CN109461748B - Packaging structure and packaging method of optical element - Google Patents
Packaging structure and packaging method of optical element Download PDFInfo
- Publication number
- CN109461748B CN109461748B CN201811308893.0A CN201811308893A CN109461748B CN 109461748 B CN109461748 B CN 109461748B CN 201811308893 A CN201811308893 A CN 201811308893A CN 109461748 B CN109461748 B CN 109461748B
- Authority
- CN
- China
- Prior art keywords
- optical filter
- layer
- photosensitive
- buffer layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 200
- 238000000034 method Methods 0.000 title claims abstract description 79
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 239000004033 plastic Substances 0.000 claims abstract description 65
- 229920003023 plastic Polymers 0.000 claims abstract description 65
- 238000000465 moulding Methods 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 10
- 229920006335 epoxy glue Polymers 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 13
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention provides a packaging structure and a packaging method of an optical element.A light sensitive chip carrying a light filter is connected to a substrate, a buffer layer is arranged in a non-light sensitive area of the light sensitive chip to at least cover partial area of the side wall of the light filter, and then a plastic packaging layer is arranged on the substrate to at least wrap the partial area of the non-light sensitive area of the light sensitive chip and the partial area of the buffer layer. According to the invention, the buffer layer is arranged at the position where the plastic packaging layer is contacted with the optical filter, so that the phenomenon that the optical filter is broken due to the fact that stress generated in the plastic packaging process is transmitted to the optical filter is reduced or avoided, and the reliability of the product is further improved. Furthermore, compared with the prior art, the method for packaging the optical element provided by the invention does not need to change a plastic package mold, and the specific plastic package process is compatible with the prior art and is easy to realize.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a package structure and a package method for an optical device.
Background
Along with the progress of the scientific and technical level, the size of the lens module is smaller and smaller, the lens module is widely applied to various mobile terminals such as mobile phones, notebook computers, tablet computers and wearable intelligent equipment, and a user can conveniently shoot static or dynamic pictures without additionally purchasing a camera or a camera device.
Currently, a lens module generally includes a light sensing chip (e.g., an image sensor chip), a circuit board (e.g., a flexible rigid printed circuit (RFPC)), a bracket, a filter, and a lens assembly having a lens. At present, manufacturers of high-end mobile phone lens modules generally adopt a Chip On Board (COB) packaging process to package module lenses. As shown in fig. 1, the photo sensor chip 13 is mounted on the hard board portion 12 of the soft and hard combined board by Die Bond (Die Bond) and Wire Bond (Wire Bond) processes, the bracket 15 is mounted on the hard board portion 12 of the soft and hard combined board and covers over the photo sensor chip 13, the lens assembly 16 (including the lens 17) is mounted on the bracket 15, and the optical filter 14 is located between the lens assembly 16 and the photo sensor chip 13 and mounted in the middle of the bracket 15. However, the lens module with such a structure has a large size, and is not suitable for the development trend of light, thin and small electronic products (such as mobile phones, tablet computers, and the like) at present, and the reliability of the product is yet to be further enhanced.
In order to solve the above problems, attempts have been made to directly assemble the photosensitive chip and the optical filter by a Molding (Molding) process, but the optical filter is easily broken by stress generated in the Molding process, which results in a decrease in product reliability. Therefore, the chinese patent CN107071252A discloses a miniaturized camera device, which replaces the traditional bracket with a plastic package layer, and reserves a sinking groove on the plastic package layer, and directly mounts the optical filter into the sinking groove, so as to reduce the size of the camera module, and cast all the passive components and gold wires around the photosensitive chip in the plastic package layer, thereby enhancing the reliability of the product. However, in the plastic packaging (Molding) process, the packaging method puts higher requirements on the manufacturing of the plastic packaging mold and the plastic packaging process due to the existence of the steps (sinking grooves), and the cost is relatively high.
Disclosure of Invention
In order to solve the technical problems, the invention provides a packaging structure and a packaging method of an optical element, which can reduce or avoid the phenomenon of optical filter breakage caused by stress generated in the plastic packaging process.
The invention provides a packaging structure of an optical element, comprising:
a substrate;
the photosensitive chip is provided with a photosensitive area and a non-photosensitive area, is arranged on the substrate and is electrically connected with the substrate;
the optical filter is arranged on the photosensitive area of the photosensitive chip;
the buffer layer is arranged in a non-photosensitive area of the photosensitive chip and at least covers partial area of the side wall of the optical filter; and
the plastic package layer is arranged on one surface of the substrate, which is provided with the photosensitive chip, and at least wraps the partial region of the non-photosensitive area of the photosensitive chip and the partial region of the buffer layer.
Optionally, the buffer layer covers at least a partial region of the upper surface of the optical filter
Optionally, the package structure of the optical element further includes:
the lens component is arranged on one side, deviating from the substrate, of the plastic packaging layer and is correspondingly arranged above the optical filter.
Optionally, a dry film layer is disposed between the optical filter and the photosensitive chip.
Optionally, the thickness of the dry film layer is less than 50 μm.
Optionally, the dry film layer is annular, and the dry film layer is located in a non-photosensitive area of the functional surface of the photosensitive chip.
Optionally, the buffer layer covers the entire side wall of the optical filter and also covers the outer wall of the dry film layer.
Optionally, the width of the portion of the buffer layer on the side wall of the filter is less than 50 μm.
Optionally, the thickness of the portion of the buffer layer on the upper surface of the optical filter is less than 10 μm.
Optionally, the upper surface of the plastic package layer is not lower than the upper surface of the buffer layer, and the width of the portion, located on the upper surface of the optical filter, of the buffer layer is greater than or equal to the width of the portion, located on the upper surface of the optical filter, of the plastic package layer.
Optionally, the width of the portion of the buffer layer on the upper surface of the optical filter is greater than 30 μm.
Optionally, the material used for the buffer layer includes, but is not limited to, epoxy glue.
