CN109686472A - A kind of one pack system HJT battery low temperature silver paste - Google Patents
A kind of one pack system HJT battery low temperature silver paste Download PDFInfo
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- CN109686472A CN109686472A CN201811652931.4A CN201811652931A CN109686472A CN 109686472 A CN109686472 A CN 109686472A CN 201811652931 A CN201811652931 A CN 201811652931A CN 109686472 A CN109686472 A CN 109686472A
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- powder
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- conductive
- low temperature
- silver paste
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 71
- 239000004332 silver Substances 0.000 title claims abstract description 71
- 239000000843 powder Substances 0.000 claims abstract description 118
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 22
- 238000002844 melting Methods 0.000 claims abstract description 22
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 16
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid group Chemical group C(CCCCC(=O)O)(=O)O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 7
- 239000003085 diluting agent Substances 0.000 claims description 7
- 239000000314 lubricant Substances 0.000 claims description 7
- 235000011037 adipic acid Nutrition 0.000 claims description 6
- 239000001361 adipic acid Substances 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 239000013008 thixotropic agent Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- -1 organobentonite Chemical compound 0.000 claims description 4
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical group CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 229910021485 fumed silica Inorganic materials 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012188 paraffin wax Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 13
- 238000006303 photolysis reaction Methods 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- 238000007711 solidification Methods 0.000 description 29
- 230000008023 solidification Effects 0.000 description 29
- 230000000694 effects Effects 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005245 sintering Methods 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000003870 refractory metal Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- WQPDQJCBHQPNCZ-UHFFFAOYSA-N cyclohexa-2,4-dien-1-one Chemical compound O=C1CC=CC=C1 WQPDQJCBHQPNCZ-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H01L31/022425—
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention discloses a kind of one pack system HJT battery low temperature silver pastes, comprise the following components in parts by weight: the first 50~90 parts of conductive powder, 5~40 parts of the second conductive powder, 1~2 part of heat reactive resin, 0~5 part of curing agent, 0~5 part of auxiliary agent；First conductive powder is flake silver powder, and second conductive powder is at least one of nanometer conductive powder, low melting point conductive metal powder, low melting point electrical conductivity alloy powder, high-melting-point conductive metal powder, high-melting-point electrical conductivity alloy powder.HJT battery low temperature silver paste of the invention has solidify after resistivity is low, conductive particle combination adhesive force is good, good mistake net, excellent depth-width ratio, good resistance to photodissociation, resistance to ag(e)ing, and cost is lower.
Description
Technical field
The present invention relates to and conductive silver paste and the conductive silver paste preparation method, and in particular to a kind of one pack system HJT
Battery low temperature silver paste.
Background technique
HJT battery be at present can one of the high-efficiency battery of mass production surface metal silver paste is wanted due to its unique structure
There is difference substantially in the crystal silicon battery for summing traditional.Conventional metals conductive silver paste is high temperature sintering type, and silver paste itself combines
Contact between silver-colored silicon is formed by high temperature sintering.Solidification that HJT battery low temperature silver paste (is lower than 250 DEG C) at a lower temperature,
There is no a high temperature sintering, organic macromolecule crosslinking curing is mainly leaned in the contact between Argent grain and between Argent grain and TCO.
The contact interface of conventional batteries is silver paste and silicon nitride anti-reflecting film, and HJT battery is TCO film and elargol.
Existing HJT battery low temperature silver paste is mainly flake silver powder as conductive phase, with epoxy resin, acrylic resin,
Base polyurethane prepolymer for use as and curing agent, additive etc. are used as organic moiety.
The prior art has the disadvantages that
1) conductive phase mainly uses silver powder, and the cost is relatively high.
2) contact of the contact between particle and particle between matrix mainly by the solidification between resin in conjunction with, resin contains
When measuring high, attachment is relatively preferable but resistivity can be high.And resin content it is low when, resistivity can be low, but adhesion effect can be deteriorated.Cause
This is leaned on merely between resin solidification bonded particulate and adhesive force and resistivity balance are bad between particle and conductive film.
3) in epoxy resin generally there are benzene ring structure, comparatively more crisp and resistance to photodissociation, resistance to ag(e)ing is not good enough.And
It needs after silver paste solidification by illumination, therefore light fastness will be got well after resin solidification.
4) form of construction work of low temperature silver paste is mainly printed in HJT battery, and the net performance excessively of slurry is needed to get well.And HJT
Having in silver powder in low temperature silver paste is greatly flakelike powder, for relatively spherical sprills, flakelike powder cross net and
Linear higher temperatures slug type silver paste after printing is obviously weaker.
5) contact after TCO film layer solidifies with silver paste needs to be promoted.
Summary of the invention
There is provided that a kind of adhesive force is good, resistivity it is an object of the invention to overcome in place of the shortcomings of the prior art
One pack system HJT battery low temperature silver paste low, mistake net performance is good.
To achieve the above object, the technical scheme adopted by the invention is as follows: a kind of one pack system HJT battery low temperature silver paste, packet
Include the component of following parts by weight: the first 50~90 parts of conductive powder, 5~40 parts of the second conductive powder, 1~2 part of heat reactive resin,
0~5 part of curing agent, 0~5 part of auxiliary agent；First conductive powder is flake silver powder, and second conductive powder is nano silver
Powder, low melting point conductive metal powder, low melting point electrical conductivity alloy powder, high-melting-point conductive metal powder, high-melting-point electrical conductivity alloy powder
At least one of end.
Conductive phase part of the invention is using inexpensive conductive metal powder (refractory metal powder and high-melting-point alloy powder
End), use cost can be reduced to a certain extent.The present invention is other than organic resin is as Binder Phase, and there are also low melting point powder
Fusion, nano particle sintering be used as accessory attachment Binder Phase, make 200 DEG C, 30min minutes or so solidify after, conductive particle it
Between in addition to there is the solidification of resin bonding, there are also the fusion between the sintering of nano particle and low-melting-point metal powder, make conductive
The combination adhesive force of grain further increases.So that adhesive force and conductivity are balanced, avoid the prior art because between particle
Contact between matrix of contact and particle is combined mainly by the solidification between resin, and when resin content is high, attachment is relatively preferable
But resistivity can be high.And resin content it is low when, resistivity can be low, but adhesion effect can be deteriorated.Therefore viscous by resin solidification merely
Adhesive force and resistivity balance bad problem between knot particle and between particle and conductive film.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the low temperature silver paste second is conductive
Nano-silver powder in powder is 10~40 parts by weight, the low melting point conductive metal powder, low melting point electrical conductivity alloy powder, Gao Rong
Point conductive metal powder, high-melting-point electrical conductivity alloy powder are 0~10 parts by weight.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the low temperature silver paste includes following
The component of parts by weight: 30~40 parts of nano-silver powder in 60~70 parts of first conductive powder, the second conductive powder, low melting point
Conductive metal powder, low-melting alloy powder, high-melting-point conductive metal powder, high-melting-point electrical conductivity alloy powder summation are 2~7
Part, 1~2 part of heat reactive resin, 0.05~0.5 part of curing agent, 2.5~4.5 parts of auxiliary agent.
The proportion of each component of the present invention influences the performance of HJT battery low temperature silver paste, when each group distribution ratio is in the scope of the invention
Within when, HJT battery low temperature silver paste of the invention has resistivity after solidification low, and the combination adhesive force of conductive particle is good, good
Good depth-width ratio after crossing net and solidification, slurry are suitble to more narrow linewidth halftone, and depth-width ratio is more excellent, under the premise of keeping resistivity
Light-receiving area is further increased, transfer efficiency is increased.With good resistance to photodissociation, resistance to ag(e)ing.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the low temperature silver paste includes following
The component of parts by weight: 30 parts of nano-silver powder, low melting point conductive metal in 65 parts of first conductive powder, the second conductive powder
Powder or low-melting alloy powder are 5 parts, 1.5 parts of heat reactive resin, 0.05 part of curing agent, 3 parts of auxiliary agent.
When 30 parts by weight of nano-silver powder, (low melting point gold in 65 parts of the first conductive powder (flake silver powder), the second conductive powder
Category or alloy powder or refractory metal or alloy powder) 5 parts by weight, 1.5 parts by weight of heat reactive resin, 1.5 weight of curing agent
When part, 3 parts by weight of auxiliary agent, HJT battery low temperature silver paste of the invention has optimal electric conductivity, adhesion performance, crosses net
Depth-width ratio, resistance to photodissociation and resistance to ag(e)ing after more preferably solidifying.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the nanometer conductive powder is nanometer
Silver powder, the low melting point conductive metal powder are indium powder, and low melting point electrical conductivity alloy powder is sn-bi alloy powder, high-melting-point conductive gold
Category powder is nickel powder, and high-melting-point electrical conductivity alloy powder is silver-coated copper powder.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the flake silver powder piece radius D50
For 1um~15um, preferably 2um~10um.Specific surface area is in 0.1~0.8m2/ g, preferably 0.2~0.5m2/g.Tap density is 1
~10g/cm3, preferably 4~6g/cm3.500 DEG C of 30min burn out rates of flake silver powder are less than 0.5%, and preferably 0.2~0.4%.Nanometer
The D50 of silver powder is not more than 80nm.The radius of flake silver powder, tap density affect the performance of conductive silver paste, and sheet silver is carefully led very much
It is electrically relatively weaker, it is bad to will lead to very much net greatly.Therefore, it selects in radius D50 to be 1um~15um, and when D50 is
2um~10um crosses net performance and electric conductivity more preferably, the higher silver powder of tap density, and accumulation compactness can be more preferable.Nanometer
Silver powder serves low sintering, makes to contact between Argent grain more preferable, electric conductivity is more preferable, when tap density is 7~8g/cm3, lead
Electrical property is more preferably.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the heat reactive resin is no benzene
One of the epoxy resin of ring structure, organic siliconresin, hydroxylated acrylic resin, polyester resin, base polyurethane prepolymer for use as.It is excellent
The epoxy resin of selection of land, no benzene ring structure selects hydrogenated bisphenol A epoxy resin.
Organic carrier as powder.The main reactivity considered with curing agent of the selection of resin, cured product
Electric conductivity, light shine and resistance to ag(e)ing.Generally there are benzene ring structure in epoxy resin in the prior art, it is comparatively more crisp and
Resistance to photodissociation, resistance to ag(e)ing are not good enough.And it needs after silver paste solidification by illumination, therefore light fastness will be got well after resin solidification.
Can to avoid cause after light resin cured matter degradation and decomposition electric conductivity be deteriorated.The present invention is selected without benzene ring structure or fast light
The better resin of light resistance is solved as matrix resin, such as acrylic resin, the reactant of polyisocyanates and carbonate polyol
Deng so that resistance to photodissociation, resistance to ag(e)ing more preferably, to not influence electric conductivity.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, curing agent is enclosed type isocyanic acid
Ester, the compound containing blocked isocyanate group, amine chemicals, amine complex compound, acid anhydrides, aginomoto curing agent PN-
23J, MY-25, one of Fuji's chemical conversion 1020.Such curing agent at normal temperature with resin portion Fails To Respond, when heated
It exposes active function groups part and resin activity part and carries out cross linking reaction and solidification.
It further include 0.4~0.5 parts by weight as the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention
Additive, the additive be adipic acid, at least one of glutaric acid.Additive of the invention such as adipic acid, glutaric acid
Equal substances have removal effect to the organic substance of metal powder surface, reduce the resistance value after solidifying.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the auxiliary agent is dispersing agent, thixotroping
At least one of agent, levelling agent, lubricant, diluent.The present invention adds dispersing agent, thixotropic agent, levelling agent, profit in the slurry
Lubrication prescription, diluent improve slurry printing characteristic, cross net, it is made to have better depth-width ratio.
As the preferred embodiment of one pack system HJT battery low temperature silver paste of the present invention, the dispersing agent be byk163,
One of BYK180；Dispersing agent, which primarily serves dispersion, reduces the effect of viscosity；
The thixotropic agent is one of fumed silica, organobentonite, graphene；
The levelling agent is organosilicon levelling agent or acrylic acid levelling agent；
The lubricant is silicone oil or paraffin；
The diluent is butyl carbitol or terpinol.The main principle that diluent is selected is that diluent is keeping good
Under the premise of dilution capacity, the latency of curing agent cannot be destroyed, the service life of single-component conductive slurry cannot be influenced.
The beneficial effects of the present invention are:
1, the unicity of conductive phase silver powder is solved, is partially replaced using high performance-price ratio conductive powder.
2, other than organic resin is as Binder Phase, introduce other low-melting-point metal conductive nano powder or other
Material, after making 200 DEG C of solidifications in 30min minutes or so, in addition to there is the solidification of resin bonding between conductive particle, there are also low melting point powder
The sintering of last fusion, nano particle is as accessory attachment Binder Phase.
3, it selects without benzene ring structure or the resistance to better resin of photodissociation light resistance as matrix resin.
4, depth-width ratio after net and solidification was printed in optimization under existence conditions, and slurry is made to be suitble to more narrow linewidth halftone, high
Wide ratio is more excellent, and light-receiving area is further increased under the premise of keeping resistivity, increases transfer efficiency.
5, in addition to itself need to have sufficiently low resistivity after the addition excessive substance in interface (indium oxide powder) elargol solidifies, together
When with TCO film layer have good contact effect, substrate upper conductive film is not destroyed or is preferably minimized destruction.
Specific embodiment
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with specific embodiment to the present invention
It is described further.
Each raw material involved by following embodiment is commercially available versatile material unless otherwise instructed.
Embodiment 1
A kind of one pack system HJT battery low temperature silver paste embodiment of the invention, one pack system HJT battery described in the present embodiment are used
Low temperature silver paste constituent is as shown in table 1.
The low temperature silver paste of one pack system HJT battery shown in the present embodiment the preparation method comprises the following steps:
After being weighed by formula, by resin, the first conductive powder, the second conductive powder morning planetary stirring machine platform according to
(1000 turns/min) turn 70s and are mixed, and are rolled after stirring, and then addition crosses three rollers after curing agent, auxiliary agent is added
Milling train.
Embodiment 2~5 and comparative example 1-2
The constituent component of embodiment 2~5 and comparative example 1~2 is as shown in table 1,1~2 institute of embodiment 2~5 and comparative example
The preparation method is the same as that of Example 1 for the one pack system HJT battery low temperature silver paste stated.
Burn out rate is the burn out rate measured in 500 DEG C of 30min.
Meanwhile the following performance of low temperature silver paste of one pack system HJT battery described in testing example 1~5 and comparative example 1~2:
Resistivity after solidification, adhesive force, resistance to photodissociation, resistance to ag(e)ing, printed it is linear high wide after net, product service life, solidification
Than.Wherein, the test method of each performance are as follows:
Resistivity after solidification: printing fixed pattern (long 10cm, width 1mm serpentine pattern), measuring resistance value after solidification.According to public affairs
Formula R=ρ L/S converses resistivity.
Printed net: continuous printing 3h under halftone (360 mesh -16um line footpath -30um line width) observes network blocking situation, breaks
Line situation.
Linear depth-width ratio after solidification: it is tested after solidification with 3D microscope
Adhesive force: welding test welding pulling force after solidification
Resistance to photodissociation: sun-proof instrument 1000h observes color change, resistivity attenuation
Resistance to ag(e)ing: TC200 electrical property attenuation
Test result is as shown in table 2.
Table 1
--- expression is not added.
Table 2
As shown in Table 2, the component using one pack system HJT battery low temperature silver paste of the present invention of Examples 1 to 5 has solid
Resistivity is low after change, conductive particle combination adhesive force is good, good depth-width ratio after crossing net and solidification, and slurry is suitble to narrower line
Wide screen version, depth-width ratio is more excellent, and light-receiving area is further increased under the premise of keeping resistivity, increases transfer efficiency, has simultaneously
There is good resistance to photodissociation, resistance to ag(e)ing has longer service life.The one pack system HJT battery low temperature silver paste of comparative example 1
Without the second conductive powder, conductive powder only with flake silver powder, remaining component within the scope of the present invention, after solidification
Resistivity it is higher, electric conductivity is worse, while its binding force between resin is worse, comparative example 2 use contain benzene ring structure
Bisphenol A epoxide resin content it is higher, adhesive force is improved relative to comparative example 1, but its resistivity relative to the present invention more
Height, so that electric conductivity is worse.Comparative example 1 and comparative example 2 do not contain additive adipic acid, glutaric acid substance, due to adipic acid,
The substances such as glutaric acid have removal effect to the organic substance of metal powder surface, have the function of reducing the resistance value after solidifying,
Therefore, electric conductivity is not as good as the present invention.Embodiment 5 does not contain auxiliary agent, and the auxiliary agent in comparative example 1 and comparative example 2 contains only dilution
Agent, and as can be known from the results, embodiment 5, the net excessively of comparative example 1~2, depth-width ratio are not so good as the embodiment of the present invention 1~4.Reason exists
In printing net and be affected by lubricant, depth-width ratio is affected by thixotropic agent.
Effect example 1
The proportion of each component of the present invention influences the performance of one pack system HJT battery low temperature silver paste, to investigate each group distribution ratio
To the influence of low temperature silver paste performance of one pack system HJT battery, applicant is prepared for test group and control according to the method for embodiment 1
Group one pack system HJT battery low temperature silver paste, and one pack system HJT battery low temperature silver paste performance in accordance with the above-mentioned embodiment 1~5
Test method, test the performance of this effect example test group and control group one pack system HJT battery low temperature silver paste.
In this effect example, the proportion of each component is different, remaining is all the same, and each group distribution ratio is as shown in table 3.
In test group and control group, the first conductive powder uses flake silver powder, and radius D50 is 8um, and specific surface area is
0.5m2/ g, tap density 8g/cm3, the nano-silver powder radius D50 of the second conductive powder is 50nm, and heat reactive resin uses hydroxyl
Base acrylic resin, curing agent use blocked isocyanate, and auxiliary agent uses thixotropic agent and lubricant.
In this effect example, test group and control group the performance test results are as shown in table 4.
Table 3
Table 4
As shown in Table 4, the proportion of each component of the present invention influences the performance of HJT battery low temperature silver paste, when each group distribution ratio exists
When within the scope of the invention, it is low that HJT battery low temperature silver paste of the invention has resistivity after solidification, and the combination of conductive particle is attached
Put forth effort, good depth-width ratio after crossing net and solidification, slurry is suitble to more narrow linewidth halftone, and depth-width ratio is more excellent, is keeping resistance
Light-receiving area is further increased under the premise of rate, increases transfer efficiency.With good resistance to photodissociation, resistance to ag(e)ing.When first
30~40 parts by weight of nano-silver powder, (low-melting-point metal in 60~70 parts by weight of conductive powder (flake silver powder), the second conductive powder
Or alloy powder or refractory metal or alloy powder) 2~7 parts by weight, 1~2 parts by weight of heat reactive resin, curing agent 0.05~
When 0.5 parts by weight, 2.5~4.5 parts by weight of auxiliary agent, the present invention have more preferably electric conductivity, adhesion performance, cross net and more
Depth-width ratio, resistance to photodissociation and resistance to ag(e)ing after excellent solidification, when 65 parts of the first conductive powder (flake silver powder), the second conductive powder
Middle 30 parts by weight of nano-silver powder, (low-melting-point metal or alloy powder or refractory metal or alloy powder) 5 parts by weight, heat cure
When 1.5 parts by weight of resin, 1.5 parts by weight of curing agent, 3 parts by weight of auxiliary agent, HJT battery low temperature silver paste of the invention has optimal
Electric conductivity, adhesion performance cross net and more preferably depth-width ratio, resistance to photodissociation and resistance to ag(e)ing after solidification.
Effect example 2
This effect example has investigated each property of the first conductive powder to the performance of one pack system HJT battery low temperature silver paste
It influences, to investigate influence of each property of the first conductive powder to one pack system HJT battery low temperature silver paste performance, applicant is pressed
It is prepared for test group and control group one pack system HJT battery low temperature silver paste according to the method for embodiment 1, and in accordance with the above-mentioned embodiment 1
The test method of~5 one pack system HJT battery low temperature silver paste performances, tests this effect example test group and control group single group
Divide the performance of HJT battery low temperature silver paste.
In this effect example, except property (radius D50, specific surface area, tap density, the flake silver powder 500 of the first conductive powder
DEG C 30min burn out rate) it is different, remaining is all the same, and in test group and control group, one pack system HJT battery low temperature silver paste includes
The component of following parts by weight: 65 parts of flake silver powder, 35 parts of nano-silver powder, 5 parts of indium powder, 1.6 parts of hydrogenated bisphenol A epoxy resin, envelope
0.4 part of closed form isocyanates, 2.5 parts release agent, 0.5 part of lubricant, 0.5 part of adipic acid.
In this effect example, the radius D50 of the first conductive powder of test group and control group, specific surface area, tap density, sheet
500 DEG C of 30min burn out rates of silver powder are as shown in table 5, and the performance test results are as shown in table 6.
Table 5
Table 6
From 6 data of table it is found that 500 DEG C of radius D50, specific surface area, tap density, the flake silver powder of the first conductive powder
30min burn out rate on one pack system HJT battery with low temperature silver paste performance influence mainly resistivity, cross net performance influence, other
Performance influences less, and wherein electric conductivity is relatively weaker for sheet silver too thin (< 1um), and the increase of the radius with flake silver powder,
Although electric conductivity improves, it crosses the decline of net performance, and the burn out rate of control group 2 is greater than 0.65%, and resistivity increases.Vibration
The higher silver powder of real density, accumulation compactness can be more preferable.Nano-silver powder serves low sintering, makes to contact between Argent grain
More preferably, electric conductivity is more preferable.As can be known from the results, when the radius D50 of flake silver powder is 2um~10um, specific surface area be 0.2~
0.5m2/ g, tap density are 4~6g/cm3, 500 DEG C of 30min burn out rates of flake silver powder are 0.2~0.4%, obtained low-temperature silver
Starch comprehensive performance more preferably.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than protects to the present invention
The limitation of range is protected, although the invention is described in detail with reference to the preferred embodiments, those skilled in the art should
Understand, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the essence of technical solution of the present invention
And range.
Claims (10)
1. a kind of one pack system HJT battery low temperature silver paste, which is characterized in that comprise the following components in parts by weight: the first conducting powder
Last 50~90 parts, 5~40 parts of the second conductive powder, 1~2 part of heat reactive resin, 0~5 part of curing agent, 0~5 part of auxiliary agent；It is described
First conductive powder is flake silver powder, and second conductive powder is nanometer conductive powder, low melting point conductive metal powder, low melting point
At least one of electrical conductivity alloy powder, high-melting-point conductive metal powder, high-melting-point electrical conductivity alloy powder.
2. low temperature silver paste according to claim 1, which is characterized in that the nanometer conductive powder in second conductive powder is
10~40 parts by weight, the low melting point conductive metal powder, low melting point electrical conductivity alloy powder, high-melting-point conductive metal powder, height
Fusing point electrical conductivity alloy powder is 0~10 parts by weight.
3. low temperature silver paste according to claim 2, which is characterized in that including following components in parts by weight: described first leads
30~40 parts of nanometer conductive powder, low melting point conductive metal powder, low melting point in 60~70 parts of electro-powder, the second conductive powder close
Bronze end, high-melting-point conductive metal powder, high-melting-point electrical conductivity alloy powder summation are 2~7 parts, 1~2 part of heat reactive resin, consolidate
0.05~0.5 part of agent, 2.5~4.5 parts of auxiliary agent.
4. low temperature silver paste according to claim 3, which is characterized in that including following components in parts by weight: described first leads
30 parts of nano-silver powder, low melting point conductive metal powder or low-melting alloy powder in 65 parts of electro-powder, the second conductive powder are 5
Part, 1.5 parts of heat reactive resin, 0.05 part of curing agent, 3 parts of auxiliary agent.
5. low temperature silver paste according to any one of claims 1 to 4, which is characterized in that the nanometer conductive powder is nano silver
Powder, the low melting point conductive metal powder are indium powder, and low melting point electrical conductivity alloy powder is sn-bi alloy powder, high-melting-point conductive metal
Powder is nickel powder, and high-melting-point electrical conductivity alloy powder is silver-coated copper powder.
6. low temperature silver paste according to any one of claims 1 to 4, which is characterized in that the flake silver powder piece radius D50 is
1um~15um, specific surface area is in 0.1~0.8m2/ g, tap density are 1~10g/cm3, 500 DEG C of 30min burn out rates of flake silver powder
Less than 0.5%；The D50 of nanometer conductive powder is not more than 80nm；Preferably, the flake silver powder piece radius D50 is 2um~10um,
Specific surface area is in 0.2~0.5m2/ g, tap density are 4~6g/cm3, burn out rate is 0.2~0.4%.
7. low temperature silver paste according to any one of claims 1 to 4, which is characterized in that the heat reactive resin is no phenyl ring
One of the epoxy resin of structure, organic siliconresin, hydroxylated acrylic resin, polyester resin, base polyurethane prepolymer for use as；It is preferred that
The epoxy resin on ground, no benzene ring structure selects hydrogenated bisphenol A epoxy resin.
8. low temperature silver paste according to any one of claims 1 to 4, which is characterized in that curing agent be blocked isocyanate,
Compound containing blocked isocyanate group, amine chemicals, amine complex compound, acid anhydrides, aginomoto curing agent PN-23J,
MY-25, one of Fuji's chemical conversion 1020.
9. low temperature silver paste according to claim 1, which is characterized in that further include the additive of 0.4~0.5 parts by weight, institute
Stating additive is adipic acid, at least one of glutaric acid.
10. low temperature silver paste according to any one of claims 1 to 4, which is characterized in that the auxiliary agent is dispersing agent, thixotroping
Agent, at least one of levelling agent, lubricant, diluent；Preferably, the dispersing agent is one of byk163, BYK180；
The thixotropic agent is one of fumed silica, organobentonite, graphene；
The levelling agent is organosilicon levelling agent or acrylic acid levelling agent；
The lubricant is silicone oil or paraffin；
The diluent is butyl carbitol or terpinol.
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