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CN101295755A - Phosphor film for light emitting diodes - Google Patents

Phosphor film for light emitting diodes Download PDF

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Publication number
CN101295755A
CN101295755A CNA2007100975980A CN200710097598A CN101295755A CN 101295755 A CN101295755 A CN 101295755A CN A2007100975980 A CNA2007100975980 A CN A2007100975980A CN 200710097598 A CN200710097598 A CN 200710097598A CN 101295755 A CN101295755 A CN 101295755A
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light
phosphor
film
phosphor film
emitting diodes
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林善仁
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本发明是一种用于发光二极管的荧光粉薄膜,其是利用适量的任何透明胶液或透明可塑性材料与荧光粉依照适当的比例混合与搅拌均匀后,并将该胶液制成薄膜形状而成。

The invention relates to a fluorescent powder film for light emitting diodes, which is made by mixing and stirring appropriate amounts of any transparent glue or transparent plastic material with fluorescent powder in a proper proportion, and then molding the glue into a film shape.

Description

用于发光二极管的荧光粉薄膜 Phosphor Thin Films for Light Emitting Diodes

技术领域 technical field

本发明是一种荧光粉薄膜,尤指一种用于发光二极管的荧光粉薄膜。The invention is a fluorescent powder film, especially a fluorescent powder film used for light-emitting diodes.

背景技术 Background technique

为使传统高功率发光二极管具有不同的色光发光方式,例如发出白光,公知的制作过程是将发出蓝光芯片(InGaN)经由包含黄色荧光粉(Yellow Phosphor)的胶液进行点胶,以便将该胶液覆盖该芯片,而其混光的原理则在于,通过该芯片所发出的蓝光来激发胶内黄色荧光粉发出黄光,以便将两种色光混光后而形成白光。In order to make traditional high-power light-emitting diodes have different color light emitting methods, such as emitting white light, the known manufacturing process is to dispense blue light-emitting chips (InGaN) through glue containing yellow phosphor (Yellow Phosphor), so that the glue Liquid covers the chip, and the principle of light mixing is that the blue light emitted by the chip excites the yellow phosphor in the glue to emit yellow light, so that the two colors of light are mixed to form white light.

如图1所示,乃传统高功率发光二极管(LED)封装荧光粉的示意图,其制备流程为:As shown in Figure 1, it is a schematic diagram of a traditional high-power light-emitting diode (LED) packaged phosphor, and its preparation process is as follows:

(1)固晶步骤:先将导线架(Lead frame)10点上银胶,再把蓝光芯片20贴固在导线架10上,然后放进烘烤箱内烘烤固定;(1) Die-fixing step: first apply silver glue on the lead frame 10 points, then stick the blue light chip 20 on the lead frame 10, and then put it into a baking oven to bake and fix;

(2)焊线步骤:将该导线架10杯体内芯片20的P极及N极与导线架10间各焊上数条导电线(金线)30,使该导线架10与芯片20上的P、N极形成导通;(2) wire bonding step: several conductive wires (gold wires) 30 are respectively welded between the P pole and the N pole of the chip 20 in the cup of the lead frame 10 and the lead frame 10, so that the lead frame 10 and the chip 20 The P and N poles are turned on;

(3)荧光粉胶液点胶步骤:先将一定量的荧光粉与透明硅胶混合与搅拌,然后利用注射器将包含荧光粉胶液40点胶在已经焊上导电线30的芯片20上,并将其覆盖后,接着放进烘烤箱内烘烤使该荧光粉胶液40固化;以及(3) Phosphor powder glue dispensing step: first mix and stir a certain amount of phosphor powder and transparent silica gel, then use a syringe to dispense glue 40 containing phosphor powder on the chip 20 on which the conductive wire 30 has been welded, and After covering it, put it into a baking oven and bake to solidify the phosphor glue 40; and

(4)覆盖透镜(Lens)步骤:将完成以上步骤的导线架10覆盖一透镜50后,再利用透明硅胶注入并填满该透镜50导线架10间的空隙,最后将该发光二极管再度放进烘烤箱内烘烤至固化,即可获得发出白光的发光二极管。(4) Covering the lens (Lens) step: After the lead frame 10 that has completed the above steps is covered with a lens 50, then use transparent silica gel to inject and fill up the gap between the lead frame 10 of the lens 50, and finally put the light-emitting diode into it again. Bake in a baking oven until solidified, and then a light-emitting diode emitting white light can be obtained.

