-O-sil.
By this coating fluid, with painting frock put with the length of 320m be coated on thick 80 μm, the two of wide 500mm
Face carried out on the PET film (carrier film) that silicone release processes, with furnace superintendent 15m, hot blast temperature 70 DEG C
Drying oven be dried with the speed of 3m/ minute.Thus, obtain being provided with on a face of PET film
The adhesives film (total length 320m) of bond layer (thickness: 40 μm).
The nikel powder content of dried bond layer is 1.5 volume %, and the content of Cab-O-sil is 15 volume %(26
Quality %).
[making of adhesives reel]
By above-mentioned adhesives film, it is cut to wide 1.5mm with Reel-to-reel type cutting equipment, with the length of 300m
Adhesive material tape is wound on reel parts (core external diameter: 66mm, plastic molded article) by degree.Now,
According to making bond layer towards core side (inner side), making the base material formed by PET roll up towards the mode in outside
Around.Here, end mark is pasted at winding to stop at apart from the position of adhesives strap end portion 5m.At volume
Core both sides arrange reel side plate (thickness: 2.0mm), the seam between this reel side plate and adhesive material-tape reel stack
Gap spacing is respectively about in the range of 0.1mm ~ 0.5mm in left and right.Here, employ in the present embodiment as
Having shown in Fig. 1 is provided with the reel parts of the reel side plate of the rib structure portion 2b with radiated entends.
(embodiment 2)
The position pasting end mark is changed to 10m, in addition from distance adhesives strap end portion 5m
Operate similarly to Example 1 and make adhesives reel, and it is evaluated.
(embodiment 3)
The position pasting end mark is changed to 15m, in addition from distance adhesives strap end portion 5m
Operate similarly to Example 1 and make adhesives reel, and it is evaluated.
(embodiment 4)
The position pasting end mark is changed to 20m, in addition from distance adhesives strap end portion 5m
Operate similarly to Example 1 and make adhesives reel, and it is evaluated.
(comparative example 1)
In addition to not pasting end mark on adhesive material tape, operate similarly to Example 1 and make viscous
Connect material reel, and it is evaluated.
Above-described embodiment and the result of comparative example is represented at table 1,2.
［ table 1 ］
［ table 2 ］
［ evaluation of adhesion incidence rate ］
(test example 1)
Make for operating similarly to Example 1 in addition to not pasting end mark on adhesive material tape
30 the adhesives reels made, following evaluation adhesion incidence rate.That is, by adhesives reel with vertically
State is fixed, and hangs the counterweight of 75g at tip, is positioned over the temperature chamber (relative humidity of temperature 30 DEG C
40 ~ 60%) interior 6 hours.Then Tensilon(trade name, Co., Ltd.'s A&D system are used) with 1m/
Minute speed from adhesives reel pull out adhesive material tape.Then measure from starting most the position that sticks together
Put the distance of adhesives reel terminal part.Table 3 represent corresponding to from adhesive material tape terminal part away from
From adhesion incidence rate.
(test example 2)
According to the base material making bond layer constitute towards outside, by PET towards the side of core side (inner side)
Formula, is wound on adhesive material tape in core, and does not paste end mark on adhesive material tape, except
Operate similarly to Example 1 outside these 2 and make 30 adhesives reels.Then, with test example
1 operates equally and evaluates the adhesion incidence rate corresponding to the distance from adhesive material tape terminal part.At table 3 table
Show result.
［ table 3 ］
Claims (214)
1. an adhesives reel, it possesses core, oppositely disposed in the both sides of described core
Pair of side plates and be wound in described core and have banding substrate and be arranged on a face of this base material
The adhesive material tape of bond layer,
Described adhesive material tape has: for extend towards the direction of terminal part from the top portion of this adhesive material tape
Region and use described bond layer use portion, from this adhesive material tape terminal part in specific length not
The volume using described bond layer is abandoned portion and is arranged on described use portion and region that described volume is abandoned between portion
End mark, described volume abandons a length of more than the 5m in portion.
Adhesives reel the most according to claim 1, described volume abandons a length of more than the 5m in portion
Below 20m.
Adhesives reel the most according to claim 1, described volume abandons a length of at described volume of portion
Under the state being wound with described adhesive material tape on core more than 10 circles.
Adhesives reel the most according to claim 1, described volume abandons a length of at described volume of portion
Under the state being wound with described adhesive material tape on core below above 30 circles of 10 circles.
5., according to the adhesives reel described in any one in Claims 1 to 4, described bond layer exists
The shear viscosity of 30 DEG C is below 100000Pa s.
6. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Width be 0.5～3.0mm.
7. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 200m.
8. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 200m below 1000m.
9. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer
Thickness is 5～60 μm.
10. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Connect for circuit.
11. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer are
Glue containing the hot radical curing type that 1 minute half life temperature is the radical polymerization initiator of less than 160 DEG C
Connect agent.
12. adhesives reels according to claim 11, described hot radical curing type bonding agent
Containing thermoplastic resin, be contained in free-radical polymerised materials that 30 DEG C is aqueous free-radical polymerised material,
And radical polymerization initiator.
13. adhesives reels according to claim 12, containing of described free-radical polymerised material
Amount is 20 relative to total amount 100 mass parts of described thermoplastic resin and described free-radical polymerised material
More than mass parts below 80 mass parts.
14. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer are
Containing thermoplastic resin, it is contained in thermosets that 30 DEG C is aqueous epoxy resin and firming agent
Epoxy bonding agent.
15. adhesives reels according to claim 14, the content of described epoxy resin relative to
Total amount 100 mass parts of described thermoplastic resin and described thermosets is more than 20 mass parts 80
Below mass parts.
16. according to the adhesives reel described in any one in Claims 1 to 4, at described bond layer
In be combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the volume of this bond layer
It is 20 below volume %.
17. according to the adhesives reel described in any one in Claims 1 to 4, at described bond layer
In be combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the quality of this bond layer
It is below 50 mass %.
18. have according to the adhesives reel described in any one in Claims 1 to 4, described core
The external diameter of more than 50mm below 160mm.
19. according to the adhesives reel described in any one in Claims 1 to 4, described side plate possess with
The rib structure portion of radiated entends.
20. adhesives reels according to claim 1, described volume abandons a length of more than the 5m in portion
Below 15m.
21. adhesives reels according to claim 1, described volume abandons a length of more than the 5m in portion
Below 10m.
22. adhesives reels according to claim 1, described volume abandons a length of of portion, in core
On be wound with described adhesive material tape state under below above 20 circles of 13 circles.
23. adhesives reels according to claim 1, described volume abandons a length of of portion, in core
On be wound with described adhesive material tape state under below above 20 circles of 15 circles.
24. join according to the adhesives reel described in any one in Claims 1 to 4, described end mark
Put on described bond layer and there is the color different from described bond layer.
25. join according to the adhesives reel described in any one in Claims 1 to 4, described end mark
Put on the substrate and there is the color different from described base material.
26. according to the adhesives reel described in any one in Claims 1 to 4, described end mark
A length of more than 5cm below 1m.
27. according to the adhesives reel described in any one in Claims 1 to 4, described end mark
A length of more than 5cm below 50cm.
28. according to the adhesives reel described in any one in Claims 1 to 4, described end mark
A length of more than 5cm below 30cm.
29. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 100m below 1000m.
30. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 200m below 500m.
31. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 250m below 500m.
32. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
A length of more than 300m below 500m.
33. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Width be more than 0.5mm below 30mm.
34. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Width be more than 0.5mm below 2.0mm.
35. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Width be more than 0.5mm below 1.0mm.
36. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer
Thickness is below more than 5 μm 100 μm.
37. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer
Thickness is below more than 10 μm 40 μm.
38. according to the adhesives reel described in any one in Claims 1 to 4, described bond layer
Thickness is below more than 30 μm 100 μm.
39. according to the adhesives reel described in any one in Claims 1 to 4, the thickness of described base material
It it is below more than 4 μm 200 μm.
40. according to the adhesives reel described in any one in Claims 1 to 4, the thickness of described base material
It it is below more than 20 μm 100 μm.
41. according to the adhesives reel described in any one in Claims 1 to 4, and described base material is right by gathering
PET, PEN, polyethylene glycol isophthalate, poly-to benzene two
Formic acid butanediol ester, polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, ethylene-vinegar
Vinyl acetate copolymer, polrvinyl chloride, Vingon, synthetic rubber system or liquid crystal polymer are formed.
42. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Being the anisotropic conductive band comprising conducting particles, the use level of described conducting particles, with whole described bonding
On the basis of agent composition, it is 0.1 more than volume % 30 volume below %.
43. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Being the anisotropic conductive band comprising conducting particles, the use level of described conducting particles, with whole described bonding
On the basis of agent composition, it is 0.1 more than volume % 10 volume below %.
44. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
Being the anisotropic conductive band comprising conducting particles, the use level of described conducting particles, with whole described bonding
On the basis of agent composition, it is 0.5 more than volume % 5 volume below %.
45. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
For anisotropic conductive band, non-conducting tape or do not have anisotropic conductive strips.
46. according to the adhesives reel described in any one in Claims 1 to 4, described adhesive material tape
For connecting the electrode on solar battery cell and the conducting film of current collection weld tabs line.
The manufacture method of 47. 1 kinds of adhesives reels, it is described in any one in Claims 1 to 46
The manufacture method of adhesives reel, possess characteristic based on described adhesive material tape and determine that described volume is abandoned
The operation of the described specific length in portion.
48. 1 kinds of methods arranging end mark, it is any one institute in manufacturing claims 1～46
The method arranging described end mark during the adhesives reel stated, wherein, based on described bonding material
The characteristic of material strip determines that described volume abandons the described specific length in portion, abandon in described use portion and described volume portion it
Between region described end mark is set.
49. 1 kinds of reel external members, it possesses adhesives reel and operation instructions,
Described adhesives reel possess core, in the both sides of described core an oppositely disposed offside
Plate and be wound in described core and have banding substrate and be arranged on a face of this base material bonding
The adhesive material tape of oxidant layer,
Have described in described operation instructions and do not use from this adhesives when using described adhesive material tape
Tape terminal portion plays the described bond layer of specific length and abandons the item in portion as volume, and described volume abandons portion
A length of more than 5m.
