CN101458975B - 电子元件 - Google Patents
电子元件 Download PDFInfo
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- CN101458975B CN101458975B CN2007101251026A CN200710125102A CN101458975B CN 101458975 B CN101458975 B CN 101458975B CN 2007101251026 A CN2007101251026 A CN 2007101251026A CN 200710125102 A CN200710125102 A CN 200710125102A CN 101458975 B CN101458975 B CN 101458975B
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000002041 carbon nanotube Substances 0.000 claims description 63
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 58
- 239000002238 carbon nanotube film Substances 0.000 claims description 38
- 239000011159 matrix material Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 239000002048 multi walled nanotube Substances 0.000 claims description 6
- 239000002079 double walled nanotube Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005411 Van der Waals force Methods 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
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- 239000010931 gold Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012634 fragment Substances 0.000 claims 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 abstract description 21
- 238000000034 method Methods 0.000 description 19
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
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- 239000000126 substance Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- 229910000640 Fe alloy Inorganic materials 0.000 description 1
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- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- 229910021392 nanocarbon Inorganic materials 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
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- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L31/02—Details
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- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
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- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B82—NANOTECHNOLOGY
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
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- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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Abstract
本发明涉及一种电子元件,该电子元件包括一基体;一透明导电层,该透明导电层设置于上述基体的一表面上。其中,所述的透明导电层包括一碳纳米管层。
Description
技术领域
本发明涉及一种电子元件,尤其涉及一种用于偏振片、电极电池、场发射显示等领域的含有透明导电层的电子元件。
背景技术
从1991年日本科学家Iijima首次发现碳纳米管(Carbon Nanotube,CNT)以来(Iilima S.,Nature,vol 354,p56(1991)),以碳纳米管为代表的纳米材料以其独特的结构和性质引起了人们极大的关注。近几年来,随着碳纳米管及纳米材料研究的不断深入,其广阔应用前景不断显现出来。例如,由于碳纳米管所具有的独特的电磁学、光学、力学、化学性能等,大量有关其在场发射电子源、传感器、新型光学材料、软铁磁材料等领域的应用研究不断被报道。
碳纳米管层是碳纳米管实际应用的一种重要形式。具体地,碳纳米管层已被研究用作场发射源、光电和生物传感器、电池电极、吸波材料、水净化材料、发光材料等。
现有技术中的液晶显示器(LCD)、等离子显示器(PDP)、电致发光显示器(EL/OLED)、触摸屏(Touch Panel)、太阳能电池以及其它电子仪表通常需要一个具有透明导电层的电子元件,该电子元件通常包括一基体和一透明导电层。上述的透明导电层通常采用ITO层。上述的ITO层目前主要采用溅射或蒸镀等方法制备,在制备的过程,需要较高的真空环境及加热到200~300℃,因此,使得ITO层的制备成本较高,从而相应地使的电子元件得成本较高。另外,由于ITO层的机械和化学耐用性不够好及ITO层作透明导电层存在电阻阻值分布不均匀等缺点,导致了现有的电子元件的性能不好。
因此,确有必要提供一种电子元件,该电子元件的透明导电层具有成本低、机械性能优异、阻值分布均匀及透光性好等优点。
发明内容
一种电子元件,该电子元件包括一基体;一透明导电层,该透明导电层设置于上述基体的一表面上。其中,所述透明导电层为由多个碳纳米管组成的至少一碳纳米管层,所述碳纳米管层中的碳纳米管沿固定方向择优取向排列。
与现有技术的电子元件相比较,本技术方案提供的电子元件具有以下优点:其一,由于碳纳米管层具有很好的韧性和机械强度,故,采用碳纳米管层作透明导电层,可以相应的提高电子元件的耐用性。其二,由于碳纳米管层具有较均匀的结构,故,采用碳纳米管层作透明导电层,可使得透明导电层具有均匀的电阻,从而提高电子元件的性能。其三,由于本技术方案的碳纳米管层可通过直接铺设作透明导电层,而无需溅射和加热等工艺,故,降低了电子元件的制作成本。
附图说明
图1是本技术方案实施例的电子元件的结构示意图。
图2是沿图1所示的线II-II’的剖视图。
图3是本技术方案实施例的透明导电层的碳纳米管薄膜的扫描电镜图。
具体实施方式
以下将结合附图详细说明本技术方案的触摸屏及显示装置。
请参阅图1和图2,本技术方案实施例提供一种电子元件30包括一基体22和一透明导电层24。透明导电层24设置在基体22的至少一个表面上。
所述基体22为一曲面型或平面型的结构。该基体22由玻璃、石英、金刚石或塑料等硬性材料或柔性材料形成。所述基体22主要起支撑的作用。
所述透明导电层24包括至少一个碳纳米管层,该碳纳米管层包括无序或有序排列的多个碳纳米管。当碳纳米管层包括多个有序碳纳米管时,所述的多个碳纳米管沿同一方向择优取向排列或沿不同方向择优取向排列或各向同性。具体地,上述碳纳米管层为一个碳纳米管薄膜或多个平行且无间隙铺设的碳纳米管薄膜。
此外,上述的透明导电层24包括至少两个重叠设置的碳纳米管层。每个碳纳米管层中的碳纳米管沿固定方向择优取向排列,相邻的两个碳纳米管层中的沿同一方向排列或沿不同方向排列,具体地,相邻的两个碳纳米管层 中的碳纳米管层具有一交叉角度α,0≤α≤90度,具体可依据实际需求制备。可以理解,由于上述透明导电层24中的碳纳米管层可重叠设置,故,上述透明导电层24的厚度不限,可根据实际需要制成具有任意厚度的透明导电层24。
本实施例中,该碳纳米管薄膜的宽度与碳纳米管阵列所生长的基底的尺寸有关,该碳纳米管薄膜的长度不限,可根据实际需求制得。由于采用CVD法生长在4英寸的基底生长超顺排碳纳米管阵列,并进行进一步地处理所得一碳纳米管薄膜,故该碳纳米管薄膜的宽度可为0.01厘米~10厘米,该碳纳米管薄膜的厚度为10纳米~100微米。上述碳纳米管薄膜包括单壁碳纳米管、双壁碳纳米管和多壁碳纳米管。当碳纳米管薄膜中的碳纳米管为单壁碳纳米管时,该单壁碳纳米管的直径为0.5纳米~50纳米。当碳纳米管薄膜中的碳纳米管为双壁碳纳米管时,该双壁碳纳米管的直径为1.0纳米~50纳米。当碳纳米管薄膜中的碳纳米管为多壁碳纳米管时,该多壁碳纳米管的直径为1.5纳米~50纳米。
本技术方案实施例透明导电层24包括至少两个重叠设置的碳纳米管层,每一碳纳米管层包括多个定向排列的碳纳米管,且相邻的两个碳纳米管层中的碳纳米管沿不同方向排列或沿同一方向排列。上述的透明导电层24的制备方法主要包括以下步骤:
步骤一:提供一碳纳米管阵列,优选地,该阵列为超顺排碳纳米管阵列。
本技术方案实施例提供的碳纳米管阵列为单壁碳纳米管阵列或多壁碳纳米管阵列中。本实施例中,超顺排碳纳米管阵列的制备方法采用化学气相沉积法,其具体步骤包括:(a)提供一平整基底,该基底可选用P型或N型硅基底,或选用形成有氧化层的硅基底,本实施例优选为采用4英寸的硅基底;(b)在基底表面均匀形成一催化剂层,该催化剂层材料可选用铁(Fe)、钴(Co)、镍(Ni)或其任意组合的合金之一;(c)将上述形成有催化剂层的基底在700~900℃的空气中退火约30分钟~90分钟;(d)将处理过的基底置于反应炉中,在保护气体环境下加热到500~740℃,然后通入碳源气体反应约5~30分钟,生长得到超顺排碳纳米管阵列,其高度为200~400微米。该超顺排碳纳米管阵列为多个彼此平行且垂直于基底生长的碳纳米管形成的纯碳纳米管阵列。通过上述控制生长条件,该超顺排碳纳米管阵列中基本 不含有杂质,如无定型碳或残留的催化剂金属颗粒等。该碳纳米管阵列中的碳纳米管彼此通过范德华力紧密接触形成阵列。该碳纳米管阵列与上述基底面积基本相同。
本实施例中碳源气可选用乙炔、乙烯、甲烷等化学性质较活泼的碳氢化合物,本实施例优选的碳源气为乙炔;保护气体为氮气或惰性气体,本实施例优选的保护气体为氩气。
可以理解,本实施例提供的碳纳米管阵列不限于上述制备方法。也可为石墨电极恒流电弧放电沉积法、激光蒸发沉积法等。
步骤二:采用一拉伸工具从碳纳米管阵列中拉取获得一碳纳米管薄膜。其具体包括以下步骤:(a)从上述碳纳米管阵列中选定一定宽度的多个碳纳米管片断,本实施例优选为采用具有一定宽度的胶带接触碳纳米管阵列以选定一定宽度的多个碳纳米管片断;(b)以一定速度沿基本垂直于碳纳米管阵列生长方向拉伸该多个碳纳米管片断,以形成一连续的碳纳米管薄膜。
在上述拉伸过程中,该多个碳纳米管片段在拉力作用下沿拉伸方向逐渐脱离基底的同时,由于范德华力作用,该选定的多个碳纳米管片断分别与其他碳纳米管片断首尾相连地连续地被拉出,从而形成一碳纳米管薄膜。该碳纳米管薄膜包括多个首尾相连且定向排列的碳纳米管束。该碳纳米管薄膜中碳纳米管的排列方向基本平行于碳纳米管薄膜的拉伸方向。
步骤三:制备上述的两个碳纳米管薄膜,并重叠且交叉设置,从而形成透明导电层24。
取上述制备的两个碳纳米管薄膜,每一个碳纳米管薄膜作为一个碳纳米管层。重叠设置上述的两个碳纳米管层,从而使得到上述两个碳纳米管层中的定向排列的碳纳米管之间具有一交叉角度α,0≤α≤90°。可以理解,由于碳纳米管薄膜中碳纳米管的排列方向基本平行于碳纳米管薄膜的拉伸方向,故,可以使得上述的两个碳纳米管层之间的碳纳米管成一交叉角度α设置。
请参阅图3,该碳纳米管薄膜为择优取向排列的多个碳纳米管束首尾相连形成的具有一定宽度的碳纳米管薄膜。该碳纳米管薄膜中碳纳米管的排列方向基本平行于碳纳米管薄膜的拉伸方向。该直接拉伸获得的择优取向排列的碳纳米管薄膜比无序的碳纳米管薄膜具有更好的均匀性,即具有更均匀的厚度以及具有均匀的导电性能。同时该直接拉伸获得碳纳米管薄膜的方法简 单快速,适宜进行工业化应用。故,采用本技术方案的碳纳米管层作透明导电层24,可以降低了电子元件30的制作。
可以理解,由于本实施例超顺排碳纳米管阵列中的碳纳米管非常纯净,且由于碳纳米管本身的比表面积非常大,所以该碳纳米管薄膜本身具有较强的粘性。因此,采用本实施例中的碳纳米管薄膜形成碳纳米管层,并作为透明导电层24时,可直接粘附在基体22的一个表面上。
另外,可使用有机溶剂处理上述粘附在基体22上的碳纳米管层。具体地,可通过试管将有机溶剂滴落在碳纳米管层表面浸润整个碳纳米管层。该有机溶剂为挥发性有机溶剂,如乙醇、甲醇、丙酮、二氯乙烷或氯仿,本实施例中采用乙醇。所述至少两个碳纳米管层经有机溶剂浸润处理后,在挥发性有机溶剂的表面张力的作用下,每一碳纳米管层中的平行的碳纳米管片断会部分聚集成碳纳米管束,因此,该碳纳米管层表面体积比小,无粘性,且具有良好的机械强度及韧性。
此外,根据实际需要,还可在透明导电层24的一个表面上设置有至少两个电极26。优选地,上述的至少两个电极26间隔设置在透明导电层24远离基体22的一个表面上。可以理解,上述的电极26也可以设置在透明导电层24的不同表面上,其关键在于确保上述的电极26与透明导电层24形成电连接即可。上述至少两个电极26的材料可以是铜、银、金、石墨或碳纳米管丝。具体地,在本实施例中,基体22为玻璃基板,所述至少两个电极26为由铜的镀层或者箔片组成的条状电极。所述电极26可以采用溅射、电镀、化学镀等沉积方法直接形成在透明导电层24上。另外,也可用银胶等导电粘结剂将上述的至少两个电极26粘结在透明导电层24上。
可以理解,在本技术方案提供的电子元件30的透明导电层24上采用光刻或激光刻蚀的方法,形成布线后,所述电子元件30可以用作透明电极或电路用于平面显示、光电、触摸屏、电致发光和电磁屏蔽(EMI)中。
具体地,当电子元件30用于作热源时,该电子元件30可包括两个电极,上述的两个电极间隔设置在透明导电层24的远离基体22的一个表面上。上述的两个电极分别连接导线后,接入电源。由于上述的两个电极间隔一定距离设置。故,在上述两个电极之间的透明导电层24上接入了一定的阻值,防止了短路现象的发生。因此,当电源接入后,电子元件30的透明导电层 24可辐射出一定波长范围的电磁波。
当用于触摸屏时,电子元件30可包括四个电极,上述的四个电极间隔设置在透明导电层24的远离基体22的一个表面上。上述的四个电极分别连接导线,接入电源。由于上述的四个电极间隔一定距离设置,且上述的透明导电层24包括一碳纳米管层,该碳纳米管层中的碳纳米管有序排列,从而使得透明导电层24具有均匀的阻值分布。故,接入电源后,在透明导电层24上形成均匀分布的等电位面。当手指或导电笔等触摸物触摸或靠近触摸屏的透明导电层24时,触摸物与透明导电层24之间形成一耦合电容。对于高频电流来说,电容是直接导体,于是手指从接触点吸走了一部分电流。这个电流分别从触摸屏20上的电极中流出,并且流经这四个电极的电流与手指到四角的距离成正比,触摸屏控制器通过对这四个电流比例的精确计算,得出触摸点的位置。
本技术方案实施例提供的电子元件30具有以下优点:其一,由于碳纳米管层具有很好的韧性和机械强度,故,采用碳纳米管层作透明导电层24,可以相应的提高电子元件30的耐用性。其二,由于碳纳米管层具有较均匀的结构,故,采用碳纳米管层作透明导电层24,可使得透明导电层24具有均匀的电阻,从而提高电子元件30的性能。其三,由于本技术方案的碳纳米管层可通过直接铺设作透明导电层24,而无需溅射和加热等工艺,故,降低了电子元件30的制作成本。
另外,本领域技术人员还可在本发明精神内做其他变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。
Claims (13)
1.一种电子元件,包括一基体;一透明导电层,该透明导电层设置于上述基体的至少一个表面,其特征在于,所述透明导电层为由多个碳纳米管组成的至少一碳纳米管层,所述碳纳米管层中的碳纳米管沿固定方向择优取向排列。
2.如权利要求1所述的电子元件,其特征在于,所述碳纳米管层为一个碳纳米管薄膜或多个平行且无间隙铺设的碳纳米管薄膜,上述的碳纳米管薄膜包括多个沿同一方向择优取向排列的碳纳米管。
3.如权利要求2所述的电子元件,其特征在于,所述碳纳米管薄膜进一步包括多个碳纳米管束片段,每个碳纳米管束片段具有大致相等的长度且每个碳纳米管束片段由多个相互平行的碳纳米管束构成,碳纳米管束片段两端通过范德华力相互连接。
4.如权利要求2所述的电子元件,其特征在于,所述碳纳米管薄膜的厚度为0.01微米~100微米,所述碳纳米管薄膜的宽度为0.01厘米~10厘米。
5.如权利要求4所述的电子元件,其特征在于,所述碳纳米管包括单壁碳纳米管、双壁碳纳米管和多壁碳纳米管。
6.如权利要求5所述的电子元件,其特征在于,所述单壁碳纳米管的直径为0.5纳米~50纳米,双壁碳纳米管的直径为1.0纳米~50纳米,多壁碳纳米管的直径为1.5纳米~50纳米。
7.如权利要求1所述的电子元件,其特征在于,所述透明导电层包括至少两个重叠设置的碳纳米管层,每个碳纳米管层中的碳纳米管沿固定方向择优取向排列。
8.如权利要求7所述的电子元件,其特征在于,所述相邻两个碳纳米管层之间的碳纳米管沿不同方向排列或沿同一方向排列,即具有一交叉角度α,α大于等于0度且小于等于90度。
9.如权利要求1所述的电子元件,其特征在于,所述电子元件进一步包括至少两个电极,该至少两个电极间隔设置在上述透明导电层的一表面或基体的一表面,并与该透明导电层电连接。
10.如权利要求9所述的电子元件,其特征在于,所述至少两电极的材料为铜、银、金、钼或石墨。
11.如权利要求9所述的电子元件,其特征在于,所述至少两个电极通过一导电银胶设置在透明导电层上。
12.如权利要求1所述的电子元件,其特征在于,所述基体是平面基体或曲面基体。
13.如权利要求1所述的电子元件,其特征在于,所述基体的材料为玻璃、石英、金刚石或塑料。
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CN101458975A (zh) | 2009-06-17 |
US20110171419A1 (en) | 2011-07-14 |
JP4648451B2 (ja) | 2011-03-09 |
US9040159B2 (en) | 2015-05-26 |
JP2009146898A (ja) | 2009-07-02 |
KR101297525B1 (ko) | 2013-08-16 |
KR20090063105A (ko) | 2009-06-17 |
EP2071631A3 (en) | 2014-10-01 |
EP2071631A2 (en) | 2009-06-17 |
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