CN101071724A - Flat-panel display device with igh gate-modulated multi-arris cathode structure and its preparing process - Google Patents
Flat-panel display device with igh gate-modulated multi-arris cathode structure and its preparing process Download PDFInfo
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Abstract
The invention relates to a flat-panel display of a high grid-controlled multi-edge cathode structure and the making process thereof, comprising: sealed vacuum cavity composed of anode glass panel, cathode glass panel, and peripheral glass frame; anode conducting layer on the anode glass panel and fluorescent powder layer prepared on the anode conducting layer; cathode conducting layer, carbon nanotube and high grid-controlled multi-edge cathode structure on the cathode glass panel; supporting wall structure and degassing agent auxiliary component between the anode glass panel and cathode glass panel, and it can further improve control function and efficiency of grid structure, raise electron emission efficiency of carbon nanotube cathode, and helps to improve display brightness, and has advantages of stable and reliable making course, simple making process, low making cost, and simple structure.
Description
Technical field
The invention belongs to the mutual crossing domain in technical field of flat panel display, microelectronics science and technology field, vacuum science and technical field and nanometer science and technology field, relate to the element manufacturing of panel field emission display, be specifically related to the content of element manufacturing aspect of the panel field emission display of carbon nanotube cathod, particularly a kind of flat-panel monitor and manufacture craft thereof of high grid-controlled multi-edge type cathode construction.
Background technology
Field-emission plane display is a kind of novel self-luminous flat panel display equipment, has advantages such as low in energy consumption, high brightness, wide visual angle and response speed be fast, and being known as is a kind of desirable flat-panel display device.Carbon nano-tube has little tip curvature radius, and high aspect rate and high mechanical strength can present good field emission characteristics, is a kind of novel cold-cathode material.And the carbon nanotube cathod field-emitter display utilizes this field emission principle of carbon nanotube cathod and develops, have characteristics such as high display brightness, high image quality, high-resolution, representing the developing direction of international technical field of flat panel display.
At present, in the middle of most three-stage structure field emission display device, all adopted grid structure to be positioned at the version of carbon nanotube cathod superstructure.Its manufacture craft is simple, and the grid control action is remarkable, but grid current is bigger than normal, and grid voltage is high, and this is its disadvantage.Further reducing operating voltage of grid structure also is that the quality system that meets the low pressure flat-panel display device requires.Reduce the distance between grid structure and the carbon nanotube cathod structure as much as possible, can effectively reduce operating voltage of grid structure; Simultaneously, the shape of carbon nanotube cathod also exists certain influence to formed electric field strength.Obviously, the curvature of the shape of carbon nanotube cathod is more little, also just can strengthen the electric field strength on surperficial top more, and in fact this reduced operating voltage of grid structure from indirect angle.In addition, also need as much as possible carbon nanotube cathod to come in the middle of all participating in the electronics emission, so that improve the display brightness of device.So, in the manufacturing process of practical devices, adopt which kind of grid structure actually, how further to reduce operating voltage of grid, or the like, these all are considerable problems.
In addition, in the middle of the panel field emission display spare of three-stage structure, guaranteeing that grid structure has carbon nanotube cathod under the prerequisite of good control action, also need to reduce as much as possible the total device cost, carry out reliable and stable, with low cost, function admirable, high quality devices is made.
Summary of the invention
The objective of the invention is to overcome the shortcoming and defect that exists in the above-mentioned flat-panel display device and provide a kind of with low cost, manufacturing process is reliable and stable, be made into the power height, the flat-panel monitor and the manufacture craft thereof of high grid-controlled multi-edge type cathode construction simple in structure.
The object of the present invention is achieved like this, comprise by anode glass panel, cathode glass faceplate and all around glass enclose the sealed vacuum chamber that frame constitutes; Be arranged on anode conductive layer and the phosphor powder layer of preparation on anode conductive layer on the anode glass panel; Supporting wall structure between anode glass panel and cathode glass faceplate and getter subsidiary component, cathode glass faceplate are provided with cathode conductive layer, carbon nano-tube and high grid-controlled multi-edge type cathode construction.