前述的白光发光二极管制作过程中,其显著的缺失在于,当荧光粉与透明硅胶搅拌混合后,是放置于一旁备用。此时,随着放置的时间越长,该荧光粉与透明硅胶间产生分离的情况越明显,此种情况使得每次点胶时,荧光粉在硅胶中的含量都有所不同。再,荧光粉于点胶并覆盖芯片后,于烘烤固化时,荧光粉会产生沈淀现象,以致在芯片周围形成荧光粉厚薄不均的情况发生,以致使同一批生产的白光发光二极管却发出不同程度色温的白光,对于质量的一致性难以掌控,相对地使制造成本大增,却又无法生产出预定色温的色光,从而造成生产制造的瓶颈,诚为相关业者亟待突破的难题。In the manufacturing process of the aforementioned white light emitting diode, its obvious deficiency is that after the phosphor powder is stirred and mixed with the transparent silica gel, it is placed aside for later use. At this time, as the standing time is longer, the separation between the phosphor powder and the transparent silica gel becomes more obvious. This situation makes the content of the phosphor powder in the silica gel different every time glue is dispensed. Furthermore, after the phosphor powder is dispensed and covers the chip, the phosphor powder will precipitate during baking and curing, so that the thickness of the phosphor powder will be uneven around the chip, so that the white light emitting diodes produced in the same batch will not be uniform. Emitting white light with different color temperatures makes it difficult to control the quality consistency, which relatively increases the manufacturing cost, but cannot produce the color light with the predetermined color temperature, thus causing a bottleneck in production and manufacturing.

发明内容 Contents of the invention

有鉴于此,本发明用于发光二极管的荧光粉薄膜的目的是,期能改善现有以荧光粉胶液进行点胶作业时,该导线架杯体内的芯片上可能造成该胶液表面凹凸不平,因此,只能将之放置于震荡器内进行震荡,使该胶液表面虽可达到平整状态,却另外造成荧光粉沈淀的严重缺失,希望另辟蹊径,通过将荧光粉与胶液混合后,并将之制备成薄膜,再将该薄膜结合于透镜底面,当芯片发出的色光,例如蓝光激发设于透镜底面的黄色荧光粉发出黄光,以便将两色光混光后,而发出白光。In view of this, the purpose of the phosphor film used in light-emitting diodes of the present invention is to improve the existing glue dispensing operation with phosphor glue, which may cause unevenness on the surface of the glue on the chip in the lead frame cup. Therefore, it can only be placed in an oscillator for vibration, so that although the surface of the glue can reach a flat state, it will also cause a serious lack of phosphor precipitation. I hope to find another way. After mixing the phosphor with the glue, And prepare it into a thin film, and then combine the thin film on the bottom of the lens. When the colored light emitted by the chip, such as blue light, excites the yellow phosphor powder on the bottom of the lens to emit yellow light, so that the two colored lights can be mixed to emit white light.

为达到上述目的,本发明的技术解决方案是:提供一种用于发光二极管的荧光粉薄膜,其是利用适量的任何透明胶液或透明可塑性材料与荧光粉依照适当的比例混合与搅拌均匀后,并将该胶液制成薄膜形状而成。In order to achieve the above object, the technical solution of the present invention is to provide a phosphor film for light-emitting diodes, which is obtained by mixing and stirring an appropriate amount of any transparent glue or transparent plastic material and phosphor according to an appropriate ratio. , and make the glue into a thin film shape.

所述的用于发光二极管的荧光粉薄膜,其中该荧光粉与透明胶液或透明可塑性材料混合与搅拌均匀后,以涂布方式均匀分布在平面治具上,然后制成所需的厚度,并固化形成一薄膜。The phosphor film for light-emitting diodes, wherein the phosphor is mixed and stirred evenly with transparent glue or transparent plastic material, and then evenly distributed on the plane jig by coating, and then made into the required thickness, and cured to form a thin film.

所述的用于发光二极管的荧光粉薄膜,其中该荧光粉薄膜是通过发光二极管的芯片发出特定波长的色光来激发薄膜内的荧光粉产生不同波长的色光,再经由混光作用,达到所需的特定范围内波长的光。The phosphor film used for light-emitting diodes, wherein the phosphor film emits colored light of a specific wavelength through the chip of the light-emitting diode to excite the phosphors in the film to produce colored light of different wavelengths, and then achieves the desired color light through light mixing. light within a specific range of wavelengths.

所述的用于发光二极管的荧光粉薄膜,其中该荧光粉薄膜依据透镜底面造形裁切成型,并将的贴附于透镜底面。The phosphor film for light-emitting diodes, wherein the phosphor film is cut and shaped according to the shape of the bottom surface of the lens, and attached to the bottom surface of the lens.

所述的用于发光二极管的荧光粉薄膜,其中该荧光粉薄膜是贴附于照明灯罩内部。The phosphor film for light-emitting diodes, wherein the phosphor film is attached to the inside of the lighting lampshade.

本发明的实施,其获致的功效如下:Enforcement of the present invention, the effect that it obtains is as follows:

(1)可解决荧光粉点胶时不均匀的问题:以往的发光二极管是将荧光粉与胶体混合后,直接点胶在芯片上,并将芯片覆盖,然后再送进烘烤箱内烘烤,而在点胶覆盖和烘烤的过程中,因时间长短而致使荧光粉沈淀,进而形成不均匀的现象,使每颗发光二极管所发出的所欲色光的色温不一致。(1) It can solve the problem of uneven dispensing of phosphor powder: in the past, after mixing phosphor powder and colloid, glue is directly dispensed on the chip, and the chip is covered, and then sent to the baking oven for baking , and in the process of dispensing, covering and baking, the phosphor powder is precipitated due to the length of time, and then an uneven phenomenon is formed, so that the color temperature of the desired color light emitted by each light-emitting diode is inconsistent.

(2)运用范围广泛:本发明的荧光粉薄膜可用在不同形状的透镜或直接贴覆于照明灯罩内部,使得应用的范围更家宽广。(2) Wide range of applications: the phosphor film of the present invention can be used in lenses of different shapes or directly pasted inside lighting lampshades, making the range of applications wider.

(3)精确控制质量:通过不同荧光粉和密度来制成荧光粉薄膜的色温分级,使应用端可精确的控制色光,例如白光的色温,不论是6000k以上的冷白色光或是3500k的暖白色光的制作皆可轻易的达到控制的要求。(3) Accurate quality control: The color temperature of the phosphor film is graded by different phosphors and densities, so that the application side can accurately control the color light, such as the color temperature of white light, whether it is a cool white light above 6000k or a warm light of 3500k The production of white light can easily meet the control requirements.

(4)节省成本:因未固化的胶体一旦混合后,有一定的使用期限,若一次调配的量过多而未能在期限内使用完毕,将会固化而无法使用。因此,当制成荧光薄膜后,其业已固化可永久保存,可节省应用端的时间及金钱。(4) Cost saving: Once the uncured colloid is mixed, it has a certain period of use. If the amount of one deployment is too large and cannot be used within the period, it will solidify and cannot be used. Therefore, when the fluorescent film is made, it has been cured and can be stored permanently, which can save time and money on the application side.

(5)方便操作:传统荧光粉胶液的点胶作业,其胶量不易控制,常有过之或不及的现象发生,且同批投产数量多寡和时间长短都会造成荧光粉分布不匀的问题。反观本发明仅需将荧光粉薄膜以贴附方式结合于透镜或照明灯罩,其操作上非常方便。(5) Convenient operation: the dispensing operation of traditional fluorescent powder glue is not easy to control the amount of glue, and the phenomenon of over or under often occurs, and the quantity and time of the same batch of production will cause the problem of uneven distribution of phosphor powder . In contrast, the present invention only needs to attach the phosphor film to the lens or the lighting lampshade, which is very convenient to operate.

附图说明 Description of drawings

图1为公知发光二极管的剖面图;1 is a cross-sectional view of a known light-emitting diode;

图2为本发明荧光粉薄膜的立体图;Fig. 2 is the three-dimensional view of phosphor film of the present invention;

图3为本发明荧光粉薄膜的断面图;Fig. 3 is the sectional view of phosphor film of the present invention;

图4a至图4c为本发明运用于不同形状的透镜并封装成为发光二极管的剖面图。4a to 4c are cross-sectional views of the present invention applied to lenses of different shapes and packaged into light emitting diodes.

具体实施方式 Detailed ways

为进一步揭示本发明的具体技术内容,请参阅附图。In order to further reveal the specific technical content of the present invention, please refer to the accompanying drawings.

如图2至图3所示,基本上,本发明用于发光二极管的荧光粉薄膜1,其利用适量的任何透明胶液或透明可塑性材料11与荧光粉12依照适当的比例混合与搅拌均匀后,涂布在平面治具上,并将之放入超音波震荡排列机构静置一段时间,让荧光粉12能充分均匀的沉淀在该平面治具表面,接着再制成所需的荧光粉薄膜1,最后将该荧光粉薄膜1送进烘烤箱内进行烘烤,其固化后即成为荧光粉薄膜1的成品。唯前述的制膜方式仅为实施例的一种,其并非局限本发明所欲保护的标的,例如该制膜方式可不经由震荡或烘烤步骤,亦可形成一荧光粉薄膜1。As shown in Figures 2 to 3, basically, the phosphor film 1 used in light-emitting diodes according to the present invention is mixed and stirred evenly with any transparent glue or transparent plastic material 11 and phosphor 12 in an appropriate proportion. , coated on the plane fixture, put it into the ultrasonic vibration arrangement mechanism and let it stand for a period of time, so that the phosphor 12 can be fully and uniformly deposited on the surface of the plane fixture, and then make the required phosphor film 1. Finally, the phosphor film 1 is sent into a baking oven for baking, and becomes the finished phosphor film 1 after curing. However, the above-mentioned film-forming method is only one of the embodiments, and it is not limited to the object to be protected by the present invention. For example, the film-forming method can also form a phosphor film 1 without vibrating or baking steps.

事实上,本发明的荧光粉薄膜1的特点在于,其是通过发光二极管(LED)的芯片发出特定波长的色光来激发薄膜1内的荧光粉12产生不同波长的色光,再经由混光的作用达到所需的特定范围内波长的光,例如通过蓝光芯片发出波长为蓝色的光去激发特定黄色荧光粉来发出波长为黄色的光,经由混光作用后,而发出白光。In fact, the phosphor film 1 of the present invention is characterized in that it excites the phosphor powder 12 in the film 1 to produce colored light of different wavelengths by emitting colored light of a specific wavelength through a light-emitting diode (LED) chip, and then through the effect of light mixing To achieve the required specific range of wavelength light, for example, the blue light chip emits blue light to excite a specific yellow phosphor to emit yellow light, and after light mixing, it emits white light.

或,亦可采用RGB(红绿蓝)荧光粉制成荧光粉薄膜1,其被芯片发出的UV(紫外光)或Nuv(次紫外光)来激发薄膜1内荧光粉发出红、绿、蓝光,并通过混光作用,以形成白光。所以,任何可经由发光二极管激发的荧光粉都可制成荧光粉薄膜而加以应用。Alternatively, RGB (red, green and blue) phosphors can also be used to make the phosphor film 1, which is excited by the UV (ultraviolet light) or Nuv (sub-ultraviolet light) emitted by the chip to emit red, green, and blue light from the phosphors in the film 1. , and through light mixing to form white light. Therefore, any phosphor powder that can be excited by light-emitting diodes can be made into a phosphor film and applied.

请参阅图4a,其是将本发明的荧光粉薄膜1应用于发光二极管的制备步骤:Please refer to Figure 4a, which is the preparation steps of applying the phosphor film 1 of the present invention to light-emitting diodes:

(1)固晶步骤:首先将导线架2的杯体21内点上银胶,再把至少一蓝光芯片3固着在杯体21底面,接着将该导线架2送进烘烤箱内烘烤,使各芯片3固定于导线架2的杯体21底面。(1) Solid crystal step: First, put silver glue on the inside of the cup body 21 of the lead frame 2, then fix at least one blue-ray chip 3 on the bottom surface of the cup body 21, and then send the lead frame 2 into a baking oven for baking , so that each chip 3 is fixed on the bottom surface of the cup body 21 of the lead frame 2 .

(2)焊线步骤:将该导线架2的杯体21底面上芯片3的P极及N极与导线架2间各自焊上数条导电线4,以致使该导线架2与各芯片3的P、N极导通。(2) wire bonding step: respectively weld several conductive wires 4 between the P pole and the N pole of the chip 3 on the bottom surface of the cup body 21 of the lead frame 2 and the lead frame 2, so that the lead frame 2 and each chip 3 The P and N poles are turned on.

(3)贴附步骤:将预先制备成型的黄色荧光粉薄膜1依据透镜5底面造形裁切成型,再将各荧光粉薄膜1贴附于各透镜5底面。(3) Attaching step: cut and shape the pre-prepared yellow phosphor film 1 according to the shape of the bottom surface of the lens 5 , and then attach each phosphor film 1 to the bottom surface of each lens 5 .

(4)覆盖透镜步骤:将已经完成焊线步骤的导线架2注入透明硅胶后,再于其开口位置覆盖底面具有一黄色荧光粉薄膜1的透镜5,利用透镜5压入时将空气完全挤出,最后将该发光二极管半成品送进烘烤箱内烘烤至固化,即可获得可发出白光的发光二极管。(4) Covering the lens step: inject the lead frame 2 that has completed the wire welding step into transparent silica gel, and then cover the lens 5 with a yellow phosphor film 1 on the bottom surface at the opening position, and squeeze the air completely when the lens 5 is pressed in. Finally, the semi-finished light-emitting diode is sent into a baking oven to be baked until solidified, and then a light-emitting diode capable of emitting white light can be obtained.

因此,本发明无传统以点胶作业将荧光粉胶液用来覆盖芯片的不便,而是将荧光粉薄膜结合于透镜底面或直接贴附于灯罩内部,使芯片3发出的色光来激发荧光粉发出特定颜色的色光,并通过混光作用,而以形成所欲得到颜色的光。Therefore, the present invention does not have the inconvenience of using fluorescent powder glue to cover the chip in the traditional dispensing operation, but combines the phosphor film on the bottom surface of the lens or directly attaches it to the inside of the lampshade, so that the colored light emitted by the chip 3 excites the phosphor It emits colored light of a specific color, and through light mixing, it forms light of the desired color.

如图4a至图4c所示,则是将本发明的荧光粉薄膜1运用于不同形状的透镜5,并将之封装为发光二极管的示意图。As shown in FIGS. 4 a to 4 c , they are schematic diagrams of applying the phosphor film 1 of the present invention to lenses 5 of different shapes and packaging them into light emitting diodes.

所以,经由本发明的实施,其获致的功效如下:Therefore, through the implementation of the present invention, the effects obtained are as follows:

(1)可解决荧光粉点胶时不均匀的问题:以往的发光二极管是将荧光粉与胶体混合后,直接点胶在芯片上,并将芯片覆盖,然后再送进烘烤箱内烘烤,而在点胶覆盖和烘烤的过程中,因时间长短而致使荧光粉沈淀,进而形成不均匀的现象,使每颗发光二极管所发出的所欲色光的色温不一致。(1) It can solve the problem of uneven dispensing of phosphor powder: in the past, after mixing phosphor powder and colloid, glue is directly dispensed on the chip, and the chip is covered, and then sent to the oven for baking , and in the process of dispensing, covering and baking, the phosphor powder is precipitated due to the length of time, and then an uneven phenomenon is formed, so that the color temperature of the desired color light emitted by each light-emitting diode is inconsistent.

(2)运用范围广泛:如图4a至图4c所示,本发明的荧光粉薄膜可用在不同形状的透镜或直接贴覆于照明灯罩内部,使得应用的范围更家宽广。(2) Wide range of application: As shown in Figure 4a to Figure 4c, the phosphor film of the present invention can be used in lenses of different shapes or directly pasted inside the lighting lampshade, making the application range wider.

(3)精确控制质量:通过不同荧光粉和密度来制成荧光粉薄膜的色温分级,使应用端可精确的控制色光,例如白光的色温,不论是6000k以上的冷白色光或是3500k的暖白色光的制作皆可轻易的达到控制的要求。(3) Accurate quality control: The color temperature of the phosphor film is graded by different phosphors and densities, so that the application side can accurately control the color light, such as the color temperature of white light, whether it is a cool white light above 6000k or a warm light of 3500k The production of white light can easily meet the control requirements.

(4)节省成本:因未固化的胶体一旦混合后,有一定的使用期限,若一次调配的量过多而未能在期限内使用完毕,将会固化而无法使用。因此,当制成荧光薄膜后,其业已固化可永久保存,可节省应用端的时间及金钱。(4) Cost saving: Once the uncured colloid is mixed, it has a certain period of use. If the amount of one deployment is too large and cannot be used within the period, it will solidify and cannot be used. Therefore, when the fluorescent film is made, it has been cured and can be stored permanently, which can save time and money on the application side.

(5)方便操作:传统荧光粉胶液的点胶作业,其胶量不易控制,常有过之或不及的现象发生,且同批投产数量多寡和时间长短都会造成荧光粉分布不匀的问题。反观本发明仅需将荧光粉薄膜以贴附方式结合于透镜或照明灯罩,其操作上非常方便。(5) Convenient operation: the dispensing operation of traditional fluorescent powder glue is not easy to control the amount of glue, and the phenomenon of over or under often occurs, and the quantity and time of the same batch of production will cause the problem of uneven distribution of phosphor powder . In contrast, the present invention only needs to attach the phosphor film to the lens or the lighting lampshade, which is very convenient to operate.

本发明所揭示,乃较佳实施例的一种,举凡局部的变更或修饰而源于本发明的技术思想而为熟习该项技艺的人所易于推知,俱不脱本发明权利要求保护的范畴。The disclosure of the present invention is one of the preferred embodiments. For example, all partial changes or modifications are derived from the technical idea of the present invention and can be easily deduced by those skilled in the art, and all of them are within the scope of protection of the claims of the present invention. .

Claims (6)

1.一种用于发光二极管的荧光粉薄膜,其特征在于,其是利用适量的任何透明胶液或透明可塑性材料与荧光粉依照适当的比例混合与搅拌均匀后,并将该胶液制成薄膜形状而成。1. A fluorescent powder film for light-emitting diodes, characterized in that it is made of any transparent glue or transparent plastic material and fluorescent powder according to an appropriate ratio after mixing and stirring evenly, and the glue is made film shape. 2.如权利要求1所述的用于发光二极管的荧光粉薄膜,其特征在于,其中该荧光粉与透明胶液或透明可塑性材料混合与搅拌均匀后,以涂布方式均匀分布在平面治具上,然后制成所需的厚度,并固化形成一薄膜。2. The phosphor film used for light-emitting diodes as claimed in claim 1, wherein the phosphor is uniformly distributed on the plane fixture by coating after mixing and stirring with transparent glue or transparent plastic material on, then made to the desired thickness, and cured to form a thin film. 3.如权利要求2所述的用于发光二极管的荧光粉薄膜,其特征在于,其中该荧光粉薄膜的固化是经由烘烤箱的烘烤。3 . The phosphor film for light-emitting diodes as claimed in claim 2 , wherein the phosphor film is cured through a baking oven. 4 . 4.如权利要求1所述的用于发光二极管的荧光粉薄膜,其特征在于,其中该荧光粉薄膜是通过发光二极管的芯片发出特定波长的色光来激发薄膜内的荧光粉产生不同波长的色光,再经由混光作用,达到所需的特定范围内波长的光。4. The phosphor film used for light-emitting diodes as claimed in claim 1, wherein the phosphor film excites the phosphors in the film to produce colored lights of different wavelengths through the chip of the light-emitting diode emitting colored light of a specific wavelength , and then through light mixing to achieve the desired wavelength of light within a specific range. 5.如权利要求1所述的用于发光二极管的荧光粉薄膜,其特征在于,其中该荧光粉薄膜依据透镜底面造形裁切成型,并将之贴附于透镜底面。5 . The phosphor film for light-emitting diodes according to claim 1 , wherein the phosphor film is cut and shaped according to the shape of the bottom surface of the lens, and attached to the bottom surface of the lens. 6.如权利要求1所述的用于发光二极管的荧光粉薄膜,其特征在于,其中该荧光粉薄膜是贴附于照明灯罩内部。6 . The phosphor film for light-emitting diodes as claimed in claim 1 , wherein the phosphor film is attached to the inside of the lighting lampshade. 7 .
CNA2007100975980A 2007-04-27 2007-04-27 Phosphor film for light emitting diodes Pending CN101295755A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244177A (en) * 2010-05-11 2011-11-16 北京宇极科技发展有限公司 Semiconductor luminous device
CN102931180A (en) * 2012-11-19 2013-02-13 上舜照明(中国)有限公司 LED light source and manufacturing method thereof
CN103022323A (en) * 2012-12-10 2013-04-03 中国海洋大学 Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components
CN103390719A (en) * 2012-05-09 2013-11-13 五邑大学 Fluorescent membrane for white-light LED module chip
CN106159067A (en) * 2015-04-18 2016-11-23 郑州森源新能源科技有限公司 A kind of preparation method of flexible fluorescent powder film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102244177A (en) * 2010-05-11 2011-11-16 北京宇极科技发展有限公司 Semiconductor luminous device
CN102244177B (en) * 2010-05-11 2013-01-23 北京宇极科技发展有限公司 Semiconductor luminous device
CN103390719A (en) * 2012-05-09 2013-11-13 五邑大学 Fluorescent membrane for white-light LED module chip
CN102931180A (en) * 2012-11-19 2013-02-13 上舜照明(中国)有限公司 LED light source and manufacturing method thereof
CN103022323A (en) * 2012-12-10 2013-04-03 中国海洋大学 Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components
CN106159067A (en) * 2015-04-18 2016-11-23 郑州森源新能源科技有限公司 A kind of preparation method of flexible fluorescent powder film

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