[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN109638052B - 柔性基板、柔性显示面板及其制造方法 - Google Patents

柔性基板、柔性显示面板及其制造方法 Download PDF

Info

Publication number
CN109638052B
CN109638052B CN201811537513.0A CN201811537513A CN109638052B CN 109638052 B CN109638052 B CN 109638052B CN 201811537513 A CN201811537513 A CN 201811537513A CN 109638052 B CN109638052 B CN 109638052B
Authority
CN
China
Prior art keywords
layer
organic layer
organic
forming
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811537513.0A
Other languages
English (en)
Other versions
CN109638052A (zh
Inventor
夏晨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201811537513.0A priority Critical patent/CN109638052B/zh
Priority to US16/472,974 priority patent/US11283032B2/en
Priority to PCT/CN2019/078750 priority patent/WO2020118953A1/zh
Publication of CN109638052A publication Critical patent/CN109638052A/zh
Application granted granted Critical
Publication of CN109638052B publication Critical patent/CN109638052B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种柔性基板、柔性显示面板及其制造方法。柔性显示面板的制造方法包括：于一基板上形成第一有机层；于第一有机层上决定弯折区域，且于第一有机层位于弯折区域的部分上形成黏合层；于黏合层及第一有机层上形成无机层；于无机层上形成第二有机层；于第二有机层上依序形成薄膜晶体管层、有机发光二极体层及封装层；去除基板；以及去除第一有机层位于弯折区域的部分及黏合层，以形成柔性显示面板。

Description

柔性基板、柔性显示面板及其制造方法
技术领域
本发明涉及显示技术领域，尤其涉及一种柔性基板、柔性显示面板及其制造方法。
背景技术
近年来，大众对全面屏(full screen display)显示装置有相当高的兴趣。对于有机发光二极体(Organic Light-Emitting Diode，OLED)显示面板而言，端子弯曲技术(PADbending)通过将柔性基板上绑定控制芯片的绑定区域弯折到显示面板的背后，得以实现全面屏的效果。
当将绑定区域向显示面板的背后进行弯折时，绑定区域与显示区域之间会出现弯折区域。由于绑定区域与显示区域之间设置有多条用于传输信号的金属信号线，因此当显示面板弯折时，在弯折区域内的金属信号线容易受到应力作用而导致断裂，从而引发信号传输不良，使显示面板无法正常显示。
因此，有必要提供一种柔性基板、柔性显示面板及其制造方法，以解决上述问题。
发明内容
本发明的目的在于提供一种柔性基板、柔性显示面板及其制造方法，可以避免金属信号线受到应力作用而导致断裂，确保显示面板正常显示。
为实现上述目的，本发明提供一种柔性基板，设有弯折区域，其特征在于，所述柔性基板包括：第一有机层，设有位于所述弯折区域的镂空部；无机层，形成于所述第一有机层的上方，设有位于所述弯折区域的凹陷部和凸起部，其中所述凹陷部设于所述无机层接近所述第一有机层的表面，所述凸起部设于所述无机层远离所述第一有机层的表面；以及第二有机层，形成于所述无机层的上方，设有位于所述弯折区域的嵌合部，其中所述嵌合部与所述无机层的凸起部相嵌合。
在一些实施方式中，所述第一有机层的材料包括聚酰亚胺(Polyimide)。
在一些实施方式中，所述无机层的材料包括氮化硅(SiNx)。
在一些实施方式中，所述第二有机层的材料包括聚酰亚胺(Polyimide)。
为实现上述目的，本发明提供一种柔性显示面板，其特征在于，包括柔性基板和重叠于所述柔性基板上方的薄膜晶体管层、有机发光二极体层及封装层；其中，所述柔性基板包括：第一有机层，设有位于所述弯折区域的镂空部；无机层，形成于所述第一有机层的上方，设有位于所述弯折区域的凹陷部和凸起部，其中所述凹陷部设于所述无机层接近所述第一有机层的表面，所述凸起部设于所述无机层远离所述第一有机层的表面；以及第二有机层，形成于所述无机层的上方，设有位于所述弯折区域的嵌合部，其中所述嵌合部与所述无机层的凸起部相嵌合。
为实现上述目的，本发明提供一种柔性显示面板的制造方法，其特征在于，包括：于一基板上形成第一有机层；于所述第一有机层上决定弯折区域，且于所述第一有机层位于所述弯折区域的部分上形成黏合层；于所述黏合层及所述第一有机层上形成无机层；于所述无机层上形成第二有机层；于所述第二有机层上依序形成薄膜晶体管层、有机发光二极体层及封装层；去除所述基板；以及去除所述第一有机层位于所述弯折区域的部分及所述黏合层，以形成所述柔性显示面板。
在一些实施方式中，所述形成第一有机层和第二有机层之步骤采用涂布且固化方法以形成所述第一有机层和所述第二有机层。
在一些实施方式中，所述于第一有机层位于所述弯折区域的部分上形成黏合层之步骤采用涂布方法以形成所述黏合层。
在一些实施方式中，所述于黏合层及第一有机层上形成无机层之步骤采用化学气相沉积法以形成所述无机层。
在一些实施方式中，所述去除第一有机层位于所述弯折区域的部分之步骤采用激光镭射对所述第一有机层进行切割。
在一些实施方式中，所述黏合层的材料包括六甲基二硅胺、山梨醇、二甲亚砜之至少其中一者。
为让本发明的特征以及技术内容能更明显易懂，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考用，并非用来对本发明加以限制。
附图说明
图1为根据本发明实施例的柔性显示面板的制造方法的流程图；
图2A-2G为实施图1的步骤S01-S07的剖面示意图。
具体实施方式
为了使本发明的目的、技术手段及其效果更加清楚明确，以下将结合附图对本发明作进一步地阐述。应当理解，此处所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例，并不用于限定本发明。
请参考图1，其示出根据本发明实施例的柔性显示面板的制造方法的流程图。同时参考图2A-2G，图2A-2G为实施图1的步骤S01-S07的剖面示意图。图1中，柔性显示面板的制造方法包括如下步骤：
步骤S01、于基板20上形成第一有机层21(如图2A所示)。在一些实施方式中，步骤S01采用涂布且固化方法以形成第一有机层21。具体地，基板20为玻璃基板。第一有机层21的材料包括聚酰亚胺(Polyimide)。第一有机层21的厚度为5-15微米(micrometer)。
步骤S02、于第一有机层21上决定弯折区域BA，且于第一有机层21位于弯折区域BA的部分上形成黏合层22(如图2B所示)。在一些实施方式中，步骤S02采用涂布方法以形成黏合层22。具体地，黏合层22的材料包括六甲基二硅胺、山梨醇、二甲亚砜之至少其中一者。黏合层22的厚度为0.01-1微米(micrometer)。
步骤S03、于黏合层22及第一有机层21上形成无机层23(如图2C所示)。在一些实施方式中，步骤S03采用化学气相沉积法以形成无机层23。具体地，无机层23的材料包括氮化硅(SiNx)。无机层23的厚度为0.1-1微米(micrometer)。
步骤S04、于无机层23上形成第二有机层24(如图2D所示)。在一些实施方式中，步骤S04采用涂布且固化方法以形成第二有机层24。具体地，第二有机层24的材料包括聚酰亚胺(Polyimide)。第二有机层24的厚度为5-15微米(micrometer)。
步骤S05、于第二有机层24上依序形成薄膜晶体管层25、有机发光二极体层26及封装层27(如图2E所示)。
步骤S06、去除基板20(如图2F所示)。在一些实施方式中，步骤S06采用激光镭射对基板20进行剥离。
步骤S07、去除第一有机层21位于弯折区域BA的部分及黏合层22，以形成柔性显示面板2(如图2G所示)。在一些实施方式中，步骤S07采用激光镭射对第一有机层21进行切割，以去除第一有机层21位于弯折区域BA的部分。再者，黏合层22会因高温而发生脱落(peeling)。
继续参考图2G，本发明所提供的柔性基板1设有弯折区域BA，其包括第一有机层21、无机层23和第二有机层24。第一有机层21设有位于弯折区域BA的镂空部210。无机层23形成于第一有机层21的上方，设有位于弯折区域BA的凹陷部230和凸起部231，其中凹陷部230设于无机层23接近第一有机层21的表面，凸起部231设于无机层23远离第一有机层21的表面。第二有机层24形成于无机层23的上方，设有位于弯折区域BA的嵌合部240，其中嵌合部240与无机层23的凸起部231相嵌合。再者，如图2G所示，本发明所提供的柔性显示面板2包括柔性基板1和重叠于柔性基板1上方的薄膜晶体管层25、有机发光二极体层26及封装层27。
综上所述，本发明提供的柔性基板、柔性显示面板及其制造方法,主要通过减薄具有多层结构的柔性基板的厚度，以避免弯折区域内的金属信号线受到应力作用而导致断裂，确保显示面板正常显示。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (5)

1.一种柔性显示面板，其特征在于，包括柔性基板和重叠于所述柔性基板上方的薄膜晶体管层、有机发光二极体层及封装层；其中，所述柔性基板包括：
第一有机层，具有一弯折区域，所述第一有机层设有位于所述弯折区域的镂空部；
无机层，形成于所述第一有机层的上方，设有位于所述弯折区域的凹陷部和凸起部，其中所述凹陷部设于所述无机层接近所述第一有机层的表面，所述凸起部设于所述无机层远离所述第一有机层的表面；以及
第二有机层，形成于所述无机层的上方，设有位于所述弯折区域的嵌合部，其中所述嵌合部与所述无机层的凸起部相嵌合。
2.一种柔性显示面板的制造方法，其特征在于，包括：
于一基板上形成第一有机层；
于所述第一有机层上决定弯折区域，且于所述第一有机层位于所述弯折区域的部分上形成黏合层，所述黏合层的材料包括六甲基二硅胺、山梨醇、二甲亚砜之至少其中一者；
于所述黏合层及所述第一有机层上形成无机层；
于所述无机层上形成第二有机层；
于所述第二有机层上依序形成薄膜晶体管层、有机发光二极体层及封装层；
去除所述基板；以及
去除所述第一有机层位于所述弯折区域的部分及所述黏合层，以形成所述柔性显示面板。
3.如权利要求2所述的制造方法，其特征在于，所述于第一有机层位于所述弯折区域的部分上形成黏合层之步骤采用涂布方法以形成所述黏合层。
4.如权利要求2所述的制造方法，其特征在于，所述于黏合层及第一有机层上形成无机层之步骤采用化学气相沉积法以形成所述无机层。
5.如权利要求2所述的制造方法，其特征在于，所述去除第一有机层位于所述弯折区域的部分之步骤采用激光镭射对所述第一有机层进行切割。
CN201811537513.0A 2018-12-15 2018-12-15 柔性基板、柔性显示面板及其制造方法 Active CN109638052B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201811537513.0A CN109638052B (zh) 2018-12-15 2018-12-15 柔性基板、柔性显示面板及其制造方法
US16/472,974 US11283032B2 (en) 2018-12-15 2019-03-19 Flexible substrate, flexible display panel, and manufacturing method thereof
PCT/CN2019/078750 WO2020118953A1 (zh) 2018-12-15 2019-03-19 柔性基板、柔性显示面板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811537513.0A CN109638052B (zh) 2018-12-15 2018-12-15 柔性基板、柔性显示面板及其制造方法

Publications (2)

Publication Number Publication Date
CN109638052A CN109638052A (zh) 2019-04-16
CN109638052B true CN109638052B (zh) 2021-05-07

Family

ID=66074338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811537513.0A Active CN109638052B (zh) 2018-12-15 2018-12-15 柔性基板、柔性显示面板及其制造方法

Country Status (3)

Country Link
US (1) US11283032B2 (zh)
CN (1) CN109638052B (zh)
WO (1) WO2020118953A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220125879A (ko) * 2021-03-05 2022-09-15 삼성디스플레이 주식회사 표시 장치

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102039496B1 (ko) * 2013-08-19 2019-11-04 삼성디스플레이 주식회사 접이식 표시 장치
KR102132235B1 (ko) * 2013-11-28 2020-07-10 삼성디스플레이 주식회사 플렉서블 표시장치
US9811120B2 (en) * 2013-11-28 2017-11-07 Samsung Display Co., Ltd. Flexible display device
KR102243206B1 (ko) * 2014-03-18 2021-04-23 삼성디스플레이 주식회사 플렉서블 표시장치
US9773853B2 (en) * 2015-01-09 2017-09-26 Apple Inc. Organic light-emitting diode display with bent substrate
KR102404670B1 (ko) * 2015-06-18 2022-06-07 삼성전자주식회사 디스플레이 장치 및 그를 구비하는 전자 장치
US10020462B1 (en) * 2015-07-30 2018-07-10 Apple Inc. Electronic devices with flexible displays
KR102541453B1 (ko) * 2015-08-31 2023-06-09 삼성디스플레이 주식회사 플렉서블 표시장치
KR102497583B1 (ko) * 2015-10-27 2023-02-10 삼성전자주식회사 유연한 연결부를 갖는 반도체 장치 및 그 제조방법
KR102329978B1 (ko) 2015-10-28 2021-11-22 엘지디스플레이 주식회사 플렉서블 유기발광다이오드 표시장치
CN105679800B (zh) * 2016-01-27 2019-08-13 京东方科技集团股份有限公司 Oled显示屏及其制备方法、显示设备
KR102451081B1 (ko) * 2016-02-05 2022-10-06 삼성전자주식회사 다양한 점착제를 사용하는 디스플레이 및 그것을 포함하는 전자 장치
KR101797728B1 (ko) * 2016-03-11 2017-11-16 삼성디스플레이 주식회사 디스플레이 장치
KR102560703B1 (ko) * 2016-04-29 2023-07-28 삼성디스플레이 주식회사 디스플레이 장치
KR102572720B1 (ko) * 2016-05-03 2023-08-31 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
KR102561329B1 (ko) * 2016-06-10 2023-07-28 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN106024839B (zh) * 2016-07-12 2019-02-01 武汉华星光电技术有限公司 折叠式oled显示器
KR102385458B1 (ko) * 2016-10-06 2022-04-13 삼성디스플레이 주식회사 플렉서블 표시 장치 및 그의 제조 방법
KR102673478B1 (ko) * 2016-11-25 2024-06-11 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102327991B1 (ko) * 2016-12-16 2021-11-18 삼성디스플레이 주식회사 디스플레이 장치의 제조방법
CN107482046B (zh) * 2017-08-25 2021-01-29 京东方科技集团股份有限公司 显示基板及其制备方法和显示装置
CN207134069U9 (zh) * 2017-08-31 2019-09-27 昆山国显光电有限公司 柔性显示基板及显示装置
CN107768413B (zh) * 2017-10-26 2020-12-01 京东方科技集团股份有限公司 一种柔性显示基板、显示装置及其制作方法
KR102537378B1 (ko) * 2018-01-30 2023-05-26 삼성디스플레이 주식회사 폴더블 표시 장치
US11081660B2 (en) * 2018-05-03 2021-08-03 Samsung Display Co., Ltd. Display device and support film structure for display device
KR102494409B1 (ko) * 2018-07-10 2023-02-01 삼성디스플레이 주식회사 표시 장치
CN111508993B (zh) * 2019-01-31 2022-10-04 武汉华星光电半导体显示技术有限公司 一种oled显示面板及其制作方法
KR20210106623A (ko) * 2020-02-20 2021-08-31 삼성디스플레이 주식회사 표시 장치
US20210361175A1 (en) * 2020-05-20 2021-11-25 Koninklijke Philips N.V. Sleep-based biometric to predict and track viral infection phases

Also Published As

Publication number Publication date
US20210359232A1 (en) 2021-11-18
US11283032B2 (en) 2022-03-22
WO2020118953A1 (zh) 2020-06-18
CN109638052A (zh) 2019-04-16

Similar Documents

Publication Publication Date Title
JP6496664B2 (ja) 発光装置
CN109478580B (zh) 微发光二极管转移方法、制造方法及器件
US20180336393A1 (en) Fingerprint sensing unit
US8491955B2 (en) Method of manufacturing electronic apparatus including plastic substrate, electronic apparatus manufactured using the method, and apparatus for use in the method
US11264593B2 (en) Flexible display device
US6445866B1 (en) Optical interconnection apparatus and method of fabricating same
US20220223806A1 (en) Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible display
WO2020187151A1 (zh) 显示基板及其制造方法、显示装置
CN104393014A (zh) 一种阵列基板及其制备方法、柔性显示面板和显示装置
US20210066538A1 (en) Display substrate, manufacturing method thereof, and display device
US11307688B2 (en) Thermal transfer substrate, touch display panel and manufacturing methods therefor, and display device
CN109638052B (zh) 柔性基板、柔性显示面板及其制造方法
TW200729441A (en) Semiconductor devices and fabrication method thereof
CN107195658A (zh) 柔性基板及其制作方法
TW202106126A (zh) 可撓性顯示裝置及其製造方法
TWI514527B (zh) 半導體封裝製程用耐熱性黏著帶
US10660202B1 (en) Carrier structure and manufacturing method thereof
US20240038775A1 (en) Display panel and method for manufacturing same
US10297638B1 (en) Flexible light source structure and method for manufacturing same
TWI728222B (zh) 可撓性電子裝置及其製作方法
US8900926B2 (en) Chip package method
CN110890380B (zh) 软性基板的制造方法
KR101757430B1 (ko) 플렉서블 기능성 필름과 그 제조방법
CN111755471A (zh) 可弯折柔性显示装置及其制作方法
TWI634817B (zh) 用於電路板沖壓製程的覆蓋膜

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant