CN102522382A - Chip package - Google Patents
Chip package Download PDFInfo
- Publication number
- CN102522382A CN102522382A CN2012100075136A CN201210007513A CN102522382A CN 102522382 A CN102522382 A CN 102522382A CN 2012100075136 A CN2012100075136 A CN 2012100075136A CN 201210007513 A CN201210007513 A CN 201210007513A CN 102522382 A CN102522382 A CN 102522382A
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- CN
- China
- Prior art keywords
- fixings
- chip
- chip packaging
- area
- functional areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- Led Device Packages (AREA)
Abstract
The invention discloses a chip package which comprises a loader, a chip and a plurality of electric connectors, wherein the loader comprises a body, a plurality of embedding and fixing members and a cladding material, the body is provided with a function region and a covering region outside the function region; the plurality of embedding and fixing members are jointed to one surface of the covering region, a vertical projection of each embedding and fixing member exceeds a joining region of each embedding and fixing member and the surface; the cladding material is configured on the body to cover the covering region and the embedding and fixing members; and the chip is configured in the function region and the electric connectors are used for connecting the chip and the body.
Description
Technical field
The present invention relates to a kind of chip packaging.
Background technology
In the world of the blast of information now, integrated circuit has inseparable relation with daily life, no matter the food clothing live capable educate happy aspect, all regular meeting uses the product that integrated circuit component is formed.Along with the continuous evolution of electronics technology, more humane, functional more complicated electronic product constantly pushes away Chen Buxin, yet various product is invariably towards light, thin, short, little trend design, so that more convenient comfortable use to be provided.
(Integrated Circuits, production IC) mainly are divided into three phases to integrated circuit: the encapsulation (Package) of the manufacturing of silicon, the making of integrated circuit and integrated circuit etc.With regard to the encapsulation of integrated circuit, this promptly is a final step of accomplishing the integrated circuit finished product.
Generally speaking, a carrier that is used for chip packaging comprises a lead frame and is disposed at one of lead frame and coats material.Because coating material maybe be because of factor generation level or vertical stresses such as variations in temperature, make and between itself and the lead frame situation of delamination (delamination) takes place, and cause the chip packaging failure.How on lead frame, to process with modes such as etching or punching presses at present, formation can be promoted lead frame and the structure that coats the material associativity.But this type of mode exists minimum dimension restriction, tolerance control to be difficult for and executes the problems such as the zone is limited of doing.
Summary of the invention
The object of the present invention is to provide a kind of chip packaging, it can reduce body in the carrier and coat the situation that delamination takes place between the material.
For reaching above-mentioned purpose, the present invention proposes a kind of chip packaging, comprises a carrier, a chip and a plurality of electrical connector.Carrier comprises that a body, a plurality of fixings and coat material.Body has the area of coverage beyond functional areas and the functional areas.A plurality of fixings are engaged to a surface of the area of coverage, and wherein each fixings exceeds outside the bonding land on each fixings and surface with respect to a upright projection on surface.Coat material and be disposed on the body, to cover the area of coverage and these fixings.Chip configuration is in functional areas.Electrical connector connects chip and body.
Based on above-mentioned, the fixings that chip packaging utilization of the present invention is engaged in the area of coverage of body comes the chimeric coating material that is disposed on the body, to increase the adherence that coats between material and the body.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended accompanying drawing to elaborate as follows.
Description of drawings
Fig. 1 is the generalized section of the carrier of one embodiment of the invention;
Fig. 2 is the generalized section of the carrier of another embodiment of the present invention;
Fig. 3 is the generalized section of the carrier of another embodiment of the present invention;
Fig. 4 is the partial cutaway schematic of the carrier of an embodiment more of the present invention;
Fig. 5 is the schematic top plan view of the carrier of an embodiment more of the present invention;
Fig. 6 is the generalized section of a kind of chip packaging of one embodiment of the invention;
Fig. 7 is the generalized section of a kind of chip packaging of another embodiment of the present invention.