Optionally, the tensile modulus of the buffer layer is less than 30MPa, and the shore a hardness is less than 50.
Optionally, the filter is a blue glass filter.
Optionally, the filter is an infrared cut filter.
Optionally, the substrate is further provided with a passive element, the passive element is located on one side of the photosensitive chip, the photosensitive chip is electrically connected with the substrate through a wire, and the passive element and the wire are plastically packaged in the plastic packaging layer.
Further, a method for encapsulating an optical element, comprising:
providing a photosensitive chip, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area, and an optical filter is arranged on the photosensitive area of the photosensitive chip;
forming a buffer layer on the photosensitive chip and arranging the photosensitive chip on a substrate, wherein the buffer layer at least covers partial area of the side wall of the optical filter, and the photosensitive chip is electrically connected with the substrate; and
and injection molding a molding layer on the substrate, wherein the molding layer at least wraps partial areas of the non-photosensitive area of the photosensitive chip and partial areas of the buffer layer.
Optionally, the buffer layer covers at least a partial region of the upper surface of the optical filter.
Optionally, the photosensitive chip is disposed on the substrate, and then a buffer layer is formed on the photosensitive chip.
Optionally, a buffer layer is formed on the photosensitive chip, and then the photosensitive chip is disposed on the substrate.
Optionally, the method for packaging an optical element further includes: and assembling a lens assembly on one side of the plastic packaging layer, which is far away from the substrate, wherein the lens assembly is correspondingly arranged above the optical filter.
Optionally, a dry film layer is formed between the optical filter and the photosensitive chip;
optionally, the thickness of the dry film layer is less than 50 μm.
Optionally, the dry film layer is annular and is located in the non-photosensitive region of the photosensitive chip.
Optionally, the buffer layer covers the entire side wall of the optical filter and also covers the outer wall of the dry film layer.
Optionally, the buffer layer is formed by a dispensing process.
Optionally, the substrate is further provided with a passive element, the passive element is located on one side of the photosensitive chip, the photosensitive chip is electrically connected with the substrate through a lead, and the passive element and the lead are plastically packaged in the plastic packaging layer.
Optionally, the upper surface of the plastic package layer is not lower than the upper surface of the buffer layer, and the width of the portion, located on the upper surface of the optical filter, of the buffer layer is greater than or equal to the width of the portion, located on the upper surface of the optical filter, of the plastic package layer.
Optionally, the plastic package layer is made of epoxy resin.
Optionally, the substrate is a flexible printed circuit, a rigid printed circuit, or a flexible-rigid printed circuit.
In summary, the present invention provides a package structure of an optical device, in which a photosensitive chip carrying an optical filter is connected to a substrate, a buffer layer is disposed in a non-photosensitive region of the photosensitive chip to at least cover a partial region of a sidewall of the optical filter, and a molding layer is disposed on the substrate to at least cover the partial region of the non-photosensitive region of the photosensitive chip and a partial region of the buffer layer. According to the invention, the buffer layer is arranged at the position where the plastic packaging layer is contacted with the optical filter, so that the phenomenon that the optical filter is broken due to the fact that stress generated in the plastic packaging process is transmitted to the optical filter is reduced or avoided, and the reliability of the product is further improved. Furthermore, compared with the prior art, the method for packaging the optical element provided by the invention does not need to change a plastic package mold, and the specific plastic package process is compatible with the prior art and is easy to realize.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of an optical device package structure formed by a conventional COB packaging process;
fig. 2 is a schematic flowchart of a packaging method of an optical element according to a second embodiment of the present invention;
fig. 3A to fig. 3H are schematic structural diagrams illustrating corresponding steps of a packaging method for an optical element according to a second embodiment of the present invention;
fig. 4 is an enlarged view of a position of a buffer layer in an encapsulation structure of an optical element according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a plastic mold in the optical element packaging method according to the third embodiment of the present invention;
fig. 6 is a flowchart illustrating a packaging method of an optical device according to a fourth embodiment of the present invention;
fig. 7A to 7G are schematic structural diagrams of corresponding steps of a packaging method of an optical element according to a fourth embodiment of the present invention.
Description of reference numerals:
11-rigid-flex board; 12-a hard plate portion of the rigid-flex board; 13-a photosensitive chip; 14-an optical filter; 15-a scaffold; 16-a lens assembly; 17-a lens;
100-a substrate; 101-a photosensitive chip; 101 a-photosensitive area; 101 b-non-photosensitive region 101 b; 102-an optical filter; 103-dry film layer; 104-passive components; 105-a wire; 106-a buffer layer; 107-plastic packaging layer; 108-a lens assembly; 200-plastic packaging mold; h1-thickness of dry film layer; h2-thickness of buffer layer on top surface of optical filter; h3-height of the convex part of the plastic package mold; d1-width of buffer layer on the photosensitive chip; d2-thickness of buffer layer at edge of upper surface of optical filter; d3-width of the protruding part of the plastic mold.
Detailed Description
The optical element package structure and the optical element packaging method according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and drawings, it being understood, however, that the concepts of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. The drawings are in simplified form and are not to scale, but are provided for convenience and clarity in describing embodiments of the invention.
The terms "first," "second," and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other sequences than described or illustrated herein. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method. Although elements in one drawing may be readily identified as such in other drawings, the present disclosure does not identify each element as being identical to each other in every drawing for clarity of description.
Example one
Fig. 3G is a schematic structural diagram of a package structure of an optical element provided in this embodiment, and as shown in fig. 3E, the package structure of an optical element provided in this embodiment includes: the light-sensitive chip comprises a light-sensitive chip 101, a filter 102, a buffer layer 106, a substrate 100 and a plastic package layer 107. Further, the package structure of the optical element further includes a lens assembly 108, and specifically, the present embodiment takes the optical element of a lens module as an example to discuss the technical solution of the present invention in detail.
