CN102436295B - A kind of heat-pipe radiator - Google Patents
A kind of heat-pipe radiator Download PDFInfo
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- CN102436295B CN102436295B CN201010296624.4A CN201010296624A CN102436295B CN 102436295 B CN102436295 B CN 102436295B CN 201010296624 A CN201010296624 A CN 201010296624A CN 102436295 B CN102436295 B CN 102436295B
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- heat
- pipe
- sink unit
- radiating fin
- base portion
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Abstract
The present invention relates to a kind of heat-pipe radiator, heat radiation for computer system, including the first heat-sink unit, the second heat-sink unit, and connect the second heat pipe of the two, wherein: the first heat-sink unit includes heat conduction base portion, the first heat pipe and multiple first radiating fin, first radiating fin is arranged on heat conduction base portion, and first heat pipe one end is connected with heat conduction base portion, and the other end and the first radiating fin heat conduction connect；Second heat-sink unit includes fan, and is arranged on multiple second radiating fins of fan air side；First end of the second heat pipe is connected with heat conduction base portion, and the second end and the second radiating fin heat conduction connect.In the heat-pipe radiator of the present invention, by the second heat pipe, the partial heat of heat conduction base portion is guided to the second heat-sink unit being arranged at the air outlet of computer system, outwards dispelled the heat by the second heat-sink unit, optimize the radiator structure of computer-internal, be particularly suited for the computer system with narrow and small chassis space.
Description
Technical field
The present invention relates to the heat abstractor of electronic product, more particularly, it relates to a kind of heat-pipe radiator.
Background technology
In existing computer system, the power of central processing unit (CPU) is increasing, produces during it runs
Substantial amounts of heat, in order to solve the heat dissipation problem of CPU, heat-pipe radiator is widely used.If existing heat-pipe radiator typically by
Dry radiating fin, heat pipe and pedestal composition, radiating fin is respectively equipped with perforation, utilizes this perforation by each radiating fin with one
Determining deviation overlapping is located in one end of heat pipe, and the other end of heat pipe is connected with pedestal, and pedestal is sticked on the surface of CPU, is used for inhaling
Receive the heat produced in CPU running, and be delivered on fin outwards disperse by the heat of absorption by heat pipe, generally also
Fan can be set on the top of radiating fin, strengthen the cross-ventilation around radiating fin by fan, strengthen radiating effect.
The volume of above-mentioned heat-pipe radiator is generally large, it is adaptable to tower case, for rack-mount server, and its cabinet
Limited space, be usually the side that fan is arranged on radiating fin, use the mode inhaled or blow to increase around radiating fin
Air flowing, with improve heat radiation efficiency.Referring to Fig. 1 in the 2U rack-mount server of double mainboard frameworks, two pieces of 1U mainboards
Being stacked together, radiator also keeps the radiating mode of respective 1U, conducts the heat to alone on each radiator 1,2, then by being
The torrid zone of CPU and miscellaneous part is gone out system by system fan 3.Such radiating mode radiating effect is the best, can be because of the heat of CPU
It is discharged to the most in time outside system so that the temperature of internal system is higher, affects the normal work of CPU and surrounding component.
Summary of the invention
The technical problem to be solved in the present invention is, for the best the lacking of above-mentioned radiating effect of the radiator of prior art
Fall into, it is provided that a kind of compact conformation, the heat-pipe radiator of good heat dissipation effect, be particularly suited for the heat radiation of rack-mount server.
The technical solution adopted for the present invention to solve the technical problems is: a kind of heat-pipe radiator of structure, for computer
The heat radiation of system, including the first heat-sink unit and the second heat-sink unit, wherein:
Described first heat-sink unit includes heat conduction base portion, the first heat pipe and multiple first radiating fin, described heat conduction base
Portion is for receiving the heat from heater element, and described first radiating fin is arranged on heat conduction base portion, described first heat pipe one
End is connected with described heat conduction base portion, and the other end is connected with described first radiating fin heat conduction；
Described second heat-sink unit is arranged at the air outlet of described computer system, and described second heat-sink unit includes wind
Fan, and it is arranged on multiple second radiating fins of fan air side；
Described heat-pipe radiator also includes the second heat pipe connecting described first heat-sink unit and the second heat-sink unit, described
First end of the second heat pipe is connected with described heat conduction base portion, and the second end is connected with described second radiating fin heat conduction.
In heat-pipe radiator of the present invention, described first radiating fin is positioned at the inlet side of described fan.
In heat-pipe radiator of the present invention, multiple described first radiating fins are put down along the air intake direction of described fan
Row is arranged.
In heat-pipe radiator of the present invention, described first radiating fin is rectangle.
In heat-pipe radiator of the present invention, described first radiating fin is stairstepping, described first radiating fin
The height of side of close fan more than away from the height of fan side.
In heat-pipe radiator of the present invention, described first heat pipe includes two horizontal segments and connects inclining of two horizontal segments
Tiltedly section, described tilting section tilts certain angle with horizontal direction, in described two horizontal segments wherein one section be connected with heat conduction base portion
Connecing, another section is connected with the first radiating fin.
In heat-pipe radiator of the present invention, the part that another section described is higher with the first radiating fin is connected.
In heat-pipe radiator of the present invention, described second heat pipe includes two horizontal segments and connects inclining of two horizontal segments
Tiltedly section, described tilting section tilts certain angle with horizontal direction, in described two horizontal segments wherein one section be connected with heat conduction base portion
Connecing, another section is connected with the second radiating fin.
In heat-pipe radiator of the present invention, described first heat-sink unit is two, and two described first heat radiations are single
Unit be arranged in parallel, and each described first heat-sink unit is connected with described second heat-sink unit by second heat pipe.
In heat-pipe radiator of the present invention, the first heat pipe in described first heat-sink unit is multiple, connects institute
The second heat pipe stating the first heat-sink unit and the second heat-sink unit is multiple.
Implement the heat-pipe radiator of the present invention, have the advantages that in the heat-pipe radiator of the present invention, by the
The partial heat of heat conduction base portion is guided to the second heat-sink unit being arranged at the air outlet of computer system by two heat pipes, by the
Two heat-sink units outwards dispel the heat, and optimize the radiator structure of computer-internal, are particularly suited for the meter with narrow and small chassis space
Calculation machine system.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the schematic diagram of the radiator structure of the 2U rack-mount server of prior art；
Fig. 2 is the schematic diagram of the preferred embodiment of the heat-pipe radiator of the present invention；
Fig. 3 is the schematic diagram of another angle of the preferred embodiment of the heat-pipe radiator of the present invention；
Fig. 4 is the front view of the preferred embodiment of the heat-pipe radiator of the present invention；
Fig. 5 is the top view of the preferred embodiment of the heat-pipe radiator of the present invention；
Fig. 6 is the application schematic diagram of the preferred embodiment of the heat-pipe radiator of the present invention.
Detailed description of the invention
In order to be more clearly understood from the technical characteristic of the present invention, purpose and effect, now comparison accompanying drawing describes in detail
The detailed description of the invention of the present invention.
As shown in Figures 2 to 6, for a preferred embodiment of the heat-pipe radiator of the present invention, it is a 2U rack
The radiator of server, this 2U rack-mount server uses double mainboard structure of stacking, and enclosure interior is narrow and small, uses tradition
Radiator be easily caused heat radiation the most smooth.In this heat-pipe radiator implemented, single including two the first heat radiations be arrangeding in parallel
Unit 100a, 100b, and second heat-sink unit 200, wherein on the first heat-sink unit 100a and the first mainboard 300a
The CPU310b laminating that CPU310a fits on setting, the first heat-sink unit 100b and the second mainboard 300b is arranged, and the first heat radiation is single
Unit 100a, 100b and the second heat-sink unit 200 are connected by second heat pipe 400a, 400b respectively.Due to the first heat-sink unit
The structure of 100a, 100b is identical, thus here illustrate as a example by the first heat-sink unit 100a the structure of the first heat-sink unit with
And how to be connected with the second heat-sink unit 200.
Referring to Fig. 2 to Fig. 6, in the present embodiment, the first heat-sink unit 100a includes heat conduction base portion the 110, first heat pipe
120, and multiple first radiating fin 130, heat conduction base portion 110 is made up of the metal that copper, aluminum or other heat conductivilitys are good, its
One side fits with CPU, and for receiving the heat produced when CPU runs, the another side of heat conduction base portion 110 is provided with the first heat radiation
Fin 130, the first radiating fin 130 can be to be integrally machined molding with heat conduction base portion 110, or use the mode inlayed to set
Putting on heat conduction base portion 110, the first end of the first heat pipe 120 is connected with heat conduction base portion 110, the second end and the first radiating fin
130 heat conduction connect, the first heat pipe 120 and the connected mode of heat conduction base portion 110 and the first radiating fin 130 and existing heat pipe
Radiator is identical, repeats no more.The partial heat of heat conduction base portion 110 is delivered to the first radiating fin 130 by the first heat pipe 120
On, the first radiating fin 130 outwards disperse.
