CN102436295A - Heat tube heat radiator - Google Patents
Heat tube heat radiator Download PDFInfo
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- CN102436295A CN102436295A CN2010102966244A CN201010296624A CN102436295A CN 102436295 A CN102436295 A CN 102436295A CN 2010102966244 A CN2010102966244 A CN 2010102966244A CN 201010296624 A CN201010296624 A CN 201010296624A CN 102436295 A CN102436295 A CN 102436295A
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Abstract
The invention relates to a heat tube heat radiator which is used for heat radiation of a computer system. The heat tube heat radiator comprises a first heat radiating unit, a second heat radiating unit and a second heat tube for connecting the first heat radiating unit and the second heat radiating unit, wherein the first heat radiating unit comprises a heat conducting base part, a first heat tube and a plurality of first heat radiating fins; the first heat radiating fins are arranged on the heat conducting base part; one end of the first heat tube is connected with the heat conducting base part; the other end of the first heat tube is in heat-conducting connection with the first heat radiating fins; the second heat radiating unit comprises a fan and a plurality of second heat radiating fins arranged at the air output side of the fan; the first end of the second heat tube is connected with the heat conducting base part; and the second end of the second heat tube is in heat-conducting connection with the second heat radiating fins. In the heat tube heat radiator disclosed by the invention, part of heat of the heat conducting base part is introduced to the second heat radiating unit arranged at an air outlet of the computer system by the second heat tube and is dissipated outwards by the second heat radiating unit. According to the heat tube heat radiator, a heat radiating structure inside the computer is optimized; and the heat tube heat radiator is especially suitable for the computer systems with narrow case spaces.
Description
Technical field
The present invention relates to the heat abstractor of electronic product, more particularly, relate to a kind of heat-pipe radiator.
Background technology
In the existing computer system, the power of central processing unit (CPU) is increasing, in the process of its operation, produces a large amount of heat, and in order to solve the heat dissipation problem of CPU, heat-pipe radiator is widely used.Existing heat-pipe radiator generally is made up of some radiating fins, heat pipe and pedestal; Be respectively equipped with perforation on the radiating fin, utilize this perforation with each radiating fin with the superimposed end that is located in heat pipe of a determining deviation, the other end of heat pipe is connected with pedestal; Pedestal is sticked on the surface of CPU; Be used for absorbing the heat that the CPU operational process produces, and the heat transferred that absorbs outwards left to heat radiator, also can fan be set usually on the top of radiating fin through heat pipe; Strengthen the convection current of radiating fin ambient air by fan, strengthen radiating effect.
The volume of above-mentioned heat-pipe radiator is generally bigger, is applicable to tower case, for rack-mount server; The space of its cabinet is limited; Generally be the side that fan is arranged on radiating fin, adopt the mode of inhaling or blowing to increase the radiating fin ambient air and flow, to improve the efficient of heat radiation.Referring to Fig. 1 in the 2U of two mainboard frameworks rack-mount server; Two 1U mainboard storehouses together; Heating radiator also keeps the radiating mode of 1U separately, conducts the heat to alone on each heating radiator 1,2, through system fan 3 torrid zone of CPU and other parts is gone out system again.Such radiating mode radiating effect is good inadequately, can make that the temperature of internal system is higher because the heat of CPU in time is not discharged to outside the system, influences CPU and reaches the operate as normal of element on every side.
Summary of the invention
The technical matters that the present invention will solve is, the not good defective of above-mentioned radiating effect to the heating radiator of prior art provides a kind of compact conformation, and the heat-pipe radiator of good heat dissipation effect is particularly useful for the heat radiation of rack-mount server.
The technical solution adopted for the present invention to solve the technical problems is: constructs a kind of heat-pipe radiator, is used for the heat radiation of computer system, comprise first heat-sink unit and second heat-sink unit, wherein:
Said first heat-sink unit comprises heat conduction base portion, first heat pipe and a plurality of first radiating fin; Said heat conduction base portion is used to receive the heat from heater element; Said first radiating fin is arranged on the heat conduction base portion; Said first heat pipe, one end is connected with said heat conduction base portion, and the other end is connected with the said first radiating fin heat conduction;
Said second heat-sink unit is arranged on the air outlet place of said computer system, and said second heat-sink unit comprises fan, and a plurality of second radiating fins that are arranged on the fan air side;
Said heat-pipe radiator also comprises second heat pipe that connects said first heat-sink unit and second heat-sink unit, and first end of said second heat pipe is connected with said heat conduction base portion, and second end is connected with the said second radiating fin heat conduction.
