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CN101925663A - Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device - Google Patents

Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device Download PDF

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Publication number
CN101925663A
CN101925663A CN2009801033052A CN200980103305A CN101925663A CN 101925663 A CN101925663 A CN 101925663A CN 2009801033052 A CN2009801033052 A CN 2009801033052A CN 200980103305 A CN200980103305 A CN 200980103305A CN 101925663 A CN101925663 A CN 101925663A
Authority
CN
China
Prior art keywords
adhesive
methyl
substrate
weight
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801033052A
Other languages
Chinese (zh)
Inventor
柳川俊之
藤绳贡
堀内猛
松下正寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201510645083.4A priority Critical patent/CN105295764A/en
Publication of CN101925663A publication Critical patent/CN101925663A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)

Abstract

Disclosed is an adhesive composition containing (a) a thermoplastic resin, (b) a radically polymerizable compound containing two or more (meth)acryloyl groups and two or more urethane bonds in a molecule and having a weight average molecular weight of not less than 10,000 and (c) a radical polymerization initiator. The adhesive composition exhibits sufficient adhesion even when the composition is cured at a low temperature in a short time, and has excellent storage stability. A connected structure using the adhesive composition has high connection reliability even after long-time exposure to high temperature and high humidity environments. An adhesive for circuit connection using the adhesive composition, a connected structure and a semiconductor device are also disclosed.

Description

Adhesive composite, adhesive for circuit connection, linker and semiconductor device
Technical field
The present invention relates to adhesive composite and use its adhesive for circuit connection, linker, semiconductor device.
Background technology
In semiconductor element and liquid crystal display device, for make the various member bonded purposes in the element use various caking agents all the time.For the desired characteristic of caking agent, except cementability, also relate to the many-sides such as reliability under thermotolerance, the humid tropical condition.And, bonding for being used for by for the convered structure, except organic substrates such as printed circuit board (PCB) and polyimide, also use metals such as copper, aluminium and ITO, SiN, SiO 2Deng base material with diversified condition of surface.Therefore, need to cooperate each caking agent to be carried out molecular designing by convered structure.
In the past, as the caking agent of described semiconductor element and used for liquid crystal display element, be main flow (for example with reference to patent documentation 1) with the thermosetting resin that has used the Resins, epoxy that demonstrates high adhesion and high reliability.As such resin, the general use comprises Resins, epoxy, has with solidifying agent such as reactive phenol resins of Resins, epoxy and promotes the hot Latence catalyst of the reaction of Resins, epoxy and solidifying agent to be used as the resin of constituent.Hot Latence catalyst is the important factor of decision solidification value and curing speed, and the viewpoint of the curing speed when storage stability under room temperature and heating can be used all cpds.For the condition of cure in the actual operation,, can access desired cementability by under 170～250 ℃ temperature, solidifying 1～3 hour.
In recent years, follow the height highly integrated, liquid crystal cell of semiconductor element to become more meticulous, the spacing of interelement and wiring closet is diminishing.Therefore, the occasion of under above-mentioned condition, heat-treating, the heating during owing to curing exists the member to periphery to cause dysgenic possibility.Further,, exist to improve the necessity of turnout, require low temperature (100～170 ℃), short period of time (in 1 hour, in the preferred several seconds), in other words bonding under " low temperature fast setting " for cost degradation.In order to reach this low temperature fast setting, though also there is the situation of using the low hot Latence catalyst of activation energy, known this moment, caking agent was difficult to have both near the storage stability of room temperature under.
Gazed at (for example with reference to patent documentation 2) recently, and with acrylate derivative or methacrylate derivative (being referred to as " (methyl) acrylate " derivative later on) and radical-curable caking agent as the superoxide of radical polymerization initiator.
On the other hand, for the caking agent of radically curing system, the cure shrinkage during owing to curing is big, compares with the occasion of using Resins, epoxy, has the problem of bonding strength difference.As the modification method of bonding strength, proposed to use by ehter bond and given the method (with reference to patent documentation 3,4) that flexibility and flexible urethane acrylate compound are used as free-radical polymerised compound.
The prior art document
Patent documentation
Patent documentation 1: Japanese kokai publication hei 01-113480 communique
Patent documentation 2: TOHKEMY 2002-203427 communique
Patent documentation 3: No. 3522634 communique of Japan's special permission
Patent documentation 4: TOHKEMY 2002-285128 communique
Summary of the invention
The problem that invention will solve
Yet, be the occasion of caking agent at the existing radically curing that uses record such as patent documentation 3,4, exist caking agent rerum naturas such as Young's modulus after the curing and second-order transition temperature and reduce and then problems such as water-intake rate rising and hydrolytic resistance reduction.Therefore, when for hot and humid condition (for example 85 ℃/85%RH) also require to have the semiconductor element of stable performance and the occasion that liquid crystal display device uses this caking agent after down long-time the exposure exist bonding force and the problem that is connected characteristic degradations such as resistance behind failtests.
The objective of the invention is to, adhesive composite is provided and uses its adhesive for circuit connection, linker and semiconductor device, even if this adhesive composite also demonstrates competent cementability under the solidified situation at low temperature and in the short period of time, even if hot and humid condition (for example 85 ℃/85%RH) down long-time expose linker after connection reliability also high, and then storage stability is also good.