At the air outlet of the cabinet that the second heat-sink unit 200 is arranged on rack server, the second heat-sink unit includes fan
210, and it is arranged on multiple second radiating fins 220 of fan 210 air side, fan 210 and the second radiating fin 220 to appoint
What conventional applicable combination combines.Second heat pipe 400a is by the first heat-sink unit 100a and the second heat-sink unit
200 couple together, and first end of the second heat pipe 400a and the heat conduction base portion 110 of the first heat-sink unit 100a are connected, the second heat
Second end of pipe 400a and the second radiator fins 220 heat conduction of the second heat-sink unit 200 connect, the second heat pipe 400a and heat conduction
The connected mode of base portion 110 and the second radiating fin 220 is identical with existing heat-pipe radiator, repeats no more.Second heat pipe
The partial heat of heat conduction base portion 110 is delivered on the second radiating fin 220 by 400a, the second radiating fin 220 outwards disperse.
Owing to the first heat-sink unit 100a need not arrange fan, and partial heat by the second heat-sink unit 200 to external diffusion,
So the volume of the first heat-sink unit 100a can be reduced, with the chassis space that adaline rack server is narrow and small.In order to make
One heat-sink unit 100a has more preferable radiating effect, and first radiating fin 130 of the first heat-sink unit 100a is positioned at fan 210
Inlet side, multiple first radiating fins 130 be arranged in parallel along the air intake direction of fan 210, when fan 210 works, air by
Inlet side suction fan 210, the air around the first radiating fin 130 is sucked away, and takes away the heat of the first radiating fin 130,
To strengthen the radiating effect of the first heat-sink unit 100a.First radiating fin 130 is stairstepping in the present embodiment, the first heat radiation
The height of the side of the close fan 210 of fin 130 is more than the height away from fan side, and this is due near fan 210
Local speed air flow is bigger, it is easier to heat radiation, so can save material, thus cost-effective, in reality, and the first heat radiation
Fin 130 can also be rectangle.In order to make the first heat pipe 120 preferably play the effect of heat transfer, in the present embodiment first
Heat pipe 120 includes two horizontal segments 121,122 (the first end of the i.e. first heat pipe and the second end) and connects two horizontal segments 121,122
Tilting section 123, tilting section 123 tilts certain angle with horizontal direction, wherein a section 121 and the heat conduction base portion in two horizontal segments
110 are connected, and another section 122 is connected with the first radiating fin 130, horizontal segment 122 and the higher portion of the first radiating fin 130
Split-phase connects, and the heating agent in heat pipe 120 by thermal evaporation, condenses in horizontal segment 121 in horizontal segment 122, and tilting section 123 is favourable
It is back to horizontal segment 121 by horizontal segment 122 in coolant.Based on same consideration, the second heat pipe 400a include two horizontal segments 401,
402 (the first end of the i.e. second heat pipe and the second ends) and the tilting section 403 of connection two horizontal segments 401,402, tilting section 403 and water
Square to tilt certain angle.
It is pointed out that the first end of the first heat pipe 120, and first end of the second heat pipe 400a and heat conduction base portion
The form of the connection of 110 has two kinds, a kind of form as shown in this embodiment, the first end of the first heat pipe 120 and the second heat
First end of pipe 400a all contacts, specifically at the first radiating fin with heat conduction base portion 110 and the first radiating fin 130
130 with the groove with heat pipe form fit respectively milling out similar semicircle on heat conduction base portion 110, by the first heat pipe 120 and the second heat
Pipe 400a puts into corresponding groove；Another form, then be the first end and the second heat pipe 400a of the first heat pipe 120
The first end be only connected with heat conduction base portion 100, concrete mode is perforate on heat conduction base portion 110, is then inserted by heat pipe
In the hole opened, or heat conduction base portion 110 is divided on two faces that upper and lower two halves, upper and lower two halves contact and each has half
Circular groove, heat pipe is clipped in therebetween by upper and lower two halves.From the standpoint of processing complexity and heat-conducting effect, preferably originally
The form used in enforcement.
The structure of the first heat-sink unit 100b is identical with the structure of the first heat-sink unit 100a, repeats no more.Fig. 6 shows
The heat-pipe radiator of the present invention applies the schematic diagram on 2U rack-mount server.Arrow in Fig. 2 to Fig. 6 is air flowing side
To.
It is to be appreciated that above-described embodiment is only schematically, the heat-pipe radiator of the present invention is not limited to use
Make the radiator of 2U rack-mount server, it is also possible to for the rack-mount server of 1U, the computer system of compact and its
His computer system.The number of the first heat-sink unit is not limited to two, can be arranged as required to into one or more.This
Outward, the number of the first heat pipe of the first heat-sink unit is also not limited to one, can be multiple, connects the first heat-sink unit and
Second heat pipe of two heat-sink units can also be multiple.