50. reel external members according to claim 49, described volume abandons a length of more than the 5m 20m in portion
Below.
51. reel external members according to claim 49, described volume abandons a length of in described core of portion
On be wound with described adhesive material tape state under 10 circle more than.
52. reel external members according to claim 49, described volume abandons a length of in described core of portion
On be wound with described adhesive material tape state under below above 30 circles of 10 circles.
53. according to the reel external member described in any one in claim 49～52, and described bond layer exists
The shear viscosity of 30 DEG C is below 100000Pa s.
54. according to the reel external member described in any one in claim 49～52, described adhesive material tape
Width is 0.5～3.0mm.
55. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 200m.
56. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 200m below 1000m.
57. according to the reel external member described in any one in claim 49～52, the thickness of described bond layer
Degree is 5～60 μm.
58. use according to the reel external member described in any one in claim 49～52, described adhesive material tape
Connect in circuit.
59. according to the reel external member described in any one in claim 49～52, and described bond layer is for containing
The hot radical curing type having 1 minute half life temperature to be the radical polymerization initiator of less than 160 DEG C is bonding
Agent.
60. reel external members according to claim 59, described hot radical curing type bonding agent contains
Thermoplastic resin, be contained in free-radical polymerised materials that 30 DEG C is aqueous free-radical polymerised material, with
And radical polymerization initiator.
61. reel external members according to claim 60, the content phase of described free-radical polymerised material
Total amount 100 mass parts for described thermoplastic resin and described free-radical polymerised material is 20 mass
More than part below 80 mass parts.
62. according to the reel external member described in any one in claim 49～52, and described bond layer is for containing
There is thermoplastic resin, be contained in 30 DEG C of thermosets for aqueous epoxy resin and the ring of firming agent
Oxygen system bonding agent.
63. reel external members according to claim 62, the content of described epoxy resin is relative to described
Total amount 100 mass parts of thermoplastic resin and described thermosets is more than 20 mass parts 80 mass parts
Below.
64. according to the reel external member described in any one in claim 49～52, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the volume of this bond layer
20 below volume %.
65. according to the reel external member described in any one in claim 49～52, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the quality of this bond layer
Below 50 mass %.
66. according to the reel external member described in any one in claim 49～52, and described core has 50mm
The external diameter of above below 160mm.
67. according to the reel external member described in any one in claim 49～52, and described side plate possesses to put
Penetrate the rib structure portion that shape extends.
68. reel external members according to claim 49, described volume abandons a length of more than the 5m 15m in portion
Below.
69. reel external members according to claim 49, described volume abandons a length of more than the 5m 10m in portion
Below.
70. reel external members according to claim 49, described volume abandons a length of of portion, in core
Under the state being wound with described adhesive material tape below above 20 circles of 13 circles.
71. reel external members according to claim 49, described volume abandons a length of of portion, in core
Under the state being wound with described adhesive material tape below above 20 circles of 15 circles.
72. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 100m below 1000m.
73. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 200m below 500m.
74. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 250m below 500m.
75. according to the reel external member described in any one in claim 49～52, described adhesive material tape
A length of more than 300m below 500m.
76. according to the reel external member described in any one in claim 49～52, described adhesive material tape
Width is more than 0.5mm below 30mm.
77. according to the reel external member described in any one in claim 49～52, described adhesive material tape
Width is more than 0.5mm below 2.0mm.
78. according to the reel external member described in any one in claim 49～52, described adhesive material tape
Width is more than 0.5mm below 1.0mm.
79. according to the reel external member described in any one in claim 49～52, the thickness of described bond layer
Degree is below more than 5 μm 100 μm.
80. according to the reel external member described in any one in claim 49～52, the thickness of described bond layer
Degree is below more than 10 μm 40 μm.
81. according to the reel external member described in any one in claim 49～52, the thickness of described bond layer
Degree is below more than 30 μm 100 μm.
82. according to the reel external member described in any one in claim 49～52, and the thickness of described base material is
More than 4 μm below 200 μm.
83. according to the reel external member described in any one in claim 49～52, and the thickness of described base material is
More than 20 μm below 100 μm.
84. according to the reel external member described in any one in claim 49～52, and described base material is by gathering benzene
Naphthalate, PEN, polyethylene glycol isophthalate, poly-terephthaldehyde
Acid butanediol ester, polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, ethyl vinyl acetate
Vinyl ester copolymers, polrvinyl chloride, Vingon, synthetic rubber system or liquid crystal polymer are formed.
85. according to the reel external member described in any one in claim 49～52, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 30 volume below %.
86. according to the reel external member described in any one in claim 49～52, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 10 volume below %.
87. according to the reel external member described in any one in claim 49～52, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.5 more than volume % 5 volume below %.
88. according to the reel external member described in any one in claim 49～52, and described adhesive material tape is
Anisotropic conductive band, non-conducting tape or not there are anisotropic conductive strips.
89. according to the reel external member described in any one in claim 49～52, and described adhesive material tape is
Connect the electrode on solar battery cell and the current collection conducting film of weld tabs line.
90. according to the reel external member described in any one in claim 49～52, and described operation instructions are
Paster, is pasted onto on described adhesives reel.
