CN101206868B - Improved magnetic head tabs combination and manufacturing method thereof as well as disk drive unit - Google Patents
Improved magnetic head tabs combination and manufacturing method thereof as well as disk drive unit Download PDFInfo
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- CN101206868B CN101206868B CN2006101720378A CN200610172037A CN101206868B CN 101206868 B CN101206868 B CN 101206868B CN 2006101720378 A CN2006101720378 A CN 2006101720378A CN 200610172037 A CN200610172037 A CN 200610172037A CN 101206868 B CN101206868 B CN 101206868B
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Abstract
The invention discloses a magnetic head folding piece combination, which adopts a modified connecting mode between the magnetic head block and the suspension arm element. The connecting mode is realized through adopting the opposite surface of the air bearing surface of the magnetic block as the connecting surface. The connecting surface provides more space for arranging more magnetic head electrical connecting terminals. The magnetic head is connected mechanically and electrically with the suspension arm element on the connecting surface, thus to be provided with good anti-impulse performance. The suspension arm piece comprises a posture controlling layer which is positioned between the magnetic block and a tension element. The posture controlling layer is used for arranging and supporting the reference plate of the magnetic block, to ensure that the magnetic block maintains a good posture, and the change of the magnetic head flying height is reduced, to improve the data reading and writing performance of the magnetic head block. The invention simultaneously discloses the magnetic disc driving unit with the modified magnetic head folding piece combination and the production method of the magnetic head folding piece combination.
Description
Technical field
The present invention relates to a kind of information recording disk driver element, relate in particular to magnetic head fold piece combination and manufacture method thereof that is connected with improved procedure between a kind of head module and cantilever part and disc driver with this improved magnetic head fold piece combination.
Background technology
Disk drive system is a kind of information storing device, and it uses magnetic media to store data, and comes optionally on the magnetic media reading of data or data are write on the magnetic media with being arranged at removable read/write head above this magnetic media.
With reference to figure 1, disc driver generally includes some disks 6, and described disk 6 is connected on the Spindle Motor so that rotation.The corresponding magnetic head actuating arm combination that suspended on the surface of disk 6, described magnetic head actuating arm combination comprises magnetic head fold piece combination (HGA) 1.Described magnetic head fold piece combination 1 connects and is installed on the actuating arm 4.Voice coil motor (VCM) 5 is connected on the described actuating arm 4, motion in order to controlling and driving arm 4, and then the magnetic read/write heads in the head module 2 of control head tabs combination 1 are positioned on the track on disk 6 surfaces, thereby guarantee magnetic read/write head reading of data or data are write in the disk 6 from disk 6.
Thereby magnetic head fold piece combination 1 is synchronous with magnetic disk surface in order to the rotation of dynamically adjusting head module 2 when disk 6 rotates around Spindle Motor.Specifically, magnetic head fold piece combination 1 generally includes the cantilever part of the carrying or the magnetic head that suspends.Described cantilever part comprises carrier bar, substrate, articulated part and the flexible element that fits together.Carrier bar is connected on the substrate by articulated part.Substrate is used to strengthen the structural rigidity of whole magnetic head fold piece combination.Flexible element is made by flexible material, extends to carrier bar from articulated part.Carrier bar one end is connected on the actuating arm by substrate, and the other end is connected on the flexible element.To magnetic disk surface, and flexible element provides flexible power for magnetic head to carrier bar magnetic head deflection.One end of flexible element provides cantilever tongue piece in order to the carrying head module.
With reference to figure 2a and 2b, head module 2 generally includes read/write head.As everyone knows, described read/write head is positioned on the rear surface 23 of magnetic head 2, is used for writing the described centre data track from the centre data track reading of data of disk 6 or data.In order to realize electrically connecting, described read/write head provides some connecting terminals 24 on the rear surface 23 of head module 2, flexible element 3 provides corresponding connecting terminal 10 simultaneously, described connecting terminal 10 is connected with the read/write head cable that extends out from the read/write circuit of disc driver (figure does not show), thereby described read/write head cable is used for transmitting signal realization control at read/write head and read/write circuit, the connecting terminal 24 of read/write head bonds on the connecting terminal 10 of flexible element 3 with tin ball bonding or ultrasonic soldering mode via tin ball or other Metal Ball respectively, thereby realizes being electrically connected of read/write head and flexible element.In addition, in order to realize good physical connection performance, head module 2 be provided with epoxy glue 7 towards described flexible element 3 and the upper surface 22 relative with described air bearing face, described epoxy glue 7 couples together the upper surface 22 of head module 2 with flexible element 3.
Yet, above described head module 2 very complicated with the method that the flexible element 3 of cantilever part is connected.As mentioned above, head module 2 and being connected of flexible element 3 are at first by tin ball or other Metal Ball 8 being connected on head module 2 and the flexible element 3 corresponding contacts, fix head module 2 and flexible element 3 by epoxy glue 7 then.Head module 2 is two separation steps with the electric connection mode and the physical connection mode of flexible element 3, takes time and effort very much.
Recently, the consumer always wishes constantly to reduce the cost of magnetic head.In order to reduce the cost of magnetic head, area of bed must design more and more forr a short time, so that a wafer can be separated into more head module.Because the size of head module reduces, its back surface area is also corresponding to diminish.Simultaneously, because the continuous development of head technology, increasing functional connecting terminal need be increased on the rear surface of head module.Therefore, small-sized head module can not provide enough zones to realize connecting at place, magnetic head rear surface.On the other hand, head module 2 links to each other via tin ball or other Metal Ball with flexible element 3 in its rear surface 23, in this connected mode, to be that fulcrum is relative with the tie point with flexible element 3 rotate head module 2, and therefore this traditional connection meeting is damaged by shock stress even bump.
At present, there is a kind of more advanced, more typical method of attachment to be used between head module and the cantilever part to address the above problem.Provide some magnetic heads to electrically connect the contact on the upper surface with respect to the air bearing face of head module, cantilever part provides corresponding flexible element to electrically connect the contact simultaneously.The electrical connecting terminal of magnetic head electrically connects the contact by solder ball or other Metal Ball with flexible element and is connected, thereby realizes the physics and the electric connection of head module and cantilever part.In this case, the upper surface of head module can provide enough zones that the electrical connecting terminal of magnetic head is set, and this connected mode of head module and cantilever part has been avoided relatively rotating each other.Yet this connected mode can be brought other problem.Because head module fetches by the tin ball bonding and supports and without any reference platform, therefore, static pitch attitude (the PSA of head module, pitch static attitude) and static roll attitude (RSA, roll static attitude) can change, correspondingly, the variation of pitching and roll attitude will cause the variation of magnetic head flight height, and this has just weakened the flying quality and the reading and writing data performance of magnetic head.