The functional surface of the photosensitive chip 101 has a photosensitive area 101a and a non-photosensitive area 101b, the non-photosensitive area 101b is generally disposed around the photosensitive area 101a, and a bonding pad (not shown) is disposed on the non-photosensitive area 101b of the photosensitive chip 101. The photosensitive chip 101 is a sensor capable of sensing optical image information and converting an output electrical signal, and is also called an image sensor chip, which is an important component of a digital camera, and can be generally classified into a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal-Oxide Semiconductor) image sensor. In the embodiment, a CMOS image sensor Chip (CIS Chip) is preferable, and compared with a CCD image sensor, the CMOS image sensor has many advantages such as low cost, low power consumption, and high integration.
The optical filter 102 is disposed on the photosensitive area 101a of the photosensitive chip 101, for example, the size of the optical filter 102 is larger than the size of the photosensitive area 101a of the photosensitive chip 101, and meanwhile, the optical filter does not cover the pad on the non-photosensitive area 101b of the photosensitive chip 101, and the light-passing hole of the optical filter 102 corresponds to the photosensitive area 101a of the photosensitive chip 101. In order to avoid the influence of high temperature during the injection molding process on the optical filter, the optical filter 102 in this embodiment is preferably a high temperature resistant blue glass optical filter, and further, the optical filter 102 is preferably an infrared cut-off optical filter (IR optical filter), which has high transmittance for visible light and low transmittance for infrared light, and can filter out infrared light that cannot be detected by human eyes, and adjust the reaction to color within the visible light range, so that the color presented by the image achieves the best visual effect, and is beneficial to improving the image quality.
A dry film layer 103 is disposed between the optical filter 102 and the photosensitive chip 101, and the dry film layer 103 is disposed on a lower surface of the optical filter 102 (i.e., a surface of the optical filter 102 close to the photosensitive chip 101) and is located on the non-photosensitive area 101b of the photosensitive chip 101. The dry film layer 103 is, for example, an annular dry film layer, and is disposed around the photosensitive region 101 a. The shape of the dry film layer 103 is matched with the shape of the light-sensing region 101a, for example, the shape of the light-sensing region 101a is circular, the shape of the dry film layer 103 is correspondingly circular, the shape of the light-sensing region 101a is square, and the shape of the dry film layer 103 is correspondingly square and annular. As shown in fig. 4, the thickness H1 of the dry film layer 103 is, for example, less than 50 μm, preferably 30 μm, 35 μm, 40 μm, or 45 μm. In this embodiment, the optical filter 102 is directly attached to the photosensitive chip 101 through the dry film layer 103, and the dry film layer 103 can prevent a plastic package material from entering the photosensitive area 101a of the photosensitive chip 101 in a subsequent plastic package process, so as to avoid contamination of the photosensitive area 101a, and prevent the photosensitive area 101a of the photosensitive chip 101 from being damaged by a mold in the plastic package process. The material of the dry film layer 103 is, for example, a photoresist film having adhesiveness used in semiconductor chip packaging or printed circuit board manufacturing. The manufacturing process of the dry film layer 103 includes, for example: and coating a photoresist on the photosensitive chip, and forming a pattern in the dry film through exposure and development.
The photosensitive chip 101 with the filter 102 attached thereon is disposed on the substrate 100, one side of the substrate 100 with the photosensitive chip 101 attached thereon has a passive component 104 and a metal circuit (not shown), the photosensitive chip 101 and the substrate 100 can be electrically connected through a wire 105, and the wire 105 is preferably a metal wire, and more preferably a gold wire. It should be understood that the electrical connection between the photosensitive chip 101 and the substrate 100 may be a wire connection, or may be a contact connection of an elastic contact (the photosensitive chip 101 is soldered to the substrate 100 through a bottom solder layer), which is intended to achieve the conduction of a circuit, and thus the form of the electrical connection and the connection position are not limited. In addition, in the present embodiment, the substrate 100 includes, but is not limited to, a flexible printed circuit, a rigid printed circuit, or other types of printed circuits. In another embodiment, besides the photosensitive chip 101 disposed on the surface of the substrate 100, other functional chips or devices, such as capacitors, resistors, driving chips, etc., may be attached to the surface of the substrate 100 and disposed at intervals. Those skilled in the art can modify the number and distribution of the photosensitive chips 101 without departing from the scope of the inventive concept of the present invention.
The buffer layer 106 is used to absorb stress generated when the plastic package layer 107 is formed, so as to reduce or avoid a phenomenon that the optical filter is broken due to the transmission of the stress generated in the plastic package process to the optical filter. The buffer layer 106 is disposed in the non-photosensitive region 101b of the photosensitive chip 101 and at least covers a partial region of the side wall of the optical filter 102, optionally, the buffer layer 106 covers the entire side wall of the optical filter 102 and also covers the outer wall of the dry film layer 103, the buffer layer 106 is annular, and the buffer layer 106 is attached to the side wall of the optical filter 102 (the two are in direct contact).
The buffer layer 106 is made of a material with a medium-high elastic modulus, the material used for the buffer layer 106 includes, but is not limited to, epoxy glue (epoxy glue), and the epoxy glue includes the following components in percentage by weight: 10% -25% of epoxy resin; 5% -15% of rubber; 30-60% of solvent. The epoxy resin is one or more of bisphenol A epoxy resin, novolac epoxy resin, dicyclopentenyl ether dioxide resin or amino four-functional group epoxy resin; the rubber is natural rubber or nitrile rubber; the solvent is one or more of ethyl acetate, 2-ethyl-4-methylimidazole, m-phenylenediamine, dicyandiamide thiourea hexamethylene diamine and diethylenetriamine, and ethyl acetate is preferred. The various components of the glue are mixed according to the weight percentage to form epoxy glue, then glue films are formed on the side walls (including the outer wall of the dry film layer 103) of the optical filter 102 in a glue dispensing mode, then the structure sprayed with the glue films is placed into a baking oven to be baked, and the buffer layer in the embodiment is formed after natural cooling. In a preferred embodiment, the tensile modulus of the buffer layer 106 is less than 30MPa, and the shore a hardness is less than 50, so as to buffer stress.
