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CN102024083A - Method for extracting capacitance of interconnection structure containing redundant metal - Google Patents

Method for extracting capacitance of interconnection structure containing redundant metal Download PDF

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Publication number
CN102024083A
CN102024083A CN2010105893476A CN201010589347A CN102024083A CN 102024083 A CN102024083 A CN 102024083A CN 2010105893476 A CN2010105893476 A CN 2010105893476A CN 201010589347 A CN201010589347 A CN 201010589347A CN 102024083 A CN102024083 A CN 102024083A
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electric capacity
interconnection structure
capacitance
extraction
redundant metal
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CN102024083B (en
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马天宇
陈岚
阮文彪
李志刚
叶甜春
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Institute of Microelectronics of CAS
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Institute of Microelectronics of CAS
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Abstract

The invention provides a method for quickly extracting a capacitor of an interconnection structure containing redundant metal by establishing a capacitor lookup table. Establishing a capacitance lookup table by extracting geometric parameters of a plurality of interconnection structures, filling redundant metal and extracting capacitance after filling; and then, carrying out structural unit division and geometric parameter extraction on the circuit layout needing capacitance extraction, and inquiring the capacitance lookup table according to the extracted unit geometric parameters of each structure to obtain the actual capacitance of the structural unit. The invention solves the problems that the existing 2.5D capacitance extraction tool cannot accurately extract the capacitance of the interconnection structure containing the redundant metal and the 3D capacitance extraction tool has too long extraction time. The method provided by the invention can not only ensure that the accuracy of the extracted capacitor meets the requirement, but also ensure that the time consumed by capacitor extraction is within an acceptable range.

