CN100516989C - Panel for liquid crystal display - Google Patents
Panel for liquid crystal display Download PDFInfo
- Publication number
- CN100516989C CN100516989C CNB2006100602158A CN200610060215A CN100516989C CN 100516989 C CN100516989 C CN 100516989C CN B2006100602158 A CNB2006100602158 A CN B2006100602158A CN 200610060215 A CN200610060215 A CN 200610060215A CN 100516989 C CN100516989 C CN 100516989C
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- Prior art keywords
- mother substrate
- frame glue
- lcd
- panel
- glue
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Abstract
A face plate used on liquid crystal display is prepared for setting the first and the second mother base plates in opposite way, arranging multiple glue line between two said mother base plates, utilizing said glue lines and two said mother base plates to define out multiple containing space, setting at least one top-bottom through containing space in each glue line and laying conduction resin in said containing space.
Description
[technical field]
The present invention relates to a kind of panel that is used for LCD.
[background technology]
At present, LCD replaces conventional cathode ray tube (the Cathode Ray Tube that is used for counter gradually, CRT) display, and, because characteristics such as the liquid crystal display utensil is light, thin, little, make its be fit to very much be applied to desktop PC, laptop computer, personal digital assistant (Personal Digital Assistant, PDA), in portable phone, TV and multiple office automation and the audio-visual equipment.Liquid crystal panel is its main element, liquid crystal panel generally comprise a thin film transistor base plate, a colored filter substrate and be clipped in this thin film transistor base plate and this colored filter substrate between liquid crystal layer.In addition, on colored filter substrate respect to one another and thin film transistor base plate, form public electrode and pixel electrode so that apply electric field to liquid crystal layer.Be generally the output that improves when making liquid crystal indicator, on a big mother substrate, form a plurality of thin film transistor base plates, and on another mother substrate, form a plurality of colored filter substrates, again this two mother substrate is fitted mutually, form a plurality of liquid crystal panels simultaneously, therefore before carrying out successive process, the big panel after needing to fit cuts into a plurality of unit liquid crystal panel.
In the applying processing procedure, at first be coated with frame glue on a big mother substrate, this frame glue one is to be used to fit two mother substrates, the 2nd, and frame goes out liquid crystal and injects scope.
Cutting/sliver processing procedure is in the LCD manufacture process, big panel according to product size cut/sliver forms the processing procedure of unit panel.
See also Fig. 1 and Fig. 2, Fig. 1 is the synoptic diagram that a kind of prior art is used for the panel of LCD, and Fig. 2 is along the diagrammatic cross-section of II-II direction among Fig. 1.This panel 100 comprises one first mother substrate 110 and one second mother substrate 120, be formed with a plurality of thin film transistor base plates 111 on this first mother substrate 110, be formed with a plurality of colored filter substrates 121 on this second mother substrate 120, be coated with main frame glue 112 around this each thin film transistor base plate 111, this main frame glue 112 be used to fit this first mother substrate 110 and second mother substrate 120, and this first mother substrate 110, second mother substrate 120 and main frame glue 112 define a plurality of receiving spaces 114, this receiving space 114 is used to accommodate liquid crystal layer (figure does not show), these a plurality of main frame glue 112 peripheries are coated with a plurality of adhesive dots 115 respectively, these a plurality of adhesive dots 115 are used for the electrode (figure does not show) of this thin film transistor base plate 111 of conducting and colored filter substrate 121, make this thin film transistor base plate 111 and colored filter substrate 121 equipotentials.
But, see also Fig. 3, be the synoptic diagram after panel shown in Figure 2 is fitted.At first first mother substrate 110 and 120 applyings of second mother substrate are compressed, cut the processing procedure with sliver then simultaneously, this processing procedure is included in first mother substrate 110 and second mother substrate, 120 outside surfaces form the crack line 130 of vertical direction with scriber (figure does not show) and the crack line 130 of vertical direction by the opposite side pressurization to cut apart two steps of sliver.As shown in the figure, this first mother substrate 110 and second mother substrate 120 this adhesive dots 115 that is arranged on these main frame glue 112 peripheries after compressing of fitting is extruded lateral extension, two adjacent conducting resinls might overlap, and be cross over crack line 130, it is incomplete therefore can to cause this panel that is used for LCD 100 to cut apart sliver.
In order to address the above problem, industry also has the size with adhesive dots to reduce, and in order not influence the conductive capability of adhesive dots, increases the Metal Ball density in the conducting resinl that is coated with.But the size that reduces adhesive dots can increase the coating difficulty, and the Metal Ball density that increases in the conducting resinl also can increase coating and impregnation difficulty.