Therefore, the improved method that be necessary to provide the magnetic head fold piece combination that is connected with improved procedure between a kind of head module and cantilever part, has the disc driver of this improved magnetic head fold piece combination and make this magnetic head fold piece combination overcomes above-mentioned defective.
Summary of the invention
The purpose of this invention is to provide a kind of magnetic head fold piece combination (HGA), the head module of described magnetic head fold piece combination is connected in improved mode with cantilever part, this connection makes described magnetic head fold piece combination energy control head attitude, for example pitch attitude and roll attitude, to guarantee that head module is in good attitude, thereby reduce the variation of the flying height of head module, improve the reading and writing data performance of head module.
Another object of the present invention provides a kind of disc driver with magnetic head fold piece combination (HGA), the head module of described magnetic head fold piece combination is connected in improved mode with cantilever part, this connection makes described magnetic head fold piece combination energy control head attitude, for example pitch attitude and roll attitude, to guarantee that head module is in good attitude, thereby reduce the variation of the flying height of head module, improve the reading and writing data performance of head module.
Another purpose of the present invention provides a kind of method of making magnetic head fold piece combination, and described method can realize good being connected between the magnetic head of described magnetic head fold piece combination and cantilever part.
A further object of the present invention provides a kind of cantilever part with attitude key-course that supports magnetic head, and described attitude key-course is installed to the attitude of the head module on the described cantilever part in order to control, as pitch attitude and roll attitude.
To achieve these goals, magnetic head fold piece combination provided by the invention comprises head module and cantilever part.Described head module has the air bearing face, and joint face relative with the air bearing face and the some magnetic heads that are arranged on the described joint face electrically connect the contact.Described cantilever part has flexible element, attitude key-course and the flexible element that is arranged on the described flexible element electrically connects the contact.Described attitude key-course covers on the described flexible element, and flexible element electric connection contact is exposed.Described head module is positioned on the attitude key-course, and wherein electrical connecting terminal of magnetic head and corresponding flexible element electrically connect contact alignment so that the electrical connecting terminal of magnetic head electrically connects with corresponding flexible element electric connection contact.
As an embodiment of the present invention, described cantilever part also comprises circuit (trace pattern), and described circuit is arranged on the flexible element, and described flexible element electrically connects the contact and is formed on the described circuit.Preferably, described circuit is provided with recess in the position that electrically connects the contact corresponding to described flexible element.Preferably, described recess is a through hole by break-through.Alternatively, described flexible element is provided with recess in the position corresponding to the through hole of described circuit.
As another embodiment of the present invention, described flexible element comprises metallic substrates and insulation course, and described insulation course is between described metallic substrates and described circuit.Preferably, described metallic substrates has stress relief portion, the position part hollow out of described stress relief portion below being positioned at described flexible element electric connection contact.Described stress relief portion has some symmetrically arranged through holes or breach.Preferably, described insulation course is provided with some recesses in the position that electrically connects the contact corresponding to flexible element.
In the present invention, described circuit has some conductor cable, and described conductor cable electrically connects the contact from described flexible element and extends to extraneous control circuit respectively, and described attitude key-course is set to the local described conductor cable that covers.
As an embodiment more of the present invention, described attitude key-course is T-shaped.Alternatively, described attitude key-course has the T connector portion of a conductor cable between the described flexible element electric connection of the covering contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.Alternatively, described attitude key-course has the H type head of a conductor cable between the described flexible element electric connection of the covering contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
As another embodiment of the present invention, described head module also comprises the semiconducting insulation layer with some notches, described semiconducting insulation layer covers on the joint face of described head module and with described head module and is electrically connected, and the electrical connecting terminal of wherein said magnetic head is exposed in described each notch.Preferably, described semiconducting insulation layer is the diamond like carbon carbon-coating.Alternatively, the electrical connecting terminal of described magnetic head comprises the Electrostatic Discharge connecting terminal, and described static discharge connecting terminal electrically connects described semiconducting insulation layer and described head module.
In the present invention, have some second connecting terminals on the rear surface of described head module, described second connecting terminal is electrically connected on the electrical connecting terminal of corresponding magnetic head.
As another embodiment of the present invention, described head module also has metal conductive layers, be in the joint face and first insulation course between the described metal conductive layers of described head module and cover second insulation course on the described metal conductive layers, the electrical connecting terminal of described magnetic head is formed on the metal conductive layers, and described second insulation course has in order to expose some notches of the electrical connecting terminal of described each magnetic head.
Preferably, the electrical connecting terminal of described magnetic head also comprises at least one ground connection connecting terminal, at least one reads connecting terminal and at least one writes connecting terminal, described metal conductive layers has at least one ground cable, described ground cable is connected on the described ground connection connecting terminal, and reads connecting terminal and described writing between the connecting terminal described.Preferably, the electrical connecting terminal of described magnetic head also comprises and adds thermal contact.
Disc drive unit of the present invention comprises magnetic head fold piece combination, the actuating arm that is connected with described magnetic head fold piece combination, the Spindle Motor of spinning disk.Wherein said magnetic head fold piece combination comprises head module and cantilever part.Described head module has air bearing face, the joint face relative with the air bearing face and the some magnetic heads that are arranged on the described joint face and electrically connects the contact.Described cantilever part has flexible element, attitude key-course and the flexible element that is arranged on the described flexible element electrically connects the contact.Described attitude key-course covers on the described flexible element, and flexible element electric connection contact is exposed.Described head module is positioned on the attitude key-course, and wherein electrical connecting terminal of magnetic head and corresponding flexible element electrically connect contact alignment so that the electrical connecting terminal of magnetic head electrically connects with corresponding flexible element electric connection contact.
The method of manufacturing magnetic head fold piece combination of the present invention comprises the steps: that (1) provides the head module with air bearing face and joint face relative with described air bearing face; (2) some magnetic heads are set and electrically connect the contact on the joint face of described head module; (3) form flexible element and some flexible elements are set electrically connect the contact on described flexible element; (4) form the attitude key-course, cover described attitude key-course on the described flexible element and make described flexible element electrically connect the contact and expose; (5) be placed on described head module on the described attitude key-course and make the electrical connecting terminal of described magnetic head and described flexible element electrically connects the contact corresponding align, the electrical connecting terminal of described magnetic head is electrically connected on the corresponding flexible element electric connection contact.
