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CN102465255A - 壳体及其制造方法 - Google Patents

壳体及其制造方法 Download PDF

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Publication number
CN102465255A
CN102465255A CN2010105399096A CN201010539909A CN102465255A CN 102465255 A CN102465255 A CN 102465255A CN 2010105399096 A CN2010105399096 A CN 2010105399096A CN 201010539909 A CN201010539909 A CN 201010539909A CN 102465255 A CN102465255 A CN 102465255A
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aluminum
layer
housing
corrosion
aluminum alloy
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张新倍
陈文荣
蒋焕梧
陈正士
陈晓强
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2010105399096A priority Critical patent/CN102465255A/zh
Priority to US13/213,383 priority patent/US8715822B2/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12583—Component contains compound of adjacent metal
    • Y10T428/1259—Oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

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Abstract

一种壳体，包括铝或铝合金基体，形成于该铝或铝合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，所述防腐蚀层包括依次形成于铝或铝合金基体表面的Al层和氧化铝层。所述壳体具有良好的耐腐蚀性及装饰性外观。本发明还提供了所述壳体的制造方法，包括以下步骤：提供铝或铝合金基体；在该铝或铝合金基体上磁控溅射防腐蚀层；所述防腐蚀层包括依次形成于铝或铝合金基体表面的Al层和氧化铝层；在该防腐蚀层上磁控溅射具有装饰性的色彩层。

Description

壳体及其制造方法
技术领域
本发明涉及一种壳体及其制造方法。
背景技术
真空镀膜技术(PVD)是一种非常环保的成膜技术。以真空镀膜的方式所形成的膜层具有高硬度、高防磨性的化学稳定性、与基体结合牢固以及亮丽的金属外观等优点，因此真空镀膜在铝、铝合金及不锈钢等金属基材表面装饰性处理领域的应用越来越广。
然而，由于铝或铝合金的标准电极电位很低，与PVD镀层，如TiN层、TiN层或CrN层的电位差较大，且PVD镀层本身不可避免的会存在微小的孔隙，如针孔、裂纹，致使铝或铝合金基体易于发生微电池腐蚀。因此，直接于铝或铝合金基体表面镀覆所述TiN层、TiN层或CrN层并不能有效提高所述铝或铝合金基体的耐腐蚀性能，同时该PVD镀层本身也会发生异色、脱落等现象，难以维持良好的装饰外观。
发明内容
鉴于此，提供一种具有良好的耐腐蚀性及装饰性外观的壳体。
另外，还提供一种上述壳体的制造方法。
一种壳体，包括铝或铝合金基体，形成于该铝或铝合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，所述防腐蚀层包括依次形成于铝或铝合金基体表面的Al层和氧化铝层。
一种壳体的制造方法，包括以下步骤：
提供铝或铝合金基体；
在该铝或铝合金基体上磁控溅射防腐蚀层，所述防腐蚀层包括依
次形成于铝或铝合金基体表面的Al层和氧化铝层；
在该防腐蚀层上磁控溅射色彩层。
所述壳体的制造方法，通过磁控溅射法依次于铝或铝合金基体上形成防腐蚀层及具有装饰性的色彩层。所述防腐蚀层包括依次形成于铝或铝合金基体表面的A1层和氧化铝层，当壳体处于腐蚀性介质中时，由于所述利用铝与铝合金之间的电位差小，减缓了壳体发生微电池腐蚀的速率，从而提高了壳体的耐腐蚀性。在所述壳体防腐蚀性提高的同时，还可避免所述色彩层发生异色、脱落等失效现象，从而使该壳体经长时间使用后仍具有较好的装饰性外观。
附图说明
图1为本发明较佳实施例的壳体的剖视图。
主要元件符号说明
壳体            10
铝或铝合金基体  11
防腐蚀层        13
铝层            131
氧化铝层        133
色彩层          15
具体实施方式
请参阅图1，本发明一较佳实施例的壳体10包括铝或铝合金基体11、依次形成于该铝或铝合金基体11上的防腐蚀层13及色彩层15。该壳体10可以为3C电子产品的壳体，也可为工业、建筑用件及汽车等交通工具的零部件等。
所述防腐蚀层13包括铝层131和氧化铝层133，所述铝层131形成于基体11的表面，所述氧化铝层133形成于铝层131的表面。所述铝层131的厚度为1.0～3.0μm；所述氧化铝层133的厚度为0.5～1.0μm。
所述色彩层15为Ti-N层，其厚度为1.0～3.0μm。可以理解，所述色彩层15还可以为Cr-N层或其他具有装饰性的膜层。
所述防腐蚀层13及色彩层15均可通过磁控溅射法沉积形成。
本发明一较佳实施例的制造所述壳体10的方法主要包括如下步骤：
提供铝或铝合金基体11，并对铝或铝合金基体11依次进行研磨及电解抛光。电解抛光后，再依次用去离子水和无水乙醇对该铝或铝合金基体11表面进行擦拭。再将擦拭后的铝或铝合金基体11放入盛装有丙酮溶液的超声波清洗器中进行震动清洗，以除去铝或铝合金基体11表面的杂质和油污等。清洗完毕后吹干备用。
对经上述处理后的铝或铝合金基体11的表面进行氩气等离子清洗，进一步去除铝或铝合金基体11表面的油污，以改善铝或铝合金基体11表面与后续涂层的结合力。该等离子清洗的具体操作及工艺参数可为：将铝或铝合金基体11放入一磁控溅射镀膜机(图未示)的镀膜室内，对该镀膜室进行抽真空处理至真空度为1.0×10-3Pa，以250～500sccm(标准状态毫升/分钟)的流量向镀膜室中通入纯度为99.999％的氩气，于铝或铝合金基体11上施加-300～-800V的偏压，对铝或铝合金基体11表面进行等离子清洗，清洗时间为3～10min。
在对铝或铝合金基体11进行等离子清洗后，在该铝或铝合金基体11上形成防腐蚀层13。首先形成所述防腐蚀层13中的铝层131。形成该铝层131的具体操作及工艺参数如下：以氩气为工作气体，调节氩气流量为100～300sccm，设置占空比为30％～80％，于铝或铝合金基体11上施加-50～-200V的偏压，并加热镀膜室至100～150℃(即溅射温度为100～150)；选择Al为靶材，设置其功率为8～13kw，沉积防腐蚀层13。沉积该防腐蚀层13的时间为10～30min。
形成铝层131后，在该铝层131上形成氧化铝层133，以氩气为溅射气体，设置氩气流量为100～200sccm，以氧气为反应气体，设置氧气流量为150～200sccm，设置占空比为30～50％，对铝和铝合金基体11施加-50～-100V的偏压，并加热镀膜室至100～150(即溅射温度为100～150)；选择Al为靶材，设置其功率为8～13kw，沉积氧化铝层133。沉积氧化铝层133的时间为30～60min。控制氧化铝层133的厚度为0.5～1.0μm。
形成氧化铝层133后，在该防腐蚀层13上形成色彩层15，该色彩层15为Ti-N膜层或Cr-N膜层。形成所述Ti-N膜层或Cr-N膜层的具体操作及工艺参数如下：关闭所述Al靶的电源，开启已置于所述镀膜机内的一钛靶或铬靶的电源，设置其功率8～10kw，保持上述氩气的流量不变，并向镀膜室内通入流量为20～150sccm的反应气体氮气，沉积色彩层15。沉积该色彩层15的时间为20～30min。
本发明较佳实施方式的壳体10的制造方法，通过磁控溅射法依次于铝或铝合金基体11上形成防腐蚀层13及色彩层15。当壳体10处于腐蚀性介质中时，由于所述防腐蚀层13中的铝及氧化铝与铝或铝合金基体11之间的电位差小，减缓了壳体10发生微电池腐蚀的速率，从而提高了壳体10的耐腐蚀性。所述壳体10耐腐蚀性提高的同时，还可避免所述色彩层15发生异色、脱落等失效现象，从而使该壳体10经长时间使用后仍具有较好的装饰性外观。

Claims (9)

1.一种壳体，包括铝或铝合金基体，形成于该铝或铝合金基体表面的防腐蚀层，及形成于防腐蚀层表面的色彩层，其特征在于：所述防腐蚀层包括依次形成于铝或铝合金基体表面的Al层和氧化铝层。
2.如权利要求1所述的壳体，其特征在于：所述铝层的厚度为1.0～3.0μm。
3.如权利要求1所述的壳体，其特征在于：所述氧化铝层的厚度为0.5～1.0μm。
4.如权利要求1所述的壳体，其特征在于：所述色彩层为Ti-N层或Cr-N层。
5.如权利要求1所述的壳体，其特征在于：所述防腐蚀层及色彩层以磁控溅射镀膜法形成。
6.一种壳体的制造方法，包括以下步骤：
提供铝或铝合金基体；
在该铝或铝合金基体上磁控溅射防腐蚀层，所述防腐蚀层包括依
次形成于铝或铝合金基体表面的Al层和氧化铝层；
在该防腐蚀层上磁控溅射色彩层。
7.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述铝层的工艺参数为：以氩气为工作气体，其流量为100～300sccm，设置占空比为30％～80％，于铝或铝合金基体上施加-50～-200V的偏压，以Al为靶材，设置其功率为8～13kw，溅射温度为50～150℃，溅射时间为10～30min。
8.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述氧化铝层的工艺参数为：设置氩气流量为100～200sccm，以氧气为反应气体，设置氧气流量为150～200sccm，设置占空比为30～50％，对基体施加-50～-100V的偏压，选择Al为靶材，设置其功率为8～13kw，沉积氧化铝层的时间为30～60min。
9.如权利要求6所述的壳体的制造方法，其特征在于：磁控溅射所述色彩层的工艺参数为：开启一钛靶或铬靶的电源，设置其功率8～10kw，设置氮气流量为20～150sccm，溅射时间为20～30min。
CN2010105399096A 2010-11-11 2010-11-11 壳体及其制造方法 Pending CN102465255A (zh)

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CN113825857A (zh) * 2019-05-15 2021-12-21 赛峰集团 在金属基材表面形成氧化铝层的方法

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