The molding compound layer 107 is disposed on a surface of the substrate 100 where the photosensitive chip 101 is disposed, and the non-photosensitive region 101b and the buffer layer 106 of the photosensitive chip 101 are wrapped from the periphery to the top. Further, the molding compound layer 107 also wraps the passive component 104 and the metal circuit on the substrate 100, and also wraps the conductive wire 105 connecting the photosensitive chip 101 and the substrate 100 and the bonding pad on the non-photosensitive area 101 b. Wherein, the upper surface of the molding layer 107 is not lower than the upper surface of the buffer layer 106. The molding layer 107 may be made of any resin material capable of hot melting, and may include, for example, thermoplastic resins such as Polycarbonate (PC), polyethylene terephthalate (PET), polyether sulfone, polyphenylene ether, polyamide, polyether imide, methacrylic resin, or cyclic polyolefin resin. In the embodiment of the present invention, the molding layer 107 is made of epoxy resin. Specifically, the molding layer 107 can be formed by an injection molding process, which has good filling performance, so that the injection molding agent can be well filled in the substrate 100, thereby having a good packaging effect. Compared with the traditional packaging mode of combining the bracket and the substrate, the space between the bracket and the photosensitive chip is reduced by adopting the plastic packaging layer, and the overall size of the optical element (lens module) is reduced.
The lens assembly 108 is disposed on a side of the molding layer 107 away from the substrate 100, and is correspondingly disposed above the optical filter 102. The lens assembly 108 includes various lenses, for example.
In summary, the present invention provides a package structure of an optical device, in which a photosensitive chip carrying an optical filter is connected to a substrate, a buffer layer is disposed in a non-photosensitive region of the photosensitive chip to at least cover a partial region of a sidewall of the optical filter, and a molding layer is disposed on the substrate to at least cover the partial region of the non-photosensitive region of the photosensitive chip and a partial region of the buffer layer. According to the invention, the buffer layer is arranged at the position where the plastic packaging layer is contacted with the optical filter, so that the phenomenon that the optical filter is broken due to the fact that stress generated in the plastic packaging process is transmitted to the optical filter is reduced or avoided, and the reliability of the product is further improved. Furthermore, compared with the prior art, the method for packaging the optical element provided by the invention does not need to change a plastic package mold, and the specific plastic package process is compatible with the prior art and is easy to realize.
Example two
Fig. 3H is a schematic structural diagram of a package structure of an optical element according to the present embodiment, which is different from the package structure of an optical element according to the first embodiment of the present invention in that the buffer layer 106 is disposed in the non-photosensitive region 101 of the photosensitive chip 101, and covers not only the sidewall of the optical filter 102 but also a partial region (here, an edge region of the upper surface) of the optical filter.
As shown in fig. 3H, the package structure of the optical element provided in this embodiment includes: the light-sensitive chip comprises a light-sensitive chip 101, a filter 102, a buffer layer 106, a substrate 100 and a plastic package layer 107. The functional surface of the photosensitive chip 101 has a photosensitive area 101a and a non-photosensitive area 101b, the optical filter 102 is disposed on the photosensitive area 101a of the photosensitive chip 101 through a dry film layer 103, and the photosensitive chip 101 and the substrate 100 can be electrically connected through a wire 105.
The buffer layer 106 is disposed in the non-photosensitive region 101b of the photosensitive chip 101, covering a portion of the side wall and the upper surface of the optical filter 102, and further covering the outer wall of the dry film layer 103. The buffer layer 106 is used for absorbing stress generated when the plastic package layer 107 is formed, so that the phenomenon of optical filter breakage caused by transmission of the stress generated in the plastic package process to the optical filter is reduced or avoided.
The molding compound layer 107 is disposed on a surface of the substrate 100 where the photosensitive chip 101a is disposed, and the non-photosensitive region 101b and the buffer layer 106 of the photosensitive chip 101 are wrapped from the periphery to the top. Further, the molding compound layer 107 also wraps the passive component 104 and the metal circuit on the substrate 100, and also wraps the conductive wire 105 connecting the photosensitive chip 101 and the substrate 100 and the bonding pad on the non-photosensitive area 101 b. The upper surface of the molding layer 107 is not lower than the upper surface of the buffer layer 106, and the width of the portion of the buffer layer 108 on the upper surface of the optical filter 102 is greater than or equal to the width of the portion of the molding layer 107 on the upper surface of the optical filter 102.
Fig. 4 is an enlarged view of the position of the buffer layer 106 in the package structure of the optical element provided in this embodiment. As shown in fig. 4, the buffer layer 106 is annular, and a cross section (i.e., a longitudinal section) of the buffer layer 106 on one side of the optical filter 102, which is perpendicular to the surface of the substrate 100, is, for example, in an inverted L shape, in detail, a portion of the buffer layer 106 perpendicular to the surface of the substrate 100 is attached to a sidewall of the optical filter 102 (which is in direct contact with the sidewall), and a portion of the buffer layer 106 parallel to the surface of the substrate 100 is located at an edge of an upper surface of the optical filter 102 (which is also in direct contact with the sidewall).
The width D1 of the buffer layer 108 disposed on the non-photosensitive region 101b of the photosensitive chip 101 is, for example, less than 50 μm, preferably 30 μm, 35 μm, or 40 μm. The width D2 of the buffer layer 106 covering the edge of the upper surface of the optical filter 102 is greater than or equal to the width of the molding layer 107 after the edge of the upper surface of the optical filter 102 is cured. Generally, the width of the molding layer 107 after curing at the portion (edge portion) of the upper surface of the optical filter 102 is 20 μm to 30 μm, the width D2 of the portion (edge portion) of the buffer layer 106 at the upper surface of the optical filter 102 is greater than 30 μm, and the buffer layer 106 at the edge of the upper surface of the optical filter 102 does not affect the photosensitive area 101a of the photosensitive chip 101. In this embodiment, the buffer layer 106 covers the place where the plastic package layer 107 contacts the optical filter 102, so that the possibility of breaking the optical filter 102 due to the transmission of stress to the optical filter 102 in the plastic package process is reduced or avoided, the process yield is improved, and the reliability of the product is enhanced. In addition, the thickness H2 of the buffer layer 106 covering the edge of the upper surface of the optical filter 102 is controlled within 50 μm, preferably within 10 μm, so that the optical filter is beneficial to retaining the advantage of the optical element (lens module) on the Z axis while ensuring that the optical filter has certain buffering capacity for the stress generated in the plastic package process.