In the heat-pipe radiator of the present invention, by the second heat pipe, the partial heat of heat conduction base portion is guided to being arranged on meter
The second heat-sink unit at the air outlet of calculation machine system, is outwards dispelled the heat by the second heat-sink unit, optimizes dissipating of computer-internal
Heat structure, is particularly suited for the computer system with narrow and small chassis space.
Above in conjunction with accompanying drawing, embodiments of the invention are described, but the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned detailed description of the invention is only schematic rather than restrictive, those of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, it may also be made that a lot
Form, within these belong to the protection of the present invention.
Claims (6)
1. a heat-pipe radiator, for the heat radiation of computer system, it is characterised in that described radiator is used for using stacking master
The rack-mount server of plate structure, described radiator includes the second heat-sink unit and at least two is parallel and stacking arrange first
Heat-sink unit, wherein:
Described first heat-sink unit includes heat conduction base portion, the first heat pipe and multiple first radiating fin, and described heat conduction base portion is used
In receiving from the heat of heater element, described first radiating fin is arranged on heat conduction base portion, described first heat pipe one end with
Described heat conduction base portion connects, and the other end is connected with described first radiating fin heat conduction；
Described second heat-sink unit is arranged at the air outlet of described computer system, and described second heat-sink unit includes fan,
And it is arranged on multiple second radiating fins of fan air side；
Described heat-pipe radiator also includes the second heat pipe connecting described first heat-sink unit and the second heat-sink unit, described second
First end of heat pipe is connected with described heat conduction base portion, and the second end is connected with described second radiating fin heat conduction；
Described first radiating fin is positioned at the inlet side of described fan, and multiple described first radiating fins are along the air intake of described fan
Direction be arranged in parallel, and described first radiating fin is stairstepping, the height of the side of the close fan of described first radiating fin
More than the height away from fan side.
Heat-pipe radiator the most according to claim 1, it is characterised in that described first heat pipe includes two horizontal segments and connection
The tilting section of two horizontal segments, described tilting section and horizontal direction tilt certain angle, in described two horizontal segments wherein one section with
Heat conduction base portion is connected, and another section is connected with the first radiating fin.
Heat-pipe radiator the most according to claim 2, it is characterised in that another section described is higher with the first radiating fin
Part is connected.
Heat-pipe radiator the most according to claim 1, it is characterised in that described second heat pipe includes two horizontal segments and connection
The tilting section of two horizontal segments, described tilting section and horizontal direction tilt certain angle, in described two horizontal segments wherein one section with
Heat conduction base portion is connected, and another section is connected with the second radiating fin.
5. according to the heat-pipe radiator described in any one of Claims 1-4, it is characterised in that described first heat-sink unit is two
Individual, two described first heat-sink units be arranged in parallel, and each described first heat-sink unit is by second heat pipe and described the
Two heat-sink units are connected.
6. according to the heat-pipe radiator described in any one of Claims 1-4, it is characterised in that in described first heat-sink unit
First heat pipe is multiple, and the second heat pipe connecting described first heat-sink unit and the second heat-sink unit is multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010296624.4A CN102436295B (en) | 2010-09-29 | A kind of heat-pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010296624.4A CN102436295B (en) | 2010-09-29 | A kind of heat-pipe radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102436295A CN102436295A (en) | 2012-05-02 |
| CN102436295B true CN102436295B (en) | 2016-12-14 |
Family
ID=
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2786691Y (en) * | 2005-03-28 | 2006-06-07 | 福华电子股份有限公司 | Liquid-cooling radiator equipment improved structure |
| CN2930228Y (en) * | 2006-08-01 | 2007-08-01 | 北京市九州风神工贸有限责任公司 | Heat sink |
| CN200962704Y (en) * | 2006-07-21 | 2007-10-17 | 北京市九州风神工贸有限责任公司 | A heat radiation device of the thermal pipe |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2786691Y (en) * | 2005-03-28 | 2006-06-07 | 福华电子股份有限公司 | Liquid-cooling radiator equipment improved structure |
| CN200962704Y (en) * | 2006-07-21 | 2007-10-17 | 北京市九州风神工贸有限责任公司 | A heat radiation device of the thermal pipe |
| CN2930228Y (en) * | 2006-08-01 | 2007-08-01 | 北京市九州风神工贸有限责任公司 | Heat sink |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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Effective date of registration: 20230630 Address after: 518000 1701, Yanxiang Science and Technology Building, No. 31, High-tech Middle 4th Road, Maling Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd. Address before: 518057 Guangdong city of Shenzhen province Nanshan District high in the four EVOC Technology Building No. 31 Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |