CN215390867U - Silicon wafer guide device and silicon wafer detection and sorting equipment - Google Patents
Silicon wafer guide device and silicon wafer detection and sorting equipment Download PDFInfo
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- CN215390867U CN215390867U CN202121006990.1U CN202121006990U CN215390867U CN 215390867 U CN215390867 U CN 215390867U CN 202121006990 U CN202121006990 U CN 202121006990U CN 215390867 U CN215390867 U CN 215390867U
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Abstract
The utility model provides a silicon wafer guide device and silicon wafer detection and sorting equipment, wherein the silicon wafer guide device comprises: the device comprises a first guide mechanism, a second guide mechanism and a driving mechanism; first, the second is led and is just constructed the symmetry and set up, and arbitrary leading is just constructed and is included: the guide wheels of the first guide mechanism and the second guide mechanism form a guide space; the drive mechanism includes: the base of the first guide mechanism is connected with the sliding block on the first thread, and the base of the second guide mechanism is connected with the sliding block on the second thread and can move in the opposite direction or in the opposite direction. The silicon wafer correcting device is used for correcting the conveyed silicon wafer through the correcting mechanism, and is beneficial to correcting the position of the silicon wafer. Meanwhile, the silicon wafers conveyed by the silicon wafer conveying device can be prevented from being crushed, and fragments generated in the detection and sorting process are reduced.
Description
Technical Field
The utility model relates to the technical field of silicon wafer detection and sorting, in particular to a silicon wafer guide device and silicon wafer detection and sorting equipment.
Background
Silicon wafers are widely used as important industrial raw materials for the production and manufacture of products such as solar cells and circuit boards. Therefore, before the silicon wafer is produced and shipped, the quality of the silicon wafer needs to be strictly controlled so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer.
At present, in the process of detecting and sorting silicon wafers, the silicon wafers need to be conveyed to required stations through flow lines. Therefore, the position of the silicon wafer conveyed to the required station needs to be corrected, and a further solution is needed to solve the problem of silicon wafer alignment.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a silicon wafer guide device and silicon wafer detection and separation equipment to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a silicon wafer straightening device, comprising: the device comprises a first guide mechanism, a second guide mechanism and a driving mechanism;
first, second are led and are just constructed the symmetry and set up, and arbitrary leading is just constructed and is included: the guide wheels of the first guide mechanism and the second guide mechanism are arranged on the base side by side along the conveying direction, and a guide space is formed between the guide wheels of the first guide mechanism and the second guide mechanism;
the drive mechanism includes: the rotary driving unit is in transmission connection with the bidirectional screw, the bidirectional screw is provided with a first thread and a second thread which are arranged at intervals and symmetrically, the sliding blocks are assembled on the first thread and the second thread respectively, the base of the first guide mechanism is connected with the sliding block on the first thread, and the base of the second guide mechanism is connected with the sliding block on the second thread and moves oppositely or back to back through the sliding blocks.
As an improvement of the silicon wafer guiding device, any guiding mechanism further comprises: the guide plates are arranged at the downstream positions of the guide wheels of the guide mechanism, the guide plates of the first guide mechanism and the second guide mechanism are symmetrically arranged, and the distance between the guide plates of the first guide mechanism and the second guide mechanism is gradually increased along the conveying direction.
As an improvement of the silicon wafer guiding device of the present invention, when the first and second guiding mechanisms move to the extreme positions in opposite directions, the distance between the guide wheels of the first and second guiding mechanisms is slightly larger than the width of the silicon wafer.
As an improvement of the silicon wafer straightening device, the rotary driving unit is a motor.
As an improvement of the silicon wafer guide device, two ends of the bidirectional screw are respectively pivotally supported through bearings.
As an improvement of the silicon wafer straightening device, the silicon wafer straightening device further comprises a substrate and a slide rail, wherein the first and second straightening mechanisms are supported by the substrate and slide along the slide rail arranged on one side of the substrate in an opposite direction or in an opposite direction.
As an improvement of the silicon wafer guiding device, the bases of the first and second guiding mechanisms are provided with slots suitable for the substrate to penetrate through.
As an improvement of the silicon wafer guiding device of the present invention, the bases of the first and second guiding mechanisms comprise: the lower end of the vertical plate is connected with the bottom plate, the upper end of the vertical plate is connected with the top plate, the guide wheels are arranged on the top plate, the grooves are formed in the lower portion of the vertical plate, and the bottom plate is located below the base plate, connected with the corresponding sliding blocks and capable of sliding along the sliding rails.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a silicon wafer detecting and sorting device comprises the silicon wafer guiding device.
Compared with the prior art, the utility model has the beneficial effects that: according to the silicon wafer correcting device, the conveyed silicon wafer is corrected through the first correcting mechanism and the second correcting mechanism, so that the position of the silicon wafer is corrected, and further, the detection of a subsequent station is facilitated. Meanwhile, the first guide mechanism and the second guide mechanism move oppositely from the initial position when guiding, so that the silicon wafers conveyed by the guide mechanism can be prevented from being crushed, and the reduction of fragments generated in the detection and sorting process is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of a silicon wafer correcting device according to an embodiment of the present invention;
fig. 2 is a perspective view of another angle of the silicon wafer aligning device in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, a silicon wafer correcting apparatus according to an embodiment of the present invention includes: the device comprises a substrate 10, a slide rail 20, a first guide mechanism 30, a second guide mechanism 40 and a driving mechanism 50.
The first guiding mechanism 30 and the second guiding mechanism 40 are located on the substrate 10 and can be driven by the driving mechanism 50 to move along the slide rail 20 in an opposite direction or in an opposite direction. Therefore, the distance between the first guiding mechanism 30 and the second guiding mechanism 40 is not fixed, and when guiding the incoming silicon wafer, the first guiding mechanism 30 and the second guiding mechanism 40 move towards each other to guide the incoming silicon wafer. Therefore, the silicon wafer between the two guide mechanisms cannot be crushed by reasonably setting the movement strokes of the two guide mechanisms.
Specifically, the first and second guiding mechanisms 30 and 40 are symmetrically arranged, and a guiding space is formed between the guide wheels of the first and second guiding mechanisms 30 and 40. Any just mechanism of leading includes: a base 31 and a plurality of guide wheels 32 arranged on the base 31.
The guide wheels 32 are arranged on the base 31 side by side along the conveying direction, so that the silicon wafer is not hindered from moving in a guiding mode through the arrangement wheels. In one embodiment, each guide wheel 32 is pivotally connected to a top position of base 31 by a respective axle. The base 31 of the first and second pilot mechanisms 30, 40 includes: riser 311, bottom plate 312, and top plate 313. At this time, the lower end of the vertical plate 311 is connected to the bottom plate 312, the upper end thereof is connected to the top plate 313, and the plurality of guide wheels 32 are disposed on the top plate 313.
In order to facilitate the sending out of the silicon wafer after the guide, any guide mechanism further comprises: and a guide plate 33. The guide plates 33 are installed at the downstream positions of the guide wheels 32 of the guide mechanism, the guide plates 33 of the first guide mechanism 30 and the second guide mechanism 40 are symmetrically arranged, and the distance between the guide plates 33 of the first guide mechanism 30 and the second guide mechanism 40 is gradually increased along the conveying direction. Thus, the silicon wafer guided by the guide rollers 32 can be fed out from between the first and second guide mechanisms 30 and 40 along the guide plate 33.
In order to avoid the first and second guiding mechanisms 30, 40 from damaging the guided silicon wafer, when the first and second guiding mechanisms 30, 40 move to the extreme positions, the distance between the guide wheels 32 of the first and second guiding mechanisms 30, 40 is slightly larger than the width of the silicon wafer. Therefore, when the silicon wafer is guided to the required position by the first guide mechanism 30 and the second guide mechanism 40, the silicon wafer can be prevented from being clamped, and further, the reduction of fragments generated in the detection and sorting process is facilitated.
The driving mechanism 50 is used for driving the first guiding mechanism 30 and the second guiding mechanism 40 to move in opposite directions or back to back, and the driving mechanism 50 includes: a rotary drive unit 51, a bidirectional screw 52, and a slider 53.
The rotation driving unit 51 is in transmission connection with one end of the bidirectional screw 52, and further drives the bidirectional screw to pivot. In one embodiment, the rotary driving unit 51 is a motor, and the output end of the motor can be connected to the end of the bidirectional screw 52 through a coupling. In the mounting manner, since the bidirectional screw 52 is transversely disposed, both ends of the bidirectional screw 52 are pivotally supported by bearings, respectively.
Further, the bidirectional screw 52 has a first thread and a second thread which are spaced and symmetrically arranged, and the slider 53 is respectively assembled on the first thread and the second thread. Thus, when the rotation driving unit 51 drives the bidirectional screw 52 to pivot, since the first and second threads are symmetrically arranged, the sliding blocks 53 on the first and second threads can move towards each other or away from each other in a certain pivoting direction.
Correspondingly, the base 31 of the first guiding mechanism 30 is connected with the slide block 53 on the first thread, and the base 31 of the second guiding mechanism 40 is connected with the slide block 53 on the second thread. Therefore, the first and second guiding mechanisms 30 and 40 can move in opposite directions or back to back under the driving of the slider 53, so as to guide the incoming silicon wafer and reset the incoming silicon wafer after the guiding.