The main element symbol description
60,70: chip packaging
100,200,300,400,500,600,700: carrier
110,210,310,410,610,710: body
112,512,612: functional areas
114,214,314,414,514,614: the area of coverage
114a, 214a, 314a, 414a, 614a, 714a: surface
114b, 214b, 614b, 714b: bonding land
120,220,320,420,520,620,720: fixings
122: the tie lines projection
130,230,330,430,530,630,730: coat material
222,522: spherical protrusions
322,524: collude line
322a: end
322b: central sections
422: head
424: neck
440: adhesion coating
650: light-emitting diode chip for backlight unit
660,760: electrical connector
670: adhesive body
680: the light transition layer
750: chip
Embodiment
See also Fig. 1, it illustrates a carrier 100 that is applied to chip packaging.Carrier 100 comprises that a body 110, a plurality of fixings 120 and coat material 130.Body 110 can be a circuit base plate or a lead frame, and body 110 has the functional areas 112 and the area of coverage 114 beyond the functional areas 112, and functional areas 112 are suitable for disposing a chip.A plurality of fixings 120 are engaged to a surperficial 114a of the area of coverage 114.Each fixings 120 exceeds outside the bonding land 114b of each fixings 120 and surperficial 114a with respect to the upright projection of surperficial 114a.Coat material 130 and be disposed on the body 110, covering the area of coverage 114 and these fixings 120, and expose functional areas 112 and supply chip ccontaining to form a depression (cavity).In the present embodiment; The material that coats material 130 can be transparent polymer (transparent polymer) or translucent polymer (translucent polymer); For example flexible glue (soft gel) elastic material (elastomer) or resin (resin), wherein resin can be epoxy resin (epoxy resin), silica gel (silicone) or epoxy-silica gel hybrid resin (epoxy-silicone hybrid resin).But the kind that coats material 130 is not with the above-mentioned system of exceeding.
Present embodiment is selected to utilize the routing technology on the surperficial 114a of the body 110 of carrier 100, to form tie lines projection 122, with as fixings 120.The material of fixings 120 may be selected to be the metal that can form eutectic with body, so that the mode with for example eutectic engages between fixings 120 and the body 110.Formed fixings 120 can bear the for example horizontal stress or the vertical stress of at least 100 g of weights under this situation, and does not break away from body 110.
In addition, in the present embodiment, fixings 120 in order to position that bonding land 114b is connected in contract, make fixings 120 with respect to the area of the upright projection of surperficial 114a area greater than bonding land 114b.So, when follow-up formation coats material 130, coat material 130 and can be snapped at the position of contracting in the fixings 120, do not separate with fixings 120 easily so that coat material 130.In other words, carrier 100 utilizes fixings 120 to increase body 110 and coats associativity and the bonding area between the material 130.When variations in temperature or other factors and when coating between material 130 and the fixings 120 generation level or vertical direction stress, the setting of fixings 120 can be avoided the situation of generation delamination between body 110 and the coating material 130.
Certainly, in other embodiments, fixings also possibly be not more than the area of bonding land with respect to the area of the upright projection on surface.The present invention does not limit chimeric shape; Generally; As long as fixings exceeds the scope of bonding land with respect to the upright projection on surface; Be able to be filled in the part that is not connected on the fixings and the space between the surface and coat material, make the coating material be snapped at chimeric, can reach identical or similar effects with the bonding land.Hereinafter is further enumerated the aspect that a plurality of embodiment explain that fixings is possible.
See also Fig. 2, it illustrates another carrier that is applied to chip packaging.In the present embodiment, fixings 220 is a spherical protrusions 222.On manufacture craft, the playing skill art of for example planting capable of using forms spherical protrusions 222 (or metal ball) at the surperficial 214a of the area of coverage 214, with as fixings 220.In the present embodiment, the mode with eutectic between fixings 220 and the body 210 engages, and in other embodiments, also can adopt mode such as bonding that fixings 220 is incorporated into body.And; Owing to contract in the position of fixings 220 connection bonding land 214b and by 230 interlocks of coating material; Make to coat between material 230 and the fixings 220 to have associativity to a certain degree, therefore can effectively avoid body 210 and coat the situation that delamination takes place between the material 230.
In addition, shown in the embodiment of Fig. 3, fixings 320 is to collude line 322.On the manufacture craft, can on the body 310 of carrier 300, carry out the routing manufacture craft, collude line 322 with formation.This two ends 322a that colludes line 322 for example is that the mode with eutectic is connected in surperficial 314a, and can bear the for example horizontal stress or the vertical stress of at least 100 g of weights.And, collude line 322 and have a central sections 322b and be positioned at surperficial 314a top.This structure of colluding line 322 meets the design principle of aforementioned fixings equally, and the central sections 322b that promptly colludes line 322 exceeds outside the upright projection of two ends 322a with respect to surperficial 314a of colluding line 322 with respect to the upright projection of surperficial 314a.So; The coating material 330 of follow-up formation can coat central sections 322b and insert central sections 322b and surperficial 314a between the space; Make and have preferable associativity between fixings 320 and the coating material 330; Can effectively avoid coating material 330 disengaging bodies 310 and make because of variations in temperature or other factors generation level or vertical direction stress between coating material 330 and fixings 320.
When making the carrier of above-mentioned a plurality of embodiment, can use existing routing device or plant ball equipment on the body of carrier, to form fixings.In other words, the making of fixings of the present invention can be compatible to existing manufacturing process steps and equipment, can not cause the added burden on the cost of manufacture.
In addition, the present invention can also adopt other possible modes to form fixings.For example, can accomplish the making of fixings earlier, again fixings is engaged on the body of carrier.This kind production method can provide fixings more design flexibility, for example adopt various possible materials or method to make fixings, and the shape of fixings is also more changeable.
See also Fig. 4, this is the carrier of an embodiment again that is applied to chip packaging.In the present embodiment; Fixings 420 comprises a head 422 and a neck 424; And neck 424 is between the surperficial 414a of the head 422 and the area of coverage 414, head 422 with respect to the area of the upright projection of surperficial 414a greater than the area of neck 422 with respect to the upright projection of surperficial 414a.On the mode of making, after can earlier fixings 420 being shaped in advance, be fixed in surperficial 414a with eutectic or bonding mode again.In the present embodiment, the material of fixings 420 comprises pottery or macromolecular material, and the neck 424 of fixings 420 is disposed on the surperficial 414a of the area of coverage 414 through an adhesion coating 440.In addition, coat material 430 can be filled in fixings 420 neck 424 around, and be sticked in head 422.Carrier 400 is strengthened associativity between bodies 410 and the coating material 430 to avoid taking place the situation of delamination through fixings 420.
In addition, the difform fixings of the visual demand combinations of producer is with to body and coat between the material preferable associativity is provided.See also Fig. 5, in Fig. 5, hide the configuration state of understanding fixings with convenient coating material.As shown in Figure 5, the area of coverage 514 is round functional areas 512, and fixings 520 is arranged at the area of coverage 514 with the arrangement mode that is surrounded on functional areas 512.In the present embodiment, fixings 520 comprises spherical projection 522 and colludes line 524.With functional areas 512 is the center, spherical projection 522, collude line 524 and spherical projection 522 respectively with different radiuses around functional areas 512.In the present embodiment, spherical projection 522 can be as the spherical projection 222 among the embodiment of Fig. 2, and collude line 524 can be as colluding line 322 among the embodiment of Fig. 3.In other embodiments, carrier 500 also can make up other various types of fixings 520, and is arranged in the area of coverage 514 with other mode, so that the associativity between the specific region that carrier 500 can be strengthened bodies 510 through fixings 520 and the coating material.
In brief, the combination between the shape of fixings, material, production method and the body, the mode that makes up and be arranged on the body are not all exceeded with the foregoing description.
Above-mentioned carrier is applicable to all types of chip packagings.Chip packaging with light-emitting diode is an example, sees also Fig. 6, and chip packaging 60 comprises a carrier 600, a light-emitting diode chip for backlight unit 650, a plurality of electrical connector 660, an adhesive body 670 and a smooth transition layer 680.Present embodiment can adopt the carrier 100 of Fig. 1 to form said chip packaging 60.Particularly, carrier 600 comprises that a body 610, a plurality of fixings 620 and coat material 630.Body 610 is a lead frame, and body 610 has the functional areas 612 and the area of coverage 614 beyond the functional areas 612.A plurality of fixings 620 are engaged to a surperficial 614a of the area of coverage 614, and wherein each fixings 620 exceeds outside the bonding land 614b of each fixings 620 and surperficial 614a with respect to the upright projection of surperficial 614a.Coat material 630 and be disposed on the body 610, to cover the area of coverage 614 and fixings 620.In the present embodiment, aforementioned embodiment shown in Figure 1 is similar for the shape of fixings 620, material and production method, repeats no more here.