[summary of the invention]
Cut and split and problem that manufacture difficulty is big for solving above-mentioned influence, be necessary to provide that a kind of to split influence less and reduce the panel that is used for LCD of manufacture difficulty to cutting.
A kind of panel that is used for LCD, it comprises one first mother substrate, one second mother substrate, a plurality of frame glue and a plurality of conducting resinl, this first mother substrate and second mother substrate are oppositely arranged, these a plurality of frame glue are between this first mother substrate and second mother substrate, itself and this first mother substrate and second mother substrate define a plurality of receiving spaces, this a plurality of receiving spaces periphery all is formed with crack line, these a plurality of frame glue are coated on this first mother substrate, on each frame glue, be formed with a plurality of accommodation spaces that run through up and down, this conducting resinl correspondence is arranged in these a plurality of accommodation spaces, to such an extent as to this second mother substrate is fitted when pressing to this first mother substrate, the accommodation space that runs through up and down can not make this conducting resinl that sets within it be squeezed to this crack line.
Compared with prior art, because above-mentioned each frame glue of panel that is used for LCD is to comprise at least one accommodation space that runs through up and down, and it is peripheral and be arranged in this accommodation space that this conducting resinl is not arranged on frame glue, therefore when compressing first mother substrate and second mother substrate when fitting conducting resinl be difficult for being extruded and lateral extension so that two adjacent conducting resinls are overlapped, thereby can reduce influence to follow-up cutting/sliver manufacturing.In addition, conducting resinl is arranged in the accommodation space of this frame glue, and need not the other space that is provided with, and therefore can reduce the space constraint of conducting resinl, thereby can reduce the coating difficulty of conducting resinl.
[description of drawings]
Fig. 1 is the structural representation that prior art is used for the panel of LCD.
Fig. 2 is the diagrammatic cross-section of panel shown in Figure 1 II-II along the line.
Fig. 3 is the synoptic diagram after the panel that is used for LCD shown in Figure 2 is fitted.
Fig. 4 is the decomposing schematic representation that the present invention is used for the panel of LCD.
Fig. 5 is the synoptic diagram of the mother substrate coating frame glue of panel shown in Figure 4.
Fig. 6 is along the diagrammatic cross-section of VI-VI direction among Fig. 4.
Fig. 7 is fit a partial cutaway schematic after compressing of the panel that is used for LCD.
Fig. 8 is the enlarged diagram of regional VIII among Fig. 7.
Fig. 9 is the synoptic diagram that the present invention is used for a kind of distortion of panel of LCD.
Figure 10 is the synoptic diagram that the present invention is used for the another kind of distortion of panel of LCD.
Figure 11 is the synoptic diagram that the present invention is used for another distortion of panel of LCD.
[embodiment]
See also Fig. 4, Fig. 5 and Fig. 6, Fig. 4 is the decomposing schematic representation that the present invention is used for the panel of LCD, and Fig. 5 is the synoptic diagram of the mother substrate coating frame glue of panel shown in Figure 4, and Fig. 6 is along the diagrammatic cross-section of VI-VI direction among Fig. 4.This panel 200 that is used for LCD comprises first mother substrate 210, second mother substrate 220, frame glue 230 and adhesive dots 240.This second mother substrate 220 is to be oppositely arranged with this first mother substrate 210, and this frame glue 230 and adhesive dots 240 are arranged between this first mother substrate 210 and this second mother substrate 220.
Be formed with a plurality of thin film transistor base plates 211 on this first mother substrate 210, be formed with a plurality of colored filter substrates 221 on this second mother substrate 220.Be coated with frame glue 230 around this each thin film transistor base plate 211, this each frame glue 230 is the interruption body that comprises a plurality of headspaces 232, promptly this frame glue 230 is arranged on this each thin film transistor base plate 211 peripheries in discontinuous mode, this headspace 232 is considered as accommodation space and adhesive dots 240 is set within it, each thin film transistor base plate 211, this frame glue 230 and adhesive dots 240 define a receiving space 250, and this receiving space 250 is used to accommodate liquid crystal layer (figure does not show).
Wherein, this frame glue 230 be used to fit this first mother substrate 210 and this second mother substrate 220, it is ultraviolet hardening frame glue, thermmohardening type frame glue or the frame glue that has the two performance concurrently.This adhesive dots 240 is to mix a plurality of Metal Ball and make in a kind of glue material, and this glue material can be ultraviolet hardening glue, heating stiffening type glue or the glue that has the two performance concurrently, and this Metal Ball is a ping-pong ball etc.This adhesive dots 240 is used for the electrode (figure does not show) of this thin film transistor base plate 211 of conducting and colored filter substrate 221, thereby makes this thin film transistor base plate 211 and colored filter substrate 221 equipotentials.
This manufacture method that is used for the panel 200 of LCD may further comprise the steps:
(1) provides first mother substrate 210, form a plurality of thin film transistor base plates 211 thereon; Second mother substrate 220 is provided simultaneously, and forms a plurality of colored filter substrates 221 thereon;
(2) on this first mother substrate 210, at these thin film transistor base plate 211 peripheral discontinuous coating frame glue 230, promptly this frame glue 230 comprises a plurality of headspaces 232;
(3) on this first mother substrate 210, in the headspace 232 of this frame glue 230, adhesive dots 240 is set;
Can adjust the size of this adhesive dots 240 by the size of the headspace 232 of adjusting above-mentioned manufacturing, when increasing adhesive dots 240 big or small, can reduce the interior Metal Ball concentration of conducting resinl of pre-coating, also can keep the identical amount of conducting this moment, and be beneficial to the smoothness that coating is made.
(4) applying compresses this first mother substrate 210 and second mother substrate 220;
(5) shine this frame glue 230 and adhesive dots 240 with ultraviolet ray, make it sclerosis and firmly cohere first mother substrate 210 and second mother substrate 220.
See also Fig. 7 and Fig. 8, Fig. 7 is the synoptic diagram that the panel 200 that is used for LCD shown in Figure 6 is fitted after compressing, and Fig. 8 is the enlarged diagram of regional VIII among Fig. 7.This adhesive dots 240 is arranged in the headspace 232 of this frame glue 230, rather than be arranged on the periphery of frame glue 230, therefore after this adhesive dots 240 is extruded lateral extension in applying compresses the manufacturing of this first mother substrate 210 and this second mother substrate 220 just and frame glue 230 be combined as a whole, even and have this adhesive dots 240 of sub-fraction to be extruded into frame glue 230 peripheries also can not influence follow-up cutting/sliver manufacturing.This cutting/sliver manufacturing can have different modes, as cutting back sliver or cutting and sliver etc. earlier simultaneously, present embodiment is mainly introduced simultaneously cutting and sliver, and this cuts simultaneously and is included in this first mother substrate 210 and this second mother substrate, 220 outside surfaces with the sliver manufacturing and forms the crack line 280 of vertical direction with scriber (figure does not show) and the crack line 280 of vertical direction is pressurizeed to cut apart two steps of sliver by opposite side.
Compared with prior art, because above-mentioned panel 200 each frame glue 230 that are used for LCD are the interruption bodies that comprise at least one headspace 232, and it is peripheral and be arranged in this headspace 232 that is considered as accommodation space that this adhesive dots 240 is not arranged on frame glue 230, therefore adhesive dots 240 is difficult for being extruded lateral extension and causes two adjacent adhesive dots 240 to overlap when applying compresses first mother substrate 210 and second mother substrate 220, thereby can reduce the influence to follow-up cutting/sliver manufacturing.In addition, adhesive dots 240 is arranged in the headspace 232 of this frame glue 230, and need not the other space that is provided with, therefore can reduce the space constraint of adhesive dots 240, thereby can reduce the coating difficulty of adhesive dots 240, and can increase the size of adhesive dots 240, therefore can reduce the interior Metal Ball concentration of conducting resinl of pre-coating, also can keep the identical amount of conducting this moment, and be beneficial to the smoothness that coating is made, thereby also can reduce the coating difficulty of adhesive dots 240.
But, it is described that this module backlight is not limited to above-mentioned embodiment, the accommodation space of placing adhesive dots on this frame glue also can be by the alternate manner manufacturing as shown in Figure 9, at first on this first mother substrate 310, be coated with this frame glue 330 continuously, dig a plurality of holes that run through up and down 332 then on this frame glue 330, the back is provided with adhesive dots 340 in this hole 332; Also as shown in figure 10, opening a plurality of grooves that run through up and down 432 on the frame glue 430 of coating continuously on this first mother substrate 410, again this adhesive dots 440 is arranged in this groove 432; Also as shown in figure 11, each the frame glue 530 that is arranged on first mother substrate 510 only comprises a headspace 532, in this headspace 532 of this each frame glue 530 this adhesive dots 540 etc. is set.
Claims (10)
1. panel that is used for LCD, it comprises: one first mother substrate, one second mother substrate, a plurality of frame glue and a plurality of conducting resinl, this first mother substrate and second mother substrate are oppositely arranged, these a plurality of frame glue are between this first mother substrate and second mother substrate, itself and this first mother substrate and second mother substrate define a plurality of receiving spaces, this a plurality of receiving spaces periphery all is formed with crack line, it is characterized in that: these a plurality of frame glue are coated on this first mother substrate, on each frame glue, be formed with a plurality of accommodation spaces that run through up and down, this conducting resinl correspondence is arranged in these a plurality of accommodation spaces, to such an extent as to this second mother substrate is fitted when pressing to this first mother substrate, the accommodation space that runs through up and down can not make this conducting resinl that sets within it be squeezed to this crack line.
2. the panel that is used for LCD as claimed in claim 1 is characterized in that: be formed with a plurality of thin film transistor base plates on this first mother substrate, be coated with this frame glue around this thin film transistor base plate.
3. the panel that is used for LCD as claimed in claim 1 is characterized in that: this each frame glue is an interruption body, and described accommodation space is a headspace.
4. the panel that is used for LCD as claimed in claim 1 is characterized in that: the accommodation space that runs through up and down on this each frame glue is a hole.
5. the panel that is used for LCD as claimed in claim 1 is characterized in that: the accommodation space that runs through up and down on this each frame glue is a groove.
6. want the 1 described panel that is used for LCD as right, it is characterized in that: this frame glue is ultraviolet hardening frame glue or thermmohardening type frame glue.
7. want the 1 described panel that is used for LCD as right, it is characterized in that: this frame glue is the frame glue that has thermmohardening type frame glue and ultraviolet hardening frame colloidality energy concurrently.
8. want the 1 described panel that is used for LCD as right, it is characterized in that: this conducting resinl is to distribute a plurality of Metal Ball and make in ultraviolet hardening glue.
9. want the 1 described panel that is used for LCD as right, it is characterized in that: this conducting resinl is to distribute a plurality of Metal Ball and make in heating stiffening type glue.
10. want the 1 described panel that is used for LCD as right, it is characterized in that: this conducting resinl be have concurrently heating stiffening type glue and ultraviolet hardening colloidality can glue in distribute a plurality of Metal Ball and make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100602158A CN100516989C (en) | 2006-04-07 | 2006-04-07 | Panel for liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100602158A CN100516989C (en) | 2006-04-07 | 2006-04-07 | Panel for liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101051126A CN101051126A (en) | 2007-10-10 |
| CN100516989C true CN100516989C (en) | 2009-07-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100602158A Expired - Fee Related CN100516989C (en) | 2006-04-07 | 2006-04-07 | Panel for liquid crystal display |
Country Status (1)
| Country | Link |
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| CN (1) | CN100516989C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881909A (en) * | 2010-06-29 | 2010-11-10 | 友达光电股份有限公司 | Display panel and manufacturing method thereof |
| TWI408468B (en) * | 2010-06-18 | 2013-09-11 | Au Optronics Corp | Display panel and manufactoring method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI436312B (en) | 2009-03-04 | 2014-05-01 | Prime View Int Co Ltd | Flexible display device |
| CN101833902B (en) * | 2009-03-11 | 2012-11-07 | 元太科技工业股份有限公司 | Flexible display |
| CN103278970B (en) * | 2013-04-13 | 2016-04-20 | 福建华映显示科技有限公司 | Display panel and manufacture method thereof |
| CN104391400B (en) * | 2014-12-03 | 2017-03-15 | 京东方科技集团股份有限公司 | A kind of display floater and preparation method thereof, array base palte, display device |
| CN105629550A (en) * | 2016-01-29 | 2016-06-01 | 豪威半导体（上海）有限责任公司 | LCOS structure and manufacturing method |
| CN107369761B (en) * | 2017-08-10 | 2020-04-14 | 武汉华星光电技术有限公司 | Flexible display panel, substrate PI layer structure thereof and preparation method |
| CN109799652B (en) * | 2019-03-26 | 2021-04-02 | Tcl华星光电技术有限公司 | Mother board structure and manufacturing method of liquid crystal display panel |
| CN110288906A (en) * | 2019-07-10 | 2019-09-27 | 友达光电（昆山）有限公司 | Display device and its manufacturing method |
| WO2022027207A1 (en) * | 2020-08-04 | 2022-02-10 | 承洺股份有限公司 | Optical bonding method for micro light emitting diode display |
| CN112904628B (en) * | 2021-03-26 | 2023-04-25 | 长沙惠科光电有限公司 | Display panel, display device and manufacturing method of display panel |
-
2006
- 2006-04-07 CN CNB2006100602158A patent/CN100516989C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI408468B (en) * | 2010-06-18 | 2013-09-11 | Au Optronics Corp | Display panel and manufactoring method thereof |
| CN101881909A (en) * | 2010-06-29 | 2010-11-10 | 友达光电股份有限公司 | Display panel and manufacturing method thereof |
| CN101881909B (en) * | 2010-06-29 | 2012-09-05 | 友达光电股份有限公司 | Display panel and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101051126A (en) | 2007-10-10 |
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Granted publication date: 20090722 Termination date: 20190407 |