As an embodiment of the present invention, between described step (2) and described step (3), also comprise the steps: to form a semiconducting insulation layer and on described semiconducting insulation layer, some notches are set; Described semiconducting insulation layer is covered on the joint face of described head module and the electrical connecting terminal of described magnetic head is exposed in the corresponding notch, electrically connect described semiconducting insulation layer and described head module.
Alternatively, described semiconducting insulation layer is made by diamond-like-carbon.
Preferably, described flexible element electrically connects the contact and is formed on the circuit of being made by conductive material (trace pattern).The position that electrically connects the contact corresponding to flexible element that described step (3) also is included in circuit is provided with the step of recess.
The cantilever part of support head module of the present invention comprises flexible element, is positioned at circuit (tracepattern) and attitude key-course on the flexible element.Some flexible elements electric connections contact that described circuit comprises ground cable and is positioned at described ground cable both sides, described attitude key-course covers described ground cable, and described flexible element electric connection contact is exposed.
Compared with prior art, the present invention except providing enough positions and providing between magnetic head and the cantilever part stable the connection, also have following advantage for the electrical connecting terminal of magnetic head.At first, the attitude key-course is as the datum plate of placing and support head module, so head module aims at flexible element easily, so just guaranteed the attitude that head module is good.The good attitude of magnetic head, promptly little pitching and roll attitude change, and can reduce the variation of flying height, thereby improve the readwrite performance of head module.The second, the attitude key-course between head module and cantilever part, thereby avoided short circuit between head module and the cantilever part.In addition, the attitude key-course makes between head module and the flexible element and has formed the gap, when connecting head module and flexible element, can conveniently monitor by described gap.
By following description also in conjunction with the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiment of the present invention.
Description of drawings
Fig. 1 is the stereographic map of traditional head driver unit.
Fig. 2 a is the partial side view of a kind of traditional magnetic head fold piece combination (HGA) of disc drive unit shown in Figure 1, has showed that magnetic head electrically connects at surface and cantilever part thereafter, and surface and cantilever part mechanical connection thereon.
Fig. 2 b is the partial side view of the traditional magnetic head fold piece combination (HGA) of another kind.
Fig. 3 is the stereographic map of disc drive unit of the present invention.
Fig. 4 is the local amplification stereogram of the magnetic head fold piece combination (HGA) of disc drive unit shown in Figure 3, and wherein not demonstrating carrier bar on the cantilever part is for the ease of clearly demonstrating principle of the present invention.
Fig. 5 is the amplification stereogram of head module of first embodiment of magnetic head fold piece combination shown in Figure 4.
Fig. 6 is the three-dimensional exploded view of cantilever part of first embodiment of magnetic head fold piece combination shown in Figure 4.
Fig. 7 is that three-dimensional combination figure is amplified in the part of cantilever part shown in Figure 6, and wherein soldering is received and is assembled on the described cantilever part.
Fig. 8 is the cut-open view of Fig. 7.
Fig. 9 has showed that head module is installed on the partial side view on the cantilever part shown in Figure 7 in advance.
Figure 10 is the partial side view after head module shown in Figure 9 is installed to cantilever part.
Figure 11 a is the three-dimensional exploded view of the head module of second embodiment of the present invention, and wherein the semiconducting insulation layer is electrically connected on the head module by grounding circuit.
Figure 11 b is the local amplification stereogram of the magnetic head body of head module shown in Figure 11 a, detail display second connecting terminal of magnetic head body.
Figure 12 a is the three-dimensional exploded view of the head module of the 3rd embodiment of the present invention, and wherein the semiconducting insulation layer is electrically connected on the head module by the Electrostatic Discharge connecting terminal.
Figure 12 b is the three-dimensional exploded view of the head module of the 4th embodiment of the present invention.
Figure 12 c is the three-dimensional exploded view of the head module of the 5th embodiment of the present invention.
Figure 13 is the plane exploded view of the cantilever part of second embodiment of the present invention.
Figure 14 is for being the plane exploded view of the cantilever part of the 3rd embodiment of the present invention.
Figure 15 is the plane exploded view of the cantilever part of the 4th embodiment of the present invention.
Figure 16 is the plane exploded view of the cantilever part of the 5th embodiment of the present invention.
Figure 17 is the plane exploded view of the cantilever part of the 6th embodiment of the present invention.
Figure 18 is the plane exploded view of the cantilever part of the 7th embodiment of the present invention.
Figure 19 is the plane exploded view of the cantilever part of the 8th embodiment of the present invention.
Figure 20 is the plane exploded view of the cantilever part of the 9th embodiment of the present invention.
Figure 21 is the example flow diagram of the method for manufacturing magnetic head fold piece combination of the present invention.
Embodiment
With reference now to accompanying drawing, describe embodiment of the present invention, the similar elements label is represented similar elements in the accompanying drawing.As mentioned above, the invention provides a kind of magnetic head fold piece combination, the head module of described magnetic head fold piece combination is connected in improved mode with cantilever part, so that under the impact situation, have good performance, and for connecting terminal provides more space, the head module of guaranteeing simultaneously to be installed on the cantilever part has good attitude.This connected mode is to use the opposite face of air bearing face as joint face, connecting terminal is provided on joint face, joint face and cantilever part machinery and electric connection at head module are placed on the attitude key-course between head module and the cantilever part, thereby support head module by the attitude key-course.
Below in detail with reference to the accompanying drawings, Fig. 3 is the stereographic map of disc drive unit of the present invention, and Fig. 4 is the local amplification stereogram of the magnetic head fold piece combination of described disc drive unit.Structure and configuration principle for the ease of understanding described magnetic head fold piece combination and disc drive unit will illustrate well-known components of the present invention and feature below.
As shown in Figure 3, disc drive unit comprise one group apart from one another by disk 904, and magnetic head actuating arm combination with magnetic head fold piece combination (HGA) 901.Described disk 904 is around Spindle Motor rotation.Described magnetic head fold piece combination (HGA) 901 comprises head module 100 and cantilever part 200.Described magnetic head fold piece combination 901 is connected on the actuating arm 903.Magnetic head actuating arm combination is rotated around an axle of this actuating arm 903, and is connected on the voice coil motor 905.Described voice coil motor 905 is being controlled the motion of actuating arm 903, and then the magnetic read/write heads in the control head piece 100 are positioned on the track on disk 904 surfaces, thereby guarantees magnetic read/write head reading of data or data are write in the disk 904 from disk 904.
By shown in Fig. 3 part, cantilever part 200 comprises carrier bar and by welding or the bonding flexible element that is connected to carrier bar.Carrier bar is used for directly providing power in flexible element, and makes head module 100 deflection disks, and flexible element provides flexible power for head module.Such structure makes the Desired Height place of head module above magnetic disk surface keep equilibrium state well.Described flexible element extends to actuating arm, so that be connected with read/write circuit.During work, the motion of described read/write circuit control head piece.
After the well-known components of magnetic head fold piece combination and disc drive unit had been described in the above, the present invention will continue to set forth with reference to figure 4-21.Described Fig. 4-21 can help to explain the principle of magnetic head fold piece combination of the present invention, disc drive unit and cantilever part.
With reference to figure 4, head module 100 is received by soldering or gold solder is received 300 is electrically connected on the cantilever part 200, and soldering is received or gold solder is received 300 sets up being electrically connected of head module 100 and read/write circuit.
Describe the head module 100 and the cantilever part 200 of magnetic head fold piece combination of the present invention below in detail.
Fig. 5 is the stereographic map of the head module 100 of first embodiment of the present invention.Head module 100 comprises air bearing face 111, the joint face 112 relative with air bearing face 111 and is arranged on electrical connecting terminal 131,132,133,135 of magnetic head and ground cable 134 on the joint face 112.Head module 100 also provides some second connecting terminals 114 in surface thereafter.Described second connecting terminal 114 is connected with the electrical connecting terminal 131,132,133,135 of described each magnetic head, with the control signal in the conduction read/write circuit.In more detail, the electrical connecting terminal of magnetic head comprises an a pair of a pair of connecting terminal 133 of writing of reading connecting terminal 131 and being used to conduct write signal that adds thermal contact 132, the ground connection connecting terminal 135 that is connected with described ground cable 134, is used to conduct read signal.Ground cable 134 is being read connecting terminal 131 and is being write between the connecting terminal 133, disturbs with the crossfire that reduces between read signal and the write signal, thereby guarantees the readwrite performance that head module 100 is good.Be connected to formation heater circuit on the heating cable thereby add thermal contact 132, and then adjust the flying height of head module 100 by thermal effect.
Fig. 6 is the exploded perspective view of the cantilever part 200 of first embodiment of the present invention.Cantilever part 200 comprises attitude key-course 240, circuit (trace pattern) 230 and flexible element.Described flexible element comprises insulation course 220 and metallic substrates 210.
Circuit 230 is positioned on the insulation course 220.Some flexible elements electric connection contact 231,232,233,235 and described circuit 230 are integrally formed.Described flexible element electrically connects contact 231,232,233,235 and is configured to corresponding to the electrical connecting terminal 131,132,133,135 of described magnetic head, electrically connects being electrically connected between contact and the electrical connecting terminal of magnetic head to set up flexible element.Circuit 230 also has some conductor cable 237.One end of described conductor cable 237 and flexible element electrically connect the contact and electrically connect, and the other end is connected with read/write circuit.More particularly, flexible element electrically connects the contact and comprises and add thermal contact 232, the ground connection connecting terminal 235 that is connected with ground cable 234, be used to conduct two of read signal and read connecting terminal 231, be used to conduct two of write signal and write connecting terminal 133.Ground cable 234 is being read connecting terminal 231 and is being write between the connecting terminal 233, disturbs with the crossfire that reduces between read signal and the write signal, thereby guarantees the readwrite performance that head module 100 is good.Add thermal contact 232 and be connected with the heating cable that extends to read/write circuit, thereby and thermal contact 132 actings in conjunction that add of head module 100 form heater circuit, and then adjust the flying height of head module 100 by thermal effect.Preferably, circuit 230 is being provided with recess 236 corresponding to place, flexible element electric connection contact.The recess structure that flexible element electrically connects the contact helps holding more scolding tin, thereby the head module-cantilever part that helps to obtain electrically connects performance.In a preferable embodiment, recess 236 break-through become through hole.
Attitude key-course 240 is by electrically insulating material, and for example poly-imido or epoxy resin are made.Described attitude key-course 240 places on the circuit 230, and flexible element electric connection contact is exposed.Head module is positioned on the attitude key-course 240, and wherein electrical connecting terminal of magnetic head and flexible element electrically connect the contact corresponding align, so as by soldering receive or gold solder receive 300 both couple together.Head module 100 is placed directly on the attitude key-course 240, therefore attitude key-course 240 is as datum plate, be used for supporting head module 100 on the one hand, be convenient on the other hand align head module 100 and circuit 230, thus guarantee that the head module 100 after assembling has good attitude.Especially, the pitching and the roll attitude variation of head module 100 have been eliminated or reduced at least to attitude key-course 240, thereby kept magnetic head flight height, therefore improves the reading and writing data performance of head module 100.In addition, attitude key-course 240 helps to form the gap between head module 100 and cantilever part 200, thereby surveys quality of connection the condition that may reach is provided for when assembling.That is to say that because attitude key-course 240 generally has about 20 microns thickness, therefore be easy to form the gap of about 20 microns height, it is enough that this height is received for the fusing soldering after solidifying.Tin ball outward appearance after solidifying can detect by microscope or infra-red detection device.Certainly, quality of connection also can be detected, and this provides chance just for the optimization quality of connection.In this embodiment, attitude key-course 240 is designed to T type and the local conductor cable 237 that covers.
With reference to figure 7-8, the flexible element that tin ball 300 is arranged on circuit 230 electrically connects on each through hole 236 of contact 231,232,233,235.Attitude key-course 240 parts are covered with circuit 230, outside wherein tin ball 300 is exposed to.Tin ball 300 just is used to set up a kind of material of electric connection, the known solid welding material of all the other types include but not limited to electrically connect ball (soldering is received, SBB) or conductive adhesive also can be applied to this.
Fig. 9-10 has showed by soldering and has received 300 when connecting the installation of head modules 100 and cantilever part 200 and the state after installing.Head module 100 at first directly is placed on the attitude key-course 240, and the electrical connecting terminal of the magnetic head of head module 100 is connected with corresponding tin ball 300 respectively then.Wherein said tin ball 300 has been connected to that corresponding flexible element is electrically connected on the contact on the cantilever part 200.For example, reading on the head module 100 read connecting terminal 231 and electrically connected on the circuit 230 of connecting terminal 131 by tin ball 300 and cantilever part 200, and this point is detailed to be shown among the figure.As an embodiment of the present invention, the tin ball bonding was connected ultrasonic soldering or/and laser beam heats tin ball is finished.The tin ball sprays tin ball (J-SBB) device by one to be seized, then laser beam or hot nitrogen fusing tin ball.After the tin ball solidified, the joint face 112 and the tin ball 300 of head module 100 can electrically connect well.Because the tin ball bonding connects, transmission line electrically connects between the contact at the electrical connecting terminal of magnetic head, tin ball and flexible element and forms, and cantilever part 200 is securely fixed on the joint face 112 of head module 100 as a result.Therefore, the control signal of read/write circuit will successfully be transmitted by conductor cable 237 (shown in Figure 9), and transmission line is sent to described signal in the head module 100 reliably then, thereby correctly finishes read-write operation according to this signal.
Be being connected of head module 100 and cantilever part 200 to realize by the joint face 112 of head module 100 is connected with cantilever part 200.This connected mode of the present invention has the following advantages.At first, the opposite face by using air bearing face 111 is as joint face 112, and provides connecting terminal on described joint face 112, and therefore described joint face 112 has more Free Regions and connecting terminal is set to adapt to the development of head technology.The second, be easy to being connected between head module 100 and the cantilever part 200 implement.Because head module 100 machinery and be connected to electrically on the cantilever part 200 and all on joint face, realize, and only need a Connection Step.Specifically, the epoxy glue adhesive technology in the conventional art no longer needs in the present invention.The 3rd, owing to do not relatively rotate between head module 100 and the cantilever part 200, so being connected of head module 100 and cantilever part 200 has good performance, the anti-collision performance of raising junction when impacting.In addition, attitude key-course 240 can be avoided the short circuit between head module 100 and the cantilever part 200 between head module 100 and cantilever part 200.The more important thing is that attitude key-course 240 is used for placing as a datum plate and carrying head module 100, so head module 100 can be easy to aim at cantilever part 200, thereby guarantee the good attitude of head module.The attitude that head module is good, promptly little pitching and lift-over change, and can reduce the variation of flying height, therefore can improve the reading and writing data performance of head module 100.Moreover attitude key-course 240 provides the gap between head module 100 and cantilever part 200, thereby can convenient detection in the operation that head module 100 is connected on the cantilever part 200.
Flexible element electrically connects contact (the perhaps electrical connecting terminal of magnetic head) and is provided in circuit 230 corresponding position, the center symmetries with head module 100 pre-installation (perhaps metal conductive layers 135), help to reduce variation like this by the outside camber of the different caused head modules of thermal expansivity (CTE, variable constant ofthermal expansion).In addition, electrical connecting terminal of magnetic head of the present invention and/or flexible element electric connection contact can be made by copper, gold or nickel; Conductor cable also can for example gold or copper become by any conductive material.
Alternatively, head module 100 of the present invention can be designed to have the structure of some optimizations.Figure 11 a has showed the head module 100a of second embodiment of the present invention.As shown in the figure, head module 100a comprises magnetic head body 110, first insulation course 120, metal conductive layers 130, second insulation course 140 and the semiconducting insulation layer 150 that fits together mutually.
With reference to figure 11a and 11b, magnetic head body 110 has air bearing face 111 ', with respect to the joint face 112 ' of air bearing face 111 ', and magnetic head base portion 115, outer cover 116 and the inner covering layer 117 between magnetic head base portion 115 and outer cover 116.Second connecting terminal 114 is arranged on the described inner covering layer 117.Magnetic head body 110 also provides read-write elements 118.Described read-write elements 118 is arranged on the described inner covering layer 117, and electrically connects with described each second connecting terminal 114.Described each second connecting terminal, 114 1 branch extend to the rear surface of outer cover 117, be used for wafer level and detect (waferlevel), another branch extends to joint face 112 ', in order to described metal conductive layers 130 on the electrical connecting terminal of corresponding magnetic head electrically connect.
Same with reference to figure 11a, first insulation course 120 is positioned on the magnetic head body 110.Described first insulation course 120 can be by any insulating material such as aluminium oxide (Al
2O
3, aluminum oxide) make.At length, described first insulation course 120 is arranged on the magnetic head body 110, and the whole length and the width of covering magnetic head body 110, therefore having good electricity isolation between metal conductive layers 130 and the magnetic head body 110 and between the electrical connecting terminal of each magnetic head of metal conductive layers 130, can be illustrated below.One side of first insulation course 120 is sheared into serrated edge 122, so that expose described second connecting terminal 114 and the electrical connecting terminal of each magnetic head, thereby second connecting terminal 114 can be connected with the electrical connecting terminal of each magnetic head.An angle of first insulation course 120 is sheared into the first right angle breach 121.
Metal conductive layers 130 is positioned on first insulation course 120.In this embodiment, some magnetic heads electrically connect the contact and are formed on the described metal conductive layers 130, and the electrical connecting terminal of described magnetic head on metal conductive layers 130 with the position symmetry corresponding with the longitudinal centre line of magnetic head body 110.The electrical connecting terminal of the magnetic head of metal conductive layers 130 comprise add thermal contact 132 ', ground connection connecting terminal 135 ', two read connecting terminal 131 ' and two and write connecting terminal 133 '.Metal conductive layers 130 also provides ground cable 134 '.Understandably, the electric connection contact in this embodiment is identical with electric connection contact function in first embodiment.
Figure 12 a has showed the head module 100b of the 3rd embodiment of the present invention.Head module 100b of the present invention is similar with head module 100a recited above, except another mode of semiconducting insulation layer 150 utilization of head module 100b magnetic head body 110 ground connection.Specifically, metal conductive layers 130 provides an Electrostatic Discharge connecting terminal 136, described semiconducting insulation layer 150 and magnetic head body 110 electrically connect with static discharge connecting terminal 136 by first breach 121 of first insulation course 120 and second breach 141 of second insulation course 140 respectively, thereby realize preventing static discharge.
Figure 12 b has showed the head module 100c of the 4th embodiment of the present invention.Head module 100c of the present invention is similar with head module 100a recited above, except a side of first insulation course 120 is sheared the limit 122 ' that is in line.Second connecting terminal 114 that is to say that first insulation course 120 is shorter, so after having assembled, can not isolated by first insulation course 120 with the electrical connecting terminal of magnetic head, thereby second connecting terminal 114 and the electrical connecting terminal of corresponding magnetic head can be coupled together.
Figure 12 c has showed the head module 100d of the 4th embodiment of the present invention.Head module 100d of the present invention is identical with said head piece 100c, except semiconducting insulation layer 150 is to electrically connect by static discharge connecting terminal 136 and magnetic head body 110.
Figure 13-20 has showed the shape and the combination of 8 kinds of different optional cantilever parts of the present invention.
Figure 13 is the plane exploded view of the cantilever part 400 of second embodiment of the present invention.Described cantilever part 400 comprises attitude key-course 440, has circuit (trace pattern) 430, the insulation course 420 of some conductor cable and flexible element electric connection contact and has the metallic substrates 410 that electrically connects the corresponding through hole in contact with flexible element.The circuit 430 of wherein said cantilever part 400, insulation course 420 and metallic substrates 410 have the structure identical with the circuit 230 of the cantilever part 200 of first embodiment, insulation course 220 and metallic substrates 210 respectively.Between cantilever part 400 and the cantilever part 200 unique difference be attitude key-course 440 have one cover flexible element electrically connect the T connector portion 441 of the conductor cable between the contact and a pair of and described T connector portion 441 that separate, cover the arm 442 that flexible element electrically connects the conductor cable of periphery, contact.
Figure 14 is the plane exploded view of the cantilever part 500 of the 3rd embodiment of the present invention.Described cantilever part 500 comprises attitude key-course 540, circuit (trace pattern) 530, insulation course 520 and metallic substrates 510.The circuit 530 of wherein said cantilever part 500 and insulation course 520 have the structure identical with the circuit 430 of top described cantilever part 400 and insulation course 220.Cantilever part 500 and difference between the cantilever part 400 are that attitude key-course 540 has the arm 542 that a H type head 541 and a pair of and described H type head 541 separate; The through hole 511 of described metallic substrates 510 with respect on the described metallic substrates 510 with pre-corresponding position, head module center symmetry of installing, and the through hole of the metallic substrates 410 of described cantilever part 400 is with respect to its center line symmetry.
Figure 15 is the plane exploded view of the cantilever part 600 of the 4th embodiment of the present invention.Described cantilever part 600 comprises attitude key-course 640, circuit (trace pattern) 630, insulation course 620 and metallic substrates 610.The circuit 630 of wherein said cantilever part 600 has the structure identical with the circuit 430 of above-mentioned cantilever part 400.Difference between cantilever part 600 and the cantilever part 400 is that described insulation course 620 has through hole 621, and described each through hole 621 is corresponding with two adjacent flexible elements electric connection contacts on the circuit 630; Attitude key-course 640 has the arm 642 that a H type head 641 and a pair of and described H type head 641 are connected as a single entity; Described metallic substrates 610 has two through holes 611 that are symmetrical in its center line.
Figure 16 is the plane exploded view of the cantilever part 700 of the 5th embodiment of the present invention.Described cantilever part 700 comprises attitude key-course 740, circuit (trace pattern) 730, insulation course 720 and metallic substrates 710.The circuit 730 of wherein said cantilever part 700 and insulation course 720 have the structure identical with the circuit 430 of above-mentioned cantilever part 400 and insulation course 420 respectively.Difference between cantilever part 700 and the cantilever part 400 is that attitude key-course 740 has the arm 742 that a T connector portion 741 and a pair of and described T connector portion 741 are connected as a single entity; The metallic substrates 710 of described cantilever part 700 heart place therein has a depressed part 712 that has rectangular through holes 711.
Figure 17 is the plane exploded view of the cantilever part 800 of the 6th embodiment of the present invention.Described cantilever part 800 comprises attitude key-course 840, circuit (trace pattern) 830, insulation course 820 and metallic substrates 810.The attitude key-course 840 of wherein said cantilever part 800, circuit 830 and insulation course 820 have the structure identical with the attitude key-course 740 of above-mentioned cantilever part 700, circuit 730 and insulation course 720 respectively.Unique difference between cantilever part 800 and the cantilever part 700 is that described metallic substrates 810 has a depressed part that has manhole 811 in heart place therein.
Figure 18 is the plane exploded view of the cantilever part 900 of the 7th embodiment of the present invention.Described cantilever part 900 comprises attitude key-course 940, circuit (trace pattern) 930, insulation course 920 and metallic substrates 910.The attitude key-course 940 of wherein said cantilever part 900, circuit 930 and insulation course 920 have the structure identical with the attitude key-course 740 of above-mentioned cantilever part 700, circuit 730 and insulation course 720 respectively.Unique difference between cantilever part 900 and the cantilever part 700 is that described metallic substrates 910 has four through holes 911, described four through holes 911 have with described metallic substrates 910 on corresponding to the one-piece construction of the position symmetry at the head module center of pre-installation.
Figure 19 is the plane exploded view of the cantilever part 1000 of the 8th embodiment of the present invention.Described cantilever part 1000 comprises attitude key-course 1040, circuit (trace pattern) 1030, insulation course 1020 and metallic substrates 1010.The attitude key-course 1040 of wherein said cantilever part 1000, circuit 1030 and insulation course 1020 have the structure identical with the attitude key-course 540 of above-mentioned cantilever part 500, circuit 530 and insulation course 520 respectively.Unique difference between cantilever part 1000 and the cantilever part 500 is that the metallic substrates 1010 of described cantilever part 1000 has breach 1011 along its edge, and described breach 1011 is symmetrical in a center line of described metallic substrates 1010.
Figure 20 is the plane exploded view of the cantilever part 1100 of the 9th embodiment of the present invention.Described cantilever part 1100 comprises attitude key-course 1140, circuit (trace pattern) 1130, insulation course 1120 and metallic substrates 1110.The attitude key-course 1140 of wherein said cantilever part 1100, circuit 1130 and insulation course 1120 have the structure identical with the attitude key-course 540 of above-mentioned cantilever part 500, circuit 530 and insulation course 520 respectively.Unique difference between cantilever part 1100 and the cantilever part 500 is that described metallic substrates 1110 has through hole 1111, and described through hole 1111 is symmetrical in a line vertical with the longitudinal centre line of described metallic substrates 1110.
Figure 21 is the example flow diagram of the method for manufacturing magnetic head fold piece combination.As shown in the figure, the manufacture method of head module tabs combination is as follows: step S1 provides the head module with air bearing face and joint face relative with described air bearing face; Step S2 is provided with some magnetic heads and electrically connects the contact on the joint face of described head module; Step S3 forms a semiconducting insulation layer and on described semiconducting insulation layer some notches is set, and wherein said semiconducting insulation layer is made by diamond-like-carbon; Step S4 covers described semiconducting insulation layer on the joint face of described head module and the electrical connecting terminal of described magnetic head is exposed in the corresponding notch, electrically connects described semiconducting insulation layer and described head module; Step S5 is provided with some flexible elements and electrically connects the contact on a circuit of being made by conductive material (trace pattern), and the position corresponding to flexible element electric connection contact is provided with recess on described circuit; Step S6 forms flexible element and also described circuit is arranged on the described flexible element; Step S7 forms the attitude key-course, covers described attitude key-course on the described circuit and make described flexible element electrically connect the contact to expose; Step S8, be placed on described head module on the described attitude key-course and make the electrical connecting terminal of described magnetic head and described flexible element electrically connects the contact corresponding align, the electrical connecting terminal of described magnetic head is electrically connected on the corresponding flexible element electric connection contact.
Invention has been described for the best embodiment of above combination, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (39)
1. magnetic head fold piece combination comprises:
Head module, described head module have air bearing face, joint face and some magnetic heads and electrically connect the contact; And
Cantilever part, described cantilever part have flexible element and the flexible element that is arranged on the described flexible element electrically connects the contact;
It is characterized in that: the joint face of described head module is relative with described air bearing face, the electrical connecting terminal of described magnetic head is arranged on the described joint face, described cantilever part also has the attitude key-course, described attitude key-course covers on the described flexible element, and flexible element electric connection contact is exposed, described head module is positioned on the attitude key-course, and wherein electrical connecting terminal of magnetic head and corresponding flexible element electrically connect contact alignment so that the electrical connecting terminal of magnetic head electrically connects with corresponding flexible element electric connection contact.
2. magnetic head fold piece combination as claimed in claim 1 is characterized in that: described cantilever part also comprises circuit, and described circuit is arranged on the flexible element, and described flexible element electrically connects the contact and is formed on the described circuit.
3. magnetic head fold piece combination as claimed in claim 2 is characterized in that: described circuit is provided with recess in the position that electrically connects the contact corresponding to described flexible element.
4. magnetic head fold piece combination as claimed in claim 3 is characterized in that: described recess is a through hole by break-through.
5. magnetic head fold piece combination as claimed in claim 4 is characterized in that: described flexible element is provided with recess in the position corresponding to the through hole of described circuit.
6. magnetic head fold piece combination as claimed in claim 2 is characterized in that: described flexible element comprises metallic substrates and insulation course, and described insulation course is between described metallic substrates and described circuit.
7. magnetic head fold piece combination as claimed in claim 6 is characterized in that: described metallic substrates has stress relief portion, the position part hollow out of described stress relief portion below being positioned at described flexible element electric connection contact.
8. magnetic head fold piece combination as claimed in claim 7 is characterized in that: described stress relief portion has some symmetrically arranged through holes or breach.
9. magnetic head fold piece combination as claimed in claim 6 is characterized in that: described insulation course is provided with some recesses in the position that electrically connects the contact corresponding to flexible element.
10. magnetic head fold piece combination as claimed in claim 2, it is characterized in that: described circuit has some conductor cable, described conductor cable electrically connects the contact from described flexible element and extends to extraneous control circuit respectively, and described attitude key-course is set to the local at least described conductor cable that covers.
11. magnetic head fold piece combination as claimed in claim 10 is characterized in that: described attitude key-course is T-shaped.
12. magnetic head fold piece combination as claimed in claim 10 is characterized in that: described attitude key-course has one and covers the T connector portion of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
13. magnetic head fold piece combination as claimed in claim 10 is characterized in that: described attitude key-course has one and covers the H type head of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
14. magnetic head fold piece combination as claimed in claim 1, it is characterized in that: described head module also comprises the semiconducting insulation layer with some notches, described semiconducting insulation layer covers on the joint face of described head module and with described head module and is electrically connected, and the electrical connecting terminal of wherein said magnetic head is exposed in described each notch.
15. magnetic head fold piece combination as claimed in claim 14 is characterized in that: described semiconducting insulation layer is the diamond like carbon carbon-coating.
16. the magnetic head fold piece combination shown in claim 14 is characterized in that: the electrical connecting terminal of described magnetic head comprises the static discharge connecting terminal, and described static discharge connecting terminal electrically connects described semiconducting insulation layer and described head module.
17. magnetic head fold piece combination as claimed in claim 1 is characterized in that: have some second connecting terminals on the rear surface of described head module, described second connecting terminal is electrically connected on the electrical connecting terminal of corresponding magnetic head.
18. magnetic head fold piece combination as claimed in claim 1, it is characterized in that: described head module also has metal conductive layers, be in the joint face and first insulation course between the described metal conductive layers of described head module and cover second insulation course on the described metal conductive layers, the electrical connecting terminal of described magnetic head is formed on the described metal conductive layers, and described second insulation course has in order to expose some notches of the electrical connecting terminal of described each magnetic head.
19. magnetic head fold piece combination as claimed in claim 18, it is characterized in that: the electrical connecting terminal of described magnetic head also comprises at least one ground connection connecting terminal, at least one reads connecting terminal and at least one writes connecting terminal, described metal conductive layers has at least one ground cable, described ground cable is connected on the described ground connection connecting terminal, and reads connecting terminal and described writing between the connecting terminal described.
20. magnetic head fold piece combination as claimed in claim 18 is characterized in that: the electrical connecting terminal of described magnetic head comprises and adds thermal contact.
21. a disc drive unit comprises:
Magnetic head fold piece combination;
The actuating arm that is connected with described magnetic head fold piece combination;
Disk; And
The Spindle Motor of spinning disk;
Wherein said magnetic head fold piece combination comprises:
Head module, described head module have air bearing face, joint face and some magnetic heads and electrically connect the contact; And
Cantilever part, described cantilever part have flexible element and the flexible element that is arranged on the described flexible element electrically connects the contact;
It is characterized in that: the joint face of described head module is relative with described air bearing face, the electrical connecting terminal of described magnetic head is arranged on the described joint face, described cantilever part also has the attitude key-course, described attitude key-course covers on the described flexible element, and flexible element electric connection contact is exposed, described head module is positioned on the attitude key-course, and wherein electrical connecting terminal of magnetic head and corresponding flexible element electrically connect contact alignment so that the electrical connecting terminal of magnetic head electrically connects with corresponding flexible element electric connection contact.
22. disc drive unit as claimed in claim 21 is characterized in that: described cantilever part also comprises circuit, and described circuit is arranged on the flexible element, and described flexible element electrically connects the contact and is formed on the described circuit.
23. disc drive unit as claimed in claim 22, it is characterized in that: described circuit has some conductor cable, described conductor cable electrically connects the contact from described flexible element and extends to extraneous control circuit respectively, and described attitude key-course is set to the local at least described conductor cable that covers.
24. disc drive unit as claimed in claim 23 is characterized in that: described attitude key-course is T-shaped.
25. disc drive unit as claimed in claim 23 is characterized in that: described attitude key-course has one and covers the T connector portion of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
26. disc drive unit as claimed in claim 23 is characterized in that: described attitude key-course has one and covers the H type head of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
27. disc drive unit as claimed in claim 21, it is characterized in that: described head module also comprises the semiconducting insulation layer with some notches, described semiconducting insulation layer covers on the joint face of described head module and with described head module and is electrically connected, and the electrical connecting terminal of wherein said magnetic head is exposed in described each notch.
28. disc drive unit as claimed in claim 27 is characterized in that: described semiconducting insulation layer is the diamond like carbon carbon-coating.
29. the manufacture method of a magnetic head fold piece combination is characterized in that, comprises the steps:
(1) provides head module with air bearing face and joint face relative with described air bearing face;
(2) some magnetic heads are set and electrically connect the contact on the joint face of described head module;
(3) form flexible element and some flexible elements are set electrically connect the contact on described flexible element;
(4) form the attitude key-course, cover described attitude key-course on the described flexible element and make described flexible element electrically connect the contact and expose; And
(5) be placed on described head module on the described attitude key-course and make the electrical connecting terminal of described magnetic head and described flexible element electrically connects the contact corresponding align, the electrical connecting terminal of described magnetic head is electrically connected on the corresponding flexible element electric connection contact.
30. manufacture method as claimed in claim 29 is characterized in that: between described step (2) and described step (3), also comprise the steps:
Form a semiconducting insulation layer and on described semiconducting insulation layer, some notches are set; And
Described semiconducting insulation layer is covered on the joint face of described head module and the electrical connecting terminal of described magnetic head is exposed in the corresponding notch, electrically connect described semiconducting insulation layer and described head module.
31. manufacture method as claimed in claim 30 is characterized in that: described semiconducting insulation layer is made by diamond-like-carbon.
32. the manufacture method shown in claim 29 is characterized in that: described flexible element electrically connects the contact and is formed on the circuit of being made by conductive material.
33. manufacture method as claimed in claim 32 is characterized in that: the position that electrically connects the contact corresponding to flexible element that described step (3) also is included in circuit is provided with the step of recess.
34. a cantilever part that supports head module comprises flexible element, it is characterized in that, described cantilever part also comprises:
Be positioned at the circuit on the flexible element, some flexible elements electric connections contact that described circuit comprises ground cable and is positioned at described ground cable both sides; And
The attitude key-course, described attitude key-course covers described ground cable, and described flexible element electric connection contact is exposed.
35. cantilever part as claimed in claim 34 is characterized in that: at least one among described circuit and the described flexible element is provided with recess in the position that electrically connects the contact corresponding to described flexible element.
36. cantilever part as claimed in claim 34 is characterized in that: described circuit have if
DoConductor cable, described conductor cable electrically connects the contact from described flexible element and extends to extraneous control circuit respectively, and described attitude key-course is set to the local described conductor cable that covers.
37. cantilever part as claimed in claim 36 is characterized in that: described attitude key-course is T-shaped.
38. cantilever part as claimed in claim 36 is characterized in that: described attitude key-course has one and covers the T connector portion of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
39. cantilever part as claimed in claim 36 is characterized in that: described attitude key-course has one and covers the H type head of the conductor cable between the described flexible element electric connection contact and the arm that the described flexible element of a pair of covering electrically connects the conductor cable of periphery, contact.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101720378A CN101206868B (en) | 2006-12-21 | 2006-12-21 | Improved magnetic head tabs combination and manufacturing method thereof as well as disk drive unit |
| JP2007329919A JP2008159245A (en) | 2006-12-21 | 2007-12-21 | Head gimbal assembly and its manufacturing method, and disk drive unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101720378A CN101206868B (en) | 2006-12-21 | 2006-12-21 | Improved magnetic head tabs combination and manufacturing method thereof as well as disk drive unit |
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| Publication Number | Publication Date |
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| CN101206868A CN101206868A (en) | 2008-06-25 |
| CN101206868B true CN101206868B (en) | 2011-03-30 |
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| CN2006101720378A Active CN101206868B (en) | 2006-12-21 | 2006-12-21 | Improved magnetic head tabs combination and manufacturing method thereof as well as disk drive unit |
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| JP (1) | JP2008159245A (en) |
| CN (1) | CN101206868B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866653B (en) * | 2009-04-15 | 2014-11-05 | 新科实业有限公司 | Cantilever piece with isolated tail, magnetic head folding sheet assembly and disk drive unit |
| CN101958124A (en) * | 2009-07-14 | 2011-01-26 | 新科实业有限公司 | Head gimbal assembly, cantilever piece thereof and hard disk driver |
| JP5603657B2 (en) * | 2010-05-20 | 2014-10-08 | 日東電工株式会社 | Suspension board with circuit and manufacturing method thereof |
| JP5849386B2 (en) * | 2010-09-27 | 2016-01-27 | 大日本印刷株式会社 | Suspension substrate, method for manufacturing suspension substrate, suspension, suspension with element, and hard disk drive |
| CN102592610B (en) * | 2011-01-05 | 2016-08-03 | 新科实业有限公司 | There is a cantilever part for bracer, magnetic head fold piece combination and disc drive unit |
| JP6132007B2 (en) * | 2015-12-03 | 2017-05-24 | 大日本印刷株式会社 | Suspension substrate, method for manufacturing suspension substrate, suspension, suspension with element, and hard disk drive |
| CN112420081B (en) * | 2020-11-05 | 2021-11-19 | 杭州职业技术学院 | Computer mechanical hard disk with collision protection function and collision protection method thereof |
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| JP2008159245A (en) | 2008-07-10 |
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