91. 1 kinds of adhesion suppressing method, when adhesives reel extraction adhesives brings use, do not make
Portion is abandoned as volume with the bond layer of specific length from this adhesive material tape terminal part, described bonding
Material reel possesses core, in the oppositely disposed pair of side plates in described core both sides and be wound on institute
State in core and there is the described of banding substrate and the described bond layer that is arranged on a face of this base material
Adhesive material tape.
92. according to the method described in claim 91, and described volume abandons a length of more than the 5m in portion.
93. according to the method described in claim 91, described volume abandon a length of more than the 5m 20m in portion with
Under.
94. according to the method described in claim 91, and described volume is abandoned a length of of portion and rolled up in described core
Under the state being wound with described adhesive material tape more than 10 circles.
95. according to the method described in claim 91, and described volume is abandoned a length of of portion and rolled up in described core
Under the state being wound with described adhesive material tape below above 30 circles of 10 circles.
96. according to the method described in any one in claim 91～95, and described bond layer is at 30 DEG C
Shear viscosity be below 100000Pa s.
97. according to the method described in any one in claim 91～95, the width of described adhesive material tape
It is 0.5～3.0mm.
98. according to the method described in any one in claim 91～95, the length of described adhesive material tape
For more than 200m.
99. according to the method described in any one in claim 91～95, the length of described adhesive material tape
For more than 200m below 1000m.
100. according to the method described in any one in claim 91～95, the thickness of described bond layer
It is 5～60 μm.
101. according to the method described in any one in claim 91～95, and described adhesive material tape is used for
Circuit connects.
102. according to the method described in any one in claim 91～95, and described bond layer is for containing
1 minute half life temperature is that the hot radical curing type of the radical polymerization initiator of less than 160 DEG C is bonding
Agent.
103. contain heat according to the method described in claim 102, described hot radical curing type bonding agent
Plastic resin, be contained in free-radical polymerised material that 30 DEG C is aqueous free-radical polymerised material and
Radical polymerization initiator.
104. according to the method described in claim 103, and the content of described free-radical polymerised material is relative
Total amount 100 mass parts in described thermoplastic resin and described free-radical polymerised material is 20 mass parts
Below above 80 mass parts.
105. according to the method described in any one in claim 91～95, and described bond layer is for containing
Thermoplastic resin, it is contained in thermosets and the epoxy of firming agent that 30 DEG C is aqueous epoxy resin
It it is bonding agent.
106. according to the method described in claim 105, and the content of described epoxy resin is relative to described warm
Total amount 100 mass parts of plastic resin and described thermosets be more than 20 mass parts 80 mass parts with
Under.
107., according to the method described in any one in claim 91～95, join in described bond layer
Conjunction has the inorganic filler, the inorganic filler content of described bond layer on the basis of the volume of this bond layer to be
20 below volume %.
108., according to the method described in any one in claim 91～95, join in described bond layer
Conjunction has the inorganic filler, the inorganic filler content of described bond layer on the basis of the quality of this bond layer to be
Below 50 mass %.
109. according to the method described in any one in claim 91～95, and described core has 50mm
The external diameter of above below 160mm.
110. according to the method described in any one in claim 91～95, and described side plate possesses with radiation
The rib structure portion that shape extends.
111. according to the method described in claim 91, described volume abandon a length of more than the 5m 15m in portion with
Under.
112. according to the method described in claim 91, described volume abandon a length of more than the 5m 10m in portion with
Under.
113. abandon a length of of portion according to the method described in claim 91, described volume, wind in core
Under the state having described adhesive material tape below above 20 circles of 13 circles.
114. abandon a length of of portion according to the method described in claim 91, described volume, wind in core
Under the state having described adhesive material tape below above 20 circles of 15 circles.
115. according to the method described in any one in claim 91～95, the length of described adhesive material tape
Degree is more than 100m below 1000m.
116. according to the method described in any one in claim 91～95, the length of described adhesive material tape
Degree is more than 200m below 500m.
117. according to the method described in any one in claim 91～95, the length of described adhesive material tape
Degree is more than 250m below 500m.
118. according to the method described in any one in claim 91～95, the length of described adhesive material tape
Degree is more than 300m below 500m.
119. according to the method described in any one in claim 91～95, the width of described adhesive material tape
Degree is more than 0.5mm below 30mm.
120. according to the method described in any one in claim 91～95, the width of described adhesive material tape
Degree is more than 0.5mm below 2.0mm.
121. according to the method described in any one in claim 91～95, the width of described adhesive material tape
Degree is more than 0.5mm below 1.0mm.
122. according to the method described in any one in claim 91～95, the thickness of described bond layer
It it is below more than 5 μm 100 μm.
123. according to the method described in any one in claim 91～95, the thickness of described bond layer
It it is below more than 10 μm 40 μm.
124. according to the method described in any one in claim 91～95, the thickness of described bond layer
It it is below more than 30 μm 100 μm.
125. is 4 μm according to the method described in any one in claim 91～95, the thickness of described base material
Below above 200 μm.
126. according to the method described in any one in claim 91～95, and the thickness of described base material is
More than 20 μm below 100 μm.
