CN101533319B - Touch panel and manufacture method thereof - Google Patents
Touch panel and manufacture method thereof Download PDFInfo
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- CN101533319B CN101533319B CN2008100837720A CN200810083772A CN101533319B CN 101533319 B CN101533319 B CN 101533319B CN 2008100837720 A CN2008100837720 A CN 2008100837720A CN 200810083772 A CN200810083772 A CN 200810083772A CN 101533319 B CN101533319 B CN 101533319B
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Abstract
The invention relates to a touch panel and a manufacture method thereof. The touch panel comprises a substrate, a resistance layer, a plurality of signal terminals, a conductive circuit layer, an insulation layer and a plurality of signal wires. The substrate is provided with a touch area and a circumference area; the signal terminals are arranged at the circumference area and electrically connected with the resistance layer; the conductive circuit layer is arranged at the circumference area and electrically connected with the resistance layer. The insulation layer is arranged on the signal terminals and the conductive circuit layer; the signal wires are arranged on the insulation layer and correspondingly and electrically connected with each signal terminal respectively. According to the touch panel and the manufacture method thereof, the signal wires can be effectively isolated from the conductive circuit layer and the resistance layer by the insulation layer and the size of the touch panel can be shortened by the piling in the vertical direction, thus achieving the object of miniaturization. Furthermore, the manufacture method can reduce the cost as the method needs not the cutting step and cutting equipment.
Description
Technical field
The present invention is about a kind of contact panel and preparation method thereof.
Background technology
In recent years; Contact panel has been widely used on the general consumer electronics commodity gradually; For example device for mobile communication, digital camera, digital music player (MP3), personal digital aid (PDA) (PDA), satellite navigator (GPS), palmtop computer (hand-held PC); Even brand-new super removable computer (Ultra Mobile PC, UMPC) etc.And along with the trend of product miniaturization, the area that how to dwindle contact panel also becomes crucial problem.
A kind of known contact panel 1 is as shown in Figure 1, and its part sectioned view is as shown in Figure 2.Contact panel 1 comprises substrate 11, resistive layer 12, order wire circuit layer 13, a plurality of signal end 14, protective seam 15 and many signal line 17.Substrate 11 has Touch Zone T1 and surrounding zone P1, and surrounding zone P1 is located on Touch Zone T1.Resistive layer 12 is arranged at the Touch Zone T1 and the surrounding zone P1 of substrate 11.Order wire circuit layer 13 is arranged at surrounding zone P1 with signal end 14, and links with resistive layer 12, and signal end 14 is positioned at the corner of resistive layer 12.Protective seam 15 coats order wire circuit layer 13 and signal end 14, to reach the effect of protection.One end of signal wire 17 and signal end 14 electrically connect, and the other end of signal wire 17 and winding displacement 18 electrically connect.
The start principle of contact panel 1 is following: when 13 charging of order wire circuit layer, whole resistive layer 12 can produce and be the electric field that equipotential line distributes.When the user presses a wherein position of resistive layer 12; The electric field of resistive layer 12 can change; And the signal end 14 that is positioned at four corners is according to changing and produce signal, and is sent to the rear end through signal wire 17 and winding displacement 18 and carries out signal Processing, to learn user's pressing position.
Because signal wire 17 is in order to transmit signal, so it must be isolated with order wire circuit layer 13 and resistive layer 12.The mode of known isolated employing has two kinds: first kind is that signal wire 17 is made in outside the scope of resistive layer 12, but this can make whole size become big; Second kind is through the cut mode signal wire 17 and order wire circuit layer 13 and resistive layer 12 to be separated, but this can increase the complexity of technology and the cost of cutter sweep.
Summary of the invention
Because above-mentioned problem, the object of the invention be provide a kind of can minification and need not use extra processing step and equipment, reach miniaturization and the contact panel that reduces cost and preparation method thereof.
For reaching above-mentioned purpose, comprise a substrate, a resistive layer, a plurality of signal end, an order wire circuit layer, an insulation course and many signal line according to a kind of contact panel of the present invention.Substrate has a Touch Zone and a surrounding zone, and signal end is arranged at the surrounding zone and electrically connects with resistive layer, and the order wire circuit layer is arranged at the surrounding zone and electrically connects with resistive layer.Insulation course is arranged on signal end and the order wire circuit layer, and signal wire is arranged on the insulation course, and corresponding with each signal end respectively electric connection.
For reaching above-mentioned purpose, the method for making of complying with a kind of contact panel of the present invention comprises following steps: form a resistive layer on a substrate, substrate has a Touch Zone and a surrounding zone; Form an order wire circuit layer in the surrounding zone, and electrically connect with resistive layer; Form a plurality of signal ends in this surrounding zone, and electrically connect with resistive layer; Form an insulation course on order wire circuit layer and these signal ends; And form many signal line on insulation course, and corresponding with each signal end respectively electric connection.
Hold the above; According to contact panel of the present invention and preparation method thereof insulation course is formed on signal end and the order wire circuit layer; Again signal wire is formed on the insulation course; So signal wire can completely cut off through insulation course and with order wire circuit layer and resistive layer effectively, and piling up of vertical direction and the size of dwindling contact panel thus, reach the purpose of miniaturization.In addition, the present invention need not carry out cutting step and also need not cutting equipment, so can reduce cost.
Description of drawings
Fig. 1 is a kind of synoptic diagram of known contact panel;
Fig. 2 is the part sectioned view of the contact panel of Fig. 1;
Fig. 3 A to Fig. 3 C is the different aspect synoptic diagram according to the contact panel of first embodiment of the invention;
Fig. 4 A and Fig. 4 B are the different aspect synoptic diagram according to the contact panel of second embodiment of the invention; And
Fig. 5 A and Fig. 5 B are the different aspect synoptic diagram according to the contact panel of third embodiment of the invention.
Description of reference numerals
1～4,2A, 2B, 3A, 4A: contact panel
11,21,31,41: substrate
12,22,22A, 22B, 32,42: resistive layer
13,23,33,43: the order wire circuit layer
14,24,34,44: signal end
35,35A, 45,45A: dielectric layer
16,26,36,46: protective seam
17,27,27A, 27B, 37,47: signal wire
18,28: winding displacement
29,29A, 29B, 39,49: insulation course
H: perforation
P1, P2, P3, P4: surrounding zone
T1, T2, T3, T4: Touch Zone
Embodiment
Below will contact panel according to the preferred embodiment of the present invention and preparation method thereof be described with reference to relevant indicators.Wherein components identical will be with identical symbolic representation.
First embodiment
Fig. 3 A shows the contact panel 2 of first embodiment of the invention.Contact panel 2 comprises a substrate 21, a resistive layer 22, an order wire circuit layer 23, a plurality of signal end 24, an insulation course 29, many signal line 27.
Order wire circuit layer 23 all is formed at surrounding zone P2 with signal end 24, and electrically connects with resistive layer 22, and order wire circuit layer 23 is a noncontinuous electrode.Signal end 24 is corner electrode (corner electrode), and contact panel 2 is applied voltage and received current, and forms simultaneously with order wire circuit layer 23.In the present embodiment, resistive layer 22 covers order wire circuit layer 23 and signal end 24.Order wire circuit layer 23 and signal end 24 can be formed at substrate 21 through coating, printing, applying or plated film mode.The material of order wire circuit layer 23 and signal end 24 can for example be copper or elargol.
In addition, contact panel 2 also comprises a protective seam 26 and a winding displacement 28.Protective seam 26 is formed on signal wire 27 and the insulation course 29, and can be a composite bed at this.The material of protective seam 26 can for example be epoxy resin (epoxy) or silica gel (silicon).Protective seam 26 can be protected order wire circuit layer 23 and signal end 24.Signal wire 27 electrically connects with winding displacement 28, carries out signal Processing to transmit signals to the rear end.
Fig. 3 B shows a kind of variation aspect of contact panel 2.It is one stepped that the insulation course 29A of contact panel 2A becomes, and makes signal wire 27 and signal end 24 electrically connect.
Fig. 3 C shows that the another kind of contact panel 2 changes aspect.The signal wire 27B of contact panel 2B electrically connects via a perforation H and the signal end 24 of insulation course 29B.Its middle punch H can form through etching mode.
Second embodiment
Please with reference to shown in Fig. 4 A, the contact panel 3 of second embodiment of the invention comprises a substrate 31, a resistive layer 32, an order wire circuit layer 33, a plurality of signal end 34 (only showing among the figure), a dielectric layer 35, an insulation course 39, many signal line 37 (only showing among the figure) and a protective seam 36.What need explanation is that dielectric layer 35 is formed on the resistive layer 32.Dielectric layer 35 can comprise at least one hardened layer and/or at least one anti-reflecting layer, and can form hardened layer earlier and form anti-reflecting layer again; Or the formation anti-reflecting layer forms hardened layer more earlier.Wherein the material of this anti-reflecting layer for example is monox (SiO), silicon nitride (SiN) or silicon oxynitride (SiON).In addition, signal wire 37 can be chatted bright mode and signal end 34 electric connections through the foregoing description.
Fig. 4 B shows a kind of variation aspect of contact panel 3.The dielectric layer 35A of contact panel 3A mainly is formed on the resistive layer 32 that is positioned at Touch Zone T3.
The 3rd embodiment
Please with reference to shown in Fig. 5 A, the contact panel 4 of third embodiment of the invention comprises a substrate 41, a resistive layer 42, an order wire circuit layer 43, a plurality of signal end 44 (only showing among the figure), a dielectric layer 45, an insulation course 49, many signal line 47 (only showing among the figure) and a protective seam 46.What need explanation is that resistive layer 42 is formed on the substrate 41.Order wire circuit layer 43 and signal end 44 are formed on the resistive layer 42.Dielectric layer 45 be formed at order wire circuit layer 43, signal end 44 and the resistive layer 42 that exposes to the open air on.Insulation course 49 is formed on the dielectric layer 45, and signal wire 47 is formed on the insulation course 49, and protective seam 46 covers signal wire 47.In addition, signal wire 47 can be chatted bright mode and signal end 44 electric connections through first embodiment.
Fig. 5 B shows a kind of variation aspect of contact panel 4.The dielectric layer 45A of contact panel 4A mainly is formed on the resistive layer 42 that is positioned at Touch Zone T4.
In sum; Contact panel of the present invention and preparation method thereof is formed at insulation course on signal end and the order wire circuit layer; Again signal wire is formed on the insulation course; So signal wire can completely cut off through insulation course and with order wire circuit layer and resistive layer effectively, and piling up of vertical direction and the size of dwindling contact panel thus, reach the purpose of miniaturization.In addition, the present invention need not carry out cutting step and also need not cutting equipment, so can reduce cost.
The above is merely illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the appended claim its equivalent modifications of carrying out or change.
Claims (16)
1. contact panel comprises:
One substrate has a Touch Zone and a surrounding zone;
One resistive layer is formed at this Touch Zone and this surrounding zone;
One order wire circuit layer is arranged at this surrounding zone, and electrically connects with this resistive layer;
A plurality of signal ends are arranged at this surrounding zone, and electrically connect with this resistive layer;
One insulation course is arranged on these signal ends and this order wire circuit layer; And
Many signal line are arranged on this insulation course, and corresponding with each signal end respectively electric connection;
One dielectric layer is arranged on this resistive layer, or is arranged on this resistive layer of this Touch Zone, or be arranged at these signal ends, this order wire circuit layer and this resistive layer of exposing to the open air on;
Wherein this resistive layer covers these signal ends and this order wire circuit layer, and this insulation course is formed on this resistive layer, and this dielectric layer comprises at least one hardened layer and at least one anti-reflecting layer, and the material of this anti-reflecting layer comprises monox, silicon nitride or silicon oxynitride.
2. contact panel as claimed in claim 1, wherein this substrate is glass substrate or plastic base, the material of this resistive layer comprises the metal oxide of indium tin oxide, indium-zinc oxide, aluminium zinc oxide, gallium zinc oxide, zinc paste or conduction.
3. contact panel as claimed in claim 1, wherein the material of these signal ends and this order wire circuit layer comprises elargol or copper.
4. contact panel as claimed in claim 1, wherein this order wire circuit layer is a noncontinuous electrode, and these signal ends are the corner electrode, and this order wire circuit layer and these signal ends form simultaneously.
5. contact panel as claimed in claim 1, wherein this signal wire electrically connects with this signal end via a perforation of this insulation course, and this perforation forms through etching mode.
6. contact panel as claimed in claim 5, wherein this signal end exposes to this insulation course, and it is one stepped that this insulation course is, and makes these signal wires and these signal ends electrically connect.
7. like claim 1 or 6 described contact panels, wherein these signal wires are formed on this insulation course through the screen painting mode, and electrically connect with this signal end respectively respectively.
8. contact panel as claimed in claim 1, it also comprises a protective seam, is arranged on these signal ends and this order wire circuit layer or these signal wires, the material of this protective seam comprises epoxy resin or silica gel.
9. contact panel as claimed in claim 1, wherein these signal wires and a winding displacement electrically connect.
10. the method for making of a contact panel may further comprise the steps:
Form a resistive layer on a substrate, this substrate has a Touch Zone and a surrounding zone;
Form an order wire circuit layer in this surrounding zone, and electrically connect with this resistive layer;
Form a plurality of signal ends in this surrounding zone, and electrically connect with this resistive layer;
Form an insulation course on this order wire circuit layer and these signal ends; And
Form many signal line on this insulation course, and corresponding with each signal end respectively electric connection;
Form a dielectric layer, on this resistive layer, or on this resistive layer of this Touch Zone, or on these signal ends, this order wire circuit layer and this resistive layer of exposing to the open air;
This resistive layer covers these signal ends and this order wire circuit layer, and this insulation course is formed on this resistive layer, and this dielectric layer comprises at least one hardened layer and at least one anti-reflecting layer, and the material of this anti-reflecting layer comprises monox, silicon nitride or silicon oxynitride.
11. method for making as claimed in claim 10, wherein these signal ends and this order wire circuit layer are formed at this surrounding zone of this substrate through coating, printing, applying or plated film mode.
12. method for making as claimed in claim 10, wherein this order wire circuit layer is a noncontinuous electrode, and these signal ends are the corner electrode, and this order wire circuit layer and these signal ends form simultaneously.
13. method for making as claimed in claim 10, wherein this signal end exposes to this insulation course, and it is one stepped that this insulation course is, and makes these signal wires and these signal ends electrically connect.
14. like claim 10 or 13 described method for makings, wherein these signal wires electrically connect through screen painting mode and these signal ends.
15. method for making as claimed in claim 10, it also comprises formation one protective seam on these signal ends, and the material of this protective seam comprises epoxy resin or silica gel.
16. method for making as claimed in claim 10, it also comprises these signal wires of electric connection and a winding displacement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100837720A CN101533319B (en) | 2008-03-12 | 2008-03-12 | Touch panel and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100837720A CN101533319B (en) | 2008-03-12 | 2008-03-12 | Touch panel and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101533319A CN101533319A (en) | 2009-09-16 |
| CN101533319B true CN101533319B (en) | 2012-05-30 |
Family
ID=41103949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100837720A Expired - Fee Related CN101533319B (en) | 2008-03-12 | 2008-03-12 | Touch panel and manufacture method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN101533319B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101082610B1 (en) * | 2009-10-15 | 2011-11-10 | 엘지이노텍 주식회사 | Planer member for touch panel and method for manufacturing same |
| CN102566811B (en) * | 2009-12-28 | 2014-06-11 | 友达光电股份有限公司 | Touch panel fabrication method |
| US9652089B2 (en) | 2010-11-09 | 2017-05-16 | Tpk Touch Solutions Inc. | Touch panel stackup |
| CN103576951B (en) * | 2012-07-24 | 2016-12-28 | 宸鸿科技(厦门)有限公司 | Contact panel, its manufacture method and display device thereof |
| CN108062183B (en) * | 2018-01-03 | 2021-11-05 | 京东方科技集团股份有限公司 | Touch substrate, preparation method thereof and touch panel |
-
2008
- 2008-03-12 CN CN2008100837720A patent/CN101533319B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101533319A (en) | 2009-09-16 |
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