Description

A kind of extraction contains the method for electric capacity of the interconnection structure of redundant metal
Technical field
The present invention relates to electric design automation and semiconductor technology manufacturing technology field, be specifically related to a kind of by setting up the method for electric capacity that electric capacity look-up table rapid extraction contains the interconnection structure of redundant metal.
Background technology
At integrated circuit (Integrated Circuit, IC) in the manufacture process, usually adopt the various deposition process that comprise physical vapour deposition (PVD), chemical vapor deposition that metal, dielectric and other materials are deposited to the surface of silicon chip, to form the metal construction of layering.Circuit generally includes multi-layer metal structure, links to each other by a plurality of metal filled through holes again between each layer metal.Therefore, critical step is to form the metal construction that connects between each layer with circuit in the manufacture process, makes circuit have very high complicacy and current densities.
In order to obtain to make the necessary flatness of multilayer circuit, (Chemical Mechanical Polishing, CMP) technology makes the planarization of metallic dielectric layer pattern to use chemically mechanical polishing usually.CMP technology is a kind of chemical corrosion effect and the abrasive action of ultramicron grinding technics of forming bright and clean flat surfaces on polished dielectric surface by polishing fluid, is acknowledged as present VLSI (very large scale integrated circuit) stage best material overall situation flattening method.
But be reduced to below the 90nm when the circuit technology node, especially arrive 65nm and 45nm when following, CMP process surface thickness afterwards highlights the dependence problem of underlying metal pattern, owing to the variation in thickness that metal pattern difference produces can be greater than 30%.Also bring two major issues simultaneously: metal dish and oxide layer corrode.These two problems are also closely related with domain graphic feature such as metal live width and distance between centers of tracks.
A redundant metal filled process as the domain post-processed can be used for reducing because the CMP flatness problem that pattern dependency causes.Before the CMP process, redundant metal charge is filled out on the wafer, thereby made that the thickness behind the IC chip design CMP is consistent more.And a redundant metal filled problem of bringing is, owing to added unnecessary metal between metal interconnecting wires, make line capacitance increase, and the increase of line capacitance can influence signal integrity (the Signal Integrity of circuit, and then cause the capability error of circuit SI).
Because can influence the performance of circuit, prediction is accurately made in its influence to circuit performance thereby therefore in design, will extract this electric capacity recruitment behind the redundant metal of adding accurately in the increase of the metal filled back of redundancy line capacitance.Existing electric capacity extracting tool mainly is divided into two big classes, a kind of is the electric capacity extracting tool of 2.5D, owing to the influence of the redundant metal of in 2.5D electric capacity extracting method, not considering in design cycle, to be added, therefore can't accurately extract electric capacity to containing redundant metal filled interconnection structure; Another kind is the field solver of 3D, can accurately extract interconnection capacitance, but owing to the reason of calculated amount can only be extracted the simple structure that contains the minority interconnection, can't carry out the extraction of full chip-scale.Therefore need a kind ofly can carry out the method that accurate electric capacity extracts to the interconnection structure that contains redundant metal in full chip-scale, existing very high accuracy, the corresponding calculated amount also will be in the acceptable scope.
Summary of the invention
Purpose of the present invention is intended to one of solve the problems of the technologies described above at least, particularly solves the problem that the metal line capacitance is difficult to quick and precisely extract in the existing circuit layout that is filled with redundant metal.
For achieving the above object, the present invention proposes the method for electric capacity that a kind of extraction contains the interconnection structure of redundant metal, it is characterized in that may further comprise the steps: A. sets up the electric capacity look-up table, comprising: design a plurality of interconnection structures; Adopt a plurality of geometric parameters to characterize to each described interconnection structure; It is metal filled that each described interconnection structure is carried out redundancy respectively; Each described interconnection structure is carried out electric capacity to be extracted; Set up the electric capacity look-up table of described interconnection structure; B. circuit layout is carried out electric capacity and extract, comprising: circuit layout is provided, and described circuit layout comprises the interconnection structure that contains redundant metal; Described circuit layout is carried out structure divide, to form one or more structural units; Described structural unit is extracted real geometric parameter; Inquire about described electric capacity look-up table according to the real geometric parameter that extracts, obtain the capacitance of described structural unit.
The present invention is pre-charged with the step of redundant metal by increasing in the process of setting up the electric capacity look-up table, thereby realizes the extraction to the domain electric capacity that contains redundant metal rapidly and accurately.The invention has the advantages that: with respect to the electric capacity extracting method of 2.5D, correctly consider the influence of redundant metal thus the electric capacity that extracts more near actual value; With respect to the electric capacity extracting method of 3D, calculated amount concentrated on set up in the electric capacity look-up table process, thereby reduce circuit layout is carried out the calculated amount of electric capacity when extracting, with pick up speed.Contain the method for electric capacity of the interconnection structure of redundant metal by extraction provided by the invention, can either guarantee that the electric capacity precision of extracting meets the requirements, can guarantee that again electric capacity extracts time of consuming in the acceptable scope.
Aspect that the present invention adds and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment below in conjunction with accompanying drawing, and accompanying drawing of the present invention is schematically, does not therefore draw in proportion.Wherein:
Fig. 1 is for setting up the process flow diagram of the electric capacity look-up table that contains redundant metal interconnect structure;
Fig. 2-5 is the synoptic diagram of each step shown in Figure 1;
Fig. 6 is for carrying out the process flow diagram that electric capacity extracts to circuit layout;
Fig. 7-10 is the synoptic diagram of each step shown in Figure 6.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the present invention, and can not be interpreted as limitation of the present invention.
The invention provides a kind of by setting up the method for electric capacity that electric capacity look-up table rapid extraction contains the interconnection structure of redundant metal, this method realizes by two big steps: at first set up and contain redundant metal interconnect structure electric capacity look-up table (steps A), the circuit layout to reality extracts electric capacity (step B) by the described electric capacity look-up table of inquiry electric capacity then.
Fig. 1 sets up the process flow diagram of the electric capacity look-up table that contains redundant metal interconnect structure for steps A.
Step 100 designs a plurality of interconnection structures.Interconnection structure shown in the embodiment of the invention comprises each two parallel metal lines of horizontal and vertical formation decussate texture, as shown in Figure 2.Parallel metal line structure shown in Figure 2 is an example only, and in the practice, described interconnection structure can be various interconnection structures common in the circuit design, for example can also be the network that many parallel metal lines constitute.Need be that these interconnection structures are unsuitable excessive or too small, are preferably medium-scale with pointing out.
Step 110 adopts (i.e. " extraction ") a plurality of geometric parameters to characterize to each described interconnection structure.In embodiments of the present invention, as shown in Figure 2, with the metal wire AB in the interconnection structure is example, geometric parameter can be chosen for metal wire AB live width w1 and with the live width w2 of its metal wire EF that intersects, distance s 1, s2 between metal wire AB metal wire A ' in parallel B ', metal wire EF metal wire E ' the in parallel F ', and metal wire AB with respect to its parallel metal lines A ' B ' over against length l.The parameter of being extracted is shown in the form of Fig. 3.When parallel metal lines in the described interconnection structure during, in like manner can extract the above-mentioned geometric parameter of every wires more than two.
Step 120, it is metal filled that each described interconnection structure is carried out redundancy respectively.In embodiments of the present invention, be redundant metal, as shown in Figure 4 with the square shape of ranks form filling.In practice, can fill redundant metal to form the redundant derby of rectangle or other geometric configuratioies with ranks or dislocation form, the present invention is not limited to this.And the spacing between each redundant derby (being each square among Fig. 4) can be identical or different, and the distance of each redundant derby distance interconnection line (being the metal wire in the embodiment of the invention) also can be identical or different.In addition, because the metal constructions that adopt in the copper structure circuit in the existing semiconductor technology, therefore the material of described redundant metal is correspondingly selected copper more.But, those skilled in the art will appreciate that described redundant metal is not limited to copper, so long as with the side circuit domain of electric capacity to be extracted in consistent the getting final product of the metal that metal construction adopted.The filling of redundant metal can be adopted dual damascene process.Electric capacity extracting method with respect to 2.5D, the present invention is by increasing the step that is pre-charged with redundant metal in the process of setting up the electric capacity look-up table, although follow-up when look-up table is inquired about the geometric parameter of interconnection structure do not change, in fact the influence of redundant metal has been considered in wherein, thereby improved accuracy the extraction of the domain electric capacity that contains redundant metal.
Step 130 is carried out electric capacity to each described interconnection structure and is extracted.The method that electric capacity extracts comprises that the various electric capacity of employing extract softwares and extraction algorithm, for example can adopt commercial 3D electric capacity extracting tool, also can use the electric capacity extracting tool of research and development voluntarily, and the present invention does not limit this.
Step 140 is set up the electric capacity look-up table (storehouse) of described interconnection structure, and the electric capacity that Fig. 5 extracts for utilization is set up an example of look-up table.Wherein, the electric capacity look-up table comprise with described geometric parameter (in the embodiment of the invention, live width w1, w2 that step 110 is cited, distance s 1, s2 and over against length l) as the index of look-up table, with the described capacitance that extracts as searching content.Need be, index be not limited to Fig. 5 and gives an actual example with pointing out, and the capacitance of extraction also can have a plurality of and be not limited to one shown in Figure 5.With respect to the electric capacity extracting method of 3D, the present invention concentrates on calculated amount and sets up in the electric capacity look-up table process (step 110 and step 130), thereby reduces circuit layout is carried out the calculated amount of electric capacity when extracting, with pick up speed.
Fig. 6 carries out the process flow diagram that electric capacity extracts for step B to circuit layout.
Step 200 provides circuit layout, and described circuit layout comprises the interconnection structure that contains described redundant metal.Fig. 7 is for need extracting the domain synoptic diagram of electric capacity, only for example and be not used in limitation the present invention.
Step 210 is carried out structure to described circuit layout and is divided, to form one or more structural units.Particularly, described circuit layout is divided into and the sizable structural unit of interconnection structure described in the steps A.Fig. 8 is the cited a kind of possible division methods of the embodiment of the invention, and shown in Figure 8 only is example, and all division methods that meets above-mentioned requirements all are included in the protection domain of the present invention.
Step 220 is extracted real geometric parameter to described structural unit.The parameter that this step is extracted should be identical with the geometric parameter of sign in the step 110.The interconnection structure that Fig. 9 divides for the circuit layout that needs is extracted electric capacity carries out the example that geometric parameter extracts, in embodiments of the present invention, one of them structural unit of choosing Fig. 8 extracts geometric parameter, the geometric parameter that is extracted is live width w1, the w2 of two in this structural unit intersection metal wires, distance s 1, s2 between every described metal wire metal wire in parallel, and wherein a wires with respect to its parallel metal lines over against length l, each parameter in Fig. 8 for marking, can be with reference to Fig. 3 or mark shown in Figure 4.
Step 230 is inquired about described electric capacity look-up table according to the real geometric parameter that extracts, and obtains the capacitance of described structural unit.Two kinds of situations are arranged this moment: situation one, if having in the described electric capacity look-up table and the corresponding to geometric parameter of real geometric parameter that extracts, with the capacitance of the capacitance under the index of described corresponding to geometric parameter as described structural unit; Situation two if do not have in the described electric capacity look-up table and the corresponding to geometric parameter of real geometric parameter that extracts, can adopt interpolation method to obtain required capacitance, and wherein, described interpolation method comprises interpolation methods such as linear interpolation, secondary difference.Figure 10 is for inquiring about the example that described electric capacity look-up table obtains the capacitance of described structural unit, and wherein, first row of data rows (are that geometric parameter is respectively " 0.3,0.5; 0.4,0.8; 0.3 ", capacitance is 0.765) be the example of situation one, back two row of data rows are the example of situation two.
By above step, can obtain containing the capacitance of arbitrary structural unit in the circuit layout of interconnection structure of redundant metal, if an interconnection line in the described interconnection structure is divided in a plurality of structural units, the capacitance of the described interconnection line in described a plurality of structural units is obtained mutually the capacitance of described interconnection line.For example, certain root interconnection line is divided in three structural units when step 210 pair domain carries out the structure division in the domain, then it can be obtained mutually the electric capacity of this interconnection line at the capacitance of described three structural units.
The present invention is pre-charged with the step of redundant metal by increasing in the process of setting up the electric capacity look-up table, thereby realizes the extraction to the domain electric capacity that contains redundant metal rapidly and accurately.The invention has the advantages that: with respect to the electric capacity extracting method of 2.5D, the electric capacity of correctly considering the influence of redundant metal thereby extraction is more near actual value; With respect to the electric capacity extracting method of 3D, calculated amount concentrated on set up in the electric capacity look-up table process, thereby reduce circuit layout is carried out the calculated amount of electric capacity when extracting, with pick up speed.Contain the method for electric capacity of the interconnection structure of redundant metal by extraction provided by the invention, can either guarantee that the electric capacity precision of extracting meets the requirements, can guarantee that again electric capacity extracts time of consuming in the acceptable scope.
Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can carry out multiple variation, modification, replacement and modification that scope of the present invention is by claims and be equal to and limit to these embodiment.

Claims (10)

1. an extraction contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, may further comprise the steps:
A. set up the electric capacity look-up table that contains redundant metal interconnect structure, comprising:
Design a plurality of interconnection structures;
Adopt a plurality of geometric parameters to characterize to each described interconnection structure;
It is metal filled that each described interconnection structure is carried out redundancy respectively;
Each described interconnection structure is carried out electric capacity to be extracted;
Set up the electric capacity look-up table of described interconnection structure;
B. circuit layout is carried out electric capacity and extracts, comprising:
Circuit layout is provided, and described circuit layout comprises the interconnection structure that contains described redundant metal;
Described circuit layout is carried out structure divide, to form one or more structural units;
Described structural unit is extracted real geometric parameter;
Inquire about described electric capacity look-up table according to the real geometric parameter that extracts, obtain the capacitance of described structural unit.
2. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that interconnection structure described in the steps A comprises two or many parallel metal line structures.
3. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that geometric parameter described in the steps A comprises interconnect length, interconnection line live width and the interconnection line spacing in the described interconnection structure.
4. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, carries out described in the steps A that redundancy is metal filled to be comprised: fill redundant metal to form rectangle or other geometric configuratioies with ranks or dislocation form.
5. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, electric capacity described in the steps A extracts and comprises that adopting various electric capacity to extract softwares and extraction algorithm carries out electric capacity and extract.
6. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, the electric capacity look-up table of setting up described interconnection structure described in the steps A comprises with the index of described geometric parameter as look-up table, with the described capacitance that extracts as searching content.
7. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, described in the step B described circuit layout is carried out structure and divide, comprise to form one or more structural units: described circuit layout is divided into and the sizable structural unit of interconnection structure described in the steps A.
8. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that real geometric parameter described in the step B comprises interconnect length, interconnection line live width and the interconnection line spacing in the structural unit of described circuit layout.
9. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, inquires about described electric capacity look-up table according to the real geometric parameter that extracts described in the step B, and the capacitance that obtains described structural unit comprises:
If have in the described electric capacity look-up table and the corresponding to geometric parameter of real geometric parameter that extracts, with the capacitance of the capacitance under the index of described corresponding to geometric parameter as described structural unit;
If do not have in the described electric capacity look-up table and the corresponding to geometric parameter of real geometric parameter that extracts, adopt interpolation method to obtain required capacitance.
10. extraction as claimed in claim 1 contains the method for electric capacity of the interconnection structure of redundant metal, it is characterized in that, obtain described in the step B after the capacitance of described structural unit, also comprise:, the capacitance of the described interconnection line in a plurality of described structural units is obtained mutually the capacitance of described interconnection line if an interconnection line in the described interconnection structure is divided in a plurality of structural units.
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CN102364482A (en) * 2011-11-03 2012-02-29 中国科学院微电子研究所 Filling method and filling system for redundant dummy metal
CN103116663A (en) * 2011-11-17 2013-05-22 中国科学院微电子研究所 Method for filling redundant metal and method for establishing redundant metal filling mode lookup table
CN105095532A (en) * 2014-04-22 2015-11-25 中芯国际集成电路制造(上海)有限公司 Operation method for half-node CMP model in master-node layout
CN105095532B (en) * 2014-04-22 2018-12-21 中芯国际集成电路制造(上海)有限公司 The operation method of half node CMP model in a kind of host node domain
CN105226012A (en) * 2015-09-12 2016-01-06 上海华虹宏力半导体制造有限公司 The extracting method of MOM capacitor
CN105226012B (en) * 2015-09-12 2018-06-29 上海华虹宏力半导体制造有限公司 The extracting method of MOM capacitor
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CN107798150B (en) * 2016-08-31 2021-07-23 复旦大学 Dummy filling method based on unified framework of sequence quadratic programming method
US10685168B2 (en) 2018-10-24 2020-06-16 International Business Machines Corporation Capacitance extraction for floating metal in integrated circuit
CN114492289A (en) * 2022-02-14 2022-05-13 北京华大九天科技股份有限公司 Method and device for positioning and extracting capacitor in circuit layout
CN114492289B (en) * 2022-02-14 2024-06-21 北京华大九天科技股份有限公司 Method and device for positioning and extracting capacitance in circuit layout

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