In addition, light-emitting diode chip for backlight unit 650 is disposed in the functional areas 612.Electrical connector 660 for example is many leads, connects light-emitting diode chip for backlight unit 650 and body 610 respectively, makes light-emitting diode chip for backlight unit 650 to be electrically connected on the body 610 through electrical connector 660.Adhesive body 670 is inserted in the depression, with covering luminousing diode chip 650 and these electrical connectors 660.As shown in Figure 6, lens can be selected to form in adhesive body 670 tops, light effect to increase.Between adhesive body 670 and the chip 650 the light transition layer 680 that comprises light converting substances particle can be set; The perhaps adhesive body 670 light converting substances particle that can mix itself; Make the light that light-emitting diode chip for backlight unit 650 penetrates, for example: blue light can be converted into the light of different colours by light converting substances particle; For example: green glow, gold-tinted or ruddiness, and the light that sends of the light that penetrates of light-emitting diode chip for backlight unit 650 and light converting substances particle each other mixed light be white light.
The chip packaging 60 of present embodiment utilizes fixings 620 to increase the body 610 of carrier 600 and coats associativity and the bonding area between the material 630.When variations in temperature or other factors and when coating between material 630 and the fixings 620 generation level or vertical direction stress, the situation of generation delamination between the body 610 that the setting of fixings 620 can be avoided carrier 600 and the coating material 630.
Except the chip packaging of light-emitting diode, Fig. 7 more illustrates and uses another kind of chip packaging of the present invention.As shown in Figure 7, chip packaging 70 comprises a carrier 700, a chip 750 and a plurality of electrical connector 760.Carrier 700 comprises that a body 710, a plurality of fixings 720 and coat material 730.The fixings 220 that the fixings 720 of present embodiment adopts among Fig. 2 embodiment.Particularly, in the present embodiment, body 710 is a substrate, and a surperficial 714a and chip 750 that fixings 720 is incorporated into body 710 are electrically connected to body 740 through electrical connector 760.Fixings 720 exceeds outside the bonding land 714b of fixings 720 and surperficial 714a with respect to the upright projection of surperficial 714a.Coat material 730 and cover chip 750, fixings 720 and electrical connector 760.Fixings 720 engages with body 710, and coating material 730 is snapped at the part that contracts in the fixings 720.When variations in temperature or other factors and when coating between material 730 and the fixings 720 generation level or vertical direction stress, the situation of generation delamination between the body 710 that can avoid carrier 700 and the coating material 730.
The above-mentioned carrier that chip packaging adopted is except the example that embodiment enumerated like Fig. 6 and Fig. 7; All can adopt like the arbitrary carrier among the embodiment of Fig. 1 to Fig. 5; Or not being recited in the carrier of other type of embodiment, the aspect of the employed carrier of chip packaging is not with the above-mentioned system of exceeding.As long as the fixings of carrier and body engagement well and fixings exceed the scope of bonding land with respect to the upright projection on surface; Be able to be filled in the part that is not connected on the fixings and the space between the surface and coat material, make the coating material be snapped at chimeric and get final product with the bonding land.
In sum; Chip packaging utilization of the present invention coats material and is snapped at the fixings that is bonded on the body; Increase the associativity that coats between material and the body; Coat generation level or vertical direction stress between material and the fixings to avoid because of variations in temperature or other factors, to make, cause coating material and break away from surplus body.In addition, the making of fixings of the present invention can be compatible to existing manufacturing process steps and equipment, can not cause the added burden on the cost of manufacture.And, because fixings can be made in advance, rejoin to the body of carrier, make fixings possess advantages such as pinpoint accuracy and dimension limit are little.
Though disclosed the present invention in conjunction with above embodiment; Yet it is not in order to limit the present invention; Be familiar with this operator in the technical field under any; Do not breaking away from the spirit and scope of the present invention, can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (15)
1. chip packaging comprises:
Carrier comprises:
Body has the area of coverage beyond functional areas and this functional areas;
A plurality of fixings are engaged to a surface of this area of coverage, and wherein respectively this fixings exceeds outside the bonding land of respectively this fixings and this surface with respect to the upright projection on this surface; And
Coat material, be disposed on this body, to cover this area of coverage and those fixings;
Chip is disposed in these functional areas; And
A plurality of electrical connectors connect this chip and this body.
2. chip packaging as claimed in claim 1, wherein this area of coverage is around these functional areas, and this coating material exposes this functional areas, to form a depression.
3. chip packaging as claimed in claim 2, wherein this chip is a light-emitting diode chip for backlight unit, and this chip packaging also comprises adhesive body, inserts in this depression, to cover this chip and those electrical connectors.
4. chip packaging as claimed in claim 3 also comprises the light transition layer, is disposed between this adhesive body and this chip.
5. chip packaging as claimed in claim 1, wherein respectively this fixings comprises projection, and this projection is in order to contract in the position that connects this bonding land and by this coating material interlock.
6. chip packaging as claimed in claim 5, wherein respectively this projection is spherical.
7. chip packaging as claimed in claim 1; Wherein respectively this fixings comprises and colludes line, and these two ends of colluding line connect should the surface, and this colludes line and has central sections; Be positioned at this surface, and this coating material coat this central sections and insert this central sections and this surface between the space.
8. chip packaging as claimed in claim 1, wherein respectively this fixings comprises:
Head; And
Neck is connected in this head and this surface, and this head with respect to the area of a upright projection on this surface greater than the area of this neck with respect to a upright projection on this surface.
9. chip packaging as claimed in claim 1, wherein respectively the material of this fixings comprises metal.
10. chip packaging as claimed in claim 9 wherein respectively engages for eutectic between this fixings and this body.
11. chip packaging as claimed in claim 1, wherein respectively the material of this fixings comprises pottery or macromolecular material.
12. chip packaging as claimed in claim 1 also comprises an adhesion coating, is disposed at respectively between this fixings and this surface.
13. chip packaging as claimed in claim 1, wherein this body comprises circuit base plate or lead frame.
14. chip packaging as claimed in claim 1, wherein this coating material also covers this chip and those electrical connectors.
15. chip packaging as claimed in claim 1, wherein those electrical connectors comprise many leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100075136A CN102522382A (en) | 2012-01-11 | 2012-01-11 | Chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100075136A CN102522382A (en) | 2012-01-11 | 2012-01-11 | Chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102522382A true CN102522382A (en) | 2012-06-27 |
Family
ID=46293250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100075136A Pending CN102522382A (en) | 2012-01-11 | 2012-01-11 | Chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102522382A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972222A (en) * | 2014-06-03 | 2014-08-06 | 宁波升谱光电半导体有限公司 | LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module |
| CN103972221A (en) * | 2014-06-03 | 2014-08-06 | 宁波升谱光电半导体有限公司 | LED (light-emitting diode) light source packaging structure and method |
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| JP2002009196A (en) * | 2000-06-20 | 2002-01-11 | Kyushu Hitachi Maxell Ltd | Manufacturing method of semiconductor device |
| US20090166879A1 (en) * | 2007-12-26 | 2009-07-02 | Song Kun-Ho | Semiconductor package |
| CN101859701A (en) * | 2009-02-20 | 2010-10-13 | 住友金属矿山株式会社 | Semiconductor device substrate, semiconductor device and their manufacture method |
| JP4611937B2 (en) * | 2006-06-07 | 2011-01-12 | 日亜化学工業株式会社 | Surface mount type light emitting device and manufacturing method thereof |
| CN201766073U (en) * | 2010-05-07 | 2011-03-16 | 坤远科技股份有限公司 | Lead frame capable of reinforcing sealing adhesive jointing degree and packaging structure of lead frame |
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2012
- 2012-01-11 CN CN2012100075136A patent/CN102522382A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002009196A (en) * | 2000-06-20 | 2002-01-11 | Kyushu Hitachi Maxell Ltd | Manufacturing method of semiconductor device |
| JP4611937B2 (en) * | 2006-06-07 | 2011-01-12 | 日亜化学工業株式会社 | Surface mount type light emitting device and manufacturing method thereof |
| US20090166879A1 (en) * | 2007-12-26 | 2009-07-02 | Song Kun-Ho | Semiconductor package |
| CN101859701A (en) * | 2009-02-20 | 2010-10-13 | 住友金属矿山株式会社 | Semiconductor device substrate, semiconductor device and their manufacture method |
| CN201766073U (en) * | 2010-05-07 | 2011-03-16 | 坤远科技股份有限公司 | Lead frame capable of reinforcing sealing adhesive jointing degree and packaging structure of lead frame |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972222A (en) * | 2014-06-03 | 2014-08-06 | 宁波升谱光电半导体有限公司 | LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module |
| CN103972221A (en) * | 2014-06-03 | 2014-08-06 | 宁波升谱光电半导体有限公司 | LED (light-emitting diode) light source packaging structure and method |
| US9379292B2 (en) | 2014-06-03 | 2016-06-28 | Ningbo Sunpu Led Co., Ltd. | LED light source packaging method, LED light source package structure and light source module |
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Application publication date: 20120627 |