The backing material of described high grid-controlled multi-edge type cathode construction is a glass, as soda-lime glass, Pyrex, just cathode glass faceplate; The insulation paste layer of the printing on the cathode glass faceplate forms block layer; Metal level after the etching above the block layer forms the cathode leg layer; Metal level after the etching above the cathode leg layer forms the negative electrode transition zone; The negative electrode transition zone presents the disc face shape, and its lower surface closely contacts with the cathode leg layer; The silver slurry layer of the printing above the negative electrode transition zone forms negative electrode rising layer; Negative electrode rising layer presents triangle rib type shape, i.e. the cross section of negative electrode rising layer is a triangular form, and length direction is a long strip type, is arranged adjacent in successively on the upper surface of negative electrode transition zone; Metal level after the etching on the negative electrode rising layer upper surface forms cathode conductive layer; Cathode conductive layer will be covered with the upper surface of negative electrode rising layer; The insulation paste layer of the printing above the block layer forms wall; The lower surface of wall is the plane, cover cathode leg layer and vacant block layer part; There is circular apertures in the wall, exposes negative electrode transition zone, negative electrode rising layer and the cathode conductive layer of bottom; The madial wall of circular apertures is perpendicular to the barrel surface of cathode glass faceplate in the wall; The upper surface major part of wall all is the plane, but forms an inclined plane around circular apertures, and is promptly from the upper surface of wall, downward-sloping gradually, till the madial wall position that arrives circular apertures; Metal level after the etching on the wall inclined plane forms grid control one deck; Grid control one deck is covered with wall inclined plane upper surface, and its fore-end is concordant with the circular apertures madial wall; Metal level after the etching of the upper surface of wall forms the grid lead layer; Grid lead layer and grid control one deck are interconnected; The insulation paste layer of the printing above the grid lead layer forms the additional spacer layer; The upper and lower surface of additional spacer layer is the plane, and lower surface will cover whole grid lead layers; The additional spacer layer presents a semi-circular shape near the fore-end of circular apertures one side; The semi-circular shape of additional spacer layer front end is positioned at the top on wall inclined plane in vertical direction, and it can not surmount the circular apertures madial wall foremost; Metal level after the lip-deep etching of the semi-circular shape of additional spacer layer front end forms two layers of grid control; The bottom that grid control is two layers and grid control one deck are interconnected; Made of carbon nanotubes is on cathode conductive layer.
The fixed position of described high grid-controlled multi-edge type cathode construction is for being fixed on the cathode glass faceplate; Cathode conductive layer can be metallic gold, silver, copper, aluminium, molybdenum, chromium, tin; The negative electrode transition zone can be metallic gold, silver, copper, aluminium, molybdenum, chromium; Cathode conductive layer can be metallic iron, cobalt, nickel; Grid control one deck can be metallic gold, silver, aluminium, molybdenum, chromium; Grid control can be metallic gold, silver, aluminium, molybdenum, chromium, tin for two layers; The trend of the trend of grid lead layer and cathode leg layer is orthogonal; The grid lead layer can be metallic gold, silver, aluminium, molybdenum, chromium.
A kind of manufacture craft of flat-panel monitor of high grid-controlled multi-edge type cathode construction, its manufacture craft is as follows:
1) making of cathode glass faceplate [1]: whole plate glass is carried out scribing, produce cathode glass faceplate;
2) making of block layer [2]: printing insulation paste layer on cathode glass faceplate forms block layer behind baking, sintering process;
3) making of cathode leg layer [3]: on block layer, prepare a metal level, form the cathode leg layer after the etching;
4) making of negative electrode transition zone [4]: on the cathode leg layer, prepare a metal level, form the negative electrode transition zone after the etching;
5) making of negative electrode rising layer [5]: printed silver slurry on the negative electrode transition zone forms negative electrode rising layer behind baking, sintering process;
6) making of cathode conductive layer [6]: on the surface of negative electrode rising layer, prepare a metal level, form cathode conductive layer after the etching;
7) making of wall [7]: printing insulation paste layer on block layer forms wall behind baking, sintering process;
8) making of grid control one deck [8]: on the wall inclined plane, prepare a metal level, form grid control one deck after the etching;
9) making of grid lead layer [9]: on the upper surface of wall, prepare a metallic chromium layer, form the grid lead layer after the etching;
10) making of additional spacer layer [10]: printing insulation paste layer on the grid lead layer forms the additional spacer layer behind baking, sintering process;