The scheme of dealing with problems
The present invention in view of the foregoing; adhesive composite is provided, contains (methyl) acryl that has in (a) thermoplastic resin, (b) a part more than 2 and the amino-formate bond more than 2 and weight-average molecular weight and be free-radical polymerised compound (following also only be referred to as " (b) free-radical polymerised compound ") and (c) radical polymerization initiator more than 10000.
According to such adhesive composite, even if make its solidified occasion in the short period of time, also demonstrate competent cementability at low temperature, even if connection reliability is also high behind long-time exposure linker under the hot and humid condition, and then storage stability is also good.
Preferred adhesive composite of the present invention has (b) free-radical polymerised compound of 10～250 weight parts, (c) radical polymerization initiator of 0.05～30 weight part for (a) thermoplastic resin of 100 weight parts.
Preferred adhesive composite of the present invention is for (a) thermoplastic resin of 100 weight parts, and (d) intramolecularly that also has 0.1～20 weight part has the vinyl compound of the phosphate more than 1 at least.
Preferred adhesive composite of the present invention also contains (e) electroconductive particle.
The present invention also provides adhesive for circuit connection, its be used between between substrate with relative circuit electrode and so that the adhesive for circuit connection that the mode that described relative circuit electrode is electrically connected to each other is bonded to each other described substrate make by the adhesive composite of the invention described above.
For such adhesive for circuit connection, owing to used adhesive composite of the present invention, even if make its solidified occasion in the short period of time at low temperature, also demonstrate competent cementability, even if behind long-time exposure linker under the hot and humid condition, connection reliability is also high, and then storage stability is also good.
The present invention also provides linker, it is made by following: make first substrate with first circuit electrode and second substrate with second circuit electrode according to first circuit electrode mode relative with the second circuit electrode disposed, the adhesive for circuit connection that makes the invention described above is between between first substrate and second substrate of relative configuration, heating and pressurizing is electrically connected first circuit electrode and second circuit electrode.
The present invention also provides semiconductor device, it is made by following: the adhesive for circuit connection that makes the invention described above is between between the semiconductor element and substrate for mounting semiconductor of relative configuration, heating and pressurizing is electrically connected semiconductor element and substrate for mounting semiconductor.
For such linker and semiconductor device, owing to used adhesive for circuit connection of the present invention, competent cementability is high sufficiently, even if long-time exposure back connection reliability is also very high under hot and humid condition.
The invention effect
According to the present invention, even if can provide at low temperature and make its solidified occasion in the short period of time, also can access the also good adhesive composite of competent cementability and connection reliability and then storage stability, and the adhesive for circuit connection, linker and the semiconductor device that use it.
Embodiment
Below the present invention will be described in detail, but the present invention is not limited thereto.In addition; in this manual; so-called (methyl) propenyl ((メ タ) ア Network リ Le); the meaning is propenyl (ア Network リ Le) and the methylpropenyl (ソ タ Network リ Le) corresponding with it; so-called (methyl) acrylate meaning is acrylate and the methacrylic ester corresponding with it; so-called (methyl) acryl, the meaning are acryl and the methacryloyl corresponding with it.
And in this manual, so-called " weight-average molecular weight " is meant under the following conditions and uses the polystyrene standard calibrating curve determining by gel permeation chromatography (GPC).
＜GPC condition 〉
Use machine: the L-6000 of Hitachi type (Hitachi Co., Ltd)
Post: Gel-Pak GL-R420+Gel-Pak GL-R430+Gel-Pak GL-R440 (totally 3) (Hitachi Chemical Co., Ltd.'s system trade(brand)name)
Eluant: tetrahydrofuran (THF)
Measure temperature: 40 ℃
Flow: 1.75ml/min
Detector: L-3300RI (Hitachi Co., Ltd)
Adhesive composite of the present invention contains (a) thermoplastic resin, (b) free-radical polymerised compound reaches (c) radical polymerization initiator.
As (a) thermoplastic resin, can use known material with being not particularly limited.As this resin, can use polyimide, polymeric amide, phenoxy resin class, poly-(methyl) esters of acrylic acid, polyimide, polyurethanes (carbamate resins class), polyester, polyvinyl butyral acetal class, urethane ester class etc.These can be independent or two or more mixing use, especially preferredly be and with phenoxy resin and carbamate resins.
And, also can contain siloxane bond and fluoro substituents in these resins.So long as mix fully between institute's blended resin or microphase-separated and produce the state of gonorrhoea, just can use these resins aptly.
The big more easy more film that obtains of the molecular weight of above-mentioned thermoplastic resin forms property, and influence can be set at wide scope as the melt viscosity of the flowability of caking agent.Though molecular weight is restriction especially not, as general weight-average molecular weight, is preferably 5000～150000, especially is preferably 10000～80000.Then there is the tendency of film formation property deterioration in this value as less than 5000, if surpass 150000 in addition, and the tendency of the intermiscibility variation of existence and other compositions.
(b) free-radical polymerised compound is that to have (methyl) acryl more than 2 and the amino-formate bond more than 2 and weight-average molecular weight in a part be material more than 10000; from the viewpoint of thermotolerance, flowability, cementability, be preferably and comprise at least more than one the compound of structure that is selected from following general formula (A), following general formula (B).
Figure BPA00001186937200051
Preferably the weight-average molecular weight (Mw) of (b) free-radical polymerised compound is 10000～60000, especially is preferably 30000～50000.
Mw such as less than 10000 then cause bonding force to reduce by cure shrinkage, as surpassing 60000, then have the possibility that cross-linking density reduces, connection reliability reduces.
Because Mw is that (b) free-radical polymerised compound more than 10000 is a high molecular weight material, in as reactive ingredients, can expect to have given play to (a) thermoplastic resin and be equal to or characteristic similar with it, the design margin of the films such as raising of film plasticity, flowability and bonding force broadens, and is preferred therefore.
With regard to the amount of (b) free-radical polymerised compound, (a) thermoplastic resin for 100 weight parts is preferably 10～250 weight parts, more preferably 30～150 weight parts.
In the occasion of amount less than 10 weight parts of (b) free-radical polymerised compound, the thermotolerance after the curing may reduce, and is being occasion more than 250 weight parts, and what exist in that the occasion film that uses as film forms the property reduction may.
As (c) radical polymerization initiator, though can use known compounds such as existing known superoxide and azo-compound, but viewpoint from stability, reactivity, intermiscibility, half life temperature was 90～175 ℃ in preferred 1 minute, and molecular weight is 180～1000 peroxyester derivative.
As its concrete example; can list: peroxidation neodecanoic acid isopropyl benzene ester; peroxidation neodecanoic acid-1; 1; 3; 3-tetramethyl-butyl ester; peroxidation neodecanoic acid-1-cyclohexyl-1-methyl ethyl ester; the own ester of peroxidation neodecanoic acid uncle; new peroxide tert-butyl caprate; the peroxidation PIVALIC ACID CRUDE (25) tert-butyl ester; peroxidation-2 ethyl hexanoic acid-1; 1; 3; 3-tetramethyl-butyl ester; 2; 5-dimethyl-2; 5-two (peroxidation of 2-ethyl hexanoyl) hexane; peroxidation-own the ester of 2 ethyl hexanoic acid uncle; peroxide-2-ethyl hexanoic acid tert-butyl; the new enanthic acid tert-butyl ester of peroxidation; peroxidation-2 ethyl hexanoic acid tert-pentyl ester; peroxidation hexahydroterephthalic acid di tert butyl carbonate; peroxidation-3; 5; 5-tri-methyl hexanoic acid tert-pentyl ester; peroxidation neodecanoic acid-3-hydroxyl-1; 1-dimethyl butyl ester; peroxidation-2 ethyl hexanoic acid-1; 1; 3; 3-methyl butyl ester; peroxidation neodecanoic acid tert-pentyl ester; peroxidation-2 ethyl hexanoic acid tert-pentyl ester; 2; 2 '-azo two-2; the 4-methyl pentane nitrile; 1; 1 '-azo two (1-acetoxyl group-1-diphenylphosphino ethane); 2; 2 '-Diisopropyl azodicarboxylate; 2; 2 '-azo two (2-methylbutyronitrile); dimethyl-2; 2 '-Diisopropyl azodicarboxylate; 4; 4 '-azo two (4-cyanopentanoic acid); 1; 1 '-azo two (1-hexamethylene formonitrile HCN); the own ester of peroxidation sec.-propyl list carbonic acid uncle; the peroxidation toxilic acid tert-butyl ester; peroxidation-3; 5; the 5-tri-methyl hexanoic acid tert-butyl ester; the peroxidation lauric acid tert-butyl ester; 2; 5-dimethyl-2; 5-two (peroxidation of 3-methyl benzoyl) hexane; peroxidation-2-ethylhexyl list carbonic acid the tert-butyl ester; the own ester of peroxidation phenylformic acid uncle; 2; 5-dimethyl-2,5-two (benzoyl peroxidation) hexane; peroxidized t-butyl perbenzoate; peroxidation trimethyladipic acid dibutylester; peroxidation n-caprylic acid tert-pentyl ester; the different n-nonanoic acid tert-pentyl ester of peroxidation; peroxide acid tert-amyl acetate etc.These compounds can use separately, also can mix two or more compounds and use.
(c) amount of radical polymerization initiator, (a) thermoplastic resin for 100 weight parts is preferably 0.05～30 weight part, more preferably 0.1～20 weight part.
During amount less than 0.05 weight part, deficiency may take place to solidify, in addition, when surpassing 30 weight parts, the possibility that exists shelf-stability to reduce.
Adhesive composite of the present invention preferably contains the vinyl compound that (d) intramolecularly has the phosphate more than at least 1.Have the vinyl compound of the phosphate more than at least 1 as (d) intramolecularly,, be preferably the compound of following general formula (1)～(3) expression with being not particularly limited though can use known material.
Figure BPA00001186937200071
In the general formula (1), R 1Expression acryl or methacryloyl, R 2Expression hydrogen or methyl, m, n represent 1～8 integer respectively independently.
Figure BPA00001186937200072
In the general formula (2), R 3Expression acryl or methacryloyl, the integer of 1 expression 1～8, m, n represent 1～8 integer respectively independently.
Figure BPA00001186937200073
In the general formula (3), R 4Expression acryl or methacryloyl, R 5Expression hydrogen or methyl, p, q represent 1～8 integer respectively independently.
As its object lesson, can list acid phosphorus oxygen base ethyl-methyl acrylate (acidphosphoxy ethyl metacrylate), acid phosphorus oxygen base ethyl propylene acid esters, acid phosphorus oxygen base propyl methyl acid esters, acid phosphorus oxygen base polyoxyethylene glycol monomethacrylates, acid phosphorus oxygen base polyoxy propylene glycol monomethyl acrylate, 2,2 '-two (methyl) acryloxy diethyl phosphoric acid ester, EO (oxyethane) modified phosphate dimethacrylate, phosphoric acid modification epoxy acrylate etc.
(d) intramolecularly has the amount of the vinyl compound of the phosphate more than at least 1, and (a) thermoplastic resin for 100 weight parts is preferably 0.1～20 weight part, more preferably 0.5～10 weight part.
During amount less than 0.1 weight part, the raising effect of bonding strength has the tendency of reduction, when surpassing 20 weight parts simultaneously, exists the possibility that rerum natura reduces, connection reliability reduces of the caking agent after the curing.
Preferred bonding composition of the present invention contains (e) electroconductive particle.As (e) electroconductive particle, can list metallicss such as Au, Ag, Ni, Cu, scolding tin and carbon etc.
And also can be with dielectric glass, pottery, plastics etc. is nuclear, the particle that the described metal of lining, metallics and carbon form on this nuclear.
Owing to plastics be the electroconductive particle that forms of nuclear and on this nuclear, be covered described metal, metallics and carbon and the occasion of the hot molten metal particle as scolding tin, owing to have deformability by heating and pressurizing, so when connecting with the contact area increase of electrode, absorb the deviation of thickness of electrode, improving connection reliability, is preferred therefore.
And for the electroconductive particle that further forms with the surface of these electroconductive particles of lining such as macromolecule resin, particulate, owing to can be suppressed at the short circuit that causes because of contact between the particle when increasing the electroconductive particle use level, improve the insulativity between telegraph circuit, therefore also can use separately aptly or mix use with electroconductive particle.
For the median size of these electroconductive particles,, be preferably 1～18 μ m from viewpoint dispersed, electroconductibility.Though the amount of electroconductive particle is not restricted especially, be that benchmark preferably is made as 0.1～30 volume % with all adhesive composites, more preferably be made as 0.1～10 volume %.
As this value less than 0.1 volume %, then there is the tendency of electroconductibility deterioration, as surpassing 30 volume %, then there is the tendency that is easy to take place short circuit.
In addition, the volume of " volume % " each composition before based on the curing under 23 ℃ and determine that the volume of each composition can utilize proportion to be converted into volume from weight.And, can not dissolving this composition yet and do not make its swelling, the abundant appropriate solvent (water, alcohol etc.) of wetting this composition yet in adding in the graduated cylinder etc., the volume that increases to drop into this composition is obtained as its volume.
In adhesive composite of the present invention, can with above-mentioned (b) free-radical polymerised compound and with and use free-radical polymerised compound beyond (b) composition.As such free-radical polymerised compound, as long as, just can use known material for as styrene derivatives or maleimide derivatives, coming polymeric compounds by free radical with being not particularly limited.
As its object lesson, can enumerate epoxy (methyl) origoester acrylate, polyethers (methyl) origoester acrylate, oligopolymer such as polyester (methyl) origoester acrylate, trimethylolpropane tris (methyl) acrylate, polyoxyethylene glycol two (methyl) acrylate, polyalkylene glycol two (methyl) acrylate, (methyl) vinylformic acid dicyclopentenyl ester, (methyl) vinylformic acid two cyclopentenes oxygen base ethyl esters, two (methyl) vinylformic acid DOPCP, six (methyl) vinylformic acid dipentaerythritol ester, isocyanuric acid modification 2 officials energy (methyl) acrylate, isocyanuric acid modification 3 officials can (methyl) acrylate etc. multifunctional (methyl) acrylic compound, especially preferred and with 3 officials can be above (methyl) acrylate and (b) free-radical polymerised compound.
And be purpose with the influence liquidity, also can use simple function (methyl) acrylate.As its object lesson, can list (methyl) vinylformic acid pentaerythritol ester, (methyl) vinylformic acid-2-cyanogen ethyl ester, (methyl) cyclohexyl acrylate, (methyl) vinylformic acid dicyclopentenyl ester, (methyl) vinylformic acid two cyclopentenes oxygen base ethyl esters, (methyl) vinylformic acid-2-(2-ethoxy ethoxy) ethyl ester, (methyl) vinylformic acid-2-ethoxy ethyl ester, (methyl) ethyl acrylate, the just own ester of (methyl) vinylformic acid, (methyl) 2-Hydroxy ethyl acrylate, (methyl) vinylformic acid hydroxy propyl ester, (methyl) isobornyl acrylate, (methyl) isodecyl acrylate, (methyl) Isooctyl acrylate monomer, the positive lauryl of (methyl) vinylformic acid, (methyl) vinylformic acid-2-methoxyl group ethyl ester, (methyl) vinylformic acid-2-phenoxy ethyl, (methyl) tetrahydrofurfuryl acrylate, phosphoric acid-2-(methyl) acryloxy ethyl ester, (methyl) vinylformic acid-N, the N-dimethylamino ethyl ester, (methyl) vinylformic acid-N, the N-dimethylamino ethyl ester, (methyl) vinylformic acid-N, N-dimethylamino propyl ester, (methyl) vinylformic acid-N, N-dimethylamino propyl ester, (methyl) acryloyl morpholine etc.These compounds can use separately, also can mix a plurality of compounds as required and use.
In adhesive composite of the present invention; to improve crosslinking rate is purpose; except above-mentioned compound with (methyl) acryl, also can add aptly have allyl group, dimaleoyl imino, vinyl etc. are by living radical and the compound of polymeric functional group.
As its object lesson, can list N-vinyl imidazole quinoline, N-vinyl pyridine, N-vinyl pyrrolidone, N-vinyl formamide, N-caprolactam, 4,4 '-vinylidene (N, accelerine), N-vinyl acetamide, N, N-DMAA, N-N-isopropylacrylamide, N, N-diethyl acrylamide, acrylamide etc.
In adhesive composite of the present invention,, can add stablizer in order to control curing speed and to give storage stability.
As such stablizer, can can use known compound with being not particularly limited, be preferably amphyls such as quinone derivatives such as benzoquinones and Resorcinol, 4-methoxyphenol and 4-tert-butyl catechol, 2,2,6,6-tetramethyl piperidine-1-oxygen base and 4-hydroxyl-2,2,6,6-tetramethyl piperidine-aminooxy derivatives such as 1-oxygen base, hindered amine derivatives such as methacrylic acid tetramethyl-piperidyl ester.
Its addition when adding stablizer, (a) thermoplastic resin for 100 weight parts is preferably 0.01～30 weight part, more preferably 0.05～10 weight part.During amount less than 0.01 weight part, additive effect may reduce significantly, in addition, is 30 weight parts when above, the possibility that exists the intermiscibility with other compositions to reduce.
In adhesive composite of the present invention, also can add with alkoxyl silicone alkane derivatives and silazane derivative aptly is bonding auxiliary agents such as the coupling agent of representative and driving fit promotor, flow agent.
In adhesive composite of the present invention, also can add rubber constituent for the purpose that relaxes stress and raising cementability.
As its object lesson; can list polyisoprene; polyhutadiene; carboxy terminated polybutadiene; hydroxy-terminated polybutadienes; 1; the 2-polyhutadiene; end carboxyl 1; the 2-polyhutadiene; terminal hydroxy group 1, the 2-polyhutadiene; acrylic rubber; styrene butadiene rubbers; the terminal hydroxy group styrene butadiene rubbers; acrylonitrile-butadiene rubber; polymer ends contains carboxyl; hydroxyl; the acrylonitrile-butadiene rubber of (methyl) acryl or morpholinyl; carboxylated nitrile rubber; terminal hydroxy group gathers (propylene oxide); poly-(propylene oxide) of alkoxysilyl end; poly-(oxygen tetramethylene) glycol; polyolefin diols; poly--6-caprolactone etc.
As above-mentioned rubber constituent, from improving the viewpoint of cementability, preferably in side chain or the terminal cyano group as high polar group, the rubber constituent of carboxyl of containing, further from improving mobile viewpoint, more preferably aqueous rubber.As its object lesson; can list aqueous acrylonitrile-butadiene rubber; polymer ends contains the aqueous acrylonitrile-butadiene rubber of carboxyl, hydroxyl, (methyl) acryl or morpholinyl; aqueous carboxylated nitrile rubber, the amount of polar group acryl are preferably 10～60 weight %.These compounds can use separately, and the compound that also can mix more than 2 kinds uses.
For adhesive composite of the present invention, can use as the pasty state caking agent for aqueous occasion down at normal temperature (25 ℃).Be the solid occasion down at normal temperature (25 ℃), use, also can use solvent to make its pasteization, and use as the pasty state caking agent except heating.
As the solvent that can use,, be preferably boiling point under the normal pressure and be 50～150 ℃ solvent as long as for fully little with the reactivity of adhesive composite and additive and demonstrate sufficient deliquescent material and just be not particularly limited.At boiling point is occasion below 50 ℃, exist as at room temperature place will evaporable may, the use in open system is restricted.In addition, be more than 150 ℃ as boiling point, then be difficult to make solvent evaporates, exist the reliability after bonding is caused dysgenic possibility.
Adhesive composite of the present invention also can be used as film-like adhesive and uses.Film-like adhesive can pass through, for example coating is added the solution that solvent etc. forms to adhesive composite as required on separability base materials such as fluororesin film, polyethylene terephthalate film, release paper, or make that described solution soaks in base materials such as non-woven fabrics, mounting on the separability base material, remove solvent etc. and make.As using, convenient more from viewpoints such as handlabilities with the film shape.
Above-mentioned pasty state caking agent and film-like adhesive especially can use aptly as adhesive for circuit connection.
Adhesive for circuit connection of the present invention can and with heating and pressurize and make it bonding.Though Heating temperature is not particularly limited, be preferably 100～210 ℃.For pressure,, in general be preferably 0.1～10MPa as long as for the scope that is caused damage by convered structure just is not particularly limited.This heating and pressurization are preferably carried out in 0.5～120 second scope, and 140～170 ℃, 3MPa, 10 seconds heating also can make it bonding.
Adhesive for circuit connection of the present invention can be used by the caking agent of convered structure as the different different sorts of thermal expansivity.Particularly, can be the semiconductor element adhesives use of representative with CSP with underfill, LOC adhesive tape etc. with elastomerics, CSP as being the circuit connection material of representative with anisotropically conducting adhesive, silver-colored paste, silverskin etc.
Linker of the present invention is so that first circuit electrode mode relative with the second circuit electrode disposes first substrate with first circuit electrode and second substrate with second circuit electrode, the adhesive for circuit connection that makes the invention described above is between first substrate and second substrate of relative configuration, heating and pressurizing is electrically connected first circuit electrode and second circuit electrode and forms.
Substrate as forming circuit electrode can be suitable for the various combinations of matrix materials such as organism such as inorganic materials such as semi-conductor, glass, pottery, polyimide resin, polycarbonate resin, vibrin, polyethersulfone resin, glass fibre/Resins, epoxy.
Embodiment
Below, though specifically describe the present invention based on embodiment, the present invention is not limited thereto.
(synthesizing of urethane acrylate (U-1))
After in reaction vessel, importing air gas with stirrer, thermometer, cooling tube or air gas ingress pipe, pack into the 2-Hydroxy ethyl acrylate of 238 weight parts (2.05 moles), the number-average molecular weight of 4000 weight parts (2 moles) is 2000 polyhexamethylene carbonic ether glycol (manufacturing of Aldrich company), the hydroquinone monomethyl ether of 0.49 weight part, the dibutyl tin laurate of 6.35 weight parts, be heated to 90～100 ℃, in 3 hours, drip the isophorone diisocyanate of 666 weight parts (3 moles) equably, react.
Finish and proceed reaction in about 24 hours after the dropping, measure by IR and confirm that isocyanic ester disappears, finish reaction, obtain weight-average molecular weight and be 45000 urethane acrylate (U-1).
(synthesizing of urethane acrylate (U-2))
After in reaction vessel, importing air gas with stirrer, thermometer, cooling tube or air gas ingress pipe, the number-average molecular weight of 2-Hydroxy ethyl acrylate, 1800 weight parts (2 moles) of 238 weight parts (2.05 moles) of packing into is poly-(ethylene glycol) glycol (manufacturing of Aldrich company) of 900, the hydroquinone monomethyl ether of 0.27 weight part, the dibutyl tin laurate of 2.70 weight parts, be heated to 70～75 ℃, in 3 hours, drip the isophorone diisocyanate of 666 weight parts (3 moles) equably, react.
Finish and proceed reaction in about 15 hours after the dropping, measure by IR and confirm that isocyanic ester disappears, finish reaction, obtain weight-average molecular weight and be 4800 urethane acrylate (U-2).
(embodiment 1, comparative example 1)
As (a) thermoplastic resin, use phenoxy resin and carbamate resins.
As phenoxy resin, use the solution of the solid content 40 weight % that 40g phenoxy resin (PKHC, associating carbon corporate system trade(brand)name, molecular-weight average 45000) are dissolved in the 60g butanone and make.
In addition, as carbamate resins, use is that the molecular-weight average of 2000 poly-hexanodioic acid fourth diester diol and 450 weight parts is 1 of 2000 polyoxy tetramethylene glycol, 100 weight parts with the molecular-weight average of 450 weight parts, the 4-butyleneglycol mixes in the butanone of 4000 weight parts, the diphenylmethanediisocyanate that adds 390 weight parts makes it to react under 70 ℃ and the weight-average molecular weight that obtains is 350,000 carbamate resins.
As (b) free-radical polymerised compound, using respectively the above-mentioned U-1 of 50g (weight-average molecular weight is 45000) or U-2 (weight-average molecular weight is 4800) are dissolved in the solid content that the 50g butanone forms is the solution of 50 weight %.
And, as the free-radical polymerised compound beyond (b) composition, use pentaerythritol triacrylate (NK ester A-TMM-3L, Xin Zhong village chemical industry Co., Ltd. system trade(brand)name).
As (c) radical polymerization initiator, use peroxidation-own ester of 2 ethyl hexanoic acid uncle (PerhexylO, NOF Corp's trade(brand)name).
Have the vinyl compound of the phosphate more than at least 1 as (d) intramolecularly, use phosphoric acid 2-(methyl) acryloxy ethyl ester (light ester (ラ イ ト エ ス テ Le) P-2M, Kyoeisha Chemical Co., Ltd.'s system trade(brand)name).
As (e) electroconductive particle, use and to be provided with nickel dam that thickness is 0.2 μ m on the surface that with the polystyrene is the particle of nuclear, be that the median size that the gold layer of 0.02 μ m is made is that 4 μ m, proportion are 2.5 electroconductive particle at the arranged outside thickness of this nickel dam.
Mix mentioned component with the ratio of the solid weight shown in the table 1, further with 1.5 volume % blending dispersion (e) electroconductive particles.Use apparatus for coating that the gained dispersion liquid is coated on the fluororesin film that thickness is 80 μ m, by under 70 ℃, 10 minutes warm air drying obtains the film-like adhesive that bond layer thickness is 15 μ m.
(embodiment 2, comparative example 2)
As (a) thermoplastic resin, use phenoxy resin and carbamate resins.
As phenoxy resin, using the solid content that 40g phenoxy resin (PKHC, associating carbon corporate system trade(brand)name, molecular-weight average 45000) is dissolved in the 60g butanone and makes is the solution of 40 weight %.
Simultaneously as carbamate resins, use is that the molecular-weight average of 2000 poly-hexanodioic acid fourth diester diol and 450 weight parts is 1 of 2000 polyoxy tetramethylene glycol, 100 weight parts with the molecular-weight average of 450 weight parts, the 4-butyleneglycol mixes in the butanone of 4000 weight parts, the diphenylmethanediisocyanate that adds 390 weight parts makes it to react under 70 ℃ and the weight-average molecular weight that obtains is 350,000 carbamate resins.
As (b) free-radical polymerised compound, using respectively the above-mentioned U-1 of 50g (weight-average molecular weight is 45000) or U-2 are dissolved in the solid content that the 50g butanone forms is the solution of 50 weight %.
And, as the free-radical polymerised compound beyond (b) composition, use pentaerythritol triacrylate (NK ester A-TMM-3L, Xin Zhong village chemical industry Co., Ltd. system trade(brand)name).
As (c) radical polymerization initiator, use peroxidation-own ester of 2 ethyl hexanoic acid uncle (PerhexylO, NOF Corp's trade(brand)name).
At least have the vinyl compound of the phosphate more than 1 as (d) intramolecularly, use phosphoric acid 2-(methyl) acryloxy ethyl ester (light ester P-2M, Kyoeisha Chemical Co., Ltd.'s system trade(brand)name).
Mix mentioned component with the ratio of the solid weight shown in the table 1, further with the Ni particle of 1.5 volume % blending dispersion as (e) electroconductive particle.Use apparatus for coating that the gained dispersion liquid is coated on the fluororesin film that thickness is 80 μ m, by under 70 ℃, 10 minutes warm air drying obtains the film-like adhesive that bond layer thickness is 40 μ m.
Table 1
[mensuration of bonding strength, connection resistance]
(embodiment 1, comparative example 1)
The film-like adhesive that use obtains by above-mentioned method for making, use thermo-compression bonding device (type of heating: permanent pattern of fever, Dongli Engineering Co., Ltd's system), to the flexible PCB (FPC) of copper circuit and glass (the thickness 1.1mm of the thin layer of the Indium sesquioxide (ITO) that is formed with 0.2 μ m with 500 live widths, 25 μ m, spacing 50 μ m, thickness 8 μ m, surface resistivity 20 Ω/), under the pressure of 160 ℃ temperature, 3MPa, carry out the heating and pressurizing in 10 seconds, carry out the connection that width reaches 2mm, make linker.
This linker after measuring firm bonding back and in 85 ℃, the hot and humid groove of 85%RH, keep 250 hours with volt ohm-milliammeter in abutting connection with the resistance value between circuit.Resistance value is represented with the mean value of 37 points of the resistance between the adjacency circuit.
[mensuration of bonding strength, connection resistance]
(embodiment 2, comparative example 2)
The film-like adhesive that use obtains by above-mentioned method for making, flexible PCB (FPC) and printed base plate (PCB) (thickness 1.1mm) to copper circuit with copper circuit of 500 live widths, 100 μ m, spacing 200 μ m, thickness 35 μ m with 500 live widths, 100 μ m, spacing 200 μ m, thickness 18 μ m, use thermo-compression bonding device (type of heating: permanent pattern of fever, Dongli Engineering Co., Ltd's system), under the pressure of 160 ℃ temperature, 3MPa, carry out the heating and pressurizing in 10 seconds, carry out the connection that width reaches 2mm, make linker.
This linker after measuring firm bonding back and in 85 ℃, the hot and humid groove of 85%RH, keep 250 hours with volt ohm-milliammeter in abutting connection with the resistance value between circuit.Resistance value is represented with the mean value of 37 points of the resistance between the adjacency circuit.
And, be standard with JIS-Z0237, peel off the bonding strength that method is measured, estimated this linker with 90 degree.The determinator of bonding strength uses the Tensilon UTM-4 (peeling rate 50mm/min, 25 ℃) that Japan Baldwin Co., Ltd. makes herein.
In the above described manner the bonding strength of the linker that carries out, connect resistance mensuration the results are shown in table 2.
Table 2
Figure BPA00001186937200151
As can be seen, comprise weight-average molecular weight in the composition and be film-like adhesive carbamate (methyl) acrylic compound more than 10000, that obtain at embodiment 1～2, after keeping 250 hours in firm bonding back and in 85 ℃, the hot and humid groove of 85%RH, all demonstrate good connection resistance and bonding strength, demonstrate good characteristic.
On the other hand, not containing weight-average molecular weight in composition is in the comparative example 1～2 of carbamate (methyl) acrylic compound more than 10000, though the connection resistance after just bonding is good, in 85 ℃, the hot and humid groove of 85%RH, keep 250 hours after (behind the failtests) connect resistance value and rise.And for bonding force, though compare bonding force height after just bonding with embodiment 1～2, the reduction of the bonding force behind the failtests is very remarkable.
Be clear that from above result (b) free-radical polymerised compound of the application of the invention can make good connection resistance and bonding force and deposits.
(embodiment 3)
Embodiment 1 gained film-like adhesive is implemented vacuum-packed, 40 ℃ place 3 days down after, similarly to Example 1, under 160 ℃, 3MPa, FPC and ITO carried out 10 seconds thermo-compressed.Mensuration with the bonding strength of the linker that carries out with upper type, connect the result of resistance, demonstrate the bonding strength of 840～880N/m, 1.0 the connection resistance of～1.3 Ω is compared numerical value and not have variation substantially with embodiment 1 before handling, this shows that shelf-stability is good.
(embodiment 4)
Preparation by thickness be 1mm glass epoxy substrate (circuit by Copper Foil make, thickness 18 μ m) substrate for mounting semiconductor made, this glass epoxy substrate has and semi-conductor chip (3 * 10mm, there is the gold electrode that is called as projection projection, square, the 20 μ m height of 100 μ m around 4 limits of interarea in height 0.5mm) the corresponding splicing ear of convex configuration.
Circuit surface at substrate for mounting semiconductor is implemented nickel/golden plating.Use the film-like adhesive of the foregoing description 1, connect the projected electrode and the substrate for mounting semiconductor of semi-conductor chip as follows.
Circuit face at substrate for mounting semiconductor, with 80 ℃, 1MPa, 3 seconds the membranaceous adhesives of the interim crimping of condition, after peeling off the separability fluororesin film, aim at the projected electrode of semi-conductor chip and the position of substrate for mounting semiconductor, under 180 ℃, the temperature of 10kgf/ chip and pressure, carry out 20 seconds the thermo-compressed that adds.
Thus, be electrically connected the projected electrode of semi-conductor chip and the circuit of substrate for mounting semiconductor across film-like adhesive, the electrode of semi-conductor chip and substrate for mounting semiconductor keeps this connection state by the curing of film-like adhesive simultaneously.The connection that obtains in this mode the semiconductor device of semi-conductor chip and substrate for mounting semiconductor under the condition of (55 ℃, 30 minutes)/(125 ℃, 30 minutes), stand thermal cycling test repeatedly.
Measure the result who is connected resistance that this thermal cycling test carries out projected electrode with the substrate circuit of the semi-conductor chip after 1000 times, connect resistance and do not rise, show that connection reliability is good.

Claims (7)

1. adhesive composite; it is characterized in that, contain: (a) have (methyl) acryl more than 2 and the amino-formate bond more than 2 and weight-average molecular weight in thermoplastic resin, (b) a part and be free-radical polymerised compound and (c) radical polymerization initiator more than 10000.
2. adhesive composite as claimed in claim 1, it is characterized in that, for described (a) thermoplastic resin of 100 weight parts, contain described (b) free-radical polymerised compound of 10～250 weight parts, described (c) radical polymerization initiator of 0.05～30 weight part.
3. adhesive composite as claimed in claim 1 or 2 is characterized in that, for described (a) thermoplastic resin of 100 weight parts, (d) intramolecularly that further contains 0.1～20 weight part has the vinyl compound of the phosphate more than at least 1.
4. as each described adhesive composite in the claim 1～3, it is characterized in that, further contain (e) electroconductive particle.
5. adhesive for circuit connection, be used between between substrate with relative circuit electrode, and so that the bonding described substrate of the mode that described relative circuit electrode is electrically connected to each other to each other, it is characterized in that, comprise each described adhesive composite in the claim 1～4.
6. a linker is characterized in that, makes by the following method:
First substrate with first circuit electrode and second substrate with second circuit electrode are disposed according to described first circuit electrode mode relative with described second circuit electrode,
Make the described adhesive for circuit connection of claim 5 between described first substrate and second substrate of relative configuration, heating and pressurizing, and described first circuit electrode is electrically connected with described second circuit electrode.
7. semiconductor device, it is characterized in that, make by the following method: make the described adhesive for circuit connection of claim 5 between the semiconductor element and substrate for mounting semiconductor of relative configuration, heating and pressurizing, and described semiconductor element is electrically connected with described substrate for mounting semiconductor.
CN2009801033052A 2008-04-17 2009-04-17 Adhesive composition, adhesive for circuit connection, connected structure, and semiconductor device Pending CN101925663A (en)

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