CN100348361C - Sn-Zn-Cr合金无铅焊料 - Google Patents
Sn-Zn-Cr合金无铅焊料 Download PDFInfo
- Publication number
- CN100348361C CN100348361C CNB2005100284470A CN200510028447A CN100348361C CN 100348361 C CN100348361 C CN 100348361C CN B2005100284470 A CNB2005100284470 A CN B2005100284470A CN 200510028447 A CN200510028447 A CN 200510028447A CN 100348361 C CN100348361 C CN 100348361C
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- Prior art keywords
- scolder
- solder
- present
- free solder
- seconds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100284470A CN100348361C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100284470A CN100348361C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1730229A CN1730229A (zh) | 2006-02-08 |
CN100348361C true CN100348361C (zh) | 2007-11-14 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005100284470A Expired - Fee Related CN100348361C (zh) | 2005-08-04 | 2005-08-04 | Sn-Zn-Cr合金无铅焊料 |
Country Status (1)
Country | Link |
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CN (1) | CN100348361C (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015478A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Corp | ハンダ材 |
CN1400081A (zh) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | 无铅焊料合金 |
WO2004018146A1 (ja) * | 2002-08-23 | 2004-03-04 | Nippon Metal Industry Co., Ltd. | 錫−亜鉛系鉛フリーはんだ合金及びはんだ接合部 |
US20040156741A1 (en) * | 2002-08-23 | 2004-08-12 | Masaaki Yoshikawa | Tin-zinc lead-free solder, its mixture, and solder-joined part |
-
2005
- 2005-08-04 CN CNB2005100284470A patent/CN100348361C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015478A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Corp | ハンダ材 |
CN1400081A (zh) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | 无铅焊料合金 |
WO2004018146A1 (ja) * | 2002-08-23 | 2004-03-04 | Nippon Metal Industry Co., Ltd. | 錫−亜鉛系鉛フリーはんだ合金及びはんだ接合部 |
US20040156741A1 (en) * | 2002-08-23 | 2004-08-12 | Masaaki Yoshikawa | Tin-zinc lead-free solder, its mixture, and solder-joined part |
Non-Patent Citations (2)
Title |
---|
Sn-Zn无铅焊料的研究与发展 黎小燕 等.电子工艺技术,第25卷第4期 2004 * |
合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响 任晓雪 等.电子元件与材料,第23卷第11期 2004 * |
Also Published As
Publication number | Publication date |
---|---|
CN1730229A (zh) | 2006-02-08 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignor: Shanghai Jiao Tong University Contract fulfillment period: 2008.6.28 to 2013.6.27 contract change Contract record no.: 2009310000169 Denomination of invention: Sn-Zn-Cr alloy lead-free solder Granted publication date: 20071114 License type: Exclusive license Record date: 2009.8.19 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.6.28 TO 2013.6.27; CHANGE OF CONTRACT Name of requester: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO., LTD Effective date: 20090819 |
|
EM01 | Change of recordation of patent licensing contract |
Change date: 20100915 Contract record no.: 2009310000169 Assignee after: Shanghai Xinyang Semiconductor Material Co., Ltd. Assignee before: Shanghai Xinyang Semiconductor Material Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071114 Termination date: 20130804 |