CN109979883A - A kind of integrated device mould group - Google Patents
A kind of integrated device mould group Download PDFInfo
- Publication number
- CN109979883A CN109979883A CN201910361662.4A CN201910361662A CN109979883A CN 109979883 A CN109979883 A CN 109979883A CN 201910361662 A CN201910361662 A CN 201910361662A CN 109979883 A CN109979883 A CN 109979883A
- Authority
- CN
- China
- Prior art keywords
- infrared detector
- substrate
- mould group
- chip
- integrated device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000005538 encapsulation Methods 0.000 claims abstract description 15
- 238000005516 engineering process Methods 0.000 claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses a kind of integrated device mould group, including substrate, the infrared detector being disposed on the substrate, and protection shell；Wherein, also integrally disposed on substrate to have more than one and the functional chip with different function；Infrared detector is to encapsulate the device that infrared detecting chip obtains based on WLP encapsulation technology；Infrared detector fitting is disposed on the substrate, and the pin of infrared detector passes through the electrical connection of the I/O interface of metal lead wire and substrate；Protection shell is fixedly connected with substrate, and the cavity for accommodating infrared detector is formed between protection shell and substrate plate；The cavity wall that cavity corresponds to the position of transparent zone on the window of infrared detector has through-hole, and the size of through-hole is greater than the size of transparent zone.Integrated device mould group provided by the present invention has carried out physical protection to infrared detector, avoids infrared detector and is collided or scratched, and the functional chip of different function is integrated on substrate, carries out secondary development without user, reduces use cost and uses difficulty.
Description
Technical field
The present invention relates to Wafer level packaging fields, more particularly to a kind of integrated device mould group.
Background technique
The infrared detector of WLP encapsulation (wafer-level packaging) is received by the market because of its compact, reliable performance.But
Infrared detector is obtained based on WLP encapsulation technology, to environmental requirement height, infrared detector is inevitable during Product transport
Meeting and external environment generate collision or scratched so that device is damaged.And user is when using WLP device, also
It needs to carry out secondary development to WLP device, increases the degree of difficulty that user uses WLP device.
Summary of the invention
The object of the present invention is to provide a kind of integrated device mould groups, solve WLP device and are damaged because colliding or scratching,
And the problem of secondary development difficulty.
In order to solve the above technical problems, the present invention provides a kind of integrated device mould group, comprising:
Infrared detector on the substrate, and protection shell is arranged in substrate；
Wherein, also integrally disposed on the substrate to have more than one and the functional chip with different function；
The infrared detector is to encapsulate the device that infrared detecting chip obtains based on WLP encapsulation technology；
The infrared detector fitting is arranged on the substrate, and the pin of the infrared detector passes through metal lead wire
It is electrically connected with the I/O interface of the substrate；
The protection shell is fixedly connected with the substrate, and is formed and held between the protection shell and the substrate plate
Receive the cavity of the infrared detector；The cavity wall that the cavity corresponds to light passing zone position on the window of the infrared detector has
Through-hole, and the size of the through-hole is greater than the size of the transparent zone area.
Wherein, the functional chip includes appointing in picture processing chip, pin-saving chip, crystal resonator or fpga chip
It anticipates one or more chips.
Wherein, the functional chip and the infrared detector are separately positioned on two different surfaces of the substrate.
Wherein, one end that the protection shell is connected with the infrared detector protrudes from the infrared detector.
Wherein, the surface of the protection shell is additionally provided with antistatic film layer.
Wherein, the substrate is pcb board or ceramic wafer.
Wherein, the I/O interface is JEDEC standard interface.
Integrated device mould group provided by the present invention, by the infrared detector obtained by WLP encapsulation technology and substrate phase
Connection, and there are the I/O interfaces of standard on substrate, directly the signal of infrared detector chip can be exported and be inputted.
Backend user no longer needs to carry out bonding output to the pin of infrared detector when in use.In addition, protection is arranged also on substrate
The protection shell of infrared detector, so that the components such as the side of infrared detector and pin, lead are in shell and substrate shape
At cavity in, physical protection has been carried out to infrared detector, object in infrared detector and external environment has been avoided and occurs
Collision scratches so that the problem that infrared detector is damaged.Also, being also integrated on substrate has the function of different function core
Piece carries out secondary development without user so that the function of WLP device is extended, and reduces the use cost of user and using difficult
Degree.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of protection shell provided in an embodiment of the present invention；
Fig. 2 is the partial structure diagram of integrated device mould group provided in an embodiment of the present invention；
Fig. 3 is substrate back structural schematic diagram provided in an embodiment of the present invention.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
As depicted in figs. 1 and 2, Fig. 1 is the structural schematic diagram of protection shell provided in an embodiment of the present invention, and Fig. 2 is this hair
The partial structure diagram for the integrated device mould group that bright embodiment provides, can specifically include:
Infrared detector 1 on a substrate 2, and protection shell 3 is arranged in substrate 2；
Specifically, which can be the substrate of pcb board, ceramic wafer either other materials, in this regard, in the present invention not
Do specific restriction.
Wherein, also integrally disposed on substrate 2 to have more than one and the functional chip with different function；
Infrared detector 1 is to encapsulate the device that infrared detecting chip obtains based on WLP encapsulation technology；
On a substrate 2, and the pin of infrared detector 1 passes through metal lead wire and substrate 2 for the fitting of infrared detector 1 setting
The electrical connection of I/O interface；
Protection shell 3 is fixedly connected with substrate 2, as depicted in figs. 1 and 2, in the mould group after actual assembled, the guarantor in Fig. 1
Protective case body 3 is on the structure member being fastened in Fig. 2, and is fixedly connected with the marginal position of substrate 2 in Fig. 2, and then protecting
The cavity for accommodating chip is formed between shell 3 and substrate 2；Cavity corresponds to light passing zone position on the window of the infrared detector 1
Cavity wall there is through-hole 4, the effect of the through-hole 4 is mainly used for enabling the transparent zone on window to receive external optical signal, therefore,
And the size of through-hole 4 is greater than the size of transparent zone area, avoids generating transparent zone and block.
It should be noted that integrated device mould group provided in the present invention, is for the infrared of WLP encapsulation technology acquisition
The product that detector 1 is obtained by further developing.
Wafer-level packaging (WLP) be using wafer as encapsulation process object, and unconventional encapsulation system with one chip be plus
Work object.All packaging and testing movements are completed on wafer before carrying out chip cutting, therefore nearly all manufacturing process is equal
It is completed in fab, and excludes the conventional process of encapsulation factory.After wafer comes out from foundries, just directly in full wafer chip
Upper carry out encapsulation procedure, when finally cutting down, first is that many packaged IC finished products, all pass through very much on time and cost
Ji；Chip infrared detector obtained is encapsulated based on Wafer level packaging in the application, core is encapsulated by the encapsulation technology
Piece largely improves the integrated level of chip, and structure is smaller, is laid out more compact.But even with wafer-level packaging
The IC finished product of the infrared detector formed afterwards, backend user is also required to carry out secondary development when in use, and certain customers are not
The ability and condition for having secondary development.And the chip of IC finished product is during transportation, also can be to a certain extent by outer
The influence of boundary's environment.
It by infrared detector 1 is obtained after wafer-level packaging in the integrated device mould group provided in the present embodiment
One of IC finished product encapsulates on a substrate 2, so that the I/O interface on the substrate 2 with pin and with pin electrical connection,
The specific can be that be packaged using LCC encapsulation, BGA package or other encapsulation technologies, to not limited in this present embodiment
It is fixed.The pin of infrared detector 1 is connected with the pin of substrate 2 by metal lead wire, then, the signal of infrared detector 1
Can be output and input by the I/O interface of substrate 2, specifically, the I/O interface can be JEDEC standard interface or other
Interface with similar functions, in this present embodiment without limitation.Backend user when in use, is no longer needed to infrared detector
1 pin is processed, and provides convenience for the use of user.
Secondly, protection shell 3 is additionally provided with, so that infrared detector 1, pin and metal lead wire etc. are arranged at protection
Among the cavity that shell 3 and substrate 2 are formed, formation avoids infrared detector 1 and its pin to the physical protection of infrared detector 1
Equal components are during transportation by the collision of external environment or scratch.And it is additionally provided in the window's position of infrared detector 1 logical
Hole 4 is incident to window by the through-hole 4 convenient for optical signal.
In addition, on a substrate 2 other than being packaged with infrared detector 1, also it is integrally disposed have multiple there is different function
Chip.Because the realization of the function of infrared detector cooperates toward contact needs and other function chip in actual application
It uses, can realize the function of complete infrared detector.If only only existing infrared detector 1 in mould group, rear end is used
Family is in investment in application, also needing to carry out secondary development to the mould group, so that the use of infrared detector is more cumbersome.And this Shen
Please in directly the integrated chip of infrared detector and other function is set on same substrate, user, which can be obtained one, to be had
The product of complete infrared probe function carries out secondary development without user, provides convenience for the use of user.
In conclusion integrated device mould group provided by the present invention, can be good at protecting infrared detector 1 not by the external world
The influence of environment, and it is integrated there are many chip of function, and allowing users to obtain has the mould set product for completing function, is convenient for
The use of user.
Optionally, in another embodiment of the present invention, can also further include:
Functional chip include in picture processing chip, pin-saving chip, crystal resonator or fpga chip any one or
Various chips.
In the actual application of infrared detector, picture processing chip, pin-saving chip, crystal resonator, FPGA core
Piece is several functional chips generally used in infrared detector.By one or more of these types of chip and infrared detector
1 is integrated in jointly in same mould group, user-friendly.
Optionally, in another embodiment of the present invention, can also include:
Each functional chip and infrared detector are separately positioned on two different surfaces of substrate.
Specifically, as shown in figure 3, Fig. 3 is substrate back structural schematic diagram provided in an embodiment of the present invention, in substrate back
It is integrally disposed simultaneously to have multiple functional chips 5.Each functional chip 5 and infrared detector 1 are separately positioned on substrate 2 two not
With surface, make full use of the spatial area of 2 two different surfaces of substrate, reduce 2 size of substrate so that modular structure more towards
In miniaturization.
Certainly, if integrated device mould group provided by the invention in use, is arranged and accommodates integrated device mould group
Spatial volume is sufficiently large, and each functional chip and infrared detector in the integrated device mould group can also be arranged at substrate
On same surface, in this present invention without limitation.
Optionally, in another embodiment of the present invention, can also include:
Protection shell 3 is plastic casing；
The one end of protection shell 3 being connected with infrared detector 1 protrudes from infrared detector.1
Specifically, it protects the window edge position of shell 3 and infrared detector 1 to be fitted and connected, and protrudes from window surface,
It that is to say that the edge of through-hole 4 protrudes from the surface of window, be conducive to infrared detector 1 and its phase inside protection protection shell 3
Close component.
Optionally, in another embodiment of the present invention, can also further include:
The surface of protection shell 3 is additionally provided with antistatic film layer.
For the infrared detector 1 obtained based on WLP technology, electrostatic can seriously break the circuit structure of ring core piece,
And the performance of chip is destroyed, and in the transport of mould group and assembling process, electrostatic is generated, inevitably in order to avoid electrostatic pair
The performance of infrared detector 1 and other function chip 4 has an impact, and antistatic film layer can be arranged on protection 3 surface of shell,
Conductive film layer specifically can be set, be convenient for static elimination.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
Claims (7)
1. a kind of integrated device mould group, which is characterized in that including substrate, infrared detector on the substrate is set, and
Protect shell；
Wherein, also integrally disposed on the substrate to have more than one and the functional chip with different function；
The infrared detector is to encapsulate the device that infrared detecting chip obtains based on WLP encapsulation technology；
The infrared detector fitting is arranged on the substrate, and the pin of the infrared detector passes through metal lead wire and institute
State the I/O interface electrical connection of substrate；
The protection shell is fixedly connected with the substrate, and is formed described in receiving between the protection shell and the substrate
The cavity of infrared detector；The cavity wall that the cavity corresponds to light passing zone position on the window of the infrared detector has through-hole,
And the size of the through-hole is greater than the size of the transparent zone area.
2. integrated device mould group as described in claim 1, which is characterized in that the functional chip include picture processing chip,
Any one or more chip in pin-saving chip, crystal resonator or fpga chip.
3. integrated device mould group as claimed in claim 2, which is characterized in that the functional chip and the infrared detector point
Two different surfaces of the substrate are not set.
4. integrated device mould group as described in claim 1, which is characterized in that the protection shell and the infrared detector phase
One end even protrudes from the infrared detector.
5. integrated device mould group as claimed in claim 4, which is characterized in that the surface of the protection shell is additionally provided with antistatic
Film layer.
6. such as integrated device mould group described in any one of claim 1 to 5, which is characterized in that the substrate is pcb board or ceramics
Plate.
7. integrated device mould group as claimed in claim 6, which is characterized in that the I/O interface is JEDEC standard interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910361662.4A CN109979883A (en) | 2019-04-30 | 2019-04-30 | A kind of integrated device mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910361662.4A CN109979883A (en) | 2019-04-30 | 2019-04-30 | A kind of integrated device mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109979883A true CN109979883A (en) | 2019-07-05 |
Family
ID=67087433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910361662.4A Pending CN109979883A (en) | 2019-04-30 | 2019-04-30 | A kind of integrated device mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109979883A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741286A (en) * | 2004-08-24 | 2006-03-01 | 安捷伦科技有限公司 | Integrated ball grid array optical mouse sensor packaging |
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| JP2010038549A (en) * | 2008-07-31 | 2010-02-18 | Nippon Ceramic Co Ltd | Infrared detector |
| CN202120913U (en) * | 2011-06-08 | 2012-01-18 | 旭丽电子(广州)有限公司 | Thin-type image capturing module |
| CN102956662A (en) * | 2012-11-22 | 2013-03-06 | 烟台睿创微纳技术有限公司 | Vacuum sealing packaging structure and packaging method for infrared focal plane detector chip |
| JP2013186039A (en) * | 2012-03-09 | 2013-09-19 | Panasonic Corp | Infrared detection device |
| CN104112753A (en) * | 2014-07-08 | 2014-10-22 | 浙江大立科技股份有限公司 | Infrared detector and infrared imaging system, and preparation methods thereof |
| CN204144237U (en) * | 2011-12-27 | 2015-02-04 | 京瓷株式会社 | Input and output component and electronic unit storage packaging part and electronic installation |
| CN106404187A (en) * | 2016-10-21 | 2017-02-15 | 云南北方昆物光电科技发展有限公司 | Non-refrigerated focal plane infrared detector chip vacuum packaging structure and process |
| CN107742654A (en) * | 2016-08-10 | 2018-02-27 | 菱光科技股份有限公司 | Infrared ray sensor high vacuum encapsulating structure and its method |
| CN209544307U (en) * | 2019-04-30 | 2019-10-25 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
-
2019
- 2019-04-30 CN CN201910361662.4A patent/CN109979883A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741286A (en) * | 2004-08-24 | 2006-03-01 | 安捷伦科技有限公司 | Integrated ball grid array optical mouse sensor packaging |
| KR20060041008A (en) * | 2004-11-08 | 2006-05-11 | 삼성전자주식회사 | Camera module for image sensor and method for manufacturing the same |
| JP2010038549A (en) * | 2008-07-31 | 2010-02-18 | Nippon Ceramic Co Ltd | Infrared detector |
| CN202120913U (en) * | 2011-06-08 | 2012-01-18 | 旭丽电子(广州)有限公司 | Thin-type image capturing module |
| CN204144237U (en) * | 2011-12-27 | 2015-02-04 | 京瓷株式会社 | Input and output component and electronic unit storage packaging part and electronic installation |
| JP2013186039A (en) * | 2012-03-09 | 2013-09-19 | Panasonic Corp | Infrared detection device |
| CN102956662A (en) * | 2012-11-22 | 2013-03-06 | 烟台睿创微纳技术有限公司 | Vacuum sealing packaging structure and packaging method for infrared focal plane detector chip |
| CN104112753A (en) * | 2014-07-08 | 2014-10-22 | 浙江大立科技股份有限公司 | Infrared detector and infrared imaging system, and preparation methods thereof |
| CN107742654A (en) * | 2016-08-10 | 2018-02-27 | 菱光科技股份有限公司 | Infrared ray sensor high vacuum encapsulating structure and its method |
| CN106404187A (en) * | 2016-10-21 | 2017-02-15 | 云南北方昆物光电科技发展有限公司 | Non-refrigerated focal plane infrared detector chip vacuum packaging structure and process |
| CN209544307U (en) * | 2019-04-30 | 2019-10-25 | 烟台艾睿光电科技有限公司 | A kind of integrated device mould group |
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