CN102087144A - Foundation field bus (FF) H1 temperature measuring device - Google Patents
Foundation field bus (FF) H1 temperature measuring device Download PDFInfo
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- CN102087144A CN102087144A CN2009102414763A CN200910241476A CN102087144A CN 102087144 A CN102087144 A CN 102087144A CN 2009102414763 A CN2009102414763 A CN 2009102414763A CN 200910241476 A CN200910241476 A CN 200910241476A CN 102087144 A CN102087144 A CN 102087144A
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Abstract
The invention provides a foundation fieldbus (FF) H1 temperature measuring device. The device comprises a temperature sensor, a sensor signal regulating unit, an analog-to-digital conversion unit, a microprocessor, a field bus communication controller and a media connecting unit, wherein the temperature sensor collects temperature of point testing equipment; the sensor signal regulating unit performs signal amplification and filter processing on the temperature collected by the temperature sensor, and transmits the processed signal to the analog-to-digital conversion unit; the analog-to-digital conversion unit performs analog-to-digital conversion on the signal transmitted by the sensor signal regulating unit, and transmits the converted digital signal to the microprocessor; the microprocessor performs linear processing and temperature compensation on the digital signal, and transmits the processed signal to the field bus communication controller; the field bus communication controller converts the signal transmitted by the microprocessor into FF H1 data link layer data, and transmits the data to the media connecting unit; and the media connecting unit converts the data link layer data into physical layer data, and transmits the physical layer data to the FF H1. The device performs transmission by adopting the digital signal, and has strong interference resistance, so the measured temperature is more accurate.
Description
Technical field
The present invention relates to the field bus technique field, particularly a kind of FF H1 fieldbus temperature measuring equipment.
Background technology
Foundation fieldbus (FF, FOUNDATION Fieldbus) is a kind of digital, transmitted in both directions, multi-point communication, supporting bus power supply, be used to connect the communication link of smart machine and automated system.The FF fieldbus can be regarded a kind of Local Area Network based on the scene as, is used to connect smart machines such as various instrument, valve positioner, and himself can provide controlling application program to whole network.
FF H1 fieldbus is the low speed bus that is specifically designed to process automation, and traffic rate is 31.25Kbps, and transmission signals adopts Manchester's cde, the supporting bus power supply, and essential safety is provided.The topological structure of FF H1 fieldbus can adopt bus-type, tree type and chrysanthemum chain, can be the mixed type topological structure at the same network segment.
Existing temperature transmitter adopts 4～20mA transmission technology, and each measuring point needs 2 cables at least, and distributed control system often has hundreds of, several thousand even up to ten thousand measuring points, and therefore, the number of cables that needs is surprising.Laying, check and safeguarding of cable needs cost great amount of manpower and material resources and financial resources, and the cost of cable itself is also quite high, even substantially exceeds the system equipment of pulpit.Secondly, what existing temperature transmitter adopted is 4～20mA simulating signal, because the simulating signal antijamming capability is relatively poor, therefore causes final data inaccurate.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of FF H1 fieldbus temperature measuring equipment, can reduce system cost, and measurement data is accurate simultaneously.
The embodiment of the invention provides a kind of FF H1 fieldbus temperature measuring equipment, comprising: temperature sensor, sensor signal conditioning unit, AD conversion unit, microprocessor, field bus communication controller and medium attachment unit;
Described temperature sensor, the temperature that is used to gather measuring point equipment;
Described sensor signal conditioning unit is used for that the temperature of described temperature sensor collection is carried out signal and amplifies and Filtering Processing, and the signal after handling is sent to described AD conversion unit;
Described AD conversion unit is used for the signal that described sensor signal conditioning unit sends is carried out analog to digital conversion, and the digital signal after the conversion is sent to described microprocessor;
Described microprocessor is used for described digital signal is carried out linear process and temperature compensation, and the signal after handling is sent to the field bus communication controller;
Described field bus communication controller, the conversion of signals that is used for that described microprocessor is sent are FFH1 fieldbus data link layer data, are sent to described medium attachment unit;
Described medium attachment unit is used for that described data in link layer is converted to physical layer data and is sent to FF H1 fieldbus.