The lens assembly 108 is disposed on a side of the molding layer 107 away from the substrate 100, and is correspondingly disposed above the optical filter 102.
EXAMPLE III
The embodiment provides a packaging method of an optical element. Fig. 2 is a schematic flow chart of a packaging method of an optical element provided in this embodiment, and as shown in fig. 2, the packaging method of an optical element provided in this embodiment includes:
s01: providing a photosensitive chip, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area;
s02: arranging an optical filter on a light sensing area of the light sensing chip;
s03: arranging the photosensitive chip on a substrate, wherein the photosensitive chip is electrically connected with the substrate;
s04: forming a buffer layer on the photosensitive chip, wherein the buffer layer at least covers partial area of the side wall of the optical filter; and
s05: and injection molding a molding layer on the substrate, wherein the molding layer at least wraps partial areas of the non-photosensitive area of the photosensitive chip and partial areas of the buffer layer.
Fig. 3A to fig. 3H are schematic structural diagrams of corresponding steps of the packaging method of the optical element provided in this embodiment. The method for packaging an optical element provided in the present embodiment is further described in detail below with reference to fig. 2 and fig. 3A to 3H, and specifically, the present embodiment takes the optical element as an example for discussion.
Step S01 is executed to provide the photosensitive chip 101, where the functional surface of the photosensitive chip 101 includes a photosensitive area 101a and a non-photosensitive area 101b, and a pad is disposed on the non-photosensitive area 101b of the photosensitive chip 101.
Fig. 3A is a schematic structural diagram of the optical filter 102 packaged in the photo chip 101 in the optical element packaging method according to the embodiment of the invention. With reference to fig. 3A, step S02 is executed to form a dry film layer 103 on the non-photosensitive area 101b of the functional surface of the photosensitive chip 101, attach the optical filter 102 to the photosensitive area 101a of the photosensitive chip 101 through the dry film layer 103, and a light-passing hole of the optical filter 102 corresponds to the photosensitive area 101a of the photosensitive chip 101. The dry film layer 103 is, for example, an annular dry film layer, and is disposed around the photosensitive area 101a, and the dry film layer 103 may block a plastic package material from entering the photosensitive area 101a of the photosensitive chip 101 in a subsequent plastic package process. In order to avoid the filter from being damaged by the high temperature in the subsequent injection molding process, in this embodiment, the filter 102 is preferably a high temperature resistant blue glass filter, and further, the filter 102 is preferably an infrared cut filter (IR filter), so that the color presented by the image achieves the best visual effect, which is beneficial to improving the image quality.
Fig. 3B is a schematic structural diagram of a sensor chip mounted on a substrate in an optical device packaging method according to an embodiment of the present invention. Referring to fig. 3B, step S03 is executed to first attach the photosensitive chip 101 with the optical filter 102 to a substrate 100 through an adhesive, where the substrate 100 is provided with a passive element 104 and a metal circuit (not shown). In the present embodiment, the substrate 100 includes, but is not limited to, a flexible printed circuit, a rigid-flex printed circuit, or other types of printed circuit boards. Next, the substrate 100 with the photosensitive chip 101 attached thereon is placed in an oven, and a baking process is performed at a baking temperature of 100 to 110 ℃, preferably 105 ℃, for 3 min. Then, a bonding pad on the non-photosensitive region 101b and a metal line on the substrate 100 are connected (Wire Bond) by a Wire 105, so that the photosensitive chip 101 and the substrate 100 are electrically connected. It should be understood that the electrical connection between the photosensitive chip 101 and the substrate 100 may be a wire connection, or may be a contact connection of an elastic contact (the photosensitive chip 101 is soldered to the substrate 100 through a bottom solder layer), which is intended to achieve the conduction of a circuit, and thus the form of the electrical connection and the connection position are not limited.
Fig. 3C is a schematic structural diagram of the optical device packaging method according to the embodiment of the invention after the buffer layer is formed. With reference to fig. 3C, step S04 is executed to form a buffer layer 106 on the non-photosensitive region 101b of the photosensitive chip 101 through a dispensing process, where the buffer layer 106 covers at least a partial region of a sidewall of the optical filter 102, and optionally, the buffer layer 106 covers at least a sidewall of the optical filter 102, including an outer wall of the dry film layer 103 between the optical filter 102 and the photosensitive chip 101. The tensile modulus of the buffer layer 106 is less than 30MPa, and the Shore A hardness is less than 50.
After the photosensitive chip 101 is connected to the substrate 100 and before the buffer layer 106 is formed, the method for packaging an optical element further includes: the substrate 100 carrying the photosensitive chip 101 is cleaned to remove contaminants that may be generated during the above process. Wet cleaning and plasma cleaning may be employed, and preferably, wet cleaning is employed in the present embodiment.
Fig. 3E is a schematic structural diagram of the optical element packaging method according to the embodiment of the invention after the plastic package layer is formed by injection molding. Referring to fig. 3E, step S05 is executed to place the substrate 100 with the photosensitive chip 101 in the mold 200, and to injection mold the molding layer 107 on the substrate 100, wherein the molding layer 107 wraps the photosensitive chip 101 and the buffer layer 106 from the periphery to the top. The passive component 105 and the metal circuit on the substrate 100, the conductive line connecting the photosensitive chip 101 and the substrate 100, and the bonding pad on the non-photosensitive area 101b are wrapped in the molding layer 107. The mold 200 may be a mold of the prior art without structural modification. The plastic package layer 107 is made of any resin material capable of being melted by heat, and in the embodiment of the present invention, the plastic package layer 107 is made of epoxy resin.