The base plate 10 is used for supporting the first and second guiding mechanisms 30 and 40, and the sliding rail 20 provides a guiding function for the movement of the two. Specifically, the first and second guiding mechanisms 30 and 40 are supported by the substrate 10, and at this time, a groove suitable for the substrate 10 to penetrate through is formed on the base 31 of the first and second guiding mechanisms 30 and 40, and the groove is disposed at a lower position of the vertical plate 311 of the base 31. At this time, the bottom plate 312 connected to the lower end of the vertical plate 311 is located below the substrate 10 and connected to the corresponding slider 53. The slide rail 20 is disposed on one side of the substrate 10, and the bottom plate 312 can slide along the slide rail 20 disposed on one side of the substrate 10 in an opposite direction or in an opposite direction, so as to ensure the stability of the movement of the first and second guiding mechanisms 30 and 40.
Another embodiment of the present invention further provides a silicon wafer detecting and sorting apparatus, which includes the silicon wafer guiding device as described in the above embodiments.
In summary, the conveyed silicon wafer is guided by the first guide mechanism and the second guide mechanism, so that the position of the silicon wafer is corrected, and the detection of subsequent stations is facilitated. Meanwhile, the first guide mechanism and the second guide mechanism move oppositely from the initial position when guiding, so that the silicon wafers conveyed by the guide mechanism can be prevented from being crushed, and the reduction of fragments generated in the detection and sorting process is facilitated.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A silicon wafer straightening device is characterized by comprising: the device comprises a first guide mechanism, a second guide mechanism and a driving mechanism;
first, second are led and are just constructed the symmetry and set up, and arbitrary leading is just constructed and is included: the guide wheels of the first guide mechanism and the second guide mechanism are arranged on the base side by side along the conveying direction, and a guide space is formed between the guide wheels of the first guide mechanism and the second guide mechanism;
the drive mechanism includes: the rotary driving unit is in transmission connection with the bidirectional screw, the bidirectional screw is provided with a first thread and a second thread which are arranged at intervals and symmetrically, the sliding blocks are assembled on the first thread and the second thread respectively, the base of the first guide mechanism is connected with the sliding block on the first thread, and the base of the second guide mechanism is connected with the sliding block on the second thread and moves oppositely or back to back through the sliding blocks.
2. The silicon wafer correcting device of claim 1, wherein any one of the correcting mechanisms further comprises: the guide plates are arranged at the downstream positions of the guide wheels of the guide mechanism, the guide plates of the first guide mechanism and the second guide mechanism are symmetrically arranged, and the distance between the guide plates of the first guide mechanism and the second guide mechanism is gradually increased along the conveying direction.
3. The silicon wafer straightening device according to claim 1, wherein when the first and second straightening mechanisms move towards each other to the extreme positions, the distance between the guide wheels of the first and second straightening mechanisms is slightly larger than the width of the silicon wafer.
4. The silicon wafer straightening device according to claim 1, wherein the rotary drive unit is a motor.
5. The silicon wafer straightening device according to claim 1, wherein both ends of the bidirectional screw are pivotally supported by bearings, respectively.
6. The silicon wafer straightening device according to claim 1, further comprising a base plate and a slide rail, wherein the first and second straightening mechanisms are supported by the base plate and slide along the slide rail arranged on one side of the base plate in a direction toward or away from each other.
7. The silicon wafer straightening device according to claim 6, wherein the bases of the first and second straightening mechanisms are provided with slots suitable for the substrate to penetrate through.
8. The silicon wafer straightening device according to claim 7, wherein the bases of the first and second straightening mechanisms comprise: the lower end of the vertical plate is connected with the bottom plate, the upper end of the vertical plate is connected with the top plate, the guide wheels are arranged on the top plate, the grooves are formed in the lower portion of the vertical plate, and the bottom plate is located below the base plate, connected with the corresponding sliding blocks and capable of sliding along the sliding rails.
9. A silicon wafer detecting and sorting device, characterized in that the silicon wafer detecting and sorting device comprises the silicon wafer guiding device as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121006990.1U CN215390867U (en) | 2021-05-12 | 2021-05-12 | Silicon wafer guide device and silicon wafer detection and sorting equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121006990.1U CN215390867U (en) | 2021-05-12 | 2021-05-12 | Silicon wafer guide device and silicon wafer detection and sorting equipment |
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| CN215390867U true CN215390867U (en) | 2022-01-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423071A (en) * | 2023-06-13 | 2023-07-14 | 深圳光远智能装备股份有限公司 | Ultrathin silicon wafer cutting device with automatic alignment compensation function |
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2021
- 2021-05-12 CN CN202121006990.1U patent/CN215390867U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116423071A (en) * | 2023-06-13 | 2023-07-14 | 深圳光远智能装备股份有限公司 | Ultrathin silicon wafer cutting device with automatic alignment compensation function |
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