CN101963289A - LED packaging structure with outside cutting bevel edges and manufacture method thereof - Google Patents
LED packaging structure with outside cutting bevel edges and manufacture method thereof Download PDFInfo
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- CN101963289A CN101963289A CN2009101599423A CN200910159942A CN101963289A CN 101963289 A CN101963289 A CN 101963289A CN 2009101599423 A CN2009101599423 A CN 2009101599423A CN 200910159942 A CN200910159942 A CN 200910159942A CN 101963289 A CN101963289 A CN 101963289A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention discloses an LED packaging structure with outside cutting bevel edges, comprising a substrate unit, a light emitting unit, a light reflecting unit and a packaging unit. The substrate unit is provided with a substrate body and a crystal holding area, and two opposite sides of the substrate body are respectively provided with a cutting bevel edge; the light emitting unit is provided with a plurality of LED crystal grains electrically arranged on the crystal holding area; the light reflecting unit is provided with a surrounding type light reflecting colloid, the distance between the side edge of the surrounding type light reflecting colloid and the side edge of the substrate body is within 0-1.5mm, and the surrounding type light reflecting colloid surrounds the LED crystal grains to form a colloid limiting space; and the packaging unit is provided with a light transmitting packaging colloid, wherein the light transmitting packaging colloid is used for covering the LED crystal grains and limited in the colloid limiting space.
Description
Technical field
The present invention relates to a kind of package structure for LED and preparation method thereof, refer to a kind of package structure for LED and preparation method thereof especially with outside cutting hypotenuse.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.
So, today employed on the market lighting apparatus, for example: fluorescent lamp, tengsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Moreover; the color rendering of traditional fluorescent lamp is relatively poor; so produce pale light and be out of favour; in addition because principle of luminosity is 120 times quick flowing in a second of fluorescent tube two utmost point electronics; when firm unlatching and electric current instability, cause flicker easily; this phenomenon is considered to cause the arch-criminal of domestic high rate of myopia usually; but this problem can solve by means of the fluorescent tube of repacking with " high-frequency electrical minor stabilizer "; its high-frequency electrical minor stabilizer not only can fall 20% to the power consumption of traditional fluorescent lamp again; when lighting a lamp because of high frequency moment again; the light wave of output is highly stable; therefore almost flicker free takes place; and when power supply voltage variation or fluorescent tube are in low temperature, be not easy to produce flicker, this helps the protection of eyesight.Yet the stabilizer of general Electricity-saving lamp bulb and power-saving lighting tube all is fixed, if eliminate the words of trade-in, must connect stabilizer abandons together, moreover no matter fluorescent tube how power saving again,, still inevitably environment is caused serious pollution after discarded because of it contains the coating of mercury.
Therefore, in order to solve the above problems, light emitting diode bulb or light-emitting diode lamp tube in response to and give birth to.Yet known in order to increase the stability of light-emitting diode chip for backlight unit at the routing processing procedure, generally all on circuit substrate, set up a metal framework.Therefore, can be by pushing down this metal framework locating the position of this circuit substrate, and then make the routing processing procedure of light-emitting diode chip for backlight unit to carry out smoothly.Yet, set up the increase that metal framework not only causes cost of manufacture, and additionally increase the overall weight of light emitting module.
So, the improving of the above-mentioned defective of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of package structure for LED with outside cutting hypotenuse and preparation method thereof.The present invention can be under the prerequisite of " need not increase the width of substrate body ", still can be by " pushing down a plurality of area presseds that are positioned at V-arrangement or U-shaped groove top ", to carry out the routing processing procedure of a plurality of LED crystal particles.In other words, the outside of the substrate body upper surface of each package structure for LED of the present invention the empty width that gets off very narrow.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of package structure for LED with outside cutting hypotenuse, it comprises: a base board unit, a luminescence unit, a reflecting unit and an encapsulation unit.Wherein, this base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface, and wherein a side of this substrate body has a cutting hypotenuse.This luminescence unit has many LED crystal particles on the crystal area that is arranged at this base board unit electrically.This reflecting unit has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and the distance of the reflective colloid side of this circulating type and this substrate body side is between 0-1.5mm, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of package structure for LED with outside cutting hypotenuse, it comprises: a base board unit, a luminescence unit, a reflecting unit and an encapsulation unit.Wherein, this base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface, and wherein two opposition side limits of this substrate body have a cutting hypotenuse respectively.This luminescence unit has many LED crystal particles on the crystal area that is arranged at this base board unit electrically.This reflecting unit has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and the distance of the reflective colloid side of this circulating type and this substrate body side is between 0-1.5mm, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top.This encapsulation unit has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of preparation method with package structure for LED of outside cutting hypotenuse is provided, it comprises the following steps: at first, one substrate module of being made up of a plurality of base board unit is provided, wherein the upper surface of this substrate module has a plurality of recessed grooves and a plurality of area pressed, each groove circle is between per two base board units, and each base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, by pushing down the area pressed that is positioned at each base board unit both sides, to be arranged at many LED crystal particles on the crystal area of each base board unit respectively electrically; At last, optionally execution in step (a) or step (b).
Wherein step (a) is: at first in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; In the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids then; Prolonging those grooves at last and cutting, so that those base board units are cut down from this substrate module.
Step (b) is: at first prolonging those grooves and cutting, so that those base board units are cut down from this substrate module; Then in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; At last in the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids.
Therefore, beneficial effect of the present invention is: the present invention can be under the prerequisite of " need not increase the width of this substrate body ", still can be by " pushing down the area pressed that those are positioned at those groove tops ", carrying out the routing processing procedure of those LED crystal particles, therefore the width that gets off of the outside institute sky of the substrate body upper surface of each package structure for LED of finishing according to above-mentioned manufacturing process is very narrow.As above-mentioned " distance of the substrate body side of the reflective colloid side of each circulating type and each base board unit is between 0-1.5mm ", thus the substrate body of each package structure for LED the empty width that gets off approximately between 0-1.5mm.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, can be goed deep into thus and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 has the flow chart of first embodiment of preparation method of the package structure for LED of outside cutting hypotenuse for the present invention;
Figure 1A to Fig. 1 E is respectively the making schematic flow sheet of first embodiment that the present invention has the package structure for LED of outside cutting hypotenuse;
Fig. 2 has the flow chart of second embodiment of preparation method of the package structure for LED of outside cutting hypotenuse for the present invention; And
Fig. 2 A to Fig. 2 E is respectively the making schematic flow sheet of second embodiment that the present invention has the package structure for LED of outside cutting hypotenuse.
[main element description of reference numerals]
[first embodiment]
This substrate module Ma
Groove Ga
Area pressed Pa
Base board unit 1a substrate body 10a
Heat dissipating layer 101a
The reflective colloid 30a of reflecting unit 3a circulating type
The spacing space 300a of colloid
Circular arc tangential line T
Angle θ
Height H
Width d
[second embodiment]
This substrate module Mb
Groove Gb
Area pressed Pb
Heat dissipating layer 101b
The reflective colloid 30b of reflecting unit 3b circulating type
The spacing space 300b of colloid
Circular arc tangential line T
Angle θ
Height H
Encapsulation unit 4b printing opacity packing colloid 40b
Width d
The specific embodiment
See also shown in Figure 1, first embodiment of the invention provides a kind of preparation method with package structure for LED of outside cutting hypotenuse, it comprises: at first, one substrate module of being made up of a plurality of base board unit is provided, wherein the upper surface of this substrate module has a plurality of recessed grooves and a plurality of area pressed, each groove circle is between per two base board units, and each base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, by pushing down the area pressed that is positioned at each base board unit both sides, to be arranged at many LED crystal particles on the crystal area of each base board unit respectively electrically; Then, in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; Next, in the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids; At last, prolonging those grooves and cutting, so that those base board units are cut down from this substrate module.
Please cooperate Fig. 1 and consult shown in Figure 1A to Fig. 1 E, below with first embodiment of the invention disclosed " preparation method " with package structure for LED of outside cutting hypotenuse, carry out the description of thin portion:
Please cooperate shown in Fig. 1 and Figure 1A, at first, the one substrate module Ma that is made up of a plurality of base board unit 1a is provided, wherein the upper surface of this substrate module Ma has a plurality of recessed groove Ga and a plurality of area pressed Pa (wherein two area pressed Pa lays respectively at the two opposite outsides of this substrate module Ma upper surface, remaining area pressed Pa is positioned at those grooves Ga top), each groove Ga and each area pressed Pa circle are between per two base board unit 1a, and each base board unit 1a has the crystal area 11a (step S100) that a substrate body 10a and is arranged at this substrate body 10a upper surface.Wherein, those grooves Ga can be vee-cut or U-shaped groove, with first embodiment of the invention for example, those grooves Ga is a vee-cut.