The package structure of the optical element further comprises: and assembling a lens assembly 108 on a side of the molding layer 107 away from the substrate 100, wherein the lens assembly 108 is correspondingly arranged above the optical filter 102. As shown in fig. 3G, the lens assembly 108 is mounted on the molding layer 107, so as to complete the packaging of the whole optical element (lens module).
Further, when step S04 is executed, the buffer layer 106 covers not only the side walls of the optical filter 102, but also a partial region of the upper surface of the optical filter 102 (the edge region of the upper surface), and of course, also includes the outer wall of the dry film layer 103 located between the optical filter 102 and the photosensitive chip 101. As shown in fig. 3D.
Next, step S05 is executed to place the substrate 100 carrying the photosensitive chip 101 in the mold 200, and to injection mold the molding layer 107 on the substrate 100, wherein the molding layer 107 wraps the photosensitive chip 101 and the buffer layer 106 from the periphery upwards, as shown in fig. 3F. Finally, a lens assembly 108 is assembled on a side of the molding layer 107 away from the substrate 100, and the lens assembly 108 is correspondingly disposed above the optical filter 102, as shown in fig. 3H.
Fig. 5 is a schematic structural diagram of a mold 200 in the plastic molding process (in the case that the buffer layer 106 covers the side wall and the upper surface of the filter 102) in this embodiment, as shown in fig. 5, the mold 200 adopted in this embodiment may be substantially identical to the mold in the prior art, and may be adjusted only in terms of height, that is, the height H3 of the protruding portion of the mold 200 is increased. The increased height of the raised portion of the mold 200 in this embodiment compared to the conventional mold is consistent with the thickness H2 of the edge buffer layer 106 covering the top surface of the filter 102. Referring to fig. 4, the width D2 of the buffer layer 106 covering the edge of the upper surface of the optical filter 102 depends on the difference between the width D3 of the protruding portion of the mold 200 and the size of the optical filter 102. The upper surface of the molding layer 107 is not lower than the upper surface of the buffer layer 106. The width of the molding layer 107 after the edge of the upper surface of the optical filter 102 is cured is less than or equal to the width D2 of the buffer layer 106 covering the edge of the upper surface of the optical filter 10.
Compared with the plastic package process adopted in the existing optical element (lens module) packaging method, the plastic package process in the embodiment only needs to slightly change the plastic package mold 200, the mold reliability is not affected, the modification cost is low, and the specific plastic package process is compatible with the existing process.
Example four
The present embodiment provides a method for packaging an optical element, which is different from the third embodiment in that after a buffer layer is formed on a photosensitive chip carrying a filter, the photosensitive chip is electrically connected to a substrate, and then plastic package is performed. Fig. 6 is a schematic flowchart of a method for packaging an optical element provided in this embodiment, and as shown in fig. 6, the method for packaging an optical element provided in this embodiment includes:
s11: providing a photosensitive chip, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area;
s12: arranging an optical filter on a light sensing area of the light sensing chip;
s13: forming a buffer layer on the photosensitive chip, wherein the buffer layer at least covers partial area of the side wall of the optical filter;
s14: arranging the photosensitive chip on a substrate, wherein the photosensitive chip is electrically connected with the substrate; and
s15: and injection molding a molding layer on the substrate, wherein the molding layer at least wraps partial areas of the non-photosensitive area of the photosensitive chip and partial areas of the buffer layer.
Fig. 7A to 7G are schematic structural diagrams of corresponding steps of the packaging method of the optical element provided in this embodiment. The method for packaging an optical element provided in the present embodiment is further described in detail with reference to fig. 7A to 7G, and specifically, the present embodiment takes the optical element as an example for discussion.
With reference to fig. 7A, step S11 is executed to provide a photosensitive chip 101, where the functional surface of the photosensitive chip 101 includes a photosensitive area 101a and a non-photosensitive area 101b, and a pad is disposed on the non-photosensitive area 101b of the photosensitive chip 101. Next, step S12 is executed to form a dry film layer 103 on the non-photosensitive area 101b of the functional surface of the photosensitive chip 101, and attach the optical filter 102 to the photosensitive area 101a of the photosensitive chip 101 through the dry film layer 103, where the light-passing hole of the optical filter 102 corresponds to the photosensitive area 101a of the photosensitive chip 101. The dry film layer 103 is, for example, an annular dry film layer, and is disposed around the photosensitive region 101 a.
With reference to fig. 7B, step S13 is executed to form a buffer layer 106 on the non-photosensitive region 101B of the photosensitive chip 101 through a dispensing process, where the buffer layer 106 covers at least a partial region of a sidewall of the optical filter 102, and optionally, the buffer layer 106 covers at least a sidewall of the optical filter 102, including an outer wall of the dry film layer 103 between the optical filter 102 and the photosensitive chip 101.
In addition, before forming the buffer layer 106, the method for encapsulating an optical element further includes: the photosensitive chip 101 with the optical filter 102 is cleaned to remove the contaminants possibly generated in the above process. Wet cleaning and plasma cleaning may be employed, and preferably, wet cleaning is employed in the present embodiment.
Referring to fig. 7D, step S14 is executed to first attach the photosensitive chip 101 with the optical filter 102 to a substrate 100 through an adhesive, where the substrate 100 is provided with a passive element 104 and a metal circuit (not shown). Next, the substrate 100 with the photosensitive chip 101 attached thereon is placed in an oven, and a baking process is performed at a baking temperature of 100 to 110 ℃, preferably 105 ℃, for 3 min. Then, a bonding pad on the non-photosensitive region 101b and a metal line on the substrate 100 are connected (Wire Bond) by a Wire 105, so that the photosensitive chip 101 and the substrate 100 are electrically connected. It should be understood that the electrical connection between the photosensitive chip 101 and the substrate 100 may be a wire connection, or may be a contact connection of an elastic contact (the photosensitive chip 101 is soldered to the substrate 100 through a bottom solder layer), which is intended to achieve the conduction of a circuit, and thus the form of the electrical connection and the connection position are not limited.