Preferably, also be connected the Signal Spacing unit between described AD conversion unit and the described microprocessor;
Described Signal Spacing unit is used for the signal of described AD conversion unit and the signal of described microprocessor are isolated.
Preferably, also comprise the LCD unit that is connected with described microprocessor;
Conversion of signals after described microprocessor will be handled is that temperature value shows on described LCD unit.
Preferably, also comprise the SRAM that is connected with described microprocessor, be used for the data of storage microprocessor.
Preferably, it is 3.3V and 6V power supply that described medium attachment unit also is used for FF H1 fieldbus power source conversion, described 3.3V is described microprocessor and the power supply of field bus communication controller, and described 6V power supply is described Signal Spacing unit, AD conversion unit and the power supply of sensor signal conditioning unit.
Preferably, also comprise the power supply unit that is connected with described medium attachment unit;
Described power supply unit, being used for described 3.3V power source conversion is the 1.8V power supply, is the kernel power supply of described microprocessor;
Described power supply unit also is used for described 6V is converted to 5V and 3V power supply, is described AD conversion unit, sensor signal conditioning unit and isolated location power supply.
Preferably, described microprocessor carries RAM and Flash.
Preferably, described temperature sensor is thermal resistance or thermopair.
Preferably, when described temperature sensor was thermopair, described sensor signal conditioning unit also comprised cold junction compensation resistance.
Preferably, the digital signal after described AD conversion unit will be changed is sent to described microprocessor, specifically by Serial Peripheral Interface SPI digital signal is sent to described microprocessor.
Compared with prior art, the present invention has the following advantages:
FF H1 fieldbus temperature measuring equipment provided by the invention is a field bus type temperature monitoring module.Be that each measuring point needs 2 cables in the prior art, but now owing to adopt digital signal to transmit, microprocessor centralized control 32 instrument the most for a long time can be articulated on same the bus, can save the cable more than 90% like this, therefore can reduce the cost of total system.Because this device is that the temperature of temperature sensor collection is carried out transmitting after the analog to digital conversion, digital signal is more a lot of by force than the antijamming capability of simulating signal, and therefore the temperature of measuring is more accurate.
Description of drawings
Fig. 1 is FF H1 fieldbus temperature measuring equipment embodiment one structural drawing provided by the invention;
Fig. 2 is FF H1 fieldbus temperature measuring equipment embodiment two structural drawing provided by the invention;
Fig. 3 is FF H1 fieldbus temperature measuring equipment embodiment three structural drawing provided by the invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Referring to Fig. 1, this figure is FF H1 fieldbus temperature measuring equipment embodiment one structural drawing provided by the invention.
The FF H1 fieldbus temperature measuring equipment that the embodiment of the invention provides comprises: temperature sensor 101, sensor signal conditioning unit 102, AD conversion unit 103, microprocessor 104, field bus communication controller 105 and medium attachment unit 106.
Described temperature sensor 101, the temperature that is used to gather measuring point equipment.
Described temperature sensor 101 can adopt thermopair, also can adopt thermal resistance.
Described sensor signal conditioning unit 102 is used for that the temperature that described temperature sensor 101 is gathered is carried out signal and amplifies and Filtering Processing, and the signal after handling is sent to described AD conversion unit 103.
For example, when described temperature sensor 101 adopted thermal resistance RTD, described sensor signal conditioning unit 102 adopted low power consumption high-precision amplifier AD8541 and high-accuracy voltage source ADR127.
Wherein voltage source ADR127 produces the voltage reference of 1.25V, and to drive thermal resistance RTD, the voltage signal that thermal resistance RTD obtains enters AD conversion unit 103 through after the filtering to this voltage reference process amplifier AD8541 again with its constant current source that is transformed into 1.25mA.
When described temperature sensor 101 adopted thermopair, described sensor signal conditioning unit also comprised cold junction compensation resistance.
Described AD conversion unit 103 is used for the signal that described sensor signal conditioning unit 102 sends is carried out analog to digital conversion, and the digital signal after the conversion is sent to described microprocessor 104.
The AD conversion unit 103 that present embodiment provides can preferably adopt 24 high-precision adc AD7799, and its characteristics are as follows:
Resolution: 24bit
Sampling rate: 500SPS
Port number: 3
Input type: difference
Supply voltage minimum: 2.7V
Operating temperature range :-40 ℃ to+105 ℃
Interface: 3 line serials, SPI, Queued Serial Peripheral Interface (QSPI)
Switching time: 2000 μ s
Need to prove, described AD conversion unit 103 can adopt other chips of same performance, certainly, if can reaching same processing speed, the analog to digital converter that microprocessor carries to be connected outside analog to digital converter, the analog to digital converter that directly utilizes microprocessor to carry with precision.
Described microprocessor 104 is used for described digital signal is carried out linear process and temperature compensation, and the signal after handling is sent to field bus communication controller 105.
Microprocessor can adopt the ARM chip, can preferably adopt the ARM7TDMI-S microcontroller in the present embodiment.
16K byte static RAM (SRAM).
Flash program storage in the 256K chunk.
Outside 8,16 or 32 buses.
The Boot load module is implemented in programming (IAP) in wire system programming (ISP) and the online application in the sheet.
Embedded tracking macroelement (ETM) supports that run time version is carried out glitch-free high-speed real-time to be followed the tracks of.
2 32 bit timing devices, 6 road PWM outputs, real-time clock and house dogs.
A plurality of serial line interfaces comprise 2 UART interfaces, 1 High Speed I 2C interface (400kbit/s) and 2 SPI interfaces.
Can realize being to the maximum the CPU operating frequency of 60MHz by PLL in the sheet.
The vector interruptable controller, configurable priority and vector address.
Crystal oscillator frequency scope: 1～30MHz in the sheet.
2 low-power consumption modes: free time and power down.By external interrupt processor is waken up from power-down mode.
Be understandable that microprocessor can also adopt other cpu chips that can finish the object of the invention.
Described field bus communication controller 105, being used for the conversion of signals that described microprocessor 104 sends is FF H1 fieldbus data link layer data, is sent to described medium attachment unit 106.
In the present embodiment, the field bus communication controller 105 preferred FBC0409 manchester encoder/decoder chips that adopt.
FBC0409 follows the physical layer specification of IEC 61158-2 standard, and can cooperate with ARM series CPU very easily, is configured to the main equipment or the slave unit of FF H1 bus.Built-in chip type has manchester encoder/demoder, as long as external medium attachment unit 106 can constitute FF H1 field-bus interface.
FBC0409 design has Automatic Code polarity identification calibration function and receives automatic frame check, sends optional frame check functions (FCS), and 1mS, 1mS/32, byte timing device and matching destination address function, frame control word decoding function are provided, reduce the expense of handling at link layer CPU.In order to prevent that node from taking bus after for a long time, the timing supervision device is housed in the chip, " chat " function of control in order to finish transmission: close transmission when bus surpasses 512 byte times when transmitter takies.In order to improve network throughput, alleviate the processing burden of CPU, simultaneously also for ease of software programming, chip internal is integrated dma controller is respectively applied for the transmitting-receiving of field data and the matching addresses in the data link layer.Chip internal is integrated with the asynchronous single port SRAM of 4KByte, is used for track data and address table data are stored.
Described medium attachment unit 106 is used for that described data in link layer is converted to physical layer data and is sent to FF H1 fieldbus.
The signal flow of medium attachment unit 106 is to being two-way:
When receiving data next on the FF H1 bus, signal of communication from FF H1 main equipment is the AC signal of 0.75～1V, this signal is carried out filtering to medium attachment unit 106 and waveform transformation is handled, finally become the pulse digital signal of 3.3V, again this signal is passed to field bus communication controller 105 and received.
When FF H1 bus sends data, data from field bus communication controller 105 are the pulse digital signal of 3.3V, this signal is carried out filtering to medium attachment unit 106 and waveform transformation is handled, finally becoming the amplitude that is superimposed upon on the bus is the AC signal of 0.75～1V, is transferred to the main equipment on the FF H1 bus again.
FF H1 fieldbus temperature measuring equipment provided by the invention is a field bus type temperature monitoring module.Be that each measuring point needs 2 cables in the prior art, but now owing to adopt digital signal to transmit, microprocessor centralized control 32 instrument the most for a long time can be articulated on same the bus, can save the cable more than 90% like this, therefore can reduce the cost of total system.Because this device is that the temperature of temperature sensor collection is carried out transmitting after the analog to digital conversion, digital signal is more a lot of by force than the antijamming capability of simulating signal, and therefore the temperature of measuring is more accurate.
Referring to Fig. 2, this figure is FF H1 fieldbus temperature measuring equipment embodiment two structural drawing provided by the invention.
The FF H1 fieldbus temperature measuring equipment that present embodiment provides also comprises: the SRAM203 that be connected the Signal Spacing unit 201 between described AD conversion unit and the described microprocessor, the LCD unit 202 that is connected with described microprocessor, is connected with described microprocessor.
Described Signal Spacing unit 201 is used for the signal of described AD conversion unit 103 and the signal of described microprocessor 104 are isolated.
Conversion of signals after described microprocessor 104 will be handled is that temperature value shows on described LCD unit 202.
SRAM203 is used for the data of storage microprocessor.
Described microprocessor 104 carries RAM and Flash.
Need to prove that the digital signal after described AD conversion unit 103 will be changed is sent to described microprocessor 104, specifically by Serial Peripheral Interface SPI digital signal is sent to described microprocessor 104.
The FF H1 fieldbus temperature measuring equipment that present embodiment provides comprises the LCD unit, can show the current temperature that monitors intuitively, in addition for simulating signal and digital signal are isolated, avoid producing and disturb, between AD conversion unit 103 and microprocessor 104, be provided with Signal Spacing unit 203.The digital signal that can guarantee microprocessor 104 receptions like this is more accurate.
Referring to Fig. 3, this figure is FF H1 fieldbus temperature measuring equipment embodiment three structural drawing provided by the invention.
It is 3.3V and 6V power supply that described medium attachment unit 106 also is used for FF H1 fieldbus power source conversion, described 3.3V is described microprocessor and the power supply of field bus communication controller, and described 6V power supply is described Signal Spacing unit, AD conversion unit and the power supply of sensor signal conditioning unit.
The FF H1 fieldbus temperature measuring equipment that present embodiment provides also comprises the power supply unit 301 that is connected with described medium attachment unit 106.
Described power supply unit 301, being used for described 3.3V power source conversion is the 1.8V power supply, is the kernel power supply of described microprocessor 104.
Described power supply unit 301 also is used for described 6V is converted to 5V and 3V power supply, is described AD conversion unit 103, sensor signal conditioning unit 102 and isolated location 201 power supplies.
The FF H1 fieldbus temperature measuring equipment that present embodiment provides directly comes power taking from FF H1 fieldbus, for the entire measuring device power supply, can save other power-supply device like this, and the structure of simplified apparatus reduces cost.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction.Though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention.Any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the method and the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (10)
1. a FF H1 fieldbus temperature measuring equipment is characterized in that, comprising: temperature sensor, sensor signal conditioning unit, AD conversion unit, microprocessor, field bus communication controller and medium attachment unit;
Described temperature sensor, the temperature that is used to gather measuring point equipment;
Described sensor signal conditioning unit is used for that the temperature of described temperature sensor collection is carried out signal and amplifies and Filtering Processing, and the signal after handling is sent to described AD conversion unit;
Described AD conversion unit is used for the signal that described sensor signal conditioning unit sends is carried out analog to digital conversion, and the digital signal after the conversion is sent to described microprocessor;
Described microprocessor is used for described digital signal is carried out linear process and temperature compensation, and the signal after handling is sent to the field bus communication controller;
Described field bus communication controller, the conversion of signals that is used for that described microprocessor is sent are FFH1 fieldbus data link layer data, are sent to described medium attachment unit;
Described medium attachment unit is used for that described data in link layer is converted to physical layer data and is sent to FF H1 fieldbus.
