CN103885619B - Touch-control board fabrication method - Google Patents
Touch-control board fabrication method Download PDFInfo
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- CN103885619B CN103885619B CN201210555403.3A CN201210555403A CN103885619B CN 103885619 B CN103885619 B CN 103885619B CN 201210555403 A CN201210555403 A CN 201210555403A CN 103885619 B CN103885619 B CN 103885619B
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Abstract
A kind of touch-control board fabrication method, comprises the steps of：One substrate is provided, in setting a shielding layer on the substrate, and the substrate non-touch-control area is defined as at shielding layer position, and non-shelter is defined as Touch Zone；There is the touch control electrode layer of multiple touch control electrodes in setting one on the substrate；There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；And can significantly save the cost of light shield whereby and the man-hour of overall process can be shortened again commonly through metal routing and the touch control electrode described in the development etch process of gold-tinted twice after touch control electrode layer and metal routing formable layer.
Description
Technical field
A kind of Trackpad of the present invention, it is espespecially a kind of to save the expense of light shield, and then reach the touch-control for saving manufacturing cost
Board fabrication method.
Background technology
As industry is increasingly flourishing, mobile phone (Mobile Phone), personal digital assistant (PersonalDigital
Assistant), the digitisation instrument such as notebook computer (Notebook) and plate computer (Planet Computer) is invariably
Develop towards more convenient, multi-functional and attractive in appearance direction.
However, the display screen in mobile phone, personal digital assistant, notebook computer and plate computer be can not or
Scarce man-machine communication interface, the display screen by the said goods will be able to be that the operation of user brings more facilities, its
In most display screen all with liquid crystal display device as main flow.
In recent years, as information technology, wireless mobile are communicated and the fast-developing and application of information household electrical appliances, in order to reach more
Convenient, volume is more lightly changed and more humane purpose, and many information products are input into by traditional keyboard or slide-mouse etc. and filled
Put, be changed into use contact panel (Touch Panel) as input unit, wherein capacitance touching control formula liquid crystal display device more
For most popular product now.
Above-mentioned touch control type LCD device is referred to as contact panel herein, the contact panel is a kind of stratiform knot
Structure, it includes the structures such as glass substrate, touch control electrode layer, shielding layer, electrode routing layer, insulating barrier and protective layer, foregoing each
Interlayer is the layer structure for mutually stacking, and the glass substrate has Touch Zone and non-touch-control area, and the touch control electrode layer mainly passes through
The mode of sputter is draped over one's shoulders foregoing touch control electrode layer behind the Touch Zone for investing the glass substrate and by way of gold-tinted develops etching
By touch control electrode shaping, then shielding layer is printed in the non-touch-control area on the substrate by way of printing-ink, thereafter again
Former electrodes routing layer is draped over one's shoulders in the way of sputter is invested on the shielding layer, then by gold-tinted development etching mode by the electrode
Cabling is molded, and by the mode of printing-ink, the touch control electrode elongated end and electrode cabling is not correspond in the shielded area
Part, prints dielectric ink to avoid touch control electrode elongated end and be not correspond to the short circuit of electrode cabling, then by way of plated film
In the coating protective layer, known touch surface on foregoing glass substrate, touch control electrode layer, shielding layer, electrode routing layer, insulating barrier
Board fabrication method is molded the touch control electrode and electrode cabling by the processing procedure of sputter and gold-tinted development etching, quite expends light shield
Manufacturing cost, and the time spent during sputter, therefore known contact panel manufacturing process need to expend great amount of cost and manufacture
Time.
The content of the invention
The main object of the present invention is providing a kind of touch-control board fabrication method for saving Trackpad manufacturing man-hours.
Another object of the present invention is providing a kind of touch-control board fabrication method for saving Trackpad manufacturing cost.
It is that, up to above-mentioned purpose, the present invention provides a kind of touch-control board fabrication method, comprises the steps of：
One substrate is provided, in setting a shielding layer on the substrate, and the substrate non-touch is defined as at shielding layer position
Control area, and non-shelter is defined as Touch Zone；
There is the touch control electrode layer of multiple touch control electrodes in setting one on the substrate；
There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；
First carrying out first time gold-tinted development etch process makes the shaping at non-touch-control zone position of metal routing layer described many
Individual metal routing；
Carrying out second gold-tinted development etch process again makes the touch control electrode layer described in non-touch-control area and Touch Zone shaping
Multiple touch control electrodes；
In setting an insulating barrier in the touch control electrode, and the insulating barrier in be formed with the touch control electrode it is multiple electrically
Connecting hole；
There is the conductor layer of multiple plain conductors in being provided with one on the insulating barrier, and it is electrical by the Electrical Connector Hole
Connect the touch control electrode；And
In setting a protective layer on the touch control electrode layer and the conductor layer and the insulating barrier.
By touch-control board fabrication method provided by the present invention, can significantly reduce overall manufacturing man-hours, and because reducing light shield
Using so that reduce manufacture cost.
Brief description of the drawings
The step of Fig. 1 is touch-control board fabrication method first embodiment of the present invention flow chart；
Fig. 2 is the structural representation of touch-control board fabrication method first embodiment of the present invention；
Fig. 3 is the schematic flow sheet of touch-control board fabrication method first embodiment of the present invention；
The step of Fig. 4 is touch-control board fabrication method second embodiment of the present invention flow chart；
Fig. 5 is the structural representation of touch-control board fabrication method second embodiment of the present invention.
Main element symbol description
Substrate 1
Shielding layer 11
Non-touch-control area 12
Touch Zone 13
Touch control electrode layer 14
Touch control electrode 141
Metal routing layer 15
Metal routing 151
Insulating barrier 16
Electrical Connector Hole 161
Plain conductor 17
Protective layer 18
Optical compensating layer 19
Specific embodiment
Above-mentioned purpose of the invention and its structure and characteristic functionally, will give according to the preferred embodiment of institute's accompanying drawings
Explanation.
Fig. 1, Fig. 2, Fig. 3 are referred to, flow chart and knot the step of be contact panel manufacture method first embodiment of the present invention
Structure schematic diagram and manufacturing process schematic diagram, as illustrated, the touch-control board fabrication method, comprises the steps of：
S1：One substrate is provided, in setting a shielding layer on the substrate, and the substrate is defined as at shielding layer position non-
Touch Zone, and non-shelter is defined as Touch Zone；
A substrate 1 is provided, the material of substrate 1 can be the clear sheet made by glass or macromolecular material, and by applying
The mode of cloth ink, in formation shielding layer 11 on the substrate 1, and is defined as non-touch-control by the substrate 1 at the position of shielding layer 11
Area 12, and non-shelter is defined as Touch Zone 13, the substrate 1 that this case is used is its production of the substrate 1 of a clear glass material
Previous operations it is identical with known technology, therefore will not be described in great detail herein.
S2：There is the touch control electrode layer of multiple touch control electrodes in setting one on the substrate；
In the touch control electrode layer 14 is formed on the substrate 1 by way of sputter, the touch control electrode layer 14 is indium tin oxygen
Compound (lndium Tin Oxide, ITO) and indium-zinc oxide and indium tin zinc oxide and hafnium oxide and zinc oxide and aluminum oxide
And the group that aluminium tin-oxide and aluminium zinc oxide and cadmium tin-oxide and cadmium zinc oxide are constituted.
S3：There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；
By way of sputter in formed on the touch control electrode layer 14 metal routing layer 15.
S4：First carrying out first time gold-tinted development etch process makes the shaping at non-touch-control zone position of metal routing layer described
Multiple metal routings；
First time gold-tinted development etch process is carried out to metal routing layer 15, makes metal routing layer 15 in the non-touch
The multiple metal routing 151 of shaping at the control position of area 12, the first time gold-tinted development for metal routing layer 15
The group that the etching solution that etch process is used is made up of phosphate and nitric acid and acetic acid and water.
S5：Carrying out second gold-tinted development etch process again makes the touch control electrode layer in non-touch-control area and Touch Zone shaping institute
State multiple touch control electrodes；
Second gold-tinted development etch process is carried out to the touch control electrode layer 14, makes 13 one-tenth of the non-touch-control area 12 and Touch Zone
The multiple touch control electrode 141 of type, for the erosion that second gold-tinted development etch process of the touch control electrode layer 14 is used
Carve the group that liquid is made up of nitric acid and hydrochloric acid and water.
S6：In setting an insulating barrier in the touch control electrode, and the insulating barrier in the touch control electrode in being formed with multiple
Electrical Connector Hole；
In the touch control electrode and the metal routing in the insulating barrier 16 of junction coating one in the non-touch-control area 12 and right
The insulating barrier 16 carries out wet etching processing procedure, makes to be formed with multiple electric connections in the insulating barrier 16 correspondence touch control electrode 141
Hole 161, the insulating barrier 16 is formed by screen painting and offset printing any of which mode, and the material of the insulating barrier 16 is
A kind of material of dielectric coefficient 2~4, can be used the insulating materials of tool translucency, such as ink, or do not have the insulation material of translucency
Material also can be again inorganic and organic material any of which, the inorganic be silica and silicon nitride and silicon oxynitride and
The group that carborundum and hafnium oxide and aluminum oxide are constituted, the organic material is photoresistance and benzocyclobutene
(enzocyclobutane, BCB) and also alkenes and polyesters and polyalcohols and PEO class and polyphenyl class and resinae and
The group that polyethers and polyketone class are constituted.
S7：There is the conductor layer of multiple plain conductors in being provided with one on the insulating barrier, and by the Electrical Connector Hole
It is electrically connected with the touch control electrode；
Printed by silver paste and sputter any of which mode, on the insulating barrier 16 and the reserved Electrical Connector Hole 161
Middle setting plain conductor 17, makes the touch control electrode 141 for being intended to mutually be electrically connected with and the metal routing 151 be able to electrically connect
Connect.
S8：In setting a protective layer on the touch control electrode layer and the conductor layer and the insulating barrier；
In by way of coating, formation one is protected on touch control electrode layer 151 and metal routing layer 151 and the insulating barrier 16
Sheath 18 is so as to protecting the touch control electrode layer 141 and the insulating barrier 16 and plain conductor 17.
Fig. 4, Fig. 5 are referred to, flow chart and structure are shown the step of be contact panel manufacture method second embodiment of the present invention
It is intended to, as illustrated, the contact panel manufacture method, comprises the steps of：
S1：One substrate is provided, in setting a shielding layer on the substrate, and the substrate is defined as at shielding layer position non-
Touch Zone, and non-shelter is defined as Touch Zone；
S2：There is the touch control electrode layer of multiple touch control electrodes in setting one on the substrate；
S3：There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；
S4：First carrying out first time gold-tinted development etch process makes the shaping at non-touch-control zone position of metal routing layer described
Multiple metal routings；
S5：Carrying out second gold-tinted development etch process again makes the touch control electrode layer in non-touch-control area and Touch Zone shaping institute
State multiple touch control electrodes；
S6：In setting an insulating barrier in the touch control electrode, and the insulating barrier in the touch control electrode in being formed with multiple
Electrical Connector Hole；
S7：There is the conductor layer of multiple plain conductors in being provided with one on the insulating barrier, and by the Electrical Connector Hole
It is electrically connected with the touch control electrode；
S8：In setting a protective layer on the touch control electrode layer and the conductor layer and the insulating barrier.
Only the present embodiment is identical with aforementioned first embodiment part description, therefore be will not be described in great detail herein, only this reality
It is step S2 that example is applied with not existing together for aforementioned first embodiment：There is the touch-control electricity of multiple touch control electrodes in setting one on the substrate
Pole layer；With step S3：There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；Between also have one
Step S2-1：An optical compensating layer is formed in the Touch Zone non-touch-control area；Set on the substrate by sputtering way
State optics optical compensating layer 19.
Manufacturing man-hours can be greatly decreased by contact panel manufacture method of the invention, and reduce the use of light shield, and then
Reduce overall manufacturing cost.
The above, the present invention has the advantages that following compared to known technology：
1. manufacturing cost is reduced；
2. the use of light shield is reduced.
Press, the above, preferred embodiment only of the invention, only feature of the invention be not limited thereto, appoint
What is familiar with this those skilled in the art in field of the present invention, can think easily and change or modification, should all cover of the invention below
In claim.
Claims (9)
1. a kind of touch-control board fabrication method, comprises the steps of：
One substrate is provided, in setting a shielding layer on the substrate, and the substrate non-touch-control area is defined as at shielding layer position,
And non-shelter is defined as Touch Zone；
There is the touch control electrode layer of multiple touch control electrodes in setting one on the substrate；
An optical compensating layer is formed in the Touch Zone non-touch-control area, wherein, it is described in setting on the substrate by sputtering way
Optical compensating layer；
There is the metal routing layer of multiple metal routings in setting one on the touch control electrode layer；
First carrying out first time gold-tinted development etch process makes metal routing layer that the multiple gold is molded at non-touch-control zone position
Category cabling；
Carrying out second gold-tinted development etch process again makes the touch control electrode layer the multiple in non-touch-control area and Touch Zone shaping
Touch control electrode；
In setting an insulating barrier in the touch control electrode, and the insulating barrier is in being formed with multiple electric connections in the touch control electrode
Hole；
There is the conductor layer of multiple plain conductors in being provided with one on the insulating barrier, and be electrically connected with by the Electrical Connector Hole
The touch control electrode；And
In setting a protective layer on the touch control electrode layer and the conductor layer and the insulating barrier.
2. touch-control board fabrication method as claimed in claim 1, wherein the touch control electrode layer is formed by way of sputter,
And its touch control electrode layer is indium tin oxide lndium Tin Oxide, ITO and indium-zinc oxide and indium tin zinc oxide and oxygen
Change hafnium and zinc oxide and aluminum oxide and aluminium tin-oxide and aluminium zinc oxide and cadmium tin-oxide and cadmium zinc oxide constituted
Group.
3. touch-control board fabrication method as claimed in claim 1, wherein the shielding layer is formed by way of being coated with ink.
4. touch-control board fabrication method as claimed in claim 1, wherein metal routing layer is formed by way of sputter.
5. touch-control board fabrication method as claimed in claim 1, wherein the insulating barrier by screen painting and offset printing its
In it is any.
6. touch-control board fabrication method as claimed in claim 1, wherein the protective layer be inorganic and organic material wherein
It is any, and the group that its inorganic is made up of silica and silicon nitride and silicon oxynitride and carborundum and hafnium oxide and aluminum oxide
Group, the organic material is photoresistance and benzocyclobutene enzocyclobutane, BCB and goes back alkenes and polyesters and polyalcohols
And the group that PEO class and polyphenyl class and resinae and polyethers and polyketone class are constituted.
7. touch-control board fabrication method as claimed in claim 1, wherein the insulating barrier be inorganic and organic material wherein
It is any, and the group that its inorganic is made up of silica and silicon nitride and silicon oxynitride and carborundum and hafnium oxide and aluminum oxide
Group, the organic material is photoresistance and benzocyclobutene enzocyclobutane, BCB and goes back alkenes and polyesters and polyalcohols
And the group that PEO class and polyphenyl class and resinae and polyethers and polyketone class are constituted.
8. touch-control board fabrication method as claimed in claim 1, wherein the etching used in the first time gold-tinted developing manufacture process
The group that liquid is made up of phosphate and nitric acid and acetic acid and water, and the etching solution used in second gold-tinted developing manufacture process is
The group that nitric acid and hydrochloric acid and water are constituted.
9. touch-control board fabrication method as claimed in claim 1, wherein conductor layer selection by silver paste printing and sputter its
Middle either type shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555403.3A CN103885619B (en) | 2012-12-19 | 2012-12-19 | Touch-control board fabrication method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210555403.3A CN103885619B (en) | 2012-12-19 | 2012-12-19 | Touch-control board fabrication method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103885619A CN103885619A (en) | 2014-06-25 |
| CN103885619B true CN103885619B (en) | 2017-05-31 |
Family
ID=50954552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210555403.3A Active CN103885619B (en) | 2012-12-19 | 2012-12-19 | Touch-control board fabrication method |
Country Status (1)
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| CN (1) | CN103885619B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325618A (en) * | 2015-06-18 | 2017-01-11 | 宸鸿光电科技股份有限公司 | Touch panel |
| CN112462965A (en) * | 2019-09-09 | 2021-03-09 | 苏州维业达触控科技有限公司 | Multilayer conductive film and method for manufacturing same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM414616U (en) * | 2010-11-09 | 2011-10-21 | Tpk Touch Solutions Inc | Touch panel stackup |
| TW201205398A (en) * | 2010-07-30 | 2012-02-01 | Chimei Innolux Corp | Display system having capacitive touch panel and manufacturing method thereof |
| TW201250557A (en) * | 2011-06-07 | 2012-12-16 | Rtr Tech Technology Co Ltd | Manufacturing method of touch panel |
-
2012
- 2012-12-19 CN CN201210555403.3A patent/CN103885619B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201205398A (en) * | 2010-07-30 | 2012-02-01 | Chimei Innolux Corp | Display system having capacitive touch panel and manufacturing method thereof |
| TWM414616U (en) * | 2010-11-09 | 2011-10-21 | Tpk Touch Solutions Inc | Touch panel stackup |
| TW201250557A (en) * | 2011-06-07 | 2012-12-16 | Rtr Tech Technology Co Ltd | Manufacturing method of touch panel |
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| Publication number | Publication date |
|---|---|
| CN103885619A (en) | 2014-06-25 |
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