Referring to fig. 7E, step S15 is executed to place the substrate 100 with the photosensitive chip 101 in the mold 200, and to injection mold the molding layer 107 on the substrate 100, wherein the molding layer 107 wraps the photosensitive chip 101 and the buffer layer 106 from the periphery to the top. The passive component 105 and the metal circuit on the substrate 100, the conductive line connecting the photosensitive chip 101 and the substrate 100, and the bonding pad on the non-photosensitive area 101b are wrapped in the molding layer 107. The plastic package layer 107 is made of any resin material capable of being melted by heat, and in the embodiment of the present invention, the plastic package layer 107 is made of epoxy resin.
Finally, a lens assembly 108 is assembled on a side of the molding layer 107 away from the substrate 100, and the lens assembly 108 is correspondingly disposed above the optical filter 102. As shown in fig. 7F, the lens assembly 108 is mounted on the molding layer 107, so as to complete the packaging of the whole optical element (lens module).
Further, when step S13 is executed, the buffer layer 106 covers not only the side walls of the optical filter 102, but also a partial region of the upper surface of the optical filter 102 (the edge region of the upper surface), including the outer wall of the dry film layer 103 between the optical filter 102 and the photosensitive chip 101. As shown in fig. 7C. Next, steps S14-S15 are performed to form the package structure shown in FIG. 7G.
It should be noted that the method and structure in this embodiment are described in a progressive manner, and the description of the method and structure in the following is mainly different from the previous method and structure, and for the structure disclosed in this embodiment, since the method corresponds to the method disclosed in the embodiment, the description is relatively simple, and for the relevant points, the description may be referred to the method part.
The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.
Claims (19)
1. An optical device package comprising:
a substrate;
the photosensitive chip is provided with a photosensitive area and a non-photosensitive area, is arranged on the substrate and is electrically connected with the substrate;
the optical filter is arranged on the photosensitive area of the photosensitive chip;
the dry film layer is arranged between the optical filter and the photosensitive chip and is positioned in a non-photosensitive area of the photosensitive chip, and the dry film layer is a sticky photoresist film;
the buffer layer is arranged in a non-photosensitive area of the photosensitive chip and at least covers partial areas of the side wall of the optical filter and at least also covers partial areas of the upper surface of the optical filter, the buffer layer is made of epoxy glue, the epoxy glue comprises epoxy resin, rubber and a solvent, the tensile modulus of the buffer layer is less than 30MPa, and the Shore A hardness is less than 50; and
the plastic package layer is arranged on one surface of the substrate, which is provided with the photosensitive chip, and at least wraps the partial region of the non-photosensitive area of the photosensitive chip and the partial region of the buffer layer.
2. The optical device package according to claim 1, further comprising:
the lens component is arranged on one side, deviating from the substrate, of the plastic packaging layer and is correspondingly arranged above the optical filter.
3. The package structure of claim 1, wherein the thickness of the dry film layer is less than 50 μm.
4. The package structure of claim 3, wherein the dry film layer is annular in shape.
5. The optical device package according to claim 3, wherein the buffer layer covers the entire side wall of the optical filter and also covers the outer wall of the dry film layer.
6. The package structure of claim 1, wherein the width of the portion of the buffer layer on the side wall of the optical filter is less than 50 μm, and the thickness of the portion of the buffer layer on the upper surface of the optical filter is less than 10 μm.
7. The package structure of claim 1, wherein the upper surface of the molding layer is not lower than the upper surface of the buffer layer, and the width of the portion of the buffer layer on the upper surface of the optical filter is greater than or equal to the width of the portion of the molding layer on the upper surface of the optical filter.
8. The package structure of claim 7, wherein the width of the portion of the buffer layer on the upper surface of the optical filter is greater than 30 μm.
9. The package structure of an optical element according to any one of claims 1 to 8, wherein the filter is an infrared cut filter.
10. The package structure of an optical element according to any one of claims 1 to 8, wherein the substrate further has a passive element thereon, the passive element is located at one side of the photosensitive chip, the photosensitive chip is electrically connected to the substrate through a conductive wire, and both the passive element and the conductive wire are plastically packaged in the plastic package layer.
11. A method of packaging an optical component, comprising:
providing a photosensitive chip, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area, the non-photosensitive area of the photosensitive chip is provided with a bonding pad, a dry film layer is formed on the non-photosensitive area of the functional surface of the photosensitive chip, and an optical filter is attached to the photosensitive area of the photosensitive chip through the dry film layer so as to be arranged on the photosensitive area of the photosensitive chip;
forming glue films on the side wall of the optical filter and part of the area of the upper surface of the optical filter in a glue dispensing mode, placing the photosensitive chip sprayed with the glue films into a baking furnace for baking, cooling to form a buffer layer located between the side wall of the optical filter and the bonding pad and part of the area of the upper surface of the optical filter, and arranging the photosensitive chip on a substrate, wherein the photosensitive chip is electrically connected with the substrate;
the buffer layer material comprises epoxy glue, wherein the epoxy glue comprises epoxy resin, rubber and a solvent, the tensile modulus of the buffer layer is less than 30MPa, and the Shore A hardness is less than 50;
and
and injection molding a molding layer on the substrate, wherein the molding layer at least wraps partial areas of the non-photosensitive area of the photosensitive chip and partial areas of the buffer layer.
12. The method of claim 11, wherein the photo-sensor chip is disposed on the substrate, and a buffer layer is formed on the photo-sensor chip.
13. The method of claim 11, wherein a buffer layer is formed on the photo-sensor chip before the photo-sensor chip is disposed on the substrate.
