CN104157774A - Fluorescent powder encapsulation structure used for light-mixed LED - Google Patents
Fluorescent powder encapsulation structure used for light-mixed LED Download PDFInfo
- Publication number
- CN104157774A CN104157774A CN201310174602.4A CN201310174602A CN104157774A CN 104157774 A CN104157774 A CN 104157774A CN 201310174602 A CN201310174602 A CN 201310174602A CN 104157774 A CN104157774 A CN 104157774A
- Authority
- CN
- China
- Prior art keywords
- fluorescent
- metal substrate
- layer
- fluorescent powder
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 15
- 238000005538 encapsulation Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000011810 insulating material Substances 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims description 32
- 239000003292 glue Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a fluorescent powder encapsulation structure used for a light-mixed LED. The structure comprises an LED chip and a metal substrate. The LED chip is disposed on an upper surface of the metal substrate. An insulating layer is disposed on the metal substrate. A circuit layer is disposed on the insulating layer. An encapsulation adhesive limiting layer made of an insulating material is disposed on the circuit layer. A fluorescent adhesive limiting layer made of the insulating material is disposed on the encapsulation adhesive limiting layer. The encapsulation adhesive is filled into the encapsulation adhesive limiting layer, the fluorescent adhesive limiting layer is filled with fluorescent adhesive. Beneficial effect of the structure is that problems of color drifting and brightness decay of the LED device caused by reduction of fluorescent powder conversion efficiency are solved.
Description
Technical field
The present invention relates to field of photoelectric technology, be specifically related to a kind of mixed light LED fluorescent powder packaging structure.
Background technology
Existing mixed light LED preparation method is for can excitated fluorescent powder chip surface apply fluorescent material or chip is wrapped in fluorescent glue, utilize chip excitated fluorescent powder, fluorescent material is sent and coordinate light to mix with chip body is luminous, prepare mixed light LED device, chip can be because electric light transformational relation by electric current in the situation that, PN junction can produce high temperature, because fluorescent material directly applies or wrap up chip, therefore fluorescent material can direct contact chip, the temperature that causes wafer to produce is directly delivered to fluorescent material, pyrocaloric effect causes the decay of fluorescent material, thereby cause LED device light decay and look drift.
Summary of the invention
For solving the problems of the technologies described above, the object of the present invention is to provide a kind of mixed light LED fluorescent powder packaging structure, solve because of fluorescent material the decay brightness decay and the colour temperature drifting problem that cause.
For achieving the above object, technical scheme of the present invention is as follows: a kind of mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate, described LED chip is located at the upper surface of described metal substrate, on described metal substrate, lay one deck insulating barrier, above described insulating barrier, line layer is set, above described line layer, is equipped with the spacing layer of packaging plastic that insulating material is made, on the spacing layer of described packaging plastic, be provided with again the spacing layer of fluorescent glue that insulating material is made; In the spacing layer of described packaging plastic, pour into packaging plastic, in the spacing layer of described fluorescent glue, pour into fluorescent glue.
Preferably, the positive and negative lead wires of described metal substrate is welded on described line layer.
Preferably, described fluorescent glue is that fluorescent material adds glue.
Preferably, described packaging plastic is silica gel.
Adopt the beneficial effect of above technical scheme to be: owing to being provided with encapsulation glue-line, avoid fluorescent glue and the direct of wafer to contact, the fluorescent material conversion efficiency that the heat that wafer itself sends while lighting causes the thermal effect of fluorescent material reduces, and reduces thereby solved fluorescent material conversion efficiency the drift of LED device look and the brightness decay problem brought.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in embodiment of the present invention technology, to the accompanying drawing of required use in embodiment technical description be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of a kind of mixed light LED of the present invention fluorescent powder packaging structure.
The represented corresponding component title of numeral in figure:
1, metal substrate 2, insulating barrier 3, line layer 4, the spacing layer 5 of packaging plastic, the spacing layer of fluorescent glue.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment
As shown in Figure 1, a kind of mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate 1, LED chip is located at the upper surface of described metal substrate 1, on metal substrate 1, lay one deck insulating barrier 2, line layer 3 is set above insulating barrier 2, above described line layer, be equipped with the spacing layer 4 of packaging plastic that insulating material is made, in order to weigh the use amount of packaging adhesive material and to use packaging adhesive material protection wafer, on the spacing layer 4 of described packaging plastic, be provided with again the spacing layer 5 of fluorescent glue that insulating material is made, in order to weigh the use amount of fluorescent glue glue material; In the spacing layer 4 of described packaging plastic, pour into packaging plastic, in the spacing layer 4 of described fluorescent glue, pour into fluorescent glue, wherein packaging plastic adopts silica gel, and fluorescent glue is that fluorescent material adds glue.
Concrete encapsulation process is as follows:
1, the power of foundation production product and profile customize or buy the support of existing male model;
2, the power ratio according to actual production at the substrate layer of support, uses crystal-bonding adhesive fixing metal substrate;
3, fix after metal substrate, according to wafer arrangement mode on actual metal substrate, the positive and negative electrode lead-in wire of metal substrate is welded to respectively on line layer, connect in order to wafer and support external power source pin;
4, the semi-finished product after bonding wire pour into packaging adhesive material in the spacing layer of packaging plastic, and the upper limit of packaging adhesive material is limited to and is parallel to the spacing layer of packaging plastic, and it is solidified;
5, the semi-finished product after solidifying pour into fluorescent glue in the spacing layer of fluorescent glue, and fluorescent glue glue material upper limit is limited to and does not overflow the spacing layer of fluorescent glue, and it is solidified.
Owing to being provided with encapsulation glue-line, avoid fluorescent glue and the direct of wafer to contact, the fluorescent material conversion efficiency that the heat that wafer itself sends while lighting causes the thermal effect of fluorescent material reduces, and reduces thereby solved fluorescent material conversion efficiency the drift of LED device look and the brightness decay problem brought.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. a mixed light LED fluorescent powder packaging structure, comprise LED chip and metal substrate, described LED chip is located at the upper surface of described metal substrate, it is characterized in that, on described metal substrate, lay one deck insulating barrier, above described insulating barrier, line layer is set, above described line layer, is equipped with the spacing layer of packaging plastic that insulating material is made, on the spacing layer of described packaging plastic, be provided with again the spacing layer of fluorescent glue that insulating material is made; In the spacing layer of described packaging plastic, pour into packaging plastic, in the spacing layer of described fluorescent glue, pour into fluorescent glue.
2. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, the positive and negative lead wires of described metal substrate is welded on described line layer.
3. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, described fluorescent glue is that fluorescent material adds glue.
4. mixed light LED fluorescent powder packaging structure according to claim 1, is characterized in that, described packaging plastic is silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310174602.4A CN104157774A (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for light-mixed LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310174602.4A CN104157774A (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for light-mixed LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104157774A true CN104157774A (en) | 2014-11-19 |
Family
ID=51883228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310174602.4A Pending CN104157774A (en) | 2013-05-13 | 2013-05-13 | Fluorescent powder encapsulation structure used for light-mixed LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104157774A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101826590A (en) * | 2010-04-20 | 2010-09-08 | 北京朗波尔光电股份有限公司 | LED lamp with lens injected with fluorescent glue and packaging method thereof |
| CN101963289A (en) * | 2009-07-23 | 2011-02-02 | 柏友照明科技股份有限公司 | LED packaging structure with outside cutting bevel edges and manufacture method thereof |
| CN102216671A (en) * | 2008-11-19 | 2011-10-12 | 罗姆股份有限公司 | Led lamp |
| CN203339221U (en) * | 2013-05-13 | 2013-12-11 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for mixed light LED |
-
2013
- 2013-05-13 CN CN201310174602.4A patent/CN104157774A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102216671A (en) * | 2008-11-19 | 2011-10-12 | 罗姆股份有限公司 | Led lamp |
| CN101963289A (en) * | 2009-07-23 | 2011-02-02 | 柏友照明科技股份有限公司 | LED packaging structure with outside cutting bevel edges and manufacture method thereof |
| CN101826590A (en) * | 2010-04-20 | 2010-09-08 | 北京朗波尔光电股份有限公司 | LED lamp with lens injected with fluorescent glue and packaging method thereof |
| CN203339221U (en) * | 2013-05-13 | 2013-12-11 | 南通亚浦照明电器制造有限公司 | Fluorescent powder encapsulation structure used for mixed light LED |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141119 |