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CN102487590A - 壳体及其制造方法 - Google Patents

壳体及其制造方法 Download PDF

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Publication number
CN102487590A
CN102487590A CN2010105702750A CN201010570275A CN102487590A CN 102487590 A CN102487590 A CN 102487590A CN 2010105702750 A CN2010105702750 A CN 2010105702750A CN 201010570275 A CN201010570275 A CN 201010570275A CN 102487590 A CN102487590 A CN 102487590A
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corrosion
housing
resistant coating
layer
magnetron sputtering
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张新倍
陈文荣
蒋焕梧
陈正士
陈晓强
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010105702750A priority Critical patent/CN102487590A/zh
Priority to US13/213,398 priority patent/US20120141826A1/en
Publication of CN102487590A publication Critical patent/CN102487590A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/12—Alloys based on aluminium with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/1275—Next to Group VIII or IB metal-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本发明提供一种壳体，包括金属基体、形成于该金属基体上的防腐蚀层及具有装饰性的色彩层，所述防腐蚀层为Al-Cu膜层。所述壳体具有良好的耐腐蚀性及装饰性外观。本发明还提供了所述壳体的制造方法，包括以下步骤：提供金属基体；于该金属基体上磁控溅射形成防腐蚀层；于该防腐蚀层上磁控溅射形成具有装饰性的色彩层。

Description

壳体及其制造方法
技术领域
本发明涉及一种壳体及其制造方法。
背景技术
真空镀膜技术(PVD)是一种非常环保的成膜技术。以真空镀膜的方式所形成的膜层具有高硬度、高耐磨性、良好的化学稳定性、与基体结合牢固以及亮丽的金属外观等优点，因此真空镀膜在铝、铝合金及不锈钢等金属基材表面装饰性处理领域的应用越来越广。
然而，由于铝或铝合金的标准电极电位很低，且PVD装饰性涂层本身不可避免的会存在微小的孔隙，如针孔、裂纹，并且在铝及铝合金基体会发生微电池腐蚀作用，形成很大的膜-基电位差，加快了微电池的腐蚀速率，因此，直接于金属基体表面镀覆诸如TiN层、TiN层、CrN层等具有色彩的PVD装饰性涂层，不能有效防止所述金属基体发生电化学腐蚀，同时该PVD装饰性涂层本身也会发生异色、脱落等现象。
发明内容
鉴于此，提供一种具有良好的耐腐蚀性及装饰性外观的壳体。
另外，还提供一种上述壳体的制造方法。
一种壳体，包括金属基体，形成于金属基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，所述防腐蚀层为Al-Cu层。
一种壳体的制造方法，包括以下步骤：
提供金属基体；
于该金属基体上磁控溅射防腐蚀层，该防腐蚀层为一Al-Cu层；
于该防腐蚀层上磁控溅射色彩层。
所述壳体的制造方法，通过磁控溅射法依次于金属基体上形成铝铜的防腐蚀层及具有装饰性的色彩层。所述防腐蚀层Al-Cu层的致密性比化合物(如Al-N、Al-O)的致密性要好，可最大限度的过滤腐蚀性物质的浓度，另外，由于所述防腐蚀层的存在，有效地降低了膜-基电位差，减缓了壳体发生微电池腐蚀的速率，从而提高了壳体的耐腐蚀性。在所述壳体防腐蚀性提高的同时，还可避免所述色彩层发生异色、脱落等失效现象，从而使该壳体经长时间使用后仍具有较好的装饰性外观。
附图说明
图1为本发明较佳实施例的壳体的剖视图。
主要元件符号说明
壳体        10
金属基体    11
防腐蚀层    13
色彩层      15
具体实施方式
请参阅图1，本发明一较佳实施例的壳体10包括金属基体11、依次形成于该金属基体11上的防腐蚀层13及色彩层15。该壳体10可以为3C电子产品的壳体，也可为工业、建筑用件及汽车等交通工具的零部件等。
所述金属基体的材质为铝、铝合金、镁或镁合金。
所述防腐蚀层13为Al-Cu层，其厚度为1.0～3.0μm。
所述色彩层15为Ti-N层，其厚度为1.0～3.0μm。
可以理解，所述色彩层15还可以为Cr-N或其他具有装饰性的色彩层。
所述防腐蚀层13及色彩层15均可通过磁控溅射法沉积形成。
本发明一较佳实施例的制造所述壳体10的方法主要包括如下步骤：
提供金属基体11，并对金属基体11依次进行研磨及电解抛光。电解抛光后，再依次用去离子水和无水乙醇对该金属基体11表面进行擦拭。再将擦拭后的金属基体11放入盛装有丙酮溶液的超声波清洗器中进行震动清洗，以除去金属基体11表面的杂质和油污等。清洗完毕后吹干备用。
对经上述处理后的金属基体11的表面进行氩气等离子清洗，进一步去除金属基体11表面的油污，以改善金属基体11表面与后续涂层的结合力。该等离子清洗的具体操作及工艺参数可为：将金属基体11放入一磁控溅射镀膜机(图未示)的镀膜室内，对该镀膜室进行抽真空处理至真空度为1.0×10-3Pa，以250～500sccm(标准状态毫升/分钟)的流量向镀膜室中通入纯度为99.999％的氩气，于金属基体11上施加-300～-800V的偏压，对金属基体11表面进行等离子清洗，清洗时间为3～10min。
在对金属基体11进行等离子清洗后，于该金属基体11上形成防腐蚀层13。所述防腐蚀层13为Al-Cu层。形成该防腐蚀层13的具体操作及工艺参数如下：以氩气为工作气体，调节氩气流量为100～300sccm，设置占空比为30％～80％，于金属基体11上施加-50～-200V的偏压，并加热镀膜室至100～150(即溅射温度为100～150)；选择Al-Cu合金靶材，所述Al-Cu合金靶中铜的质量百分含量为0.5％～25％，设置其功率为2～8kw，沉积防腐蚀层13。沉积该防腐蚀层13的时间为45～120min。
形成所述防腐蚀层13后，于该防腐蚀层13上形成色彩层15，形成该色彩层15的具体操作及工艺参数如下：关闭所述Al-Cu靶的电源，开启已置于所述镀膜机内的一靶材电源，该靶材可为钛靶或铬靶，设置其功率为8～10kw，保持上述氩气的流量不变，并向镀膜室内通入流量为20～150sccm的反应气体氮气，沉积色彩层15。沉积该色彩层15的时间为20～30min，该色彩层15为Ti-N膜层或Cr-N膜层。
可以理解，Al-Cu合金靶材中Al、Cu的含量可根据所需实现的涂层功能而选择，提高Cu含量可获得较佳的耐腐蚀性能，但涂层塑性会有所下降。
本发明较佳实施方式的壳体10的制造方法，通过磁控溅射法依次于金属基体11上形成铝铜的防腐蚀层13及色彩层15。Al-Cu复合膜系的致密性比化合物(如Al-N、Al-O)的致密性要好，可最大限度的过滤腐蚀性物质的浓度，另外，由于所述防腐蚀层13的存在，有效地降低了膜-基电位差，减缓了壳体10发生微电池腐蚀的速率，从而提高了壳体10的耐腐蚀性。相较于以Al膜作为防腐蚀层的情况，所述的壳体10的耐蚀性能可提高2倍以上。在所述壳体10防腐蚀性提高的同时，还可避免所述色彩层15发生异色、脱落等失效现象，从而使该壳体10经长时间使用后仍具有较好的装饰性外观。

Claims (10)

1.一种壳体，包括金属基体，形成于金属基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，其特征在于：所述防腐蚀层为Al-Cu层。
2.如权利要求1所述的壳体，其特征在于：该防腐蚀层的厚度为1.0～3.0μm。
3.如权利要求1所述的壳体，其特征在于：所述色彩层为Ti-N层或Cr-N层。
4.如权利要求1所述的壳体，其特征在于：所述防腐蚀层及色彩层以磁控溅射镀膜法形成。
5.如权利要求1所述的壳体，其特征在于：所述基体为铝、铝合金、镁或镁合金。
6.一种壳体的制造方法，包括以下步骤：
提供金属基体；
于该金属基体上磁控溅射防腐蚀层，该防腐蚀层为一Al-Cu层；
于该防腐蚀层上磁控溅射色彩层。
7.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述防腐蚀层的工艺参数为：以氩气为工作气体，其流量为50～300sccm，设置占空比为30％～80％，于金属基体上施加-50～-200V的偏压，选择Al-Cu合金靶材，所述Al-Cu合金靶中Cu的质量百分含量为0.5％～25％，设置其功率为2～8kw。
8.如权利要求7所述的壳体的制造方法，其特征在于：磁控溅射所述防腐蚀层的时间为45～120min。
9.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述色彩层的工艺参数为：以钛靶或铬靶为靶材，设置靶材功率为8～10kw，以氮气为反应气体，设置氮气流量为20～150sccm。
10.如权利要求9所述的壳体的制造方法，其特征在于：磁控溅射所述色彩层的时间为20～30min。
CN2010105702750A 2010-12-02 2010-12-02 壳体及其制造方法 Pending CN102487590A (zh)

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WO2018209520A1 (zh) * 2017-05-15 2018-11-22 广东欧珀移动通信有限公司 复合金属板材、用于电子设备的壳体以及电子设备
CN110876245A (zh) * 2018-08-30 2020-03-10 苹果公司 具有耐腐蚀涂层的电子设备
CN115207576A (zh) * 2022-05-30 2022-10-18 宜宾长盈精密技术有限公司 动力电池连接片的制作方法及动力电池模组连接方法

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