11) making of grid control two layers [11]: the surface preparation in the semi-circular shape of additional spacer layer front end goes out a metallic chromium layer, forms two layers of grid control after the etching;
12) cleaning surfaces of high grid-controlled multi-edge type cathode construction is handled: clean is carried out on the surface to high grid-controlled multi-edge type cathode construction, removes impurity and dust;
13) preparation of carbon nano-tube [12]: with made of carbon nanotubes on cathode conductive layer;
14) making of anode glass panel [13]: whole plate glass is carried out scribing, produce the anode glass panel;
15) making of anode conductive layer [14]: evaporation one deck tin indium oxide rete on the anode glass panel; Form anode conductive layer after the etching;
16) making of insulation paste layer [15]: at the non-display area printing insulation paste layer of anode conductive layer;
17) making of phosphor powder layer [16]: the viewing area printing phosphor powder layer on anode conductive layer;
18) device assembling: with cathode glass faceplate, anode glass panel, supporting wall structure [17] and all around glass enclose frame [18] and be assembled together, and getter [19] is put in the middle of the cavity, fix with glass powder with low melting point.Around face glass, smeared glass powder with low melting point, fixed with clip;
19) finished product is made: the device that has assembled is carried out packaging technology form finished parts.
Described step 16 is specially the non-display area printing insulation paste layer at anode conductive layer, is used to prevent the parasitic electrons emission; Through overbaking (baking temperature: 150 ℃, retention time: 5 minutes) afterwards, be placed on and carry out high temperature sintering (sintering temperature: 580 ℃, retention time: 10 minutes) in the sintering furnace.
Described step 17 is specially the viewing area printing phosphor powder layer on anode conductive layer; In the middle of baking oven, toast (baking temperature: 120 ℃, the retention time: 10 minutes).
The device that described step 19 is specially having assembled carries out following packaging technology: toast in the middle of the sample device is put into baking oven; Carry out sintering in the middle of putting into sintering furnace; On exhaust station, carry out device exhaust, sealed-off, on the roasting machine that disappears, the getter of device inside bake and disappears, install pin formation finished parts at last additional.
The present invention has following good effect:
At first, in described high grid-controlled multi-edge type cathode construction, above the cathode conductive layer, cathode conductive layer then is to have made on the surface of the negative electrode rising layer that presents many ribs type shape with made of carbon nanotubes.Like this, made full use of the endemism that the marginal position in the carbon nanotube cathod can be launched a large amount of electronics on the one hand, change the surface configuration of carbon nanotube cathod, made it under lower voltage, launch a large amount of electronics, improved the electronic transmitting efficiency of carbon nanotube cathod; On the other hand, also greatly increase the electron emission area of carbon nanotube cathod, made more carbon nano-tube all participate in the electronics emission, helped improving the display brightness of device.
Secondly, in described high grid-controlled multi-edge type cathode construction, grid control one deck, two layers of grid control and grid lead layer structure have been made respectively.Wherein the grid lead layer can be delivered to device inside with external voltage, the then strict electronics emission of controlling carbon nanotube cathod of grid control one deck, when two layers of grid control play the emission of assistant regulating and controlling carbon nanotube cathod electronics, can also embody the function that the electrons emitted Shu Jinhang of institute is focused on.When after applying appropriate voltage on the grid structure, will form powerful electric field strength on top, carbon nanotube cathod surface, force carbon nano-tube to launch a large amount of electronics.Help further improving the display resolution of integral device.
In addition, in described high grid-controlled multi-edge type cathode construction, do not adopt special structure fabrication material, do not adopt special device making technics yet, this has just further reduced the cost of manufacture of whole flat-panel display device to a great extent, simplify the manufacturing process of device, can carry out large-area element manufacturing, helped carrying out business-like large-scale production.
Description of drawings
Fig. 1 has provided the vertical structure schematic diagram of high grid-controlled multi-edge type cathode construction;
Fig. 2 has provided the transversary schematic diagram of high grid-controlled multi-edge type cathode construction;
Fig. 3 has provided the stravismus schematic diagram of negative electrode in the high grid-controlled multi-edge type cathode construction;
Fig. 4 has provided and has had high grid-controlled multi-edge type cathode construction structural representation emitting structural, the carbon nanotube field emission flat-panel screens.
Embodiment
Below in conjunction with drawings and Examples the present invention is further specified, but the present invention is not limited to these embodiment.
The flat-panel monitor of described high grid-controlled multi-edge type cathode construction, comprise by anode glass panel [13], cathode glass faceplate [1] and all around glass enclose the sealed vacuum chamber that frame [18] is constituted; Anode conductive layer [14] and the phosphor powder layer [16] of preparation on anode conductive layer are arranged on the anode glass panel; Supporting wall structure between anode glass panel and cathode glass faceplate [17] and getter subsidiary component [19].Cathode conductive layer [6], carbon nano-tube [12] and high grid-controlled multi-edge type cathode construction are arranged on cathode glass faceplate;
Described high grid-controlled multi-edge type cathode construction comprises cathode glass faceplate [1], block layer [2], cathode leg layer [3], negative electrode transition zone [4], negative electrode rising layer [5], a cathode conductive layer [6], wall [7], grid control one deck [8], grid lead layer [9], additional spacer layer [10], grid control two layers of [11] and carbon nano-tube [12] part.
The backing material of described high grid-controlled multi-edge type cathode construction is a glass, as soda-lime glass, Pyrex, just cathode glass faceplate; The insulation paste layer of the printing on the cathode glass faceplate forms block layer; Metal level after the etching above the block layer forms the cathode leg layer; Metal level after the etching above the cathode leg layer forms the negative electrode transition zone; The negative electrode transition zone presents the disc face shape, and its lower surface closely contacts with the cathode leg layer; The silver slurry layer of the printing above the negative electrode transition zone forms negative electrode rising layer; Negative electrode rising layer presents triangle rib type shape, i.e. the cross section of negative electrode rising layer is a triangular form, and length direction is a long strip type, is arranged adjacent in successively on the upper surface of negative electrode transition zone; Metal level after the etching on the negative electrode rising layer upper surface forms cathode conductive layer; Cathode conductive layer will be covered with the upper surface of negative electrode rising layer; The insulation paste layer of the printing above the block layer forms wall; The lower surface of wall is the plane, cover cathode leg layer and vacant block layer part; There is circular apertures in the wall, exposes negative electrode transition zone, negative electrode rising layer and the cathode conductive layer of bottom; The madial wall of circular apertures is perpendicular to the barrel surface of cathode glass faceplate in the wall; The upper surface major part of wall all is the plane, but forms an inclined plane around circular apertures, and is promptly from the upper surface of wall, downward-sloping gradually, till the madial wall position that arrives circular apertures; Metal level after the etching on the wall inclined plane forms grid control one deck; Grid control one deck is covered with wall inclined plane upper surface, and its fore-end is concordant with the circular apertures madial wall; Metal level after the etching of the upper surface of wall forms the grid lead layer; Grid lead layer and grid control one deck are interconnected; The insulation paste layer of the printing above the grid lead layer forms the additional spacer layer; The upper and lower surface of additional spacer layer is the plane, and lower surface will cover whole grid lead layers; The additional spacer layer presents a semi-circular shape near the fore-end of circular apertures one side; The semi-circular shape of additional spacer layer front end is positioned at the top on wall inclined plane in vertical direction, and it can not surmount the circular apertures madial wall foremost; Metal level after the lip-deep etching of the semi-circular shape of additional spacer layer front end forms two layers of grid control; The bottom that grid control is two layers and grid control one deck are interconnected; Made of carbon nanotubes is on cathode conductive layer.
The fixed position of described high grid-controlled multi-edge type cathode construction is for being fixed on the cathode glass faceplate; Cathode conductive layer can be metallic gold, silver, copper, aluminium, molybdenum, chromium, tin; The negative electrode transition zone can be metallic gold, silver, copper, aluminium, molybdenum, chromium; Cathode conductive layer can be metallic iron, cobalt, nickel; Grid control one deck can be metallic gold, silver, aluminium, molybdenum, chromium; Grid control can be metallic gold, silver, aluminium, molybdenum, chromium, tin for two layers; The trend of the trend of grid lead layer and cathode leg layer is orthogonal; The grid lead layer can be metallic gold, silver, aluminium, molybdenum, chromium.
A kind of manufacture craft that has the flat-panel monitor of high grid-controlled multi-edge type cathode construction, its manufacture craft is as follows:
1) making of cathode glass faceplate [1]: the dull and stereotyped soda-lime glass of integral body is carried out scribing, produce cathode glass faceplate;
2) making of block layer [2]: printing insulation paste layer on cathode glass faceplate forms block layer behind baking, sintering process;
3) making of cathode leg layer [3]: on block layer, prepare a metal molybdenum layer, form the cathode leg layer after the etching;
4) making of negative electrode transition zone [4]: on the cathode leg layer, prepare a metallic chromium layer, form the negative electrode transition zone after the etching;
5) making of negative electrode rising layer [5]: printed silver slurry on the negative electrode transition zone forms negative electrode rising layer behind baking, sintering process;
6) making of cathode conductive layer [6]: on the surface of negative electrode rising layer, prepare a metal nickel dam, form cathode conductive layer after the etching;
7) making of wall [7]: printing insulation paste layer on block layer forms wall behind baking, sintering process;
8) making of grid control one deck [8]: on the wall inclined plane, prepare a metallic chromium layer, form grid control one deck after the etching;
9) making of grid lead layer [9]: on the upper surface of wall, prepare a metallic chromium layer, form the grid lead layer after the etching;
10) making of additional spacer layer [10]: printing insulation paste layer on the grid lead layer forms the additional spacer layer behind baking, sintering process;
11) making of grid control two layers [11]: the surface preparation in the semi-circular shape of additional spacer layer front end goes out a metallic chromium layer, forms two layers of grid control after the etching;
12) cleaning surfaces of high grid-controlled multi-edge type cathode construction is handled: clean is carried out on the surface to high grid-controlled multi-edge type cathode construction, removes impurity and dust;
13) preparation of carbon nano-tube [12]: with made of carbon nanotubes on cathode conductive layer;
14) reprocessing of carbon nano-tube: carbon nano-tube is carried out reprocessing, improve field emission characteristics;
15) making of anode glass panel [13]: the dull and stereotyped soda-lime glass of integral body is carried out scribing, produce the anode glass panel;
16) making of anode conductive layer [14]: evaporation one deck tin indium oxide rete on the anode glass panel; Form anode conductive layer after the etching;
17) making of insulation paste layer [15]: at the non-display area printing insulation paste layer of anode conductive layer;
18) making of phosphor powder layer [16]: the viewing area printing phosphor powder layer on anode conductive layer;
19) device assembling: with cathode glass faceplate, anode glass panel, supporting wall structure [17] and all around glass enclose frame [18] and be assembled together, and getter [19] is put in the middle of the cavity, fix with glass powder with low melting point.Around face glass, smeared glass powder with low melting point, fixed with clip;
20) finished product is made: the device that has assembled is carried out packaging technology form finished parts.
Described step 17 is specially the non-display area printing insulation paste layer at anode conductive layer, is used to prevent the parasitic electrons emission; Through overbaking (baking temperature: 150 ℃, retention time: 5 minutes) afterwards, be placed on and carry out high temperature sintering (sintering temperature: 580 ℃, retention time: 10 minutes) in the sintering furnace.
Described step 18 is specially the viewing area printing phosphor powder layer on anode conductive layer; In the middle of baking oven, toast (baking temperature: 120 ℃, the retention time: 10 minutes).
The device that described step 20 is specially having assembled carries out following packaging technology: toast in the middle of the sample device is put into baking oven; Carry out sintering in the middle of putting into sintering furnace; On exhaust station, carry out device exhaust, sealed-off, on the roasting machine that disappears, the getter of device inside bake and disappears, install pin formation finished parts at last additional.
Claims (7)
1, a kind of flat-panel monitor of high grid-controlled multi-edge type cathode construction, comprise by anode glass panel [13], cathode glass faceplate [1] and all around glass enclose the sealed vacuum chamber that frame [18] is constituted; Be arranged on anode conductive layer [14] and the phosphor powder layer [16] of preparation on anode conductive layer on the anode glass panel; Supporting wall structure between anode glass panel and cathode glass faceplate [17] and getter subsidiary component [19] is characterized in that: cathode glass faceplate is provided with cathode conductive layer [6], carbon nano-tube [12] and high grid-controlled multi-edge type cathode construction.
2, the flat-panel monitor of high grid-controlled multi-edge type cathode construction according to claim 1 is characterized in that: the backing material of described high grid-controlled multi-edge type cathode construction is soda-lime glass, Pyrex, i.e. cathode glass faceplate; The insulation paste layer of the printing on the cathode glass faceplate forms block layer; Metal level after the etching above the block layer forms the cathode leg layer; Metal level after the etching above the cathode leg layer forms the negative electrode transition zone; The negative electrode transition zone presents the disc face shape, and its lower surface closely contacts with the cathode leg layer; The silver slurry layer of the printing above the negative electrode transition zone forms negative electrode rising layer; Negative electrode rising layer presents triangle rib type shape, i.e. the cross section of negative electrode rising layer is a triangular form, and length direction is a long strip type, is arranged adjacent in successively on the upper surface of negative electrode transition zone; Metal level on the negative electrode rising layer upper surface after the etching forms cathode conductive layer; Cathode conductive layer will be covered with the upper surface of negative electrode rising layer; The insulation paste layer that block layer prints above forms wall; The lower surface of wall is the plane, cover cathode leg layer and vacant block layer part; There is circular apertures in the wall, exposes negative electrode transition zone, negative electrode rising layer and the cathode conductive layer of bottom; The madial wall of circular apertures is perpendicular to the barrel surface of cathode glass faceplate in the wall; The upper surface major part of wall all is the plane, forms an inclined plane around circular apertures, and is promptly from the upper surface of wall, downward-sloping gradually, till the madial wall position that arrives circular apertures; Metal level after the etching on the wall inclined plane forms grid control one deck; Grid control one deck is covered with wall inclined plane upper surface, and its fore-end is concordant with the circular apertures madial wall; Metal level after the etching of the upper surface of wall forms the grid lead layer; Grid lead layer and grid control one deck are interconnected; The insulation paste layer of the printing above the grid lead layer forms the additional spacer layer; The upper and lower surface of additional spacer layer is the plane, and lower surface will cover whole grid lead layers; The additional spacer layer presents a semi-circular shape near the fore-end of circular apertures one side; The semi-circular shape of additional spacer layer front end is positioned at the top on wall inclined plane in vertical direction, and it can not surmount the circular apertures madial wall foremost; Metal level after the lip-deep etching of the semi-circular shape of additional spacer layer front end forms two layers of grid control; The bottom that grid control is two layers and grid control one deck are interconnected; Made of carbon nanotubes is on cathode conductive layer.
3, the flat-panel monitor of high grid-controlled multi-edge type cathode construction according to claim 2 is characterized in that: the fixed position of described high grid-controlled multi-edge type cathode construction is for being fixed on the cathode glass faceplate; Cathode conductive layer is metal gold, silver, copper, aluminium, molybdenum, chromium, tin; The negative electrode transition zone is metal gold, silver, copper, aluminium, molybdenum, chromium; Cathode conductive layer is metallic iron, cobalt, nickel; Grid control one deck is metal gold, silver, aluminium, molybdenum, chromium; Grid control is metal gold, silver, aluminium, molybdenum, chromium, tin for two layers; The trend of the trend of grid lead layer and cathode leg layer is orthogonal; The grid lead layer is metal gold, silver, aluminium, molybdenum, chromium.
4, a kind of manufacture craft of flat-panel monitor of high grid-controlled multi-edge type cathode construction is characterized in that, its manufacture craft is as follows:
1) making of cathode glass faceplate [1]: whole plate glass is carried out scribing, produce cathode glass faceplate;
2) making of block layer [2]: printing insulation paste layer on cathode glass faceplate forms block layer behind baking, sintering process;
3) making of cathode leg layer [3]: on block layer, prepare a metal level, form the cathode leg layer after the etching;
4) making of negative electrode transition zone [4]: on the cathode leg layer, prepare a metal level, form the negative electrode transition zone after the etching;
5) making of negative electrode rising layer [5]: printed silver slurry on the negative electrode transition zone forms negative electrode rising layer behind baking, sintering process;
6) making of cathode conductive layer [6]: on the surface of negative electrode rising layer, prepare a metal level, form cathode conductive layer after the etching;
7) making of wall [7]: printing insulation paste layer on block layer forms wall behind baking, sintering process;
8) making of grid control one deck [8]: on the wall inclined plane, prepare a metal level, form grid control one deck after the etching;
9) making of grid lead layer [9]: on the upper surface of wall, prepare a metal level, form the grid lead layer after the etching;
10) making of additional spacer layer [10]: printing insulation paste layer on the grid lead layer forms the additional spacer layer behind baking, sintering process;
11) making of grid control two layers [11]: the surface preparation in the semi-circular shape of additional spacer layer front end goes out a metallic chromium layer, forms two layers of grid control after the etching;
12) cleaning surfaces of high grid-controlled multi-edge type cathode construction is handled: clean is carried out on the surface to high grid-controlled multi-edge type cathode construction, removes impurity and dust;
13) preparation of carbon nano-tube [12]: with made of carbon nanotubes on cathode conductive layer;
14) making of anode glass panel [13]: whole plate glass is carried out scribing, produce the anode glass panel;
15) making of anode conductive layer [14]: evaporation one deck tin indium oxide rete on the anode glass panel; Form anode conductive layer after the etching;
16) making of insulation paste layer [15]: at the non-display area printing insulation paste layer of anode conductive layer;
17) making of phosphor powder layer [16]: the viewing area printing phosphor powder layer on anode conductive layer;
18) device assembling: with cathode glass faceplate, anode glass panel, supporting wall structure [17] and all around glass enclose frame [18] and be assembled together, and getter [19] is put in the middle of the cavity, fix with glass powder with low melting point;
19) finished product is made: the device that has assembled is carried out packaging technology form finished parts.
5, the manufacture craft of the flat-panel monitor of high grid-controlled multi-edge type cathode construction according to claim 4 is characterized in that: described step 16 is specially the non-display area printing insulation paste layer at anode conductive layer, is used to prevent the parasitic electrons emission; Through overbaking, baking temperature: 150 ℃, the retention time: 5 minutes, afterwards, be placed on and carry out high temperature sintering in the sintering furnace, sintering temperature: 580 ℃, the retention time: 10 minutes.
6, the manufacture craft of the flat-panel monitor of high grid-controlled multi-edge type cathode construction according to claim 4 is characterized in that: described step 17 is specially the viewing area printing phosphor powder layer on anode conductive layer; In the middle of baking oven, toast baking temperature: 120 ℃, the retention time: 10 minutes.
7, the manufacture craft of the flat-panel monitor of high grid-controlled multi-edge type cathode construction according to claim 4 is characterized in that: the device that described step 19 is specially having assembled carries out following packaging technology: toast in the middle of the sample device is put into baking oven; Carry out sintering in the middle of putting into sintering furnace; On exhaust station, carry out device exhaust, sealed-off, on the roasting machine that disappears, the getter of device inside bake and disappears, install pin formation finished parts at last additional.
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| CNB2007100545855A CN100527336C (en) | 2007-06-19 | 2007-06-19 | Flat-panel display device with igh gate-modulated multi-arris cathode structure and its preparing process |
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| CNB2007100545855A CN100527336C (en) | 2007-06-19 | 2007-06-19 | Flat-panel display device with igh gate-modulated multi-arris cathode structure and its preparing process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128922A (en) * | 2016-07-07 | 2016-11-16 | 金陵科技学院 | The most straight upper active display gating structure of terrace with edge job mix many ribs shape negative electrode three |
| CN106128920A (en) * | 2016-07-07 | 2016-11-16 | 金陵科技学院 | The active display of the staggered many faceted pebbles composite cathode structure of branch's silver gate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106328462B (en) * | 2016-10-31 | 2018-08-07 | 电子科技大学 | A kind of micro-nano size ribbon-like electron note field-emissive cathode system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106128922A (en) * | 2016-07-07 | 2016-11-16 | 金陵科技学院 | The most straight upper active display gating structure of terrace with edge job mix many ribs shape negative electrode three |
| CN106128920A (en) * | 2016-07-07 | 2016-11-16 | 金陵科技学院 | The active display of the staggered many faceted pebbles composite cathode structure of branch's silver gate |
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| CN100527336C (en) | 2009-08-12 |
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