In addition, this substrate body 10a has a circuit substrate 100a, and is arranged at the heat dissipating layer 101a of this circuit substrate 100a bottom, a plurality of conductive welding pad 102a that is arranged at this circuit substrate 100a upper surface, and one is arranged at this circuit substrate 100a upper surface and is used to expose the insulating barrier 103a of those conductive welding pad 102a.Therefore, this heat dissipating layer 101a can be used for increasing the heat dissipation of this circuit substrate 100a, and those insulating barriers 103a is a kind of welding resisting layer that can be used for only allowing those conductive welding pad 102a expose out and reach the limitation welding region.Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention such as in order to qualification the present invention for defining of substrate body 10a.For example: this substrate body 10a can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please cooperate shown in Fig. 1 and Figure 1B,, go up (step S102) with the crystal area 11a that many LED crystal particle 20a is arranged at electrically each base board unit 1a respectively by pushing down the area pressed Pa that is positioned at each base board unit 1a both sides.In other words, the designer can cook up a predetermined crystal area 11a in advance on this base board unit 1a, so that those LED crystal particles 20a can be placed on the crystal area 11a of this base board unit 1a electrically.With first embodiment of the invention for example, the mode of those LED crystal particles 20a by routing (wire-bonding) is on the crystal area 11a that is arranged at this base board unit 1a electrically.Moreover, when carrying out the routing processing procedure of each LED crystal particle 20a, must push the area pressed Pa that is positioned at each LED crystal particle 20a both sides respectively by two press element B, in regular turn those LED crystal particles 20a is electrically connected at those substrate body 10a in this way.
Please cooperate shown in Fig. 1 and Fig. 1 C, in the upper surface of the substrate body 10a of each base board unit 1a around the ground reflective colloid 30a of a circulating type that is shaped, wherein the reflective colloid 30a of each circulating type centers on the LED crystal particle 20a on those crystal area 11a that are arranged at each base board unit 1a, to form a plurality of spacing space 300a of colloid (step S104) that lay respectively at those substrate body 10a top.In addition, in the step of the reflective colloid 30a of those circulating types of above-mentioned shaping, further comprise: the upper surface in the substrate body 10a of each base board unit 1a is coated with liquid glue material (figure does not show) around ground, this liquid state glue material can optionally be surrounded into a predetermined shape (for example circular, square, rectangle or the like), solidify this liquid state glue material then to form the reflective colloid 30a of those circulating types, wherein the reflective colloid 30a of this circulating type can be a white hot that the is mixed with inorganic additive reflective colloid that hardens, and the cross section of the spacing space 300a of this colloid can be rectangle.
Wherein, the thixotropic index of this liquid state glue material (thixotropic index) is between 4-6, be coated with this liquid state glue material in the pressure of this substrate body 10a upper surface between 350-450kpa, be coated with this liquid state glue material in the speed of this substrate body 10a upper surface between 5-15mm/s, being coated with this liquid state glue material around ground is identical position in the starting point of this substrate body 10a upper surface with terminating point, this liquid state glue material hardens by the mode of baking, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Please cooperate shown in Fig. 1 and Fig. 1 D, in the upper surface of the substrate body 10a of each the base board unit 1a printing opacity packing colloid 40a that is shaped, to cover those LED crystal particles 20a, wherein those printing opacity packing colloids 40a is limited in respectively in the spacing space 300a of those colloids (step S106), and wherein the upper surface of this printing opacity packing colloid 40a can be a convex surface, concave surface or plane.With first embodiment of the invention for example, the upper surface of this printing opacity packing colloid 40a can be a convex surface.
Moreover, by Fig. 1 D as can be known, the upper surface of the reflective colloid 30a of this circulating type can be a circular arc, the reflective colloid 30a of this circulating type with respect to the angle θ of the circular arc tangential line T of this substrate body 10a upper surface between 40～50 degree, the end face of the reflective colloid 30a of this circulating type with respect to the height H of this substrate body 10a upper surface between 0.3～0.7mm, the width of the reflective colloid 30a of this circulating type bottom is between 1.5～3mm, and the thixotropic index of the reflective colloid 30a of this circulating type (thixotropic index) is between 4-6.
With first embodiment of the invention for example, each LED crystal particle 20a can be a blue LED crystal grain, and this printing opacity packing colloid 40a can be a fluorescent colloid, therefore the blue light beam (figure does not show) that cast out of those LED crystal particles 20a (those blue LED crystal grain) can pass this printing opacity packing colloid 40a (this fluorescent colloid), with the white light beam (figure does not show) that produces similar fluorescent lamp source.
Please cooperate shown in Fig. 1, Fig. 1 D and Fig. 1 E, prolong those grooves Ga and cutting, so that those base board units 1a is cut down (step S108) from this substrate module Ma, and then finish a plurality made from package structure for LED of outside cutting hypotenuse.In addition, those base board units 1a wherein two belong to outermost base board unit 1a, remaining base board unit 1a of those base board units 1a is then between above-mentioned two outermost base board unit 1a in addition, the side of the substrate body 10a of each outermost base board unit 1a has a cutting hypotenuse 12a, and the two opposition side limits of the substrate body 10a of remaining each base board unit 1a have a cutting hypotenuse 12a respectively.Moreover, the substrate body 10a side of each circulating type reflective colloid 30a side and each base board unit 1a apart from d between 0-1.5mm, wherein when the substrate body 10a side of each circulating type reflective colloid 30a side and each base board unit 1a apart from d be 0mm the time after, represent that the substrate body 10a side of each circulating type reflective colloid 30a side and each base board unit 1a trims.
Therefore, the present invention can be under the prerequisite of " need not increase the width of this substrate body 10a ", still can be by " pushing down the area pressed Pa (shown in Figure 1B) that those are positioned at those grooves Ga top ", carrying out the routing processing procedure of those LED crystal particles 20a, therefore the width that gets off of the outside institute sky of the substrate body 10a upper surface of each package structure for LED of finishing according to above-mentioned manufacturing process is very narrow.As above-mentioned " the substrate body 10a side of each circulating type reflective colloid 30a side and each base board unit 1a apart from d between 0-1.5mm ", thus the substrate body 10a of each package structure for LED the empty width that gets off approximately between 0-1.5mm.
See also shown in Figure 2, second embodiment of the invention provides a kind of preparation method with package structure for LED of outside cutting hypotenuse, it comprises: at first, one substrate module of being made up of a plurality of base board unit is provided, wherein the upper surface of this substrate module has a plurality of recessed grooves and a plurality of area pressed, each groove circle is between per two base board units, and each base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, by pushing down the area pressed that is positioned at each base board unit both sides, to be arranged at many LED crystal particles on the crystal area of each base board unit respectively electrically; Then, prolonging those grooves and cutting, so that those base board units are cut down from this substrate module; Next, in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; At last, in the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids.
Please cooperate Fig. 2 and consult shown in Fig. 2 A to Fig. 2 E, below with second embodiment of the invention disclosed " preparation method " with package structure for LED of outside cutting hypotenuse, carry out the description of thin portion:
Please cooperate shown in Fig. 2 and Fig. 2 A, at first, the one substrate module Mb that is made up of a plurality of base board unit 1b is provided, wherein the upper surface of this substrate module Mb has a plurality of recessed groove Gb and a plurality of area pressed Pb (wherein two area pressed Pb lays respectively at the two opposite outsides of this substrate module Mb upper surface, remaining area pressed Pb is positioned at those grooves Gb top), each groove Gb and each area pressed Pb circle are between per two base board unit 1b, and each base board unit 1b has the crystal area 11b (step S200) that a substrate body 10b and is arranged at this substrate body 10b upper surface.Wherein, those grooves Gb can be vee-cut or U-shaped groove, with second embodiment of the invention for example, those grooves Gb is the U-shaped groove.
In addition, this substrate body 10b has a circuit substrate 100b, and is arranged at the heat dissipating layer 101b of this circuit substrate 100b bottom, a plurality of conductive welding pad 102b that is arranged at this circuit substrate 100b upper surface, and one is arranged at this circuit substrate 100b upper surface and is used to expose the insulating barrier 103b of those conductive welding pad 102b.Therefore, this heat dissipating layer 101b can be used for increasing the heat dissipation of this circuit substrate 100b, and those insulating barriers 103b is a kind of welding resisting layer that can be used for only allowing those conductive welding pad 102b expose out and reach the limitation welding region.Yet above-mentioned is not that the substrate of any pattern is all the applicable category of the present invention such as in order to qualification the present invention for defining of substrate body 10b.For example: this substrate body 10b can be a printed circuit board (PCB), a soft base plate, an aluminium base, a ceramic substrate or a copper base.
Please cooperate shown in Fig. 2 and Fig. 2 B,, go up (step S202) with the crystal area 11b that many LED crystal particle 20b is arranged at electrically each base board unit 1b respectively by pushing down the area pressed Pb that is positioned at each base board unit 1b both sides.In other words, the designer can cook up a predetermined crystal area 11b in advance on this base board unit 1b, so that those LED crystal particles 20b can be placed on the crystal area 11b of this base board unit 1b electrically.With second embodiment of the invention for example, the mode of those LED crystal particles 20b by routing (wire-bonding) is on the crystal area 11b that is arranged at this base board unit 1b electrically.Moreover, when carrying out the routing processing procedure of each LED crystal particle 20b, must push the area pressed Pb that is positioned at each LED crystal particle 20b both sides respectively by two press element B, in regular turn those LED crystal particles 20b is electrically connected at those substrate body 10b in this way.
Please cooperate shown in Fig. 2, Fig. 2 B and Fig. 2 C, prolong those grooves Gb and cutting, so that those base board units 1b is cut down (step S204) from this substrate module Mb.In addition, those base board units 1b wherein two belong to outermost base board unit 1b, remaining base board unit 1b of those base board units 1b is then between above-mentioned two outermost base board unit 1b in addition.
Please cooperate shown in Fig. 2 and Fig. 2 D, in the upper surface of the substrate body 10b of each base board unit 1b around the ground reflective colloid 30b of a circulating type that is shaped, wherein the reflective colloid 30b of each circulating type centers on the LED crystal particle 20b on those crystal area 11b that are arranged at each base board unit 1b, to form a plurality of spacing space 300b of colloid (step S206) that lay respectively at those substrate body 10b top.In addition, in the step of the reflective colloid 30b of those circulating types of above-mentioned shaping, further comprise: the upper surface in the substrate body 10b of each base board unit 1b is coated with liquid glue material (figure does not show) around ground, this liquid state glue material can optionally be surrounded into a predetermined shape (for example circular, square, rectangle or the like), solidify this liquid state glue material then to form the reflective colloid 30b of those circulating types, wherein the reflective colloid 30b of this circulating type can be a white hot that the is mixed with inorganic additive reflective colloid that hardens, and the cross section of the spacing space 300b of this colloid can be rectangle.
Wherein, the thixotropic index of this liquid state glue material (thixotropic index) is between 4-6, be coated with this liquid state glue material in the pressure of this substrate body 10b upper surface between 350-450kpa, be coated with this liquid state glue material in the speed of this substrate body 10b upper surface between 5-15mm/s, being coated with this liquid state glue material around ground is identical position in the starting point of this substrate body 10b upper surface with terminating point, this liquid state glue material hardens by the mode of baking, the temperature of baking is between the 120-140 degree, and the time of baking is between 20-40 minute.
Please cooperate shown in Fig. 2 and Fig. 2 E, in the upper surface of the substrate body 10b of each the base board unit 1b printing opacity packing colloid 40b that is shaped, to cover those LED crystal particles 20b, wherein those printing opacity packing colloids 40b is limited in respectively in the spacing space 300b of those colloids (step S208), and then finishes a plurality made from package structure for LED of outside cutting hypotenuse.Wherein the upper surface of this printing opacity packing colloid 40b can be a convex surface, concave surface or plane.With second embodiment of the invention for example, the upper surface of this printing opacity packing colloid 40b can be a convex surface.
Moreover, by the 2nd E figure as can be known, the upper surface of the reflective colloid 30b of this circulating type can be a circular arc, the reflective colloid 30b of this circulating type with respect to the angle θ of the circular arc tangential line T of this substrate body 10b upper surface between 40～50 degree, the end face of the reflective colloid 30b of this circulating type with respect to the height H of this substrate body 10b upper surface between 0.3～0.7mm, the width of the reflective colloid 30b of this circulating type bottom is between 1.5～3mm, and the thixotropic index of the reflective colloid 30b of this circulating type (thixotropic index) is between 4-6.
With second embodiment of the invention for example, each LED crystal particle 20b can be a blue LED crystal grain, and this printing opacity packing colloid 40b can be a fluorescent colloid, therefore the blue light beam (figure does not show) that cast out of those LED crystal particles 20b (those blue LED crystal grain) can pass this printing opacity packing colloid 40b (this fluorescent colloid), with the white light beam (figure does not show) that produces similar fluorescent lamp source.
Moreover, because " those base board units 1b wherein two belong to outermost base board unit 1b; and in addition remaining base board unit 1b of those base board units 1b then between above-mentioned two outermost base board unit 1b ", " so the side of the substrate body 10b of each outermost base board unit 1b has a cutting hypotenuse 12b, and the two opposition side limits of the substrate body 10b of remaining each base board unit 1b have a cutting hypotenuse 12b respectively ".Moreover, the substrate body 10b side of each circulating type reflective colloid 30b side and each base board unit 1b apart from d between 0-1.5mm, wherein when the substrate body 10b side of each circulating type reflective colloid 30b side and each base board unit 1b apart from d be 0mm the time after, represent that the substrate body 10b side of each circulating type reflective colloid 30b side and each base board unit 1b trims.
Therefore, the present invention can be under the prerequisite of " need not increase the width of this substrate body 10b ", still can be by " pushing down the area pressed Pb (shown in Fig. 2 B) that those are positioned at those grooves Gb top ", carrying out the routing processing procedure of those LED crystal particles 20b, therefore the width that gets off of the outside institute sky of the substrate body 10b upper surface of each package structure for LED of finishing according to above-mentioned manufacturing process is very narrow.As above-mentioned " the substrate body 10b side of each circulating type reflective colloid 30b side and each base board unit 1b apart from d between 0-1.5mm ", thus the substrate body 10b of each package structure for LED the empty width that gets off approximately between 0-1.5mm.
Therefore, by above-mentioned Fig. 1 and Fig. 2 as can be known, a kind of preparation method provided by the present invention with package structure for LED of outside cutting hypotenuse, it comprises the following steps: at first, one substrate module of being made up of a plurality of base board unit is provided, wherein the upper surface of this substrate module has a plurality of recessed grooves and a plurality of area pressed, each groove circle is between per two base board units, and each base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface; Then, by pushing down the area pressed that is positioned at each base board unit both sides, to be arranged at many LED crystal particles on the crystal area of each base board unit respectively electrically; At last, optionally execution in step (a) or step (b).
Wherein step (a) is: at first in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; In the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids then; Prolonging those grooves at last and cutting, so that those base board units are cut down from this substrate module.
Step (b) is: at first prolonging those grooves and cutting, so that those base board units are cut down from this substrate module; Then in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; At last in the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids.
Moreover, by means of above-mentioned preparation method, see also shown in Fig. 1 E and Fig. 2 E, the invention provides a kind of package structure for LED with outside cutting hypotenuse, it comprises: a base board unit (1a, 1b), a luminescence unit (2a, 2b), a reflecting unit (3a, 3b) and an encapsulation unit (4a, 4b).
Wherein, this base board unit (1a, 1b) has the crystal area (11a, 11b) that a substrate body (10a, 10b) and is arranged at this substrate body (10a, 10b) upper surface.This luminescence unit (2a, 2b) has many LED crystal particles (20a, 20b) on the crystal area (11a, 11b) that is arranged at this base board unit (1a, 1b) electrically.
Because " those base board units (1a, 1b) wherein two belong to outermost base board unit; and in addition remaining base board unit of those base board units (1a, 1b) then between above-mentioned two outermost base board units ", " so a side of the substrate body (10a, 10b) of each outermost base board unit (1a, 1b) has a cutting hypotenuse (12a, 12b), and two opposition side limits of the substrate body (10a, 10b) of remaining each base board unit (1a, 1b) have a cutting hypotenuse (12a, 12b) respectively ".
In addition, this reflecting unit (3a, 3b) has one and forms in the reflective colloid of circulating type (30a, 30b) of this substrate body (10a, 10b) upper surface by the mode of coating around ground, wherein the reflective colloid of this circulating type (30a, 30b) is arranged at LED crystal particle (20a, 20b) on this crystal area (11a, 11b) around those, to form a spacing space of colloid (300a, 300b) that is positioned at this substrate body (10a, 10b) top.Moreover, substrate body (10a, the 10b) side of the reflective colloid of each circulating type (30a, 30b) side and each base board unit (1a, 1b) apart from d between 0-1.5mm.
In addition, this encapsulation unit (4a, 4b) has one and forms in the printing opacity packing colloid (40a, 40b) of this substrate body (10a, 10b) upper surface to cover those LED crystal particles (20a, 20b), and wherein this printing opacity packing colloid (40a, 40b) is limited in the spacing space of this colloid (300a, 300b).
In sum, the present invention can be under the prerequisite of " need not increase the width of this substrate body ", still can be by " pushing down the area pressed that those are positioned at those groove tops ", carrying out the routing processing procedure of those LED crystal particles, therefore the width that gets off of the outside institute sky of the substrate body upper surface of each package structure for LED of finishing according to above-mentioned manufacturing process is very narrow.As above-mentioned " distance of the substrate body side of the reflective colloid side of each circulating type and each base board unit is between 0-1.5mm ", thus the substrate body of each package structure for LED the empty width that gets off approximately between 0-1.5mm.
But; all scopes of the present invention should be as the criterion with described claim; all closing in the embodiment of the spirit variation similar of claim of the present invention with it; all should be contained in the category of the present invention; any those of ordinary skill in the field of the invention, can think easily and variation or revise all can be encompassed in the claim protection domain of this case.
Claims (10)
1. the package structure for LED with outside cutting hypotenuse is characterized in that, comprising:
One base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface, and wherein a side of this substrate body has a cutting hypotenuse;
One luminescence unit, it has many LED crystal particles on the crystal area that is arranged at this base board unit electrically;
One reflecting unit, it has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and the distance of the reflective colloid side of this circulating type and this substrate body side is between 0-1.5mm, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
2. the package structure for LED with outside cutting hypotenuse as claimed in claim 1 is characterized in that: this substrate body has a circuit substrate, and is arranged at the heat dissipating layer of this circuit substrate bottom, a plurality of conductive welding pad that is arranged at this circuit substrate upper surface, an and insulating barrier that is arranged at this circuit substrate upper surface and is used to expose those conductive welding pad.
3. the package structure for LED with outside cutting hypotenuse as claimed in claim 1, it is characterized in that: each LED crystal particle is a blue LED crystal grain, and this printing opacity packing colloid is a fluorescent colloid.
4. the package structure for LED with outside cutting hypotenuse as claimed in claim 1, it is characterized in that: the cross section in this spacing space of colloid is a rectangle.
5. the package structure for LED with outside cutting hypotenuse as claimed in claim 1, it is characterized in that: the upper surface of the reflective colloid of this circulating type is a circular arc.
6. the package structure for LED with outside cutting hypotenuse as claimed in claim 1, it is characterized in that: the reflective gel phase of this circulating type for the angle of the circular arc tangential line of this substrate body upper surface between 40～50 degree, the end face of the reflective colloid of this circulating type with respect to the height of this substrate body upper surface between 0.3～0.7mm, the width of the reflective colloid of this circulating type bottom is between 1.5～3mm, and the thixotropic index of the reflective colloid of this circulating type is between 4-6.
7. the package structure for LED with outside cutting hypotenuse as claimed in claim 1 is characterized in that: the reflective colloid of this circulating type is a white hot that the is mixed with inorganic additive reflective colloid that hardens.
8. the package structure for LED with outside cutting hypotenuse is characterized in that, comprising:
One base board unit, it has the crystal area that a substrate body and is arranged at this substrate body upper surface, and wherein two opposition side limits of this substrate body have a cutting hypotenuse respectively;
One luminescence unit, it has many LED crystal particles on the crystal area that is arranged at this base board unit electrically;
One reflecting unit, it has one and forms in the reflective colloid of circulating type of this substrate body upper surface by the mode of coating around ground, and the distance of the reflective colloid side of this circulating type and this substrate body side is between 0-1.5mm, wherein the reflective colloid of this circulating type is arranged at LED crystal particle on this crystal area around those, to form a spacing space of colloid that is positioned at this substrate body top; And
One encapsulation unit, it has one and forms in this substrate body upper surface to cover the printing opacity packing colloid of those LED crystal particles, and wherein this printing opacity packing colloid is limited in the spacing space of this colloid.
9. the preparation method with package structure for LED of outside cutting hypotenuse is characterized in that, comprises the following steps:
One substrate module of being made up of a plurality of base board unit is provided, wherein the upper surface of this substrate module has a plurality of recessed grooves and a plurality of area pressed, each groove circle is between per two base board units, and each base board unit has the crystal area that a substrate body and is arranged at this substrate body upper surface;
By pushing down the area pressed that is positioned at each base board unit both sides, to be arranged at many LED crystal particles on the crystal area of each base board unit respectively electrically; And
Optionally execution in step (a) or step (b), wherein step (a) is: at first in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; In the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids then; Prolonging those grooves at last and cutting, so that those base board units are cut down from this substrate module; Step (b) is: at first prolonging those grooves and cutting, so that those base board units are cut down from this substrate module; Then in the mode of coating in the upper surface of the substrate body of each base board unit around the ground reflective colloid of a circulating type that is shaped, wherein the reflective colloid of each circulating type centers on the LED crystal particle on those crystal areas that are arranged at each base board unit, to form a plurality of spacing spaces of colloid that lay respectively at those substrate body tops; At last in the upper surface of the substrate body of each base board unit printing opacity packing colloid that is shaped, to cover those LED crystal particles, wherein those printing opacity packing colloids are limited in respectively in the spacing space of those colloids.
10. the preparation method with package structure for LED of outside cutting hypotenuse as claimed in claim 9, it is characterized in that: in the step of the reflective colloid of those circulating types of above-mentioned shaping, further comprise: the mode with coating is coated with liquid glue material in the upper surface of the substrate body of each base board unit around ground, solidifies this liquid state glue material then to form the reflective colloid of those circulating types.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101599423A CN101963289A (en) | 2009-07-23 | 2009-07-23 | LED packaging structure with outside cutting bevel edges and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101599423A CN101963289A (en) | 2009-07-23 | 2009-07-23 | LED packaging structure with outside cutting bevel edges and manufacture method thereof |
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| CN101963289A true CN101963289A (en) | 2011-02-02 |
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| CN2009101599423A Pending CN101963289A (en) | 2009-07-23 | 2009-07-23 | LED packaging structure with outside cutting bevel edges and manufacture method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157774A (en) * | 2013-05-13 | 2014-11-19 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for light-mixed LED |
| CN111200047A (en) * | 2018-11-20 | 2020-05-26 | 诺沛半导体有限公司 | Full abdication light-emitting diode carrier plate |
| WO2023205989A1 (en) * | 2022-04-25 | 2023-11-02 | 联嘉光电股份有限公司 | Strip-shaped light-emitting diode and application device thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101465300A (en) * | 2007-12-18 | 2009-06-24 | 亿光电子工业股份有限公司 | LED optical strip and method of manufacturing the same |
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2009
- 2009-07-23 CN CN2009101599423A patent/CN101963289A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101465300A (en) * | 2007-12-18 | 2009-06-24 | 亿光电子工业股份有限公司 | LED optical strip and method of manufacturing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157774A (en) * | 2013-05-13 | 2014-11-19 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for light-mixed LED |
| CN111200047A (en) * | 2018-11-20 | 2020-05-26 | 诺沛半导体有限公司 | Full abdication light-emitting diode carrier plate |
| WO2023205989A1 (en) * | 2022-04-25 | 2023-11-02 | 联嘉光电股份有限公司 | Strip-shaped light-emitting diode and application device thereof |
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