In heat-pipe radiator of the present invention, said first radiating fin is positioned at the inlet side of said fan.
In heat-pipe radiator of the present invention, a plurality of said first radiating fins laterally arrange along the air intake direction of said fan.
In heat-pipe radiator of the present invention, said first radiating fin is a rectangle.
In heat-pipe radiator of the present invention, said first radiating fin is a stepped appearance, said first radiating fin near the height of a side of fan greater than height away from fan one side.
In heat-pipe radiator of the present invention; Said first heat pipe comprises two horizontal segments and the tilting section that is connected two horizontal segments; Said tilting section and inclined certain angle, in said two horizontal segments wherein one section be connected with the heat conduction base portion, another section is connected with first radiating fin.
In heat-pipe radiator of the present invention, said another section is connected with the higher part of first radiating fin.
In heat-pipe radiator of the present invention; Said second heat pipe comprises two horizontal segments and the tilting section that is connected two horizontal segments; Said tilting section and inclined certain angle, in said two horizontal segments wherein one section be connected with the heat conduction base portion, another section is connected with second radiating fin.
In heat-pipe radiator of the present invention, said first heat-sink unit is two, and two said first heat-sink units laterally arrange, and each said first heat-sink unit is connected with said second heat-sink unit through one second heat pipe.
In heat-pipe radiator of the present invention, first heat pipe in said first heat-sink unit is a plurality of, and second heat pipe that connects said first heat-sink unit and second heat-sink unit is a plurality of.
The heat-pipe radiator of embodiment of the present invention; Has following beneficial effect: in heat-pipe radiator of the present invention; The part heat of heat conduction base portion is guided to second heat-sink unit at the air outlet place that is arranged on computer system through second heat pipe; Outwards dispel the heat by second heat-sink unit, optimized the radiator structure of computer-internal, be particularly useful for having the computer system of narrow and small chassis space.
Description of drawings
To combine accompanying drawing and embodiment that the present invention is described further below, in the accompanying drawing:
Fig. 1 is the synoptic diagram of radiator structure of the 2U rack-mount server of prior art;
Fig. 2 is the synoptic diagram of the preferred embodiment of heat-pipe radiator of the present invention;
Fig. 3 is the synoptic diagram of another angle of the preferred embodiment of heat-pipe radiator of the present invention;
Fig. 4 is the front view of the preferred embodiment of heat-pipe radiator of the present invention;
Fig. 5 is the vertical view of the preferred embodiment of heat-pipe radiator of the present invention;
Fig. 6 is the application synoptic diagram of the preferred embodiment of heat-pipe radiator of the present invention.
Embodiment
To understand in order technical characterictic of the present invention, purpose and effect being had more clearly, to contrast accompanying drawing at present and specify embodiment of the present invention.
Extremely shown in Figure 6 like Fig. 2; Be a preferred embodiment of heat-pipe radiator of the present invention, it is the heating radiator of a 2U rack-mount server, and this 2U rack-mount server adopts range upon range of two mainboard structure; The cabinet inside space is narrow and small, adopts traditional heating radiator to cause heat radiation not smooth easily.In the heat-pipe radiator of this enforcement; Comprise two the first heat- sink unit 100a, 100b that laterally arrange; With one second heat-sink unit 200; Wherein the CPU310a on the first heat-sink unit 100a and the first mainboard 300a fits and is provided with, and the CPU310b on the first heat-sink unit 100b and the second mainboard 300b fits and is provided with, and the first heat- sink unit 100a, 100b are connected through the second heat pipe 400a, 400b respectively with second heat-sink unit 200.Because the structure of the first heat- sink unit 100a, 100b is identical, thus here with the first heat-sink unit 100a be example structure that first heat-sink unit is described with and how to be connected with second heat-sink unit 200.
Referring to Fig. 2 to Fig. 6, in the present embodiment, the first heat-sink unit 100a comprises heat conduction base portion 110, first heat pipe 120; And a plurality of first radiating fins 130, heat conduction base portion 110 is processed by copper, aluminium or other heat conductivility good metal, and its one side fits with CPU; The heat that produces when being used to receive the CPU operation; The another side of heat conduction base portion 110 is provided with first radiating fin, 130, the first radiating fins 130, or adopts the mode of inlaying to be arranged on the heat conduction base portion 110; First end of first heat pipe 120 is connected with heat conduction base portion 110; Second end is connected with 130 heat conduction of first radiating fin, and first heat pipe 120 is identical with existing heat-pipe radiator with the connected mode of the heat conduction base portion 110 and first radiating fin 130, repeats no more.First heat pipe 120 is delivered to the part heat of heat conduction base portion 110 on first radiating fin 130, is outwards left by first radiating fin 130.
Second heat-sink unit 200 is arranged on the air outlet place of the cabinet of rack server; Second heat-sink unit comprises fan 210; And a plurality of second radiating fins 220 that are arranged on fan 210 air sides, the fan 210 and second radiating fin 220 combine with the suitable combination of any routine.The second heat pipe 400a couples together the first heat-sink unit 100a and second heat-sink unit 200; First end of the second heat pipe 400a is connected with the heat conduction base portion 110 of the first heat-sink unit 100a; Second end of the second heat pipe 400a is connected with second radiator fins, 220 heat conduction of second heat-sink unit 200; The second heat pipe 400a is identical with existing heat-pipe radiator with the connected mode of the heat conduction base portion 110 and second radiating fin 220, repeats no more.The second heat pipe 400a is delivered to the part heat of heat conduction base portion 110 on second radiating fin 220, is outwards left by second radiating fin 220.
Because the first heat-sink unit 100a need not be provided with fan, and the part heat by second heat-sink unit 200 to external diffusion, so can reduce the volume of the first heat-sink unit 100a, to adapt to the narrow and small chassis space of rack-mount server.In order to make the first heat-sink unit 100a have better radiating effect; First radiating fin 130 of the first heat-sink unit 100a is positioned at the inlet side of fan 210, and a plurality of first radiating fins 130 laterally arrange along the air intake direction of fan 210, during fan 210 work; Air is by inlet side suction fan 210; First radiating fin, 130 ambient airs are siphoned away, and take away the heat of first radiating fin 130, to strengthen the radiating effect of the first heat-sink unit 100a.First radiating fin 130 is stepped appearance in the present embodiment; First radiating fin 130 near the height of a side of fan 210 greater than height away from fan one side, this is because bigger near the local speed air flow of fan 210, heat radiation more easily; Can save material like this; Thereby the saving cost, in the reality, first radiating fin 130 also can be a rectangle.In order to make the better effect of performance heat transfer of first heat pipe 120; First heat pipe 120 comprises two horizontal segments 121,122 (i.e. first end of first heat pipe and second end) and the tilting section 123 that is connected two horizontal segments 121,122 in the present embodiment; Tilting section 123 and inclined certain angle, wherein being connected with heat conduction base portion 110 for one period 121 in two horizontal segments, another section 122 is connected with first radiating fin 130; Horizontal segment 122 is connected with first radiating fin, 130 higher parts; Heating agent in the heat pipe 120 receives thermal evaporation in horizontal segment 121, condensation in horizontal segment 122, and tilting section 123 helps refrigerant and is back to horizontal segment 121 by horizontal segment 122.Based on same consideration, the second heat pipe 400a comprises two horizontal segments 401,402 (i.e. first end of second heat pipe and second end) and the tilting section 403 that is connected two horizontal segments 401,402, tilting section 403 and inclined certain angle.
It is to be noted; First end of first heat pipe 120; And first end of the second heat pipe 400a has two kinds with the form that is connected of heat conduction base portion 110; A kind of form shown in present embodiment; First end of first end of first heat pipe 120 and the second heat pipe 400a all contacts with the heat conduction base portion 110 and first radiating fin 130, specifically is on first radiating fin 130 and heat conduction base portion 110, respectively to mill out similar semicircle and the groove heat pipe form fit, first heat pipe 120 and the second heat pipe 400a is put into corresponding groove get final product; A kind of in addition form; Then be that first end of first heat pipe 120 and first end of the second heat pipe 400a only are connected with heat conduction base portion 100; Concrete mode is perforate on heat conduction base portion 110, then heat pipe is inserted in the hole of being opened, or heat conduction base portion 110 is divided into two halves up and down; Have semicircular groove separately on contacted two faces of two halves up and down, two halves are clipped in heat pipe between the two up and down.Consider the form that preferably adopts in this enforcement from processing complexity and heat-conducting effect aspect.
The structure of the first heat-sink unit 100b is identical with the structure of the first heat-sink unit 100a, repeats no more.Fig. 6 shows heat-pipe radiator of the present invention and is applied in the synoptic diagram on the 2U rack-mount server.Arrow among Fig. 2 to Fig. 6 is an air-flow direction.
It will be appreciated that the foregoing description only is schematically, heat-pipe radiator of the present invention is not limited to the heating radiator as the 2U rack-mount server, also can be used for the rack-mount server of 1U, computer system and other computer systems of compact.The number of first heat-sink unit is not limited to two, can be arranged to one or more as required.In addition, the number of first heat pipe of first heat-sink unit also is not limited to one, can be a plurality of, and second heat pipe that connects first heat-sink unit and second heat-sink unit also can be a plurality of.
In heat-pipe radiator of the present invention; The part heat of heat conduction base portion is guided to second heat-sink unit at the air outlet place that is arranged on computer system through second heat pipe; Outwards dispel the heat by second heat-sink unit; Optimize the radiator structure of computer-internal, be particularly useful for having the computer system of narrow and small chassis space.
Combine accompanying drawing that embodiments of the invention are described above; But the present invention is not limited to above-mentioned embodiment, and above-mentioned embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under enlightenment of the present invention; Not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (10)
1. a heat-pipe radiator is used for the heat radiation of computer system, it is characterized in that, comprises first heat-sink unit and second heat-sink unit, wherein:
Said first heat-sink unit comprises heat conduction base portion, first heat pipe and a plurality of first radiating fin; Said heat conduction base portion is used to receive the heat from heater element; Said first radiating fin is arranged on the heat conduction base portion; Said first heat pipe, one end is connected with said heat conduction base portion, and the other end is connected with the said first radiating fin heat conduction;
Said second heat-sink unit is arranged on the air outlet place of said computer system, and said second heat-sink unit comprises fan, and a plurality of second radiating fins that are arranged on the fan air side;
Said heat-pipe radiator also comprises second heat pipe that connects said first heat-sink unit and second heat-sink unit, and first end of said second heat pipe is connected with said heat conduction base portion, and second end is connected with the said second radiating fin heat conduction.
2. heat-pipe radiator according to claim 1 is characterized in that said first radiating fin is positioned at the inlet side of said fan.
3. heat-pipe radiator according to claim 2 is characterized in that, a plurality of said first radiating fins laterally arrange along the air intake direction of said fan.
4. heat-pipe radiator according to claim 3 is characterized in that, said first radiating fin is a rectangle.
5. heat-pipe radiator according to claim 3 is characterized in that, said first radiating fin is a stepped appearance, said first radiating fin near the height of a side of fan greater than height away from fan one side.
6. heat-pipe radiator according to claim 5; It is characterized in that; Said first heat pipe comprises two horizontal segments and the tilting section that is connected two horizontal segments; Said tilting section and inclined certain angle, in said two horizontal segments wherein one section be connected with the heat conduction base portion, another section is connected with first radiating fin.
7. heat-pipe radiator according to claim 5 is characterized in that, said another section is connected with the higher part of first radiating fin.
8. heat-pipe radiator according to claim 3; It is characterized in that; Said second heat pipe comprises two horizontal segments and the tilting section that is connected two horizontal segments; Said tilting section and inclined certain angle, in said two horizontal segments wherein one section be connected with the heat conduction base portion, another section is connected with second radiating fin.
9. according to each described heat-pipe radiator of claim 1 to 8; It is characterized in that; Said first heat-sink unit is two, and two said first heat-sink units laterally arrange, and each said first heat-sink unit is connected with said second heat-sink unit through one second heat pipe.
10. according to each described heat-pipe radiator of claim 1 to 8, it is characterized in that first heat pipe in said first heat-sink unit is a plurality of, second heat pipe that connects said first heat-sink unit and second heat-sink unit is a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010296624.4A CN102436295B (en) | 2010-09-29 | A kind of heat-pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010296624.4A CN102436295B (en) | 2010-09-29 | A kind of heat-pipe radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102436295A true CN102436295A (en) | 2012-05-02 |
| CN102436295B CN102436295B (en) | 2016-12-14 |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547118A (en) * | 2012-07-10 | 2014-01-29 | 三星电机株式会社 | Multi-stage heat sink, cooling system with the same and method for controlling the same |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
| CN105376994A (en) * | 2015-11-16 | 2016-03-02 | 珠海格力电器股份有限公司 | Heat abstractor and have its refrigeration electrical apparatus |
| CN107438349A (en) * | 2017-07-07 | 2017-12-05 | 西安交通大学 | A kind of natural heat dissipation device using stack effect |
| CN107613732A (en) * | 2017-09-28 | 2018-01-19 | 深圳兴奇宏科技有限公司 | Heat-sinking structure of chassis |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能系统科技有限公司 | A kind of operation board radiator structure |
| CN109062374A (en) * | 2018-08-16 | 2018-12-21 | 郑州云海信息技术有限公司 | Server |
| TWI649530B (en) * | 2015-07-14 | 2019-02-01 | 日商古河電氣工業股份有限公司 | Cooling device |
| TWI656828B (en) * | 2017-03-31 | 2019-04-11 | 日商古河電氣工業股份有限公司 | Heat sink |
| TWI673943B (en) * | 2018-08-29 | 2019-10-01 | Micro-Star Int'l Co.,Ltd. | Heat dissipating device |
| CN111381645A (en) * | 2018-12-29 | 2020-07-07 | 北京图森智途科技有限公司 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
| CN112074147A (en) * | 2020-08-06 | 2020-12-11 | 北京比特大陆科技有限公司 | Radiator assembly, power calculating assembly and server |
| WO2021007727A1 (en) * | 2019-07-12 | 2021-01-21 | 华为技术有限公司 | Vehicle-mounted computing device in smart automobile, and smart automobile |
| US11867467B2 (en) | 2015-07-14 | 2024-01-09 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
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| CN2786691Y (en) * | 2005-03-28 | 2006-06-07 | 福华电子股份有限公司 | Liquid-cooling radiator equipment improved structure |
| CN101098605A (en) * | 2006-06-30 | 2008-01-02 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
| CN200962704Y (en) * | 2006-07-21 | 2007-10-17 | 北京市九州风神工贸有限责任公司 | A heat radiation device of the thermal pipe |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547118A (en) * | 2012-07-10 | 2014-01-29 | 三星电机株式会社 | Multi-stage heat sink, cooling system with the same and method for controlling the same |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
| US11150028B2 (en) | 2015-07-14 | 2021-10-19 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups and parallel heatpipes |
| TWI649530B (en) * | 2015-07-14 | 2019-02-01 | 日商古河電氣工業股份有限公司 | Cooling device |
| US11867467B2 (en) | 2015-07-14 | 2024-01-09 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
| US10571199B2 (en) | 2015-07-14 | 2020-02-25 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
| CN105376994A (en) * | 2015-11-16 | 2016-03-02 | 珠海格力电器股份有限公司 | Heat abstractor and have its refrigeration electrical apparatus |
| TWI656828B (en) * | 2017-03-31 | 2019-04-11 | 日商古河電氣工業股份有限公司 | Heat sink |
| CN107438349A (en) * | 2017-07-07 | 2017-12-05 | 西安交通大学 | A kind of natural heat dissipation device using stack effect |
| CN107438349B (en) * | 2017-07-07 | 2020-01-14 | 西安交通大学 | Natural heat dissipation device utilizing chimney effect |
| CN107613732A (en) * | 2017-09-28 | 2018-01-19 | 深圳兴奇宏科技有限公司 | Heat-sinking structure of chassis |
| CN107613732B (en) * | 2017-09-28 | 2024-06-07 | 深圳兴奇宏科技有限公司 | Heat dissipation structure of chassis |
| CN108594975A (en) * | 2018-07-12 | 2018-09-28 | 常州天能博智能系统科技有限公司 | A kind of operation board radiator structure |
| CN108594975B (en) * | 2018-07-12 | 2023-11-21 | 常州天能博智能系统科技有限公司 | Operation board card heat radiation structure |
| CN109062374B (en) * | 2018-08-16 | 2021-11-09 | 郑州云海信息技术有限公司 | Server |
| CN109062374A (en) * | 2018-08-16 | 2018-12-21 | 郑州云海信息技术有限公司 | Server |
| TWI673943B (en) * | 2018-08-29 | 2019-10-01 | Micro-Star Int'l Co.,Ltd. | Heat dissipating device |
| CN111381645A (en) * | 2018-12-29 | 2020-07-07 | 北京图森智途科技有限公司 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
| WO2021007727A1 (en) * | 2019-07-12 | 2021-01-21 | 华为技术有限公司 | Vehicle-mounted computing device in smart automobile, and smart automobile |
| US11073877B2 (en) | 2019-07-12 | 2021-07-27 | Huawei Technologies Co., Ltd. | In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle |
| US11726534B2 (en) | 2019-07-12 | 2023-08-15 | Huawei Technologies Co., Ltd. | In-vehicle computing apparatus in intelligent vehicle and intelligent vehicle |
| CN112074147A (en) * | 2020-08-06 | 2020-12-11 | 北京比特大陆科技有限公司 | Radiator assembly, power calculating assembly and server |
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Effective date of registration: 20230630 Address after: 518000 1701, Yanxiang Science and Technology Building, No. 31, High-tech Middle 4th Road, Maling Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Yanxiang Smart Technology Co.,Ltd. Address before: 518057 Guangdong city of Shenzhen province Nanshan District high in the four EVOC Technology Building No. 31 Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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