127. according to the method described in any one in claim 91～95, and described base material is by gathering benzene two
Formic acid glycol ester, PEN, polyethylene glycol isophthalate, poly terephthalic acid
Butanediol ester, polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, ethyl vinyl acetate second
Enoate copolymer, polrvinyl chloride, Vingon, synthetic rubber system or liquid crystal polymer are formed.
128. according to the method described in any one in claim 91～95, and described adhesive material tape is bag
Anisotropic conductive band containing conducting particles, the use level of described conducting particles, become with whole described bonding agents
It is divided into benchmark, is 0.1 more than volume % 30 volume below %.
129. according to the method described in any one in claim 91～95, and described adhesive material tape is bag
Anisotropic conductive band containing conducting particles, the use level of described conducting particles, become with whole described bonding agents
It is divided into benchmark, is 0.1 more than volume % 10 volume below %.
130. according to the method described in any one in claim 91～95, and described adhesive material tape is bag
Anisotropic conductive band containing conducting particles, the use level of described conducting particles, become with whole described bonding agents
It is divided into benchmark, is 0.5 more than volume % 5 volume below %.
131. is each according to the method described in any one in claim 91～95, described adhesive material tape
Anisotropy conductive strips, non-conducting tape or not there are anisotropic conductive strips.
132. according to the method described in any one in claim 91～95, and described adhesive material tape is for even
Connect the electrode on solar battery cell and the conducting film of current collection weld tabs line.
The exchange method of 133. 1 kinds of adhesives reels, after using the first adhesives reel, exchange
During the new second adhesives reel that the same structure of the first adhesives reel described in Cheng Youyu is constituted, from
The described first adhesives reel of the adhesive material tape leaving specific length exchanges to described second bonding material
Material reel, described first adhesives reel possesses core, in described core both sides oppositely disposed
To side plate and be wound in described core and have banding substrate and be arranged on a face of this base material
The described adhesive material tape of bond layer, stays the described adhesive material tape on described first adhesives reel
Described specific length be more than 5m.
134., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is more than 5m below 20m.
135., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is the state being wound with described adhesive material tape in described core
More than lower 10 circles.
136., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is the state being wound with described adhesive material tape in described core
Below above 30 circles of lower 10 circles.
137. according to the method described in any one in claim 133～136, and described bond layer is at 30 DEG C
Shear viscosity be below 100000Pa s.
138. according to the method described in any one in claim 133～136, described adhesive material tape
Width is 0.5～3.0mm.
139. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 200m.
140. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 200m below 1000m.
141. according to the method described in any one in claim 133～136, the thickness of described bond layer
Degree is 5～60 μm.
142. use according to the method described in any one in claim 133～136, described adhesive material tape
Connect in circuit.
143. according to the method described in any one in claim 133～136, and described bond layer is for containing
The hot radical curing type having 1 minute half life temperature to be the radical polymerization initiator of less than 160 DEG C is bonding
Agent.
144. contain heat according to the method described in claim 143, described hot radical curing type bonding agent
Plastic resin, be contained in free-radical polymerised material that 30 DEG C is aqueous free-radical polymerised material and
Radical polymerization initiator.
145. according to the method described in claim 144, and the content of described free-radical polymerised material is relative
Total amount 100 mass parts in described thermoplastic resin and described free-radical polymerised material is 20 mass parts
Below above 80 mass parts.
146. according to the method described in any one in claim 133～136, and described bond layer is for containing
There is thermoplastic resin, be contained in 30 DEG C of thermosets for aqueous epoxy resin and the ring of firming agent
Oxygen system bonding agent.
147. according to the method described in claim 146, and the content of described epoxy resin is relative to described warm
Total amount 100 mass parts of plastic resin and described thermosets be more than 20 mass parts 80 mass parts with
Under.
148. according to the method described in any one in claim 133～136, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the volume of this bond layer
20 below volume %.
149. according to the method described in any one in claim 133～136, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the quality of this bond layer
Below 50 mass %.
150. according to the method described in any one in claim 133～136, and described core has 50mm
The external diameter of above below 160mm.
151. according to the method described in any one in claim 133～136, and described side plate possesses to put
Penetrate the rib structure portion that shape extends.
152., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is more than 5m below 15m.
153., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is more than 5m below 10m.
154., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is, when being wound with described adhesive material tape in core
Below above 20 circles of 13 circles.
155., according to the method described in claim 133, stay the institute on described first adhesives reel
The described specific length stating adhesive material tape is, when being wound with described adhesive material tape in core
Below above 20 circles of 15 circles.
156. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 100m below 1000m.
157. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 200m below 500m.
158. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 250m below 500m.
159. according to the method described in any one in claim 133～136, described adhesive material tape
A length of more than 300m below 500m.
160. according to the method described in any one in claim 133～136, described adhesive material tape
Width is more than 0.5mm below 30mm.
161. according to the method described in any one in claim 133～136, described adhesive material tape
Width is more than 0.5mm below 2.0mm.
162. according to the method described in any one in claim 133～136, described adhesive material tape
Width is more than 0.5mm below 1.0mm.
163. according to the method described in any one in claim 133～136, the thickness of described bond layer
Degree is below more than 5 μm 100 μm.
164. according to the method described in any one in claim 133～136, the thickness of described bond layer
Degree is below more than 10 μm 40 μm.
165. according to the method described in any one in claim 133～136, the thickness of described bond layer
Degree is below more than 30 μm 100 μm.
166. according to the method described in any one in claim 133～136, and the thickness of described base material is
More than 4 μm below 200 μm.
167. according to the method described in any one in claim 133～136, and the thickness of described base material is
More than 20 μm below 100 μm.
168. according to the method described in any one in claim 133～136, and described base material is by gathering benzene
Naphthalate, PEN, polyethylene glycol isophthalate, poly-terephthaldehyde
Acid butanediol ester, polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, ethyl vinyl acetate
Vinyl ester copolymers, polrvinyl chloride, Vingon, synthetic rubber system or liquid crystal polymer are formed.
169. according to the method described in any one in claim 133～136, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 30 volume below %.
170. according to the method described in any one in claim 133～136, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 10 volume below %.
171. according to the method described in any one in claim 133～136, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.5 more than volume % 5 volume below %.
172. according to the method described in any one in claim 133～136, and described adhesive material tape is
Anisotropic conductive band, non-conducting tape or not there are anisotropic conductive strips.
173. according to the method described in any one in claim 133～136, and described adhesive material tape is
Connect the electrode on solar battery cell and the current collection conducting film of weld tabs line.
The extraction method of 174. 1 kinds of adhesive material tapes, it is to extract described bonding material out from adhesives reel
The method of material strip, do not use specific length from this adhesive material tape terminal part bond layer and as
Volume abandons portion, and described adhesives reel possesses core, at the oppositely disposed offside in described core both sides
Plate and be wound in described core and have banding substrate and be arranged on a face of this base material described
The described adhesive material tape of bond layer, described volume abandons a length of more than the 5m in portion.
175. according to the method described in claim 174, and described volume abandons a length of more than the 5m 20m in portion
Below.
176. according to the method described in claim 174, and described volume abandons a length of in described core of portion
Under the state being wound with described adhesive material tape more than 10 circles.
177. according to the method described in claim 174, and described volume abandons a length of in described core of portion
Under the state being wound with described adhesive material tape below above 30 circles of 10 circles.
178. according to the method described in any one in claim 174～177, and described bond layer is at 30 DEG C
Shear viscosity be below 100000Pa s.
179. according to the method described in any one in claim 174～177, described adhesive material tape
Width is 0.5～3.0mm.
180. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 200m.
181. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 200m below 1000m.
182. according to the method described in any one in claim 174～177, the thickness of described bond layer
Degree is 5～60 μm.
183. use according to the method described in any one in claim 174～177, described adhesive material tape
Connect in circuit.
184. according to the method described in any one in claim 174～177, and described bond layer is for containing
The hot radical curing type having 1 minute half life temperature to be the radical polymerization initiator of less than 160 DEG C is bonding
Agent.
185. contain heat according to the method described in claim 184, described hot radical curing type bonding agent
Plastic resin, be contained in free-radical polymerised material that 30 DEG C is aqueous free-radical polymerised material and
Radical polymerization initiator.
186. according to the method described in claim 185, and the content of described free-radical polymerised material is relative
Total amount 100 mass parts in described thermoplastic resin and described free-radical polymerised material is 20 mass parts
Below above 80 mass parts.
187. according to the method described in any one in claim 174～177, and described bond layer is for containing
There is thermoplastic resin, be contained in 30 DEG C of thermosets for aqueous epoxy resin and the ring of firming agent
Oxygen system bonding agent.
188. according to the method described in claim 187, and the content of described epoxy resin is relative to described warm
Total amount 100 mass parts of plastic resin and described thermosets be more than 20 mass parts 80 mass parts with
Under.
189. according to the method described in any one in claim 174～177, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the volume of this bond layer
20 below volume %.
190. according to the method described in any one in claim 174～177, in described bond layer
Being combined with inorganic filler, the inorganic filler content of described bond layer is on the basis of the quality of this bond layer
Below 50 mass %.
191. according to the method described in any one in claim 174～177, and described core has 50mm
The external diameter of above below 160mm.
192. according to the method described in any one in claim 174～177, and described side plate possesses to put
Penetrate the rib structure portion that shape extends.
193. according to the method described in claim 174, and described volume abandons a length of more than the 5m 15m in portion
Below.
194. according to the method described in claim 174, and described volume abandons a length of more than the 5m 10m in portion
Below.
195. abandon a length of of portion according to the method described in claim 174, described volume, roll up in core
Under the state being wound with described adhesive material tape below above 20 circles of 13 circles.
196. abandon a length of of portion according to the method described in claim 174, described volume, roll up in core
Under the state being wound with described adhesive material tape below above 20 circles of 15 circles.
197. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 100m below 1000m.
198. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 200m below 500m.
199. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 250m below 500m.
200. according to the method described in any one in claim 174～177, described adhesive material tape
A length of more than 300m below 500m.
201. according to the method described in any one in claim 174～177, described adhesive material tape
Width is more than 0.5mm below 30mm.
202. according to the method described in any one in claim 174～177, described adhesive material tape
Width is more than 0.5mm below 2.0mm.
203. according to the method described in any one in claim 174～177, described adhesive material tape
Width is more than 0.5mm below 1.0mm.
204. according to the method described in any one in claim 174～177, the thickness of described bond layer
Degree is below more than 5 μm 100 μm.
205. according to the method described in any one in claim 174～177, the thickness of described bond layer
Degree is below more than 10 μm 40 μm.
206. according to the method described in any one in claim 174～177, the thickness of described bond layer
Degree is below more than 30 μm 100 μm.
207. according to the method described in any one in claim 174～177, and the thickness of described base material is
More than 4 μm below 200 μm.
208. according to the method described in any one in claim 174～177, and the thickness of described base material is
More than 20 μm below 100 μm.
209. according to the method described in any one in claim 174～177, and described base material is by gathering benzene
Naphthalate, PEN, polyethylene glycol isophthalate, poly-terephthaldehyde
Acid butanediol ester, polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, ethyl vinyl acetate
Vinyl ester copolymers, polrvinyl chloride, Vingon, synthetic rubber system or liquid crystal polymer are formed.
210. according to the method described in any one in claim 174～177, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 30 volume below %.
211. according to the method described in any one in claim 174～177, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.1 more than volume % 10 volume below %.
212. according to the method described in any one in claim 174～177, and described adhesive material tape is
Comprising the anisotropic conductive band of conducting particles, the use level of described conducting particles, with whole described bonding agents
On the basis of composition, it is 0.5 more than volume % 5 volume below %.
213. according to the method described in any one in claim 174～177, and described adhesive material tape is
Anisotropic conductive band, non-conducting tape or not there are anisotropic conductive strips.
214. according to the method described in any one in claim 174～177, and described adhesive material tape is
Connect the electrode on solar battery cell and the current collection conducting film of weld tabs line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2011/068700 | 2011-08-18 | ||
| PCT/JP2011/068700 WO2013024544A1 (en) | 2011-08-18 | 2011-08-18 | Adhesive material reel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102951498A CN102951498A (en) | 2013-03-06 |
| CN102951498B true CN102951498B (en) | 2016-11-16 |
Family
ID=47714887
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204055315U Expired - Fee Related CN203020727U (en) | 2011-08-18 | 2012-08-15 | Packaging body and packaging body set and packaging body assembly |
| CN2012204058050U Expired - Fee Related CN203021117U (en) | 2011-08-18 | 2012-08-15 | Splicing material winding disc and winding disc kit |
| CN201210291451.6A Expired - Fee Related CN102951498B (en) | 2011-08-18 | 2012-08-15 | Adhesives reel and reel external member |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204055315U Expired - Fee Related CN203020727U (en) | 2011-08-18 | 2012-08-15 | Packaging body and packaging body set and packaging body assembly |
| CN2012204058050U Expired - Fee Related CN203021117U (en) | 2011-08-18 | 2012-08-15 | Splicing material winding disc and winding disc kit |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6036694B2 (en) |
| KR (1) | KR101940355B1 (en) |
| CN (3) | CN203020727U (en) |
| TW (1) | TWI580628B (en) |
| WO (2) | WO2013024544A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6119718B2 (en) | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | Anisotropic conductive film and connection structure |
| KR102697500B1 (en) | 2013-11-19 | 2024-08-21 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic electroconductive film and connection structure |
| JP6366975B2 (en) * | 2014-03-27 | 2018-08-01 | デクセリアルズ株式会社 | Adhesive film winding body, connection body manufacturing method, and electronic component connection method |
| WO2015151874A1 (en) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | Anisotropic conductive film and production method therefor |
| JP6098949B2 (en) * | 2014-12-12 | 2017-03-22 | トヨタ自動車株式会社 | Electrolyte membrane wound body |
| JP6510846B2 (en) * | 2015-03-24 | 2019-05-08 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
| TWI605942B (en) * | 2016-01-04 | 2017-11-21 | 厚生股份有限公司 | Pressure-sensitive composite structure and method of manufacturing the same |
| JP6905320B2 (en) * | 2016-09-27 | 2021-07-21 | デクセリアルズ株式会社 | Adhesive film winding body, manufacturing method of adhesive film winding body |
| CN111094486B (en) * | 2017-09-11 | 2022-10-04 | 昭和电工材料株式会社 | Adhesive film housing module and method for manufacturing same |
| JP7264054B2 (en) * | 2017-09-11 | 2023-04-25 | 株式会社レゾナック | Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film housing set |
| CN111052881B (en) * | 2017-09-11 | 2024-02-13 | 株式会社力森诺科 | Adhesive film for circuit connection, method for producing same, method for producing circuit connection structure, and adhesive film housing assembly |
