CN101681891A - Solder precoated substrate, mounting substrate, and solder precoating method - Google Patents
Solder precoated substrate, mounting substrate, and solder precoating method Download PDFInfo
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- CN101681891A CN101681891A CN200780053397A CN200780053397A CN101681891A CN 101681891 A CN101681891 A CN 101681891A CN 200780053397 A CN200780053397 A CN 200780053397A CN 200780053397 A CN200780053397 A CN 200780053397A CN 101681891 A CN101681891 A CN 101681891A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
An object is to form a solder layer which does not have a variation in the heights of a plurality of electrode portions arranged at a fine pitch regardless of the type of a solder material and realizestable bonding with an electronic component. Provided as means for solving the problem is a solder precoated substrate in which a plurality of electrode portions are arranged at a fine pitch in the opening portion of an insulating film covering the principal plane of the substrate, the electrode portion is precoated with solder, and the shape of the electrode portion simultaneously satisfies (i)and (ii) below: (i) the upper surface of the electrode portion (3) presents a rectangular shape in which the ratio of electrode length (L) to electrode width (W), (L/W), is equal to or less than 6.0 (note that L=W); and (ii) the thickness (t) of the electrode portion (3) is equal to or less than the electrode width (W).
Description
Technical field
The present invention relates to the soldering-tin precoating substrate that precoating scolding tin forms on the electrode part of loop substrate of electronic unit and the installation base plate that uses it, and soldering-tin precoating method are installed in desire.
Background technology
In recent years, follow the miniaturization of electronic equipment or electronic unit, the electrode of electronic loop substrate is also formed a plurality of electrodes with extremely narrow interval, the arrangement pitches of the electrode part (pad) of miniaturization electronic loop substrate in narrow scope.For example, in semiconductor package part, the general dielectric film (solder resist) that utilizes is by the wiring pattern coated with the minuteness space configuration, have the electronic loop substrate of the zone of the wiring pattern that will expose from dielectric film as the circuit design of electrode part, electrode part at such electronic loop substrate is pre-formed soldering-tin layer (precoating scolding tin), can semiconductor chip terminal (electronic unit) be engaged in substrate via this soldering-tin layer thus.At this, when the electrode part precoating scolding tin of the minuteness spaceization of electronic loop substrate, be difficult to as in the past, utilize print solder paste correctly such as stencil printing, therefore, usually adopt comprehensively after applying the scolding tin paste on the loop substrate, heat, in the method for each electrode part surface precoating scolding tin.
But, in the process that the miniaturization of the arrangement pitches of electrode part makes progress further, utilization is heated by the scolding tin paste is coated on the substrate comprehensively, the method of precoating scolding tin, under the situation of electrode of substrate portion precoating scolding tin, because variety of issue takes place in the influence of the surface tension of scolding tin or wetability etc. sometimes.Specifically, have 1) as shown in Figure 4, the position of the maximum jut of the scolding tin 4 that forms different problem or 2 between each electrode part 3a, 4a) as shown in Figure 5, in an electrode part 3, be formed with the problem or 3 of the jut of a plurality of scolding tin 4) as shown in Figure 6, preferentially form soldering-tin layer, the problem that the soldering tin amount that causes the upper surface in electrode part 3 to form tails off in the electrode side.If cause these problems, between each electrode part, inequality takes place on the height of scolding tin, cause bad with engaging of electronic unit.
As avoiding above-mentioned 1)～3) one of the scheme of problem, consider the shape of electrode part (pad) is studied.For example, so far propose to have and utilize the wiring pattern that comprises wiring and at the position of the bump bond of electronic unit setting and the connection gasket formation bonding conductor pattern (electrode part) that wiring pattern forms continuously, form the scheme of the width dimensions W1 of the connection gasket shape bigger than the width dimensions W2 of wiring pattern, in other words, the part that the shape of electrode part is formed at long side direction has the shape (with reference to patent documentation 1) of width than other wide wide width parts.In addition, also propose to have pad (electrode part) to form the scheme (with reference to patent documentation 2) of shape of the ratio (L/W)＜10 of its length (L) and width (W).
[patent documentation 1] spy opens the 2000-77441 communique
[patent documentation 2] spy opens flat 5-226825 communique
Yet, according to the scheme of patent documentation 1 record as can be known, need wide width part be set in electrode part, therefore unfavorable aspect the miniaturization arrangement pitches, prediction is difficult to tackle the situation of expectation from now on and then miniaturized electric subset or electronic unit.On the other hand, in the scheme of patent documentation 2 records, electrode part is formed specific shape, and, use specific soldering tin material, therefore, there is the shortcoming of restriction soldering tin material.
Summary of the invention
Therefore, the object of the present invention is to provide the soldering-tin layer that is not subject to soldering tin material and on a plurality of electrode part formation height, does not have inequality, can carry out and the stable soldering-tin precoating substrate that engages of electronic unit and the installation base plate that uses its formation with the minuteness space configuration.
The inventor etc. have carried out the result of intent research repeatedly in order to solve described problem, and two sides of thickness that found out the shape of upper surface of electrode part and electrode part are to producing above-mentioned 1)～3) the fact that influences greatly of the essential factor of problem.Also have, find: in order to carry out the miniaturization of the arrangement pitches of electrode part, the upper surface shape of electrode part is formed rectangle, and, the electrode length of upper surface shape (L) is made as particular range with respect to the ratio (L/W) of electrode width (W), and with the thickness setting of electrode part is below the described electrode width, can solve the fact of described problem thus, thereby finish the present invention.
That is, soldering-tin precoating substrate of the present invention, it disposes a plurality of electrode part with minuteness space in the peristome of the dielectric film of covered substrate interarea, scribble scolding tin on this electrode part in advance, it is characterized in that,
Following (i) and shape are (ii) satisfied in being shaped as of electrode part, that is:
(i) upper surface of electrode part be electrode length (L) with respect to the ratio (L/W) of electrode width (W) be below 6.0 rectangle (wherein, L 〉=W),
(ii) the thickness of electrode part (t) is below the electrode width (W).
In installation base plate of the present invention, it is characterized in that, utilize scolding tin, the thermo-compressed electronic unit in the precoating of described soldering-tin precoating substrate of the present invention.
Soldering-tin precoating method of the present invention, it is to use the substrate that disposes a plurality of electrode part in the peristome of the dielectric film of covered substrate interarea with minuteness space, after having applied the scolding tin paste on the electrode part of this substrate, heat, the method of precoating scolding tin on this electrode part thus, it is characterized in that
With the shape set of described electrode part is to satisfy following (i) and shape (ii), that is:
(i) upper surface of electrode part be electrode length (L) with respect to the ratio (L/W) of electrode width (W) be below 6.0 rectangle (wherein, L 〉=W),
(ii) the thickness of electrode part (t) is below the electrode width (W).
According to the present invention as can be known, position difference between each electrode of maximum jut can not take place at the soldering-tin layer of a plurality of electrode part formation of disposing with minuteness space on the substrate, or in an electrode part, be formed with a plurality of juts, or be pre-formed soldering-tin layer to the electrode side, cause the problem that tails off at the soldering tin amount that the upper surface of electrode part forms, obtain becoming the good soldering-tin layer that does not have inequality on the height, therefore, can carry out stable engaging with electronic unit.In addition, according to the present invention as can be known, the soldering tin material that uses in the formation of soldering-tin layer is not limited, and, can also be than the arrangement pitches of more miniaturization electrode part in the past.
Description of drawings
Fig. 1 be remove precoating scolding tin and with (a) approximate vertical view, (b) its x-x line profile, (c) its y-y profile of the execution mode that schematically shows soldering-tin precoating substrate of the present invention.
Fig. 2 is the figure of metewand of scolding tin shape that is used for illustrating the soldering-tin precoating substrate of embodiment, the summary section of (when the electrode part side the is observed) scolding tin that is expression when long side direction blocks electrode part.
Fig. 3 is the figure of metewand of scolding tin shape that is used for illustrating the soldering-tin precoating substrate of embodiment, the summary section of the scolding tin that is the residing part of maximum jut that is illustrated in the scolding tin that electrode part forms when the long side direction of electrode part vertically blocks.
Fig. 4 is the figure of position different problem in the past between each electrode part 3a, 4a that is used to illustrate the maximum jut of scolding tin 4, summary section (a), the b of the scolding tin 4 that is expression when long side direction blocks two electrode part 3a, 4a).
Fig. 5 is the figure that is used to illustrate in an electrode part 3 problem in the past of the jut that forms a plurality of scolding tin 4, the summary section of the scolding tin 4 that is expression when long side direction blocks electrode part 3.
Fig. 6 is used for explanation to form scolding tin in the electrode side in advance, the summary section of the scolding tin 4 that the figure of the problem in the past that the soldering tin amount that causes the upper surface in electrode part 3 to form tails off is expression when long side direction vertically blocks electrode part 3.
Among the figure: the 1-substrate; The 2-dielectric film; The 3-electrode part; 4-scolding tin.
Embodiment
Soldering-tin precoating substrate of the present invention for example as shown in Figure 1,2 ' disposes a plurality of electrode part 3 with minuteness space in the peristome of the dielectric film 2 of the interarea of covered substrate 1, scribbles scolding tin (not shown) in advance having on this electrode part 3 of specific shape.
Also have, in Fig. 1, (a) approximate vertical view of expression substrate, (b) figure of the section when schematically showing x-x line in described (a) and block, (c) figure of the section the during section when schematically showing y-y line in described (a) and block.
The electrode part 3 of soldering-tin precoating substrate of the present invention is to satisfy following (i) and shape (ii) simultaneously.
(i) to be electrode length (L) be rectangle (wherein, L 〉=W) below 6.0 with respect to the ratio (L/W) of electrode width (W) to the upper surface of electrode part 3.
(ii) the thickness of electrode part 3 (t) is below the electrode width (W).
Like this, in electrode part 3 of the present invention, electrode length in its upper surface (L) is below 6.0 with respect to the ratio (L/W) of electrode width (W), and its thickness (t) is below the electrode width (W), and can form at its surface (upper surface) does not thus have uneven good scolding tin on the height.The value of (L/W) of preferably described (i) is for good below 5.0.In addition, the upper surface of electrode part 3 of the present invention is rectangular, can also tackle the miniaturization (especially the spacing between each electrode part 3 is the situation of scope described later) of the arrangement pitches of electrode part 3 thus.
Preferred specifically 30～250 μ m of electrode length (L) in the soldering-tin precoating substrate of the present invention, more preferably 70～150 μ m.If electrode length (L) is too small, then rate of finished products variation when dielectric film 2 is provided with peristome 2 ' may cause the productivity ratio of soldering-tin precoating substrate to reduce.On the other hand, if electrode length (L) is long, then the position of the maximum jut of the scolding tin 4 that forms on electrode part 3 is in each electrode part 3a, 4a difference (with reference to Fig. 4), or in an electrode part 3, form easily the jut (with reference to Fig. 5) of a plurality of scolding tin 4, be in the tendency that the uneven big solder sections of such height is difficult to the bond semiconductor chip.
Also have, about the concrete scope of electrode width (W), according to described electrode length (L), satisfy described suitably the setting gets final product (i), about the concrete scope of the thickness ((t)) of electrode part,, satisfy described (ii) suitably the setting and get final product according to described electrode width (W).
Below the preferred specifically 150 μ m of spacing between each electrode part 3 in the soldering-tin precoating substrate of the present invention, more preferably below the 100 μ m.Usually, the arrangement pitches of electrode part 3 is more little, the soldering tin amount that forms in electrode part 3 is few more, the inequality that is in the height of scolding tin exerts an influence to installation property and becomes big tendency, but as can be known according to the present invention, the inequality that can suppress this height effectively takes place, and therefore, can also tackle the same minuteness space of above-mentioned scope.
Soldering-tin precoating substrate of the present invention is by pre-coating method of the present invention as described below, that is: for example use electronic loop substrate as shown in Figure 1 promptly in the peristome of the dielectric film 2 of the interarea of covered substrate 1,2 ' to dispose the substrate of the electrode part 3 of a plurality of specific shapes with minuteness space, after having applied the scolding tin paste on the electrode part 3 of this substrate 1, heat, thus at the scolding tin of the electrode part 3 precoating fusions of substrate 1.
When on the electrode part 3 of substrate 1, applying the scolding tin paste, for example, be not to use web plate mask by each electrode part 3 each openings on the substrate 1, and be to use the web plate mask of the wide scope opening that comprises a plurality of electrode part 3, by screen printing etc., ignore the position of each electrode part 3 or shape and roughly apply the scolding tin paste comprehensively and get final product comprising with the wide scope of a plurality of electrode part 3 of minuteness space configuration.
The heating that has applied the substrate of scolding tin paste does not limit especially, but for example carries out precoating under about 150～200 ℃, carries out precoating and get final product under about 170～280 ℃ of maximum temperatures.To the coating on the substrate and reflux in atmosphere can be also can, at N
2, carry out also can in the inert atmospheres such as Ar, He.
The soldering tin material that uses in the formation of the soldering-tin layer in soldering-tin precoating substrate of the present invention does not limit especially, as described scolding tin paste, for example, use the known in the past scolding tin paste that comprises soldering tin powder and solder flux (flux) also can, used the known in the past precipitation type scolding tin paste that comprises precipitation type soldering tin material and solder flux also could.
The height (height of maximum jut) of the scolding tin in the soldering-tin precoating substrate of the present invention of Xing Chenging is generally about 10～20 μ m like this, and between each electrode part 3, the inequality of scolding tin height is few.Specifically, the standard deviation (n=20) of the scolding tin height of precoating on electrode part 3 (being the height of maximum jut) is usually preferred 1～2.5, and more preferably 1～2.Also have, the scolding tin that forms on the soldering-tin precoating substrate of the present invention does not exist above-mentioned 1 as shown in Figures 2 and 3)～3) problem, form a jut an electrode part, and the soldering tin amount that forms at upper surface is more than the side of electrode part.
Installation base plate of the present invention is the scolding tin that utilizes in the precoating of described soldering-tin precoating substrate of the present invention, and the electronic unit thermo-compressed that will carry on the electronic loop substrate forms.
Especially, preferred installation base plate of the present invention is the scolding tin of utilization in the electrode part precoating of the interarea of soldering-tin precoating substrate, the interarea of flip-over type connection soldering-tin precoating substrate and the interarea of electronic unit are (specifically, at the electrode part of substrate interarea and the electrode (projection) of electronic unit interarea setting) form, but be not limited to this.
Under the situation of the installation base plate that flip-over type connects, preferably between soldering-tin precoating substrate and electronic unit, be filled with the form of bottom potting resin.That is, usually, favourable when then the electrode length on the substrate (L) is long if consider the fillibility of bottom potting resin, but then, if electrode length (L) is long, then the scolding tin of Xing Chenging forms as Fig. 4 or shape shown in Figure 5, in height is easy to generate inequality.At this, in the present invention, set electrode length (L) more longways in the mode of fillibility that can guarantee the bottom potting resin fully, also satisfy described (i) and shape (ii), can form good shape and not have the soldering-tin layer of inequality highly by electrode part is formed.
[embodiment]
Below, enumerate embodiment, explain the present invention, but the present invention is not limited to following embodiment.
[Production Example (preparation of scolding tin paste)]
At first, mix WW level pine slurry rosin (ト one Le ロ ジ Application) 70 weight portions, hexyl carbitol (solvent) 20 weight portions, hydrogenated castor oil (thixotropic agent) 10 weight portions,, be cooled to room temperature, prepared solder flux with viscosity at 120 ℃ of following heating and meltings.
Use blender ((strain) new mechanism " あ わ と り practices too youth "), any of soldering tin powder shown in following (a)～(d) of mixing 35 weight portions (average grain diameter is 5 μ m) and solder flux 65 weight portions as above-mentioned preparation of 65 weight portions have been prepared the scolding tin paste that four kinds of metals shown in the table 1 are formed respectively.
(a) Ag content is that the Sn-Ag of 3.5 weight % is solder alloy powder (Sn3.5Ag)
(b) Ag content is 3.0 weight %, and Cu content is that the Sn-Ag-Cu of 0.5 weight % is solder alloy powder (Sn3Ag0.5Cu)
(c) Sn content is that the Sn of 100 weight % is solder alloy powder (Sn)
(d) Sn content is 63 weight %, and Pb content is that the Sn-Pb of 37 weight % is solder alloy powder (63Sn37Pb)
[embodiment 1～12 and comparative example 1～4]
Cover interarea with dielectric film, made respectively in this peristome with 100 μ m spacings and disposed the semiconductor package part substrate that size (thickness (t) of electrode length (L), electrode width (W), the electrode part) electrode as shown in table 1 of each one forms with peristome.Scolding tin paste at the composition of the metal shown in this substrate screen printing table 1, thickness coating with 100 μ m is comprehensive shape, use the backflow profile (atmosphere: oxygen concentration 300ppm is following) of 260 ℃ of maximum temperatures, after heating, impregnated in the supersonic wave cleaning machine of putting into 60 ℃ of butyl carbitol solution, remove deflux thus, obtained the soldering-tin precoating substrate.
[table 1]
| ??L(μm) | ??W(μm) | ??t(μm) | ??L/W | ??W/t | Metal is formed | |
| |
??70 | ??15 | ??15 | ??4.7 | ??1.0 | ?? |
| Embodiment | ||||||
| 2 | ??70 | ??30 | ??15 | ??2.3 | ??2.0 | ?? |
| Embodiment | ||||||
| 3 | ??90 | ??15 | ??15 | ??6 | ??1.0 | ??Sn3.5Ag |
| Embodiment 4 | ??90 | ??30 | ??15 | ??3 | ??2.0 | ??Sn3.5Ag |
| Embodiment 5 | ??150 | ??30 | ??15 | ??5 | ??2.0 | ??Sn3.5Ag |
| Embodiment 6 | ??90 | ??15 | ??7 | ??6 | ??2.1 | ??Sn3.5Ag |
| Comparative example 1 | ??70 | ??10 | ??15 | ??7 | ??0.7 | ??Sn3.5Ag |
| Comparative example 2 | ??90 | ??10 | ??15 | ??9 | ??0.7 | ??Sn3.5Ag |
| Comparative example 3 | ??150 | ??10 | ??15 | ??15 | ??0.7 | ??Sn3.5Ag |
| Comparative example 4 | ??150 | ??15 | ??15 | ??10 | ??1.0 | ??Sn3.5Ag |
| Comparative example 5 | ??90 | ??15 | ??20 | ??6 | ??0.8 | ??Sn3.5Ag |
| Embodiment 7 | ??70 | ??15 | ??15 | ??4.7 | ??1.0 | ??Sn3Ag0.5Cu |
| Embodiment 8 | ??90 | ??15 | ??15 | ??6 | ??1 | ??Sn3Ag0.5Cu |
| Comparative example 6 | ??90 | ??10 | ??15 | ??9 | ??0.7 | ??Sn3Ag0.5Cu |
| Comparative example 7 | ??150 | ??15 | ??15 | ??10 | ??1.0 | ??Sn3Ag0.5Cu |
| Comparative example 8 | ??90 | ??15 | ??20 | ??6 | ??0.8 | ??Sn3Ag0.5Cu |
| Embodiment 9 | ??70 | ??15 | ??15 | ??4.7 | ??1.0 | ??Sn |
| Embodiment 10 | ??90 | ??15 | ??15 | ??6 | ??1 | ??Sn |
| Comparative example 9 | ??90 | ??10 | ??15 | ??9 | ??0.7 | ??Sn |
| Comparative example 10 | ??150 | ??15 | ??15 | ??10 | ??1.0 | ??Sn |
| Comparative example 11 | ??90 | ??15 | ??20 | ??6 | ??0.8 | ??Sn |
| Embodiment 11 | ??70 | ??15 | ??15 | ??4.7 | ??1.0 | ??63Sn37Pb |
| Embodiment 12 | ??90 | ??15 | ??15 | ??6 | ??1 | ??63Sn37Pb |
| Comparative example 12 | ??90 | ??10 | ??15 | ??9 | ??0.7 | ??63Sn37Pb |
| Comparative example 13 | ??150 | ??15 | ??15 | ??10 | ??1.0 | ??63Sn37Pb |
| Comparative example 14 | ??90 | ??15 | ??20 | ??6 | ??0.8 | ??63Sn37Pb |
About as above-mentioned each soldering-tin precoating substrate that obtains, carried out following evaluation.The results are shown in the table 2.
＜scolding tin shape 〉
The use microscope is observed the soldering-tin layer that forms at the soldering-tin precoating substrate, confirms that the soldering-tin layer that has or not, reaches to the electrode side that the offset of the maximum jut of soldering-tin layer, a plurality of jut produce forms state, estimates by following benchmark.
(1) about having or not that the offset of maximum jut, a plurality of jut produce
Zero: (L) ± 10% is with interior scope along the electrode long side direction to electrode length in self-electrode portion center C in maximum protruding part, and there is not plural situation (with reference to Fig. 2) in jut
*: the situation that does not meet above-mentioned " zero "
(2) form state about soldering-tin layer to the electrode side
Zero: in the residing part of maximum jut of the scolding tin that electrode part forms, the thickness of the soldering-tin layer of the vertical direction of the upper surface of self-electrode portion (scolding tin height) is made as h, the thickness of the soldering-tin layer of self-electrode lateral vertical side direction (thickness about the different situation in side under be thickness from the big side's of thickness side) when being made as d, under the situation of h＞d (with reference to Fig. 3)
*: above-mentioned h and d are the situation of h≤d
The standard deviation of＜average scolding tin height and scolding tin height 〉
Use depth of focus meter ((strain) Ji Ensi system), the height (locate with the electrode part is the center) of the soldering-tin layer that forms on each electrode part of the soldering-tin precoating substrate of 20 of each basal lamina determinations has been calculated its mean value (average scolding tin height) and its standard deviation (standard deviation of scolding tin height).
[table 2]
More than, understand soldering-tin precoating substrate of the present invention, installation base plate and soldering-tin precoating method in detail, but scope of the present invention is not limited to these explanations, can suitably change or improvement in the scope of not damaging aim of the present invention.
Claims (12)
1. soldering-tin precoating substrate, it disposes a plurality of electrode part with minuteness space in the peristome of the dielectric film of covered substrate interarea, scribble scolding tin on this electrode part in advance, it is characterized in that,
Following (i) and shape are (ii) satisfied in being shaped as of electrode part, that is:
(i) to be electrode length L be rectangle below 6.0 with respect to the ratio L/W of electrode widths W to the upper surface of electrode part, wherein, and L 〉=W,
(ii) the thickness t of electrode part is below the electrode widths W.
2. soldering-tin precoating substrate according to claim 1, wherein,
Electrode length L in described (i) is below 5.0 with respect to the ratio L/W of electrode widths W.
3. soldering-tin precoating substrate according to claim 1 and 2, wherein,
Spacing between each electrode part is below the 150 μ m.
4. according to each described soldering-tin precoating substrate in the claim 1～3, wherein,
Described electrode length L is 30～250 μ m.
5. according to each described soldering-tin precoating substrate in the claim 1～4, wherein,
The standard deviation of the scolding tin height of precoating on described electrode part is 1～2.5.
6. an installation base plate is characterized in that,
Utilization scolding tin of precoating on each described soldering-tin precoating substrate in claim 1～5, the thermo-compressed electronic unit.
7. installation base plate according to claim 6, wherein,
Flip-over type connects the interarea of described soldering-tin precoating substrate and the interarea of described electronic unit.
8. installation base plate according to claim 7, wherein,
Between described soldering-tin precoating substrate and described electronic unit, be filled with the bottom potting resin.
9. soldering-tin precoating method, it is to use the substrate that disposes a plurality of electrode part in the peristome of the dielectric film of covered substrate interarea with minuteness space, after having applied the scolding tin paste on the electrode part of this substrate, heat, the method of precoating scolding tin on this electrode part is characterized in that thus
With the shape set of described electrode part is to satisfy following (i) and shape (ii), that is:
(i) to be electrode length L be rectangle below 6.0 with respect to the ratio L/W of electrode widths W to the upper surface of electrode part, wherein, and L 〉=W,
(ii) the thickness t of electrode part is below the electrode widths W.
10. soldering-tin precoating method according to claim 9, wherein,
Electrode length L in described (i) is below 5.0 with respect to the ratio L/W of electrode widths W.
11. according to claim 9 or 10 described soldering-tin precoating methods, wherein,
Spacing between each electrode part is below the 150 μ m.
12. according to each described soldering-tin precoating method in the claim 9～11, wherein,
Described electrode length L is set at 30～250 μ m.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/067765 WO2009034628A1 (en) | 2007-09-12 | 2007-09-12 | Solder precoated substrate, mounting substrate, and solder precoating method |
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| CN101681891A true CN101681891A (en) | 2010-03-24 |
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| CN200780053397A Pending CN101681891A (en) | 2007-09-12 | 2007-09-12 | Solder precoated substrate, mounting substrate, and solder precoating method |
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| Country | Link |
|---|---|
| JP (1) | JPWO2009034628A1 (en) |
| KR (1) | KR100931508B1 (en) |
| CN (1) | CN101681891A (en) |
| TW (1) | TWI479967B (en) |
| WO (1) | WO2009034628A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281751A (en) * | 2010-05-20 | 2011-12-14 | 松下电器产业株式会社 | mounting structure |
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| JP5960633B2 (en) | 2013-03-22 | 2016-08-02 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method and semiconductor device |
| JP2014195124A (en) * | 2014-06-30 | 2014-10-09 | Dainippon Printing Co Ltd | Manufacturing method of component incorporated wiring board |
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| JP2867969B2 (en) * | 1996-07-12 | 1999-03-10 | 日本電気株式会社 | Manufacturing method of printed wiring board |
| JP2001135667A (en) * | 1999-08-26 | 2001-05-18 | Seiko Epson Corp | Method of forming bump, mold to be used therein, semiconductor device, its manufacturing method, circuit board and electronic apparatus |
| JP2002050857A (en) * | 2000-07-31 | 2002-02-15 | Kyocera Corp | Connecting structure of electronic part and circuit board |
| JP2003007902A (en) * | 2001-06-21 | 2003-01-10 | Shinko Electric Ind Co Ltd | Electronic component mounting substrate and mounting structure |
| JP4769022B2 (en) * | 2005-06-07 | 2011-09-07 | 京セラＳｌｃテクノロジー株式会社 | Wiring board and manufacturing method thereof |
| JP2007073617A (en) * | 2005-09-05 | 2007-03-22 | Tamura Seisakusho Co Ltd | Electrode structure, substrate for packaging, projection electrode, and manufacturing method thereof |
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2007
- 2007-09-12 CN CN200780053397A patent/CN101681891A/en active Pending
- 2007-09-12 KR KR1020077025595A patent/KR100931508B1/en active IP Right Grant
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281751A (en) * | 2010-05-20 | 2011-12-14 | 松下电器产业株式会社 | mounting structure |
| CN102281751B (en) * | 2010-05-20 | 2014-04-16 | 松下电器产业株式会社 | Mounting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200913833A (en) | 2009-03-16 |
| JPWO2009034628A1 (en) | 2010-12-16 |
| KR100931508B1 (en) | 2009-12-15 |
| TWI479967B (en) | 2015-04-01 |
| KR20080094753A (en) | 2008-10-24 |
| WO2009034628A1 (en) | 2009-03-19 |
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