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CN101077956B - 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 - Google Patents

挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 Download PDF

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Publication number
CN101077956B
CN101077956B CN2007101061106A CN200710106110A CN101077956B CN 101077956 B CN101077956 B CN 101077956B CN 2007101061106 A CN2007101061106 A CN 2007101061106A CN 200710106110 A CN200710106110 A CN 200710106110A CN 101077956 B CN101077956 B CN 101077956B
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CN
China
Prior art keywords
solder resist
flexible substrate
epoxy resin
type epoxy
compound
Prior art date
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Active
Application number
CN2007101061106A
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English (en)
Chinese (zh)
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CN101077956A (zh
Inventor
大胡义和
宇敷滋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN101077956A publication Critical patent/CN101077956A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2007101061106A 2006-05-26 2007-05-25 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法 Active CN101077956B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006146994A JP4864545B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法
JP2006146993 2006-05-26
JP2006146993A JP4871646B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板およびフレキシブル基板の製造方法
JP2006146994 2006-05-26
JP2006-146994 2006-05-26
JP2006-146993 2006-05-26

Publications (2)

Publication Number Publication Date
CN101077956A CN101077956A (zh) 2007-11-28
CN101077956B true CN101077956B (zh) 2010-12-08

Family

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CN2007101061106A Active CN101077956B (zh) 2006-05-26 2007-05-25 挠性基板用阻焊剂组合物、挠性基板及挠性基板制造方法

Country Status (4)

Country Link
JP (2) JP4864545B2 (ja)
KR (1) KR100830810B1 (ja)
CN (1) CN101077956B (ja)
TW (1) TW200811236A (ja)

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DE102010014319A1 (de) * 2010-01-29 2011-08-04 Siemens Aktiengesellschaft, 80333 Dämpfungsmasse für Ultraschallsensor, Verwendung eines Epoxidharzes
TWI546150B (zh) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
CN102933033B (zh) * 2012-10-31 2015-04-22 广州金鹏源康精密电路股份有限公司 一种pi油墨的运用方法
KR101451568B1 (ko) 2013-03-27 2014-10-22 주식회사 엘 앤 에프 방열구조를 갖는 인쇄회로기판
KR101687394B1 (ko) 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
CN105820646A (zh) * 2015-01-04 2016-08-03 赖中平 防焊油墨及其制造方法
CN112106450A (zh) * 2018-05-11 2020-12-18 昭和电工材料株式会社 导体基板、伸缩性配线基板及配线基板用伸缩性树脂膜
JP7071300B2 (ja) * 2019-01-21 2022-05-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム、半導体積層体、半導体積層体の製造方法及び半導体装置の製造方法
JP7336881B2 (ja) * 2019-06-06 2023-09-01 太陽ホールディングス株式会社 熱硬化性組成物及びその硬化被膜を有する被覆基材

Citations (3)

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CN1498236A (zh) * 2001-03-23 2004-05-19 太阳油墨制造株式会社 活性能量线固化树脂和含其的光固化·热固性树脂组合物
CN1523058A (zh) * 2003-02-18 2004-08-25 �������ɹ�ҵ��ʽ���� 绝缘树脂组合物及其制备方法、多层布线板及其生产方法
WO2005100448A1 (ja) * 2004-03-31 2005-10-27 Taiyo Ink Manufacturing Co., Ltd. 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物

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JPH0415273A (ja) * 1990-05-10 1992-01-20 Tonen Corp ソルダーレジストインク
JP2002171050A (ja) * 1997-04-11 2002-06-14 Ibiden Co Ltd プリント配線板
JP3346263B2 (ja) * 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
JP3537119B2 (ja) * 1998-01-16 2004-06-14 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物
JP3415047B2 (ja) * 1998-11-18 2003-06-09 ジャパンエポキシレジン株式会社 硬化性エポキシ樹脂組成物
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DE10057111C1 (de) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
JP4845274B2 (ja) * 2001-02-27 2011-12-28 京セラ株式会社 配線基板及びその製造方法
JP2002256063A (ja) 2001-02-28 2002-09-11 Ootex Kk 光硬化性レジスト組成物
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TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
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JP2006008867A (ja) * 2004-06-25 2006-01-12 Matsushita Electric Works Ltd ビニルエステル樹脂組成物及びその成形品

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CN1498236A (zh) * 2001-03-23 2004-05-19 太阳油墨制造株式会社 活性能量线固化树脂和含其的光固化·热固性树脂组合物
CN1523058A (zh) * 2003-02-18 2004-08-25 �������ɹ�ҵ��ʽ���� 绝缘树脂组合物及其制备方法、多层布线板及其生产方法
WO2005100448A1 (ja) * 2004-03-31 2005-10-27 Taiyo Ink Manufacturing Co., Ltd. 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物

Non-Patent Citations (1)

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Also Published As

Publication number Publication date
JP4871646B2 (ja) 2012-02-08
JP2007317945A (ja) 2007-12-06
TW200811236A (en) 2008-03-01
TWI379865B (ja) 2012-12-21
JP4864545B2 (ja) 2012-02-01
CN101077956A (zh) 2007-11-28
JP2007314695A (ja) 2007-12-06
KR100830810B1 (ko) 2008-05-19
KR20070114027A (ko) 2007-11-29

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20071128

Assignee: Taiyo Ink Mfg.Co., Ltd.

Assignor: Taiyo Holding Co., Ltd.

Contract record no.: 2011990000116

Denomination of invention: Welding resistant agent composition for flexible substrate, flexible substrate and preparation method for the flexible substrate

Granted publication date: 20101208

License type: Common License

Record date: 20110302

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model