CN101648304A - Return air device for reflow soldering - Google Patents
Return air device for reflow soldering Download PDFInfo
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- CN101648304A CN101648304A CN200910115688A CN200910115688A CN101648304A CN 101648304 A CN101648304 A CN 101648304A CN 200910115688 A CN200910115688 A CN 200910115688A CN 200910115688 A CN200910115688 A CN 200910115688A CN 101648304 A CN101648304 A CN 101648304A
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- reflow soldering
- air
- returning device
- return passage
- outer chamber
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Abstract
The invention discloses a return air device for reflow soldering, which comprises an inner cavity (1), an outer cavity (2) and a gas transmission power unit (3). The device is characterized in that the inner cavity (1) and the outer cavity (2) are mutually separated; and the outer cavity (2) is communicated with the gas output end of the gas transmission power unit. The device realizes the circulating return-air heating, so that the reflow soldering furnace has the advantages of even temperature and stable air flow so as to enhance the quality of the soldering joints and the appearance effectof the circuit boards. The device can be used in the technical field of circulating hot-air heating for reflow soldering.
Description
Technical field
The invention belongs to reflow soldering gas heating technique of backflow field, be specifically related to the air-returning device that a kind of heating that circulates makes things convenient for the reflow soldering of return air.
Background technology
Surface mounting technology (SMT) can carry out full-automatic production scale, can carry out mount components on the two sides of PCB, to realize High Density Packaging; Even the element of minimum dimension can realize that also precision mounts, therefore can produce high-quality PCB assembly.Surface installation technique (SMT) can be divided into two types of Reflow Soldering and wave-solderings according to welding manner.
General surface mount elements all adopts Reflow Soldering to mount.At first, utilize printing machine to scrape solder(ing) paste at the pad on the printed circuit board (PCB); Then, with chip mounter surface mount elements is pressed on the corresponding welding position of printed circuit board (PCB) and fit with solder(ing) paste; At last, the printed circuit board (PCB) that posts element being sent into reflow soldering welds.Reflow soldering adopts the internal-circulation type heating system of a plurality of temperature provinces, because solder(ing) paste adopts multiple alloy material to constitute, different temperatures and time can cause the different variations of tin cream state.Solder(ing) paste is fused into liquid state in the high-temperature region, and surface mount elements is easy and solder(ing) paste is combined; After entering the cooling zone, solder(ing) paste is frozen into solid-state, and the pin and the printed circuit board (PCB) of surface mount elements is integrally welded firmly.
And reflow soldering is divided into following several stages according to the improvement of its mode of heating and equipment:
Hot plate (Hot-plate) and push-plate type hot plate conduction Reflow Soldering: this class reflow soldering relies on the thermal source heating under conveyer belt or the push pedal, by the element on the heat conducting mode heated substrates, is used for adopting pottery (Al
2O
3) the single face assembling of substrate thick film circuit, having only on the ceramic substrate to paste to be placed on the conveyer belt just can obtain enough heats, it is simple in structure, low price.The infrared radiation Reflow Soldering: this type of reflow soldering also mostly is conveyor type, but conveyer belt only works to support, transmit substrate, its mode of heating mainly heats with radiation mode according to infrared heat reservoir, temperature in the burner hearth is more even than preceding a kind of mode, mesh is bigger, is suitable for the substrate of two-sided assembling is carried out the reflow soldering heating.Because heating is convenient, this class reflow soldering is the basic model of present reflow soldering.Infraredly add hot blast (Hot air) Reflow Soldering: this class reflow soldering is to add that on the basis of IR stove hot blast makes more uniform temperature in the stove, when using infrared radiation heating merely, it is found that in same heating environment, different materials and color absorption heat are different, for example the encapsulation of SMD such as IC is the phenolic aldehyde or the epoxy of black, and lead-in wire is the metal of white, and when heating merely, the temperature of lead-in wire is lower than the SMD body of its black.Can make more uniform temperature after adding hot blast, and overcome differences in absorbed heat and shade unfavorable condition, the reflow soldering of IR Hot air once used very generally in the world.