2. FF H1 fieldbus temperature measuring equipment according to claim 1 is characterized in that, also is connected the Signal Spacing unit between described AD conversion unit and the described microprocessor;
Described Signal Spacing unit is used for the signal of described AD conversion unit and the signal of described microprocessor are isolated.
3. FF H1 fieldbus temperature measuring equipment according to claim 2 is characterized in that, also comprises the LCD unit that is connected with described microprocessor;
Conversion of signals after described microprocessor will be handled is that temperature value shows on described LCD unit.
4. FF H1 fieldbus temperature measuring equipment according to claim 1 is characterized in that, also comprises the SRAM that is connected with described microprocessor, is used for the data of storage microprocessor.
5. FF H1 fieldbus temperature measuring equipment according to claim 3, it is characterized in that, it is 3.3V and 6V power supply that described medium attachment unit also is used for FF H1 fieldbus power source conversion, described 3.3V is described microprocessor and the power supply of field bus communication controller, and described 6V power supply is described Signal Spacing unit, AD conversion unit and the power supply of sensor signal conditioning unit.
6. FF H1 fieldbus temperature measuring equipment according to claim 6 is characterized in that, also comprises the power supply unit that is connected with described medium attachment unit;
Described power supply unit, being used for described 3.3V power source conversion is the 1.8V power supply, is the kernel power supply of described microprocessor;
Described power supply unit also is used for described 6V is converted to 5V and 3V power supply, is described AD conversion unit, sensor signal conditioning unit and isolated location power supply.
7. FF H1 fieldbus temperature measuring equipment according to claim 1 is characterized in that described microprocessor carries RAM and Flash.
8. FF H1 fieldbus temperature measuring equipment according to claim 1 is characterized in that described temperature sensor is thermal resistance or thermopair.
9. FF H1 fieldbus temperature measuring equipment according to claim 1 is characterized in that when described temperature sensor was thermopair, described sensor signal conditioning unit also comprised cold junction compensation resistance.
10. FF H1 fieldbus temperature measuring equipment according to claim 1, it is characterized in that, digital signal after described AD conversion unit will be changed is sent to described microprocessor, specifically by Serial Peripheral Interface SPI digital signal is sent to described microprocessor.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009102414763A CN102087144A (en) | 2009-12-03 | 2009-12-03 | Foundation field bus (FF) H1 temperature measuring device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009102414763A CN102087144A (en) | 2009-12-03 | 2009-12-03 | Foundation field bus (FF) H1 temperature measuring device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104535205A (en) * | 2015-01-06 | 2015-04-22 | 上海自动化仪表股份有限公司 | Multi-channel temperature value real-time transmission method based on FF protocol |
| CN110912790A (en) * | 2018-09-18 | 2020-03-24 | 奥特润株式会社 | IC communication device and IC ID automatic communication method |
| WO2021259187A1 (en) * | 2020-06-22 | 2021-12-30 | 宝星智能科技(上海)有限公司 | Daisy chain two-wire sensor measurement system and measurement method therefor |
-
2009
- 2009-12-03 CN CN2009102414763A patent/CN102087144A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104535205A (en) * | 2015-01-06 | 2015-04-22 | 上海自动化仪表股份有限公司 | Multi-channel temperature value real-time transmission method based on FF protocol |
| CN110912790A (en) * | 2018-09-18 | 2020-03-24 | 奥特润株式会社 | IC communication device and IC ID automatic communication method |
| CN110912790B (en) * | 2018-09-18 | 2021-11-16 | 现代摩比斯株式会社 | IC communication device and IC ID automatic communication method |
| WO2021259187A1 (en) * | 2020-06-22 | 2021-12-30 | 宝星智能科技(上海)有限公司 | Daisy chain two-wire sensor measurement system and measurement method therefor |
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Application publication date: 20110608 |