| CN111094487A (en) * | 2017-09-11 | 2020-05-01 | 日立化成株式会社 | Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module |
| WO2020184583A1 (en) * | 2019-03-13 | 2020-09-17 | 日立化成株式会社 | Adhesive film for circuit connection, manufacturing method thereof, manufacturing method of circuit connection structure, and adhesive film accommodating set |
| CN113264422A (en) * | 2021-05-28 | 2021-08-17 | 广东电网有限责任公司 | Telescopic sealing belt device |
| CN117280008A (en) * | 2021-06-02 | 2023-12-22 | 株式会社力森诺科 | Adhesive tape and adhesive tape winding reel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4147614B2 (en) | 1998-04-15 | 2008-09-10 | 日立化成工業株式会社 | Rolled body having an adhesive layer |
| JP4465788B2 (en) * | 2000-03-28 | 2010-05-19 | 日立化成工業株式会社 | Anisotropic conductive tape and reel |
| JP3959247B2 (en) | 2001-02-16 | 2007-08-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | Reel member and film winding method |
| JP3889944B2 (en) | 2001-08-30 | 2007-03-07 | 日立化成工業株式会社 | Adhesive film for circuit connection and method for producing circuit board using the same |
| JP4477823B2 (en) * | 2002-12-20 | 2010-06-09 | 日立化成工業株式会社 | Adhesive tape connection method and adhesive tape connector |
| CN100548840C (en) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | The method of attachment of adhesive material tape connector and adhesive material tape |
| KR100981478B1 (en) * | 2002-07-30 | 2010-09-10 | 히다치 가세고교 가부시끼가이샤 | Connecting structure |
| JP2004115153A (en) * | 2002-09-24 | 2004-04-15 | Shibaura Mechatronics Corp | Sticking device and sticking method for tape member |
| JP2004237996A (en) * | 2003-02-04 | 2004-08-26 | Shin Etsu Polymer Co Ltd | Cover tape and package using the same |
| JP2007002130A (en) * | 2005-06-24 | 2007-01-11 | Asahi Kasei Chemicals Corp | Cation-curable composition and its cured product |
| KR101025369B1 (en) | 2005-08-04 | 2011-03-28 | 히다치 가세고교 가부시끼가이샤 | Anisotropic conductive film and method for producing same |
| JP4238885B2 (en) * | 2005-08-31 | 2009-03-18 | 日立化成工業株式会社 | Adhesive reel and adhesive tape |
| JP4193858B2 (en) | 2006-03-27 | 2008-12-10 | ソニーケミカル＆インフォメーションデバイス株式会社 | Film adhesive application device |
| EP2030937A4 (en) * | 2006-06-21 | 2010-12-22 | Hitachi Chemical Co Ltd | Reel |
| KR101100595B1 (en) | 2006-10-31 | 2011-12-29 | 히다치 가세고교 가부시끼가이샤 | Adhesive tape and adhesive tape roll |
| JP2008303067A (en) * | 2007-05-09 | 2008-12-18 | Hitachi Chem Co Ltd | Adhesive reel and circuit connector manufacturing method using it |
| JP2009004354A (en) * | 2007-05-23 | 2009-01-08 | Hitachi Chem Co Ltd | Adhesive reel and method of manufacturing circuit connector using the same |
| JP2007331949A (en) * | 2007-08-20 | 2007-12-27 | Hitachi Chem Co Ltd | Adhesive reel |
| JP2009278059A (en) * | 2008-04-17 | 2009-11-26 | Hitachi Chem Co Ltd | Thermo-compression bonding apparatus |
| JP2010001084A (en) * | 2008-06-18 | 2010-01-07 | Sony Chemical & Information Device Corp | Reel member, film storage body, and drawing method for film |
| CN102037615B (en) * | 2009-02-27 | 2013-08-28 | 日立化成株式会社 | Adhesive material reel |
| JP4596089B2 (en) * | 2009-03-26 | 2010-12-08 | 日立化成工業株式会社 | Adhesive reel |
| CN102148178A (en) * | 2009-12-16 | 2011-08-10 | 第一毛织株式会社 | Die adhesive film, reel for die adhesive film, mounting apparatus and electronic device comprising the same |
| JP5608052B2 (en) * | 2010-11-09 | 2014-10-15 | デクセリアルズ株式会社 | Adhesive film application method |
-
2011
- 2011-08-18 WO PCT/JP2011/068700 patent/WO2013024544A1/en active Application Filing
-
2012
- 2012-08-15 CN CN2012204055315U patent/CN203020727U/en not_active Expired - Fee Related
- 2012-08-15 CN CN2012204058050U patent/CN203021117U/en not_active Expired - Fee Related
- 2012-08-15 KR KR1020147006339A patent/KR101940355B1/en active IP Right Grant
- 2012-08-15 JP JP2013529027A patent/JP6036694B2/en active Active
- 2012-08-15 CN CN201210291451.6A patent/CN102951498B/en not_active Expired - Fee Related
- 2012-08-15 WO PCT/JP2012/070757 patent/WO2013024873A1/en active Application Filing
- 2012-08-16 TW TW101129778A patent/TWI580628B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102951498A (en) | 2013-03-06 |
| CN203020727U (en) | 2013-06-26 |
| JPWO2013024873A1 (en) | 2015-03-05 |
| TWI580628B (en) | 2017-05-01 |
| WO2013024873A1 (en) | 2013-02-21 |
| WO2013024544A1 (en) | 2013-02-21 |
| JP6036694B2 (en) | 2016-11-30 |
| KR101940355B1 (en) | 2019-01-18 |
| KR20140053298A (en) | 2014-05-07 |
| CN203021117U (en) | 2013-06-26 |
| TW201318952A (en) | 2013-05-16 |
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Effective date of registration: 20160914 Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2 Applicant after: HITACHI CHEMICAL Co.,Ltd. Address before: Tokyo, Japan Applicant before: HITACHI CHEMICAL Co.,Ltd. |
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