14. The method of claim 11, further comprising:
and assembling a lens assembly on one side of the plastic packaging layer, which is far away from the substrate, wherein the lens assembly is correspondingly arranged above the optical filter.
15. A method of encapsulating an optical element as claimed in claim 11, characterized in that the thickness of the dry film layer is less than 50 μm.
16. A method for encapsulating an optical element as recited in claim 15, wherein the dry film layer is annular in shape.
17. The method of claim 15, wherein the buffer layer covers the entire side wall of the filter and also covers the outer wall of the dry film layer.
18. The method for packaging an optical element according to any one of claims 12 to 17, wherein the substrate further includes a passive element, the passive element is located on one side of the photosensitive chip, the photosensitive chip is electrically connected to the substrate through a conductive wire, and both the passive element and the conductive wire are plastically packaged in the plastic package layer.
19. The method of packaging an optical element according to any one of claims 12 to 17, wherein an upper surface of the molding layer is not lower than an upper surface of the buffer layer, and a width of a portion of the buffer layer on the upper surface of the optical filter is greater than or equal to a width of a portion of the molding layer on the upper surface of the optical filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811308893.0A CN109461748B (en) | 2018-11-05 | 2018-11-05 | Packaging structure and packaging method of optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811308893.0A CN109461748B (en) | 2018-11-05 | 2018-11-05 | Packaging structure and packaging method of optical element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461748A CN109461748A (en) | 2019-03-12 |
| CN109461748B true CN109461748B (en) | 2021-12-24 |
Family
ID=65609352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811308893.0A Active CN109461748B (en) | 2018-11-05 | 2018-11-05 | Packaging structure and packaging method of optical element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109461748B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112118373B (en) * | 2019-06-21 | 2021-08-06 | 致伸科技股份有限公司 | Miniaturized image acquisition module and manufacturing method thereof |
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN112698463A (en) * | 2020-12-29 | 2021-04-23 | 豪威光电子科技（上海）有限公司 | Packaging structure and packaging method of optical element |
| CN113079291B (en) * | 2021-03-29 | 2023-04-07 | 南昌欧菲光电技术有限公司 | Chip packaging structure, processing method, camera module and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1801493A (en) * | 2005-01-05 | 2006-07-12 | 育霈科技股份有限公司 | FBGA and BOC package structure for image sensor |
| JP2008130738A (en) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | Solid-state imaging element |
| JP2014192442A (en) * | 2013-03-28 | 2014-10-06 | Nec Corp | Hermetic sealing body and hermetic sealing method |
| CN203895461U (en) * | 2014-05-20 | 2014-10-22 | 苏州晶方半导体科技股份有限公司 | Image sensor module |
| WO2016152431A1 (en) * | 2015-03-24 | 2016-09-29 | ソニー株式会社 | Solid-state image capture device, method for manufacturing solid-state image capture device, and electronic equipment |
| CN206712912U (en) * | 2017-04-11 | 2017-12-05 | 昆山丘钛微电子科技有限公司 | Minimize cam device |
-
2018
- 2018-11-05 CN CN201811308893.0A patent/CN109461748B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1801493A (en) * | 2005-01-05 | 2006-07-12 | 育霈科技股份有限公司 | FBGA and BOC package structure for image sensor |
| JP2008130738A (en) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | Solid-state imaging element |
| JP2014192442A (en) * | 2013-03-28 | 2014-10-06 | Nec Corp | Hermetic sealing body and hermetic sealing method |
| CN203895461U (en) * | 2014-05-20 | 2014-10-22 | 苏州晶方半导体科技股份有限公司 | Image sensor module |
| WO2016152431A1 (en) * | 2015-03-24 | 2016-09-29 | ソニー株式会社 | Solid-state image capture device, method for manufacturing solid-state image capture device, and electronic equipment |
| CN206712912U (en) * | 2017-04-11 | 2017-12-05 | 昆山丘钛微电子科技有限公司 | Minimize cam device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109461748A (en) | 2019-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7964945B2 (en) | Glass cap molding package, manufacturing method thereof and camera module | |
| US10008533B2 (en) | Semiconductor package | |
| TWI706212B (en) | Camera module and manufacturing method of moulded photosensitive component | |
| CN109461748B (en) | Packaging structure and packaging method of optical element | |
| JP3187222U (en) | Image sensor package having enlarged air space | |
| EP2393116B1 (en) | Wafer level image sensor packaging structure and manufacturing method for the same | |
| US6737292B2 (en) | Method of fabricating an image sensor module at the wafer level and mounting on circuit board | |
| US8045026B2 (en) | Solid-state image sensing device | |
| CN107566691B (en) | Photosensitive assembly, camera module and manufacturing method thereof | |
| CN109246348B (en) | Lens module, packaging method thereof and electronic equipment | |
| JP2011015392A (en) | Camera module | |
| CN109274876B (en) | Photosensitive assembly and packaging method thereof, lens module and electronic equipment | |
| US6649834B1 (en) | Injection molded image sensor and a method for manufacturing the same | |
| CN211555889U (en) | Image sensing module | |
| JP2007116560A (en) | Imaging device and method of manufacturing the same | |
| US20040070076A1 (en) | Semiconductor chip package for image sensor and method of the same | |
| US7429783B2 (en) | Image sensor package | |
| CN209086962U (en) | For shielding the recognizer component and electronic equipment of lower optical finger print | |
| JP2011165774A (en) | Production method of solid-state image pickup device | |
| WO2017134972A1 (en) | Imaging element package and imaging device | |
| CN112770019A (en) | Photosensitive assembly, preparation method thereof and camera module | |
| JP2004221874A (en) | Optical module, manufacturing method therefor, circuit board and electronic apparatus | |
| US20080303111A1 (en) | Sensor package and method for fabricating the same | |
| KR20100020614A (en) | Camera module | |
| US20090315130A1 (en) | Solid-state imaging apparatus and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |