CN109637964B - Silicon wafer feeding and discharging righting structure and righting method thereof - Google Patents
Silicon wafer feeding and discharging righting structure and righting method thereof Download PDFInfo
- Publication number
- CN109637964B CN109637964B CN201910032804.2A CN201910032804A CN109637964B CN 109637964 B CN109637964 B CN 109637964B CN 201910032804 A CN201910032804 A CN 201910032804A CN 109637964 B CN109637964 B CN 109637964B
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- China
- Prior art keywords
- silicon wafer
- righting
- auxiliary transmission
- transmission shaft
- auxiliary
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 70
- 239000010703 silicon Substances 0.000 title claims abstract description 70
- 238000007599 discharging Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims abstract description 66
- 235000012431 wafers Nutrition 0.000 claims description 58
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000013016 damping Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000010606 normalization Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a silicon wafer feeding and discharging correcting structure and a correcting method thereof. If larger silicon wafer is needed to be switched, the locking nut is only required to be loosened, and then the return catch wheel is screwed to the required position, so that the whole auxiliary transmission shaft is not required to be replaced.
Description
Technical Field
The invention relates to a material inlet and outlet resetting device, which can quickly switch the positions of resetting flanges required by silicon wafers with different sizes on the premise of not replacing the whole resetting device, and belongs to semiconductor and solar cleaning equipment and wet processing equipment, in particular to chain cleaning equipment and wet processing equipment.
Background
In the cleaning industry, especially in the chain wet treatment industry, a silicon wafer rectifying device is often arranged at an inlet and an outlet of a main device so as to prevent the silicon wafer from being skewed when entering the device, and at present, a fixed structure is basically adopted, and due to innovation of silicon wafer raw material production technology, the silicon wafer is developing towards a large-size direction, for example, the silicon wafer with the traditional square 125 is gradually eliminated by the market, and at present, the silicon wafer with the main flow of 156 square is still 166 square in the near future. When the size of the silicon wafer is fed, the traditional righting device needs to be replaced integrally and can be suitable for the whole device. The switching cost is high and the modification is large.
Disclosure of Invention
The invention aims to solve the problem that the traditional silicon wafer inlet and outlet resetting device cannot be suitable for silicon wafers with various sizes.
In order to solve the technical problems, the technical scheme of the invention provides a silicon wafer feeding and discharging righting structure, which comprises a bottom plate, wherein a main transmission shaft is arranged on the bottom plate and is fixed on the bottom plate through a bearing support seat, a plurality of main transmission gears are arranged on the main transmission shaft and are respectively meshed with a plurality of auxiliary transmission gears which are fixed on the bottom plate at one side of the main transmission shaft, the plurality of auxiliary transmission gears are respectively connected with a plurality of auxiliary transmission shafts, the plurality of auxiliary transmission shafts are arranged in parallel, righting structures for righting silicon wafers are respectively arranged on the plurality of parallel auxiliary transmission shafts in parallel, the parallelly arranged righting structures are on the same central line, and a righting device which is longitudinally arranged and gradually narrows the dimension of the righting structures from bottom to top is formed on the plurality of auxiliary transmission shafts according to the movement direction of the silicon wafers shown by an arrow A; by means of the righting device, when the silicon wafer moves from bottom to top as shown by arrow A, the silicon wafer which is not in the middle of the righting device or is askew is adjusted through the size of the righting structure which is gradually narrowed.
Preferably, a plurality of sets of righting devices are arranged on the plurality of auxiliary transmission shafts in parallel, so that the righting adjustment of the silicon wafers can be simultaneously carried out, and the efficiency is improved.
Preferably, the correcting structure comprises a pair of correcting baffle wheels arranged on the auxiliary transmission shaft, a protruding baffle plate is arranged at the edge of one end of each correcting baffle wheel, the pair of baffle plates are oppositely arranged, the silicon wafer is arranged between the correcting baffle wheels, and the edge of the silicon wafer is limited by the baffle plates.
Preferably, a locking nut used for locking the return catch wheel is arranged on the other end of the return catch wheel and used for limiting the displacement of the return catch wheel.
Preferably, a limiting groove is arranged between the plurality of groups of the rectifying structures on each auxiliary transmission shaft.
Preferably, a limiting check ring is arranged in the limiting groove and used for blocking and damping between adjacent return structures during operation.
Preferably, the locking nut, the correcting baffle wheel and the auxiliary transmission shaft are connected through threads, the distance between the baffle plates on each pair of correcting baffle wheels is adjusted according to the size of the silicon wafer, and the locking nut locks the adjusted correcting baffle wheels through threads.
Preferably, a positioning groove is arranged between the locking nut and the auxiliary transmission shaft, and the locking nut is sealed through a side check ring arranged in the positioning groove.
The invention also provides a silicon wafer feeding and discharging resetting method, which comprises the following steps:
s1: putting the silicon wafer into the righting device:
s2: the main transmission shaft is driven by the motor to rotate so as to drive the main transmission gear and the auxiliary transmission gear to move in a meshed mode, so that the auxiliary transmission shaft is indirectly driven to rotate, and the silicon wafer is driven by the correcting baffle wheel on the auxiliary transmission shaft to move forwards in a linear mode according to the moving direction shown by an arrow A;
if the silicon chip is not in the middle of the correcting device or is askew, the edge of the silicon chip which is driven forward can be timely adjusted to a skew state when touching the correcting baffle wheel on the gradually narrowing correcting structure.
According to the invention, a plurality of groups of correcting structures are respectively arranged on a plurality of auxiliary transmission shafts, the correcting structures are a set of correcting device formed by combining the transmission shafts by the narrowing of the width and the plurality of auxiliary transmission shafts, and the silicon wafer placed on the correcting structures is driven to move forwards in a straight line through the rotation of the auxiliary transmission shafts, so that if the silicon wafer is not in the middle of the correcting region or is inclined, the inclined state can be timely adjusted when the silicon wafer touches the narrower correcting region correcting baffle wheels. If larger silicon wafer is needed to be switched, the locking nut is only required to be loosened, and then the return catch wheel is screwed to the required position, so that the whole auxiliary transmission shaft is not required to be replaced.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer feeding and discharging resetting device provided by the invention;
fig. 2 is a schematic cross-sectional view of the righting structure of fig. 1.
The numbers in the figure are as follows:
1. a main transmission gear; 2. an auxiliary transmission shaft; 3. a silicon wafer; 4. a limit groove; 5. a limit retainer ring; 6. a return catch wheel; 7. and locking the nut.
Detailed Description
In order to make the invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
As shown in fig. 1 and fig. 2, the silicon wafer feeding and discharging normalization structure provided by the invention comprises a bottom plate, wherein a main transmission shaft is arranged on the bottom plate, the main transmission shaft is fixed on the bottom plate through a bearing support seat, a plurality of main transmission gears 1 are arranged on the main transmission shaft, the main transmission gears 1 are respectively meshed with a plurality of auxiliary transmission gears, one side of each main transmission shaft is fixed on the bottom plate, the plurality of auxiliary transmission gears are respectively connected with a plurality of auxiliary transmission shafts 2, and the plurality of auxiliary transmission shafts 2 are arranged in parallel; the silicon wafer straightening machine is characterized in that a straightening structure for straightening silicon wafers 3 is respectively arranged on the plurality of parallel auxiliary transmission shafts 2 in parallel, the straightening structure comprises a pair of straightening baffle wheels 6 arranged on the auxiliary transmission shafts 2, protruding baffle plates 6-1 are arranged at the edges of one ends of the straightening baffle wheels 6, the pair of baffle plates 6-1 are oppositely arranged, the silicon wafers 3 are arranged between the pair of straightening baffle wheels 6, the edges of the silicon wafers 3 are limited by the baffle plates 6-1, and locking nuts 7 for locking the straightening baffle wheels 6 are arranged at the other ends of the straightening baffle wheels 6 and used for limiting the displacement of the straightening baffle wheels 6.
The plurality of the parallel righting structures are arranged on the same central line, the sizes of the parallel righting structures are in accordance with the movement direction of the silicon wafer 3 shown by an arrow A, and a set of righting devices which are longitudinally arranged and gradually narrow in size from bottom to top are formed on the plurality of auxiliary transmission shafts 2; by means of this righting device, the silicon wafer 3 is adjusted by the size of the narrowing righting structure when the silicon wafer 3 moves from bottom to top as indicated by arrow a, the silicon wafer 3 not being in the middle of the righting device or being skewed.
Further, the locking nut 7, the correcting baffle wheels 6 are connected with the auxiliary transmission shaft 2 through threads, and are used for adjusting the distance between the baffle sheets 6-1 on each pair of correcting baffle wheels 6 according to the size of the silicon wafer, and the locking nut 7 locks the adjusted correcting baffle wheels 6 through threads; a positioning groove is arranged between the locking nut 7 and the auxiliary transmission shaft 2, and the locking nut is sealed by a side check ring 7-1 arranged in the positioning groove.
Further, a plurality of sets of correcting devices are arranged on the plurality of auxiliary transmission shafts 2 in parallel, so that the correcting adjustment of the silicon wafers 3 can be performed simultaneously, the efficiency is improved, a limiting groove 4 is arranged between the plurality of sets of correcting structures on each auxiliary transmission shaft 2, and a limiting check ring 5 is arranged in the limiting groove 4 and used for blocking and damping between the adjacent correcting structures during operation.
The invention provides a silicon wafer feeding and discharging normalization method, which comprises the following steps:
s1: putting the silicon wafer 3 into the righting device:
s2: the main transmission shaft is driven by a motor to rotate so as to drive the main transmission gear 1 and the auxiliary transmission gear to move in a meshing way, thereby indirectly driving the auxiliary transmission shaft 2 to rotate, and enabling the correcting catch wheel 6 on the auxiliary transmission shaft 2 to drive the silicon wafer 3 to move forwards in a straight line according to the movement direction shown by an arrow A;
if the silicon chip 3 is not in the middle of the righting device or is askew, the edge of the silicon chip 3 which is driven forward can be timely adjusted to the askew state when touching the righting baffle wheel 6 on the righting structure which is gradually narrowed.
According to the invention, a plurality of groups of correcting structures are respectively arranged on a plurality of auxiliary transmission shafts, the correcting structures are a set of correcting device formed by combining the transmission shafts by the narrowing of the width and the plurality of auxiliary transmission shafts, and the silicon wafer placed on the correcting structures is driven to move forwards in a straight line through the rotation of the auxiliary transmission shafts, so that if the silicon wafer is not in the middle of the correcting region or is inclined, the inclined state can be timely adjusted when the silicon wafer touches the narrower correcting region correcting baffle wheels. If larger silicon wafer is needed to be switched, the locking nut is only required to be loosened, and then the return catch wheel is screwed to the required position, so that the whole auxiliary transmission shaft is not required to be replaced.
Claims (3)
1. The utility model provides a silicon chip advances and discharges and returns to normal structure, includes the bottom plate, be equipped with the main drive shaft on the bottom plate, the main drive shaft passes through the bearing support seat to be fixed on the bottom plate, install a plurality of main drive gears (1) on the main drive shaft, main drive gears (1) are respectively with the fixed a plurality of auxiliary drive gears on the bottom plate of one side of main drive shaft meshing, a plurality of auxiliary drive shafts (2) are connected respectively to a plurality of auxiliary drive gears, a plurality of auxiliary drive shafts (2) are arranged side by side, characterized in that, a plurality of auxiliary drive shafts (2) that are parallel are equipped with respectively and are used for returning to normal structure of silicon chip (3), a plurality of returning to normal structures that are arranged side by side are on same central line, a set of vertical alignment is formed on a plurality of auxiliary drive shafts (2) and return to normal device that the size of returning to normal structure is narrowing gradually along silicon chip (3) direction of motion; when the silicon wafer (3) moves under the drive of the auxiliary transmission shaft (2), the silicon wafer (3) which is not in the middle of the righting device or is askew is adjusted through the size of the righting structure which is gradually narrowed; a plurality of sets of righting devices are arranged on the plurality of auxiliary transmission shafts (2) in parallel, so that the righting adjustment of the silicon wafers (3) can be simultaneously carried out, and the efficiency is improved; the silicon wafer (3) is used for being placed between the pair of the rectifying baffle wheels (6), and the edge of the silicon wafer (3) is limited by the baffle (6-1); the other end of the return catch wheel (6) is provided with a locking nut (7) for locking the return catch wheel (6) and used for limiting the displacement of the return catch wheel (6); a limiting groove (4) is arranged between the plurality of groups of rectifying structures on each auxiliary transmission shaft (2); a limiting check ring (5) is arranged in the limiting groove (4) and used for blocking and damping between adjacent return structures during operation; the locking nut (7), the return catch wheel (6) and the auxiliary transmission shaft (2) are connected through threads, the distance between the catch pieces (6-1) on each pair of return catch wheels (6) is adjusted according to the size of a silicon wafer, and the locking nut (7) locks the adjusted return catch wheels (6) through threads.
2. The silicon wafer feeding and discharging resetting structure according to claim 1, wherein a positioning groove is arranged between the locking nut (7) and the auxiliary transmission shaft (2), and the silicon wafer feeding and discharging resetting structure is sealed through a side check ring (7-1) arranged in the positioning groove.
3. A method for aligning a silicon wafer feeding and discharging aligning structure according to any one of claims 1-2, comprising the following steps: s1: putting a silicon wafer (3) into the righting device: s2: the main transmission shaft is driven by a motor to rotate so as to drive the main transmission gear (1) to move in a meshed manner with the auxiliary transmission gear, thereby indirectly driving the auxiliary transmission shaft (2) to rotate, and enabling the righting catch wheel (6) on the auxiliary transmission shaft (2) to drive the silicon wafer (3) to do linear motion along the direction vertical to the axis of the auxiliary transmission shaft (2); if the silicon chip (3) is not in the middle of the correcting device or is askew, the edge of the silicon chip (3) which is driven forward can be timely adjusted to the askew state when touching the correcting baffle wheel (6) on the gradually narrowing correcting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910032804.2A CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910032804.2A CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109637964A CN109637964A (en) | 2019-04-16 |
| CN109637964B true CN109637964B (en) | 2023-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910032804.2A Active CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
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| Country | Link |
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| CN (1) | CN109637964B (en) |
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| CN206327966U (en) * | 2016-11-23 | 2017-07-14 | 江苏华安橡胶科技有限公司 | A kind of wheel shoulder wedge feed mechanism acted on reversing resistance |
| CN107275265A (en) * | 2017-07-06 | 2017-10-20 | 深圳市华星光电技术有限公司 | Etching machines |
| CN209641641U (en) * | 2019-01-14 | 2019-11-15 | 上海釜川自动化设备有限公司 | A kind of silicon wafer input and output material is reformed structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206391A (en) * | 2016-08-23 | 2016-12-07 | 王文庆 | A kind of guider for surface-mounted integrated circuit detection line |
| CN207403325U (en) * | 2017-10-19 | 2018-05-25 | 苏州矽美仕绿色新能源有限公司 | Applied to the device of reforming at laminating machine charging |
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2019
- 2019-01-14 CN CN201910032804.2A patent/CN109637964B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101104442A (en) * | 2007-07-26 | 2008-01-16 | 徐寿海 | Automatic disc filling method for liquid soft packing bag |
| KR20120023246A (en) * | 2010-09-01 | 2012-03-13 | 엘지디스플레이 주식회사 | Substrate supporting apparatus |
| CN102769065A (en) * | 2011-05-06 | 2012-11-07 | 宇通光能股份有限公司 | Guider and substrate conveying device thereof |
| CN103381965A (en) * | 2013-07-02 | 2013-11-06 | 深圳市华星光电技术有限公司 | Air floating type guide wheel transmission device for liquid crystal panel |
| CN203895480U (en) * | 2014-04-18 | 2014-10-22 | 浙江龙柏光伏科技有限公司 | Conveyor belt for use in velvet producing machine for polycrystalline solar cell silicon chip |
| CN204847206U (en) * | 2015-07-21 | 2015-12-09 | 无锡市阳通机械设备有限公司 | Fender wheel mechanism on gyro wheel frame |
| CN206327966U (en) * | 2016-11-23 | 2017-07-14 | 江苏华安橡胶科技有限公司 | A kind of wheel shoulder wedge feed mechanism acted on reversing resistance |
| CN107275265A (en) * | 2017-07-06 | 2017-10-20 | 深圳市华星光电技术有限公司 | Etching machines |
| CN209641641U (en) * | 2019-01-14 | 2019-11-15 | 上海釜川自动化设备有限公司 | A kind of silicon wafer input and output material is reformed structure |
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| CN109637964A (en) | 2019-04-16 |
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