Along with the development of technology with to the attention of the protection of environment, the reflow soldering of full hot blast mode of heating more and more comes into one's own.The air-returning device of Reflow Soldering comprises fan motor in the prior art, centrifugal fan and heating homogenizing plate, and there is non-uniform temperature in air-returning device in the prior art, and the jiggly situation of air quantity, butt welding point quality and outward appearance produce harmful effect.The present invention comes therefrom.
Summary of the invention
The object of the invention is to provide a kind of air-returning device of reflow soldering, has solved that there is non-uniform temperature in the air-returning device of reflow soldering in the prior art, the jiggly situation of air quantity, and butt welding point quality and outward appearance produce problems such as harmful effect.
In order to solve these problems of the prior art, technical scheme provided by the invention is:
A kind of air-returning device of reflow soldering, the interior outer chamber and the gas power delivery unit that is provided with thermal source or low-temperature receiver that comprise mutual isolation, it is characterized in that described inner chamber body is communicated with the gas input of described gas power delivery unit, described outer chamber is communicated with the gas output end of described gas power delivery unit.
Preferably, described gas power delivery unit is a centrifugal fan, described fan center communication with cavity body; Described blast fan is communicated with outer chamber.
Preferably, described inner chamber body comprises hollow tube, and the two ends of described hollow tube are provided with return passage respectively, and described return passage communicates with hollow tube and reflow soldering burner hearth respectively; Offering fan center's through hole on the described hollow tube is communicated with fan center.
Preferably, described outer chamber is the hollow box of both sides, the division board that setting on four sides of described box body and return passage and adjacent air-returning device are isolated, described box body top board are provided with the impeller through hole of placing blast fan, and described box bottom is provided with homogenizing plate and communicates with the reflow soldering burner hearth; Described homogenizing plate is connected with securing member with air-returning device.
Preferably, described outer chamber is arranged on the inner chamber body outside, and by hollow tube and division board and inner chamber body isolation.
Preferably, described hollow tube is a hollow square tube, and fixedly division board of welding is passed through at described hollow tube two ends, and communicates with return passage.
Preferably, described thermal source or low-temperature receiver are fixed on fan center, are transported in the outer chamber by blast fan after thermal source or low-temperature receiver heating through the gas that inner chamber body refluxes.
Preferably, described homogenizing plate is an aluminium sheet, evenly offers a plurality of wind hole on the described aluminium sheet.
Preferably, described return passage is the return passage that the top board of division board and outer chamber forms, and in described return passage one side and the hollow tube that return passage communicates thermal source or low-temperature receiver is set, and described thermal source or low-temperature receiver two ends and return passage are fixed.
Preferably, the rear end that described fan motor is arranged on blast fan provides rotary power for impeller, also offers wind-supplying mouth on the top board of described outer chamber.
Reflow soldering carry out circuit board when welding require in the stove air quantity steadily, temperature meets and sets and keep stable, and reflow soldering does not reach this requirement in the prior art, on the top board of the present invention by outer chamber centrifugal fan is housed, fan center's arranged beneath has thermal source or low-temperature receiver, original gas make-up has been passed through heating or cooling to the depression of fan center in the stove in the course of conveying; This gas is outwards motion under the fan centrifugal action, and warp is transported in the stove stably with the distributed uniform of the porous aluminium sheet that outer chamber is fixed, and this gas attracted to fan center once more afterwards.Whole device constitutes a loop, and furnace gas is constantly circulated, in the stove temperature difference be controlled at ± 2 ℃, reach the circuit board welding requirements.
Than solution of the prior art, advantage of the present invention is:
1. pass through in the technical solution of the present invention cavity different with input with the output of gas power delivery unit is set,,, carry gas, make gas circulation heating in the reflow soldering by outer chamber by inner chamber body return air as interior outer chamber; And between outer chamber and reflow soldering burner hearth, homogenizing plate is set, and by homogenizing plate gas in the burner hearth is evenly heated, reduce the temperature contrast in the burner hearth.More preferred, described gas power delivery unit is a centrifugal fan, and the thermal source that is provided with by the fan center below heats the gas that refluxes, and the gas after will being heated by blast fan is transported in the outer chamber; After the gas output after the heating, fan center forms depression, and gas backstreaming to the fan center that can order about in the inner chamber body heats, so circulation.Through experiment confirm, of the present invention loop back wind apparatus make that temperature gap is controlled in the reflow soldering burner hearth of hot blast of the present invention heating back ± 2 ℃, satisfy the circuit board welding requirements.
In the preferred technical solution of the present invention owing between outer chamber and reflow soldering burner hearth, homogenizing plate is set, derive hot blast by the wind hole of even setting, hot blast can be with the heat uniform heating to printed circuit board (PCB); Described return passage and outer chamber are isolated, and reduce hot blast and the interior not gas heat exchange of heating of return passage in the outer chamber, reduce thermal loss; Hot blast stirs through the centrifugal fan wind wheel before blowing to homogenizing plate, and is more even from the hot blast temperature that homogenizing plate blows out.
3. the compensation of the preferred technical solution of the present invention gas is fast, thermal source or low-temperature receiver are set in the described hollow tube, with gas after the printed circuit board (PCB) heat exchange in return passage is got back to the hollow tube of inner chamber body, heat by thermal source or the low-temperature receiver that is provided with in the hollow tube, make gas reach required temperature, transport out through blast fan again.
4. optimal technical scheme air-returning device maintenance of the present invention is convenient, and thermal source or low-temperature receiver are arranged in the hollow tube, just can easily plug by the return passage that is connected with hollow tube one end; Centrifugal fan is connected with interior outer chamber, can realize the whole plug of centrifugal fan, has made things convenient for maintenance.
In sum, the air-returning device of reflow soldering of the present invention splits by interior outer chamber and gas power delivery unit input and output, realize the heating of circulation return air, make that reflow soldering temperature of the present invention is even, air quantity is steady, improved the quality of welding spot and the appearance of circuit board, can be applied in the circulating air technical field of heating of reflow soldering.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is the air-returning device perspective view of embodiment of the invention reflow soldering;
Fig. 2 is the air-returning device front view of embodiment of the invention reflow soldering;
Fig. 3 is the air-returning device rearview of embodiment of the invention reflow soldering;
Fig. 4 is the air-returning device upward view of embodiment of the invention reflow soldering;
Fig. 5 is the air-returning device left view of embodiment of the invention reflow soldering;
Fig. 6 is the assembling schematic diagram of the air-returning device of embodiment of the invention reflow soldering;
Fig. 7 is the A place enlarged drawing of Fig. 6;
Fig. 8 is another assembling schematic diagram of air-returning device of embodiment of the invention reflow soldering;
Fig. 9 is the B place enlarged drawing of Fig. 8.
Wherein: 1 is inner chamber body, and 2 is outer chamber, and 3 is gas power delivery unit, centrifugal fan, and 4 is reflow soldering;
11 is hollow tube, and 12 is return passage, and 13 is fan center's through hole, and 21 is division board, and 22 is top board, and 23 is the impeller through hole, and 24 is homogenizing plate, and 25 is the wind hole, and 26 is wind-supplying mouth.
The specific embodiment
Below in conjunction with specific embodiment such scheme is described further.Should be understood that these embodiment are used to the present invention is described and are not limited to limit the scope of the invention.The implementation condition that adopts among the embodiment can be done further adjustment according to the condition of concrete producer, and not marked implementation condition is generally the condition in the normal experiment.
Embodiment such as Fig. 1～9, the air-returning device of this reflow soldering, comprise the interior outer chamber 1,2 of mutual isolation and be provided with the gas power delivery unit 3 of thermal source or low-temperature receiver, described inner chamber body 1 is communicated with the gas input of described gas power delivery unit, and described outer chamber 2 is communicated with the gas output end of described gas power delivery unit.
This gas power delivery unit 3 is a centrifugal fan, described fan center communication with cavity body 1; Described blast fan is communicated with outer chamber 2.Described inner chamber body 1 comprises hollow tube 11, and the two ends of described hollow tube 11 are provided with return passage 12 respectively, and described return passage 12 communicates with hollow tube and reflow soldering burner hearth respectively; Offering fan center's through hole 13 on the described hollow tube is communicated with fan center.Described outer chamber 2 is the hollow box of both sides, described box body is provided with the division board 21 of isolating with return passage 12 and adjacent air-returning device on four sides, described box body top board 22 is provided with the impeller through hole 23 of placing blast fan, and described box bottom is provided with homogenizing plate 24 and communicates with the reflow soldering burner hearth.
Be communicated with the gas power delivery unit by the interior outer chamber of isolating in this device, by behind gas power delivery unit such as the centrifugal fan heat air delivery again fan center form low pressure, make in the reflow soldering with the printed circuit board (PCB) heat exchange after gas backstreaming to fan center, be transported in the outer chamber by blast fan again after thermal source that is provided with by the fan center lower end or low-temperature receiver heat, export to by homogenizing plate in the burner hearth of reflow soldering.
Present embodiment air-returning device circulating air heating has made full use of the heat that thermal source provides, and has evenly exported through homogenizing plate, has reduced the difference of temperature in the reflow soldering burner hearth, make its temperature contrast be controlled at ± 2 ℃ of scopes in, satisfy the circuit board welding requirements.
Above-mentioned example only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All spirit essence is done according to the present invention equivalent transformation or modification all should be encompassed within protection scope of the present invention.
Claims (10)
1. the air-returning device of a reflow soldering, comprise the interior outer chamber (1,2) of mutual isolation and be provided with the gas power delivery unit (3) of thermal source or low-temperature receiver, it is characterized in that described inner chamber body (1) is communicated with the gas input of described gas power delivery unit, described outer chamber (2) is communicated with the gas output end of described gas power delivery unit.
2, the air-returning device of reflow soldering according to claim 1 is characterized in that described gas power delivery unit (3) is a centrifugal fan, described fan center's communication with cavity body (1); Described blast fan is communicated with outer chamber (2).
3, the air-returning device of reflow soldering according to claim 1, it is characterized in that described inner chamber body (1) comprises hollow tube (11), the two ends of described hollow tube (11) are provided with return passage (12) respectively, and described return passage (12) communicates with hollow tube and reflow soldering burner hearth respectively; Offering fan center's through hole (13) on the described hollow tube is communicated with fan center.
4, the air-returning device of reflow soldering according to claim 1, it is characterized in that described outer chamber (2) is the hollow box of both sides, described box body is provided with the division board (21) of isolating with return passage (12) and adjacent air-returning device on four sides, described box body top board (22) is provided with the impeller through hole (23) of placing blast fan, and described box bottom is provided with homogenizing plate (24) and communicates with the reflow soldering burner hearth.
5, the air-returning device of reflow soldering according to claim 1 is characterized in that described outer chamber (2) is arranged on inner chamber body (1) outside, and isolates with inner chamber body (1) by hollow tube (11) and division board (21).
6, the air-returning device of reflow soldering according to claim 1 is characterized in that described hollow tube (11) is a hollow square tube, and fixedly division board (21) of welding is passed through at described hollow tube two ends, and communicates with return passage (12).
7, the air-returning device of reflow soldering according to claim 1 is characterized in that described thermal source or low-temperature receiver are fixed on fan center, is transported in the outer chamber (2) by blast fan after thermal source or low-temperature receiver heating through the gas that inner chamber body (1) refluxes.
8, the air-returning device of reflow soldering according to claim 1 is characterized in that described homogenizing plate (24) is an aluminium sheet, evenly offers a plurality of wind hole (25) on the described aluminium sheet.
9, the air-returning device of reflow soldering according to claim 1, it is characterized in that the return passage of described return passage (12) for the top board formation of division board (21) and outer chamber, in described return passage one side and the hollow tube that return passage communicates thermal source or low-temperature receiver are set, described thermal source or low-temperature receiver two ends and return passage are fixed.
10, the air-returning device of reflow soldering according to claim 1 is characterized in that the rear end that described fan motor is arranged on blast fan provides rotary power for impeller, also offers wind-supplying mouth (26) on the top board of described outer chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910115688A CN101648304A (en) | 2009-07-09 | 2009-07-09 | Return air device for reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910115688A CN101648304A (en) | 2009-07-09 | 2009-07-09 | Return air device for reflow soldering |
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| Publication Number | Publication Date |
|---|---|
| CN101648304A true CN101648304A (en) | 2010-02-17 |
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ID=41670686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910115688A Pending CN101648304A (en) | 2009-07-09 | 2009-07-09 | Return air device for reflow soldering |
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| CN (1) | CN101648304A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102794525A (en) * | 2011-05-24 | 2012-11-28 | 上海朗仕电子设备有限公司 | Mechanism capable of performing high/low speed switching through overrun clutches for reflow furnace |
| CN103079739A (en) * | 2010-06-28 | 2013-05-01 | 伊利诺斯工具制品有限公司 | Compression box for reflow oven heating and related method |
| US9161459B2 (en) | 2014-02-25 | 2015-10-13 | Illinois Tool Works Inc. | Pre-heater latch and seal mechanism for wave solder machine and related method |
| US9198300B2 (en) | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
| CN106802082A (en) * | 2017-03-07 | 2017-06-06 | 东莞市创威自动化科技有限公司 | It is a kind of to be easy to cleaning maintenance, the heating furnace of high energy efficiency |
| CN108237296A (en) * | 2016-12-26 | 2018-07-03 | 上海朗仕电子设备有限公司 | A kind of reflow soldering cooling module of the flat coil pipe of band |
| CN109299584A (en) * | 2018-12-07 | 2019-02-01 | 锐捷网络股份有限公司 | Temperature recommended method, equipment and storage medium in reflow soldering |
-
2009
- 2009-07-09 CN CN200910115688A patent/CN101648304A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079739A (en) * | 2010-06-28 | 2013-05-01 | 伊利诺斯工具制品有限公司 | Compression box for reflow oven heating and related method |
| CN103079739B (en) * | 2010-06-28 | 2016-05-04 | 伊利诺斯工具制品有限公司 | For discharge chambe and the correlation technique of reflow ovens heating |
| CN102794525A (en) * | 2011-05-24 | 2012-11-28 | 上海朗仕电子设备有限公司 | Mechanism capable of performing high/low speed switching through overrun clutches for reflow furnace |
| CN102794525B (en) * | 2011-05-24 | 2014-12-03 | 上海朗仕电子设备有限公司 | Mechanism capable of performing high/low speed switching through overrun clutches for reflow furnace |
| US9198300B2 (en) | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
| US9161459B2 (en) | 2014-02-25 | 2015-10-13 | Illinois Tool Works Inc. | Pre-heater latch and seal mechanism for wave solder machine and related method |
| US9427819B2 (en) | 2014-02-25 | 2016-08-30 | Illinois Tool Works Inc. | Pre-heater latch and seal mechanism for wave solder machine and related method |
| CN108237296A (en) * | 2016-12-26 | 2018-07-03 | 上海朗仕电子设备有限公司 | A kind of reflow soldering cooling module of the flat coil pipe of band |
| CN106802082A (en) * | 2017-03-07 | 2017-06-06 | 东莞市创威自动化科技有限公司 | It is a kind of to be easy to cleaning maintenance, the heating furnace of high energy efficiency |
| CN109299584A (en) * | 2018-12-07 | 2019-02-01 | 锐捷网络股份有限公司 | Temperature recommended method, equipment and storage medium in reflow soldering |
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Open date: 20100217 |