CN105629550A - LCOS structure and manufacturing method - Google Patents
LCOS structure and manufacturing method Download PDFInfo
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- CN105629550A CN105629550A CN201610069018.6A CN201610069018A CN105629550A CN 105629550 A CN105629550 A CN 105629550A CN 201610069018 A CN201610069018 A CN 201610069018A CN 105629550 A CN105629550 A CN 105629550A
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- Prior art keywords
- lcos
- groove
- glass substrate
- manufacture method
- frame glue
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13396—Spacers having different sizes
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a liquid crystal on silicon (LCOS) structure and a manufacturing method. The manufacturing method for the LCOS structure comprises a step of forming a conducting material layer in a sealant, thereby utilizing the conducting material layer to implement the conduction between a glass substrate unit and a circuit board through an LCOS substrate unit. The invention further provides an LCOS structure manufactured by utilizing the manufacturing method for the LCOS structure. Compared with the prior art, the manufacturing method for the LCOS structure not only can effectively shorten a manufacturing process of LCOS products, but also can solve the technical problems that conducting resin is removed or broken and the conducting resin is easy to oxidize in the prior art.
Description
Technical field
The present invention relates to field of liquid crystal display, particularly to a kind of LCOS structure and manufacture method.
Background technology
LCOS (LiquidCrystalonSilicon, the attached silicon of liquid crystal) structure is a kind of novel reflection type projection display device, and it is to adopt semiconductor silicon crystal technique to control liquid crystal and then " projection " colour picture. Compared with penetration LCD (LiquidCrystalDisplay) and DLP (DigitalLightProcession) structure, LCOS structure has the features such as light utilization ratio is high, volume is little, aperture opening ratio is high, manufacturing technology is ripe, and it can be easily achieved high-resolution and sufficient color representation. Above-mentioned advantage makes LCOS structure have very big advantage in large screen display application from now on.
Fig. 1 illustrates the manufacture method flow chart of LCOS structure common in prior art. As seen from Figure 1, the manufacture method of described LCOS structure includes:
Step S1, it is provided that glass substrate and LCOS substrate; Such as, described glass substrate and LCOS substrate could be formed with electrode layer.
Step S2, performs orientation process on described glass substrate and described LCOS substrate, thus the arrangement of liquid crystal after being beneficial to.
Step S3, forms frame glue, and described glass substrate and LCOS substrate are by described frame glue laminating.
Step S4, carries out cutting technique, it is thus achieved that multiple unit of glass substrate one to one and LCOS base unit, thus can obtain brilliant box, complete the formation of liquid crystal afterwards.
Step S5, fits with a circuit board away from the one side of glass substrate unit in described LCOS base unit.
Step S6, applying conductive glue, described glass substrate unit and described circuit board are turned on by described conducting resinl. Can be specifically such as PAD (terminal) the region applying conductive glue at circuit board, for instance conductive silver glue, PAD is connected with the electrode layer (such as ITO layer) of glass substrate.
But, for the LCOS structure that this method obtains, there is the risk of conducting resinl fracture, make electrode layer and PAD region open circuit, cause LCOS structural failure; Further, conducting resinl is exposed outside, it is easy to the oxidized situation also exacerbating conducting resinl fracture, LCOS reliability of structure is poor.
Summary of the invention
A kind of LCOS structure of offer and manufacture method are provided, the method not only can effectively shorten the manufacturing process of LCOS structure, and can also solve occur in prior art that conducting resinl comes off or ruptures, and the technical problem that conducting resinl easily aoxidizes.
For solving the problems referred to above, the present invention provides the manufacture method of a kind of LCOS structure, comprises the steps:
Glass substrate and LCOS substrate are provided;
The one side of described glass substrate sequentially forms the first conductive layer and the first oriented layer, the one side of described LCOS substrate sequentially forms the second conductive layer and the second oriented layer;
Forming multiple first groove in described first oriented layer, expose the first conductive layer, form multiple second groove in described second oriented layer, expose the second conductive layer, described first groove and the second groove are corresponding;
The one side of the one side of described glass substrate with described LCOS substrate is passed through frame glue laminating, described frame glue is arranged in the plurality of first groove and the plurality of second groove, forming conductive material layer in described frame glue, described conductive material layer is connected with the first conductive layer exposed and the second conductive layer exposed;
Carrying out cutting technique, it is thus achieved that multiple unit of glass substrate one to one and LCOS base unit, the one side of described glass substrate unit and the one side of described LCOS base unit are fitted by described conductive material layer and turn on;
In another side and the circuit board laminating of described LCOS base unit, described LCOS base unit and the conducting of described circuit board.
Optionally, for the manufacture method of described LCOS structure, forming frame glue in the plurality of first groove or the plurality of second groove, described frame glue includes conductive material;
The one side of the one side of described glass substrate with described LCOS substrate being fitted, described frame glue is arranged in the plurality of first groove and the plurality of second groove, forms described conductive material layer in frame glue.
Optionally, for the manufacture method of described LCOS structure, it is coated in the plurality of first groove or the plurality of second groove after described frame glue and described conductive material Homogeneous phase mixing.
Optionally, for the manufacture method of described LCOS structure, adopt some metal ball as described conductive material and described frame glue Homogeneous phase mixing.
Optionally, for the manufacture method of described LCOS structure, described metal ball is simple metal ball or plating filmed metals ball.
Optionally, for the manufacture method of described LCOS structure, the diameter of described metal ball is less than or equal to the gap between glass substrate and the LCOS substrate after laminating.
Optionally, for the manufacture method of described LCOS structure, formed the plurality of first groove and the plurality of second groove by Cement Composite Treated by Plasma.
Optionally, for the manufacture method of described LCOS structure, when forming the plurality of first groove and the plurality of second groove, adopt identical mask.
Optionally, manufacture method for described LCOS structure, after carrying out cutting technique, each first groove and each second groove be a corresponding glass substrate unit and a LCOS base unit jointly, described first groove is positioned at the edge of described glass substrate unit, and described second groove is positioned at the edge of described LCOS base unit.
Accordingly, the present invention also provides for the LCOS structure that the manufacture method of a kind of LCOS structure as above prepares.
In LCOS structure provided by the invention and manufacture method, frame glue forms conductive material layer, thus utilizing conductive material layer to achieve glass substrate unit by LCOS base unit and circuit board conducting. Compared to existing technology, processing technology is optimized, it is not necessary to perform conducting resinl coating process, and eliminate conducting resinl, it is to avoid the problem of LCOS structural failure after conducting resinl fracture. Simultaneously as conductive material layer is formed in frame glue, it is also possible to avoid oxidized, it helps improve the quality of product.
Accompanying drawing explanation
Fig. 1 is the manufacture method flow chart of prior art LCOS structure;
Fig. 2 is the manufacture method flow chart of LCOS structure of the present invention;
Fig. 3 a is the structural representation of glass substrate of the present invention;
Fig. 3 b is the structural representation of LCOS substrate of the present invention;
Fig. 4 a is the structural representation forming the first groove on glass substrate of the present invention;
Fig. 4 b is the structural representation that the present invention forms the second groove in LCOS substrate;
Fig. 5 is the structural representation after glass substrate is fitted by the present invention with LCOS substrate;
Fig. 6 is that the present invention fits the schematic diagram of front and back conductive material;
Fig. 7 is the schematic perspective view after glass substrate of the present invention is fitted with LCOS substrate;
Fig. 8 is the schematic diagram of LCOS structure of the present invention.
Detailed description of the invention
It is described in more detail below in conjunction with the schematic diagram LCOS structure to the present invention and manufacture method, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise invention described herein, and still realize the advantageous effects of the present invention. Therefore, it is widely known that description below is appreciated that for those skilled in the art, and is not intended as limitation of the present invention.
Refer to Fig. 2-Fig. 8, the manufacture method of the LCOS structure of the present invention be specifically described:
First, perform step S101, refer to Fig. 3 a and Fig. 3 b, it is provided that glass substrate 10' and LCOS substrate 20'. Can perform according to prior art, for instance include the operation etc. cleaning glass substrate and LCOS substrate.
Then, perform step S102, refer to Fig. 4 a and Fig. 4 b, the one side of described glass substrate 10' sequentially forms the first conductive layer 11 and the first oriented layer 12, the one side of described LCOS substrate 20' sequentially forms the second conductive layer 21 and the second oriented layer 22. Wherein, the formation of described first conductive layer 11, described second conductive layer 21, described first oriented layer 12 and the second oriented layer 22 all can perform according to prior art, and this is well known to those skilled in the art, and the present invention is not described in detail.
Then, perform step S103, please continue to refer to Fig. 4 a and Fig. 4 b, described first oriented layer 12 is formed multiple first groove 13, expose the first conductive layer 11, forming multiple second groove 23 in described second oriented layer 22, expose the second conductive layer 21, described first groove 13 is corresponding with the second groove 23.
In the preferred version of the present invention, the plurality of first groove 13 formed by plasma method process and the plurality of second groove 23, specifically adopt such as argon plasma method. in order to solve that processing procedure operation is saved cost and the problem being easy to laminating, identical mask is adopted when forming the plurality of first groove 13 and the plurality of second groove 23, thus the quantity of described second groove 23 is identical with the quantity of described first groove 13, and make the plurality of first groove 13 and the plurality of second groove 23 shape same or like (so-called close, refer to and consider that processing procedure may produce deviation, this deviation in processing procedure at tolerance interval, when there is deviation and falling within tolerance interval, can assert that described first groove is close with the shape of described second groove). described first groove 13 is just oppositely arranged with described second groove 23 simultaneously, consequently facilitating the making of after-frame glue 30 (referring to Fig. 5), also allow for the execution of attaching process.
Then, perform step S104, refer to Fig. 5, the one side of the one side of described glass substrate 10' with described LCOS substrate 20' is fitted by frame glue 30, described frame glue 30 is arranged in the plurality of first groove and the plurality of second groove, forming conductive material layer 31 in described frame glue 30, described conductive material layer 31 is connected with the first conductive layer 11 exposed and the second conductive layer 21 exposed.
Concrete, this step can be formation frame glue 30 in the plurality of first groove or the plurality of second groove, and described frame glue 30 includes conductive material. Preferably, it is possible to first by frame glue 30 and conductive material (such as metal ball) Homogeneous phase mixing, then it is coated in the plurality of first groove or the plurality of second groove. Afterwards by close for the one side of the one side of described glass substrate 10' and described LCOS substrate 20', described frame glue 30 is made to be arranged in the plurality of first groove and the plurality of second groove, subsequently fit, in frame glue 30, thus form conductive material layer 31, and described conductive material layer 31 is connected with described first conductive layer 11 and described second conductive layer 21. It is understandable that, before laminating, conductive material (such as metal ball) 31' is dispersed in frame glue 30, after laminating (vacuum abutted can operate according to existing in the present invention), conductive material 31' is pressed together, form conductive material layer 31, namely as shown in Figure 6.
In order to realize the filling of the liquid crystal material layer of subsequent process, as it is shown in fig. 7, described frame glue 30 is also formed with opening 32. Described liquid crystal material layer is referred to prior art, and this is skipped over not table by the present invention.
In the present invention, the material of described conductive material layer 31 is metal, for instance can be gold, silver, stannum etc. Further, in a preferred embodiment of the invention, described conductive material layer 31 is some metal ball, and the diameter of described metal ball fit less than described glass substrate unit 10 and LCOS base unit 20 after gap. Described metal ball can be such as simple metal ball, it is also possible to be plating filmed metals ball (such as plating metal film for silicon core). Described metal ball is formed in frame glue 30, it is possible to is subject to the protection of frame glue 30, effectively prevents and air contact, it is to avoid oxidized, thus being favorably improved the reliability of product.
Then, perform step S105, refer to Fig. 7-Fig. 8, direction shown in dotted line L1, L2 carries out cutting technique, obtaining multiple unit of glass substrate one to one 10 and LCOS base unit 20, the one side of described glass substrate unit 10 and the one side of described LCOS base unit 20 are fitted by described conductive material layer 31 and are turned on. Described first groove is positioned at the edge of described glass substrate unit 10, and described second groove is positioned at the edge of described LCOS base unit 20.
Afterwards, performing step S106, another side and a circuit board 40 in described LCOS base unit 20 are fitted, and described LCOS base unit 20 turns on described circuit board 40.
By above-mentioned steps, in the LCOS structure that the present invention obtains, frame glue forms conductive material layer, thus utilizing conductive material layer to achieve glass substrate unit by LCOS base unit and circuit board conducting. Compared to existing technology, processing technology is optimized, it is not necessary to perform conducting resinl coating process, and eliminate conducting resinl, it is to avoid the problem of LCOS structural failure after conducting resinl fracture. Simultaneously as conductive material layer is formed in frame glue, it is also possible to avoid oxidized, it helps improve the quality of product.
Refer to Fig. 8, LCOS structure provided by the invention, including:
Glass substrate unit 10, is positioned at the first conductive layer 11 in the one side of described glass substrate unit 10, is positioned at the first oriented layer 12 on described first conductive layer 11, has, in described first oriented layer 12, the first groove exposing described first conductive layer 11;
LCOS base unit 20, it is positioned at the second conductive layer 21 in the one side of described LCOS base unit 20, it is positioned at the second oriented layer 22 on described second conductive layer 21, having the second groove exposing described second conductive layer 21 in described second oriented layer 22, another side and a circuit board 40 of described LCOS base unit 20 are fitted and turn on;
Frame glue 30, it is arranged in described first groove and the second groove, described frame glue 30 includes conductive material layer 31, and described glass substrate unit 10 is turned on described LCOS base unit 20 by described conductive material layer 31, and is turned on described circuit board 40 by described LCOS base unit 20.
Thus, the LCOS structure of the present invention, it is to avoid application conducting resinl of the prior art, this also avoids conducting resinl occurs rupturing the generation of this problem, is effectively improved the reliability of product.
Obviously, the present invention can be carried out various change and modification without deviating from the spirit and scope of the present invention by those skilled in the art. So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. the manufacture method of a LCOS structure, it is characterised in that comprise the steps:
Glass substrate and LCOS substrate are provided;
The one side of described glass substrate sequentially forms the first conductive layer and the first oriented layer, the one side of described LCOS substrate sequentially forms the second conductive layer and the second oriented layer;
Forming multiple first groove in described first oriented layer, expose the first conductive layer, form multiple second groove in described second oriented layer, expose the second conductive layer, described first groove and the second groove are corresponding;
The one side of the one side of described glass substrate with described LCOS substrate is passed through frame glue laminating, described frame glue is arranged in the plurality of first groove and the plurality of second groove, forming conductive material layer in described frame glue, described conductive material layer is connected with the first conductive layer exposed and the second conductive layer exposed;
Carrying out cutting technique, it is thus achieved that multiple unit of glass substrate one to one and LCOS base unit, the one side of described glass substrate unit and the one side of described LCOS base unit are fitted by described conductive material layer and turn on;
In another side and the circuit board laminating of described LCOS base unit, described LCOS base unit and the conducting of described circuit board.
2. the manufacture method of LCOS structure according to claim 1, it is characterised in that forming frame glue in the plurality of first groove or the plurality of second groove, described frame glue includes conductive material;
The one side of the one side of described glass substrate with described LCOS substrate being fitted, described frame glue is arranged in the plurality of first groove and the plurality of second groove, forms described conductive material layer in frame glue.
3. the manufacture method of LCOS structure according to claim 2, it is characterised in that be coated in the plurality of first groove or the plurality of second groove after described frame glue and described conductive material Homogeneous phase mixing.
4. the manufacture method of LCOS structure according to claim 3, it is characterised in that adopt some metal ball as described conductive material and described frame glue Homogeneous phase mixing.
5. the manufacture method of LCOS structure according to claim 4, it is characterised in that described metal ball is simple metal ball or plating filmed metals ball.
6. the manufacture method of LCOS structure according to claim 5, it is characterised in that the diameter of described metal ball is less than or equal to the gap between glass substrate and the LCOS substrate after laminating.
7. the manufacture method of LCOS structure according to claim 1, it is characterised in that formed the plurality of first groove and the plurality of second groove by Cement Composite Treated by Plasma.
8. the manufacture method of LCOS structure according to claim 7, it is characterised in that adopt identical mask when forming the plurality of first groove and the plurality of second groove.
9. the manufacture method of LCOS structure according to claim 1, it is characterized in that, after carrying out cutting technique, each first groove and each second groove be a corresponding glass substrate unit and a LCOS base unit jointly, described first groove is positioned at the edge of described glass substrate unit, and described second groove is positioned at the edge of described LCOS base unit.
10. the LCOS structure that the manufacture method of LCOS structure as described in any one prepares in claim 1-9.
Priority Applications (1)
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| CN201610069018.6A CN105629550A (en) | 2016-01-29 | 2016-01-29 | LCOS structure and manufacturing method |
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| CN201610069018.6A CN105629550A (en) | 2016-01-29 | 2016-01-29 | LCOS structure and manufacturing method |
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Cited By (1)
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|---|---|---|---|---|
| CN106125419A (en) * | 2016-09-14 | 2016-11-16 | 豪威半导体（上海）有限责任公司 | LCOS display and manufacture method thereof |
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