CN109291135A - cover plate for drilling - Google Patents
cover plate for drilling Download PDFInfo
- Publication number
- CN109291135A CN109291135A CN201811204497.3A CN201811204497A CN109291135A CN 109291135 A CN109291135 A CN 109291135A CN 201811204497 A CN201811204497 A CN 201811204497A CN 109291135 A CN109291135 A CN 109291135A
- Authority
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- China
- Prior art keywords
- water
- cover plate
- drilling hole
- resin
- composition layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005553 drilling Methods 0.000 title claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 89
- 239000011347 resin Substances 0.000 claims abstract description 89
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000002518 antifoaming agent Substances 0.000 claims description 10
- -1 fatty acid amine Chemical class 0.000 claims description 10
- 150000002484 inorganic compounds Chemical class 0.000 claims description 10
- 229910010272 inorganic material Inorganic materials 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 3
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 230000036541 health Effects 0.000 claims description 3
- FBPFZTCFMRRESA-UHFFFAOYSA-N hexane-1,2,3,4,5,6-hexol Chemical compound OCC(O)C(O)C(O)C(O)CO FBPFZTCFMRRESA-UHFFFAOYSA-N 0.000 claims description 3
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- ATRMIFNAYHCLJR-UHFFFAOYSA-N [O].CCC Chemical compound [O].CCC ATRMIFNAYHCLJR-UHFFFAOYSA-N 0.000 claims 1
- 150000005215 alkyl ethers Chemical class 0.000 claims 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000003473 lipid group Chemical group 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 125000003367 polycyclic group Chemical group 0.000 claims 1
- 239000011342 resin composition Substances 0.000 abstract 3
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000005030 aluminium foil Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000010148 water-pollination Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000005588 carbonic acid salt group Chemical group 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
本发明涉及一种钻孔用盖板，包括一金属箔以及至少一层的亲水性树脂组成物层，其中该亲水性树脂组成物层结合于该金属箔上，且该亲水性树脂组成物层的反应热焓值介于10～40(J/g)，且熔点为介于48～70℃之间，可形成较佳的孔壁粗糙度与较少的钻头上树脂卷附。
The present invention relates to a drilling cover plate, comprising a metal foil and at least one layer of a hydrophilic resin composition layer, wherein the hydrophilic resin composition layer is bonded to the metal foil, and the reaction heat enthalpy value of the hydrophilic resin composition layer is between 10 and 40 (J/g), and the melting point is between 48 and 70°C, which can form a better hole wall roughness and less resin wrapping on the drill bit.
Description
This case be a divisional application, female case be the applying date be on October 22nd, 2014, application No. is
201410566017.3, the Chinese invention patent application of entitled " cover plate for drilling hole ".
Technical field
The present invention is in relation to a kind of cover plate for drilling hole, espespecially a kind of brill that can be used for the fields such as IC support plate, PCB, BGA plate and use
Hole cover board has the advantages that structure is simple, can form preferable Hole Wall Roughness and resin twisting cohesion on less drill bit.
Background technique
In recent years, electronic product tend to it is frivolous, multi-functional and at high speed develop so that printed circuit board in micropore quantity with
Density content rapidly increases, and based under this trend, drilling quality, hole location precision and drill point service life and other effects are so important finger
Mark, however traditional accessory plate such as traditional cover boards such as aluminium foil or phenolic resin, be not suitable for already this demand using upper, if making reluctantly
Occurred partially with bad missings such as drill point abrasions with then easy broken needle, hole.
Now, drilled metal cover board (Aluminum cover is most) consequentiality that different kenels are constituted, but stablize and undoubtedly by
Application it is seldom, it is mainly complicated in lubrication layer formula and in buffering drilling inferior horn pressure, lubrication drill point (reducing drill point abrasion)
It is functionally all inadequate with adherence metal foil (drill point heat sinking function) etc..Such as to belong to water-soluble lubricating mixture, synthetic wax
With perforated plate made by the scraps of paper, but there is drill point that can not radiate and stickiness problem；It is glutinous with polyethylene glycol or the improvement of polyethers esters
Property problem, but have drill point can not chip removal and the inclined problem in hole；Film, glue is made with water-soluble resin mixing water-insoluble lubricant
It is coated with thermosetting resin between the composite wood of piece and aluminium foil, film, aluminium foil, the drilling cover board of totally three kinds of various combinations construction, but matched
Side is all complicated with production and the thermoset resin layer that combines, and because hardness is high it is easier that drill point skids due to hole deviates or broken needle.
Summary of the invention
A kind of structure is simple, can form preferable Hole Wall Roughness and less drill bit providing for the main object of the present invention
The cover plate for drilling hole of upper resin twisting cohesion.
In order to achieve the above object, a kind of cover plate for drilling hole set by the present invention, including a metal foil and at least one layer of
Hydrophilic resin fat composition layer, wherein the hydrophilic resin fat composition layer is incorporated into the metal foil, and the hydrophilic resin group
At the reaction heat enthalpy of nitride layer between 10~40 (J/g), and fusing point is between 48~70 DEG C.
When implementation, the metal foil with a thickness of 0.05mm~0.2mm.
When implementation, the hydrophilic resin fat composition layer with a thickness of 0.02mm~0.15mm.
When implementation, which is selected from polypropylene oxide, polyethylene oxide including one, gathers and stretch fourth two
Alcohol, polyolefin glycol polyester, carboxymethyl cellulose, polyvinyl pyrrolidone, polyacrylamide and Sodium Polyacrylate wherein one
Kind has crystalline water-soluble resin；Or, hydrophilic resin fat composition layer includes one selected from polyethylene glycol phenolic ether, poly- second
The alcohol ethers such as glycol alkyl ether have crystalline water-soluble resin；Or, the hydrophilic resin fat composition layer is selected from including one
There is crystalline water-soluble resin in alcohols such as hexitol, propylene glycol, glycerine.
When implementation, which is separately mixed with an inorganic compound, a defoaming agent and an interfacial agent, to be formed
The hydrophilic resin fat composition layer.
When implementation, which is talcum powder, molybdenum disulfide, zinc molybdate, calcium carbonate, graphite, boron nitride, nitridation
The one of which such as aluminium, aluminium oxide, aluminium hydroxide or two or more substances.
When implementation, which is modified polysiloxanes (Polysiloxane) resin and its relevant derivative, silicon
The one of which such as power health (Silicone) and its fatty acid, fatty acid amine, polyether compound or two or more substances.
When implementation, which is to have hydrophily (hydrophilic part) part and lipophilicity in a molecule
The compound that (lipophilic part) partly coexists, wherein the hydrophilic portion then has carbonate, sulfate etc., the lipophilic
Even property part has direct steel, side refining cyclic aromatic hydrocarbon radical.
When implementation, which is the water-soluble resin of number average molecular weight 300000 to 400000
20 parts by weight after being dissolved in water with 60 parts by weight of water-soluble resin of number average molecular weight 10000 to 80000, add 8 weights
The inorganic compound of amount part stirs and is allowed to be fully dispersed in water-soluble resin aqueous solution, then adds disappearing for 2 parts by weight again
It is stirred after infusion and the interfacial agent of 2 parts by weight and is allowed to be fully dispersed in formed in water-soluble resin aqueous solution.
When implementation, which is the water-soluble resin of number average molecular weight 200000 to 300000
20 parts by weight, after being dissolved in water with 60 parts by weight of water-soluble resin of number average molecular weight 300000 to 400000, addition 8
The inorganic compound of parts by weight stirs and is allowed to be fully dispersed in water-soluble resin aqueous solution, then adds 2 parts by weight again
It is stirred after defoaming agent and the interfacial agent of 2 parts by weight and is allowed to be fully dispersed in formed in water-soluble resin aqueous solution.
When implementation, a primer layer is equipped between the metal foil and the hydrophilic resin fat composition layer.
When implementation, which is any in thermoplastic resin thermosetting resin or two kinds are used in mixed way.
To further appreciate that the present invention, preferred embodiment is lifted below, cooperates schema, figure number, by specific structure of the invention
At content and its it is reached the effect of detailed description are as follows.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of cover plate for drilling hole of the embodiment of the present invention；
Fig. 2 is that the embodiment of the present invention adds the structural schematic diagram after primer layer.
Description of symbols: 1, metal foil；2, hydrophilic resin fat composition layer；3- primer layer.
Specific embodiment
It is embodiment below, but the contents of the present invention are not limited to the range of these embodiments.
Referring to Fig. 1, it is an a kind of embodiment of cover plate for drilling hole of the present invention comprising a metal foil 1 and at least
One layer of hydrophilic resin fat composition layer 2.
The metal foil 1 is aluminium foil, with a thickness of 0.05mm~0.2mm.
The hydrophilic resin fat composition layer 2 is with a thickness of 0.02mm~0.15mm, for being incorporated into the metal foil 1, and the parent
Water-base resin forms the reaction heat enthalpy of nitride layer 2 between 10~40 (J/g), and fusing point is between 48~70 DEG C.
Wherein, which includes one selected from polypropylene oxide, polyethylene oxide, poly- stretches fourth two
Alcohol, polyolefin glycol polyester, carboxymethyl cellulose, polyvinyl pyrrolidone, polyacrylamide and Sodium Polyacrylate wherein one
Kind has crystalline water-soluble resin；Or, hydrophilic resin fat composition layer includes one selected from polyethylene glycol phenolic ether, poly- second
The alcohol ethers such as glycol alkyl ether have crystalline water-soluble resin；Or, the hydrophilic resin fat composition layer is selected from including one
There is crystalline water-soluble resin in alcohols such as hexitol, propylene glycol, glycerine.
And best mode for carrying out the invention is that the water-soluble resin is separately mixed with an inorganic compound, a defoaming agent and one
Interfacial agent, to form the hydrophilic resin fat composition layer 2.Wherein, which is talcum powder, molybdenum disulfide, molybdenum
The substance of the one of which such as sour zinc, calcium carbonate, graphite, boron nitride, aluminium nitride, aluminium oxide, aluminium hydroxide.The defoaming agent system is to change
Polysiloxanes (Polysiloxane) resin and its relevant derivative, silicon power health (Silicone) and its fatty acid, rouge of property
The one of which substance such as fat acid amide, polyether compound.The interfacial agent is to have hydrophily (hydrophilic in a molecule
Part) the compound partly partly coexisted with lipophilicity (lipophilic part), wherein the hydrophilic portion then has carbonic acid
Salt, sulfate etc., even lipophilicity part has direct steel, side refining cyclic aromatic hydrocarbon radical.
Therefore, when actual implementation, which can mitigate rushing from drill bit cutting portion using the aluminium foil of 98 or more purity
Hit, and improve the adaptation of drill point blade front end, the hydrophilic resin fat composition layer 2 be number average molecular weight 300000 to
400000 20 parts by weight of water-soluble resin, it is molten with 60 parts by weight of water-soluble resin of number average molecular weight 10000 to 80000
Solution in water after, addition 8 parts by weight inorganic compound stir and be allowed to be fully dispersed in water-soluble resin aqueous solution, then
It is stirred after adding the defoaming agent of 2 parts by weight and the interfacial agent of 2 parts by weight again and is allowed to be fully dispersed in water-soluble resin water
Formed in solution.Hydrophilic resin fat composition layer 2 after drying is made for the mode of 0.03mm, using double roller cylinder Comma
Coater is coated with this hydrophilic resin fat composition layer 2 after the metal foil 1 that single side forms thickness 0.01mm, and drying machine is recycled to make
Cooling, use to form cover plate for drilling hole of the invention (being above the 1st embodiment).
Also, number average molecular weight 200000 to 300000 also can be used in the present invention hydrophilic resin fat composition layer 2
20 parts by weight of water-soluble resin are dissolved in water with 60 parts by weight of water-soluble resin of number average molecular weight 300000 to 400000
In after, addition 8 parts by weight inorganic compound stir and be allowed to be fully dispersed in water-soluble resin aqueous solution, then add again
It is stirred after the defoaming agent of 2 parts by weight and the interfacial agent of 2 parts by weight and is allowed to be fully dispersed in water-soluble resin aqueous solution
It is formed, the hydrophilic resin fat composition layer 2 after drying is made for the mode of 0.03mm, using double roller cylinder Comma Coater
This hydrophilic resin fat composition layer 2 is coated with after the metal foil 1 that single side forms thickness 0.01mm, drying machine is recycled to be allowed to cold
But, it uses to form cover plate for drilling hole of the invention (being above the 2nd embodiment).
Therefore, by above-mentioned two embodiments cover plate for drilling hole obtained, after the copper-surfaced laminated plates of 6 thickness 0.1mm,
It is that upper mode is configured with the hydrophilic resin fat composition layer 2, on the downside of overlapped copper-surfaced laminated plates, configures lower bolster
(urea plate), with 0.105 Φ of drill bit (0.105mm*2.2mm), rotation speed 200000rpm, feed speed 25mm/sec, withdrawing speed
The condition of 423mm/sec drills to each drill point with 3000hits, shows that difference scans card meter with per minute by using heat
10 DEG C of heating rate measuring range is 40~80 DEG C and is measured, for any on the cover plate for drilling hole of above-described embodiment 1,2
3 different zones of selection carry out actual measurement, it is possible to find its heat enthalpy value is 17 (J/g), and fusing point is 60 DEG C, and thick by hole wall
Rugosity test (after drilling processing for process hole center section cutting grind, in a side of hole wall most
Big protrusion is measured with the distance until most deep recess portion.Measurement site be drill bit the 2999th hole processing hole do twice put down
As Hole Wall Roughness value), hole location precision test (using hole analyzer to bottom in the copper foil laminates being overlapped
The hole site of 3000hits and the offset of specified coordinate are measured in the back side of copper foil laminates, are calculated each drill point flat
Mean value and standard deviation (δ), calculate+3 δ of average value and maximum value, record 7 bit bores processing average value), resin volume
The judgement of attached amount degree (carries out observation phase to 7 drill points after 3000hits using the optical microscopy that multiplying power is 25 times respectively
Maximum diameter and drill bit axis direction length for the resin twisting cohesion of drill point diameter judge resin twisting cohesion amount degree) after can find, lead to
Resin twisting cohesion on preferable Hole Wall Roughness and less drill bit can be formed by crossing cover plate for drilling hole set by the present invention really.
In addition, as shown in Fig. 2, to increase the adaptation of the metal foil and the hydrophilic resin fat composition layer, it can be pre-
Primer layer 3 prior to forming 0.001~0.01mm of thickness in metal foil is most ideal.As long as the primer layer 3 can promote resin
The substance of constituent adaptation, other have no any restriction, also can be used any in thermoplasticity or thermosetting resin
A kind of or two kinds are used in mixed way, thermoplastic resin such as vinyl acetate condensate, Polyester condensate, acryloyl base system is poly-
Zoarium is the equal substances or mixture, the resin etc. of thermosetting resin such as epoxy base system resin and cyanate series.
Therefore, the boring Aluminum cover of the present invention has the heat content and fusing point of particular range by hydrophilic resin fat composition layer
Value, can provide heat dissipation appropriate and degree of lubrication for drill point, so Hole Wall Roughness and drill point when can be directed to drilling processing
Upper resin twisting cohesion is contributed.
The above is specific embodiments of the present invention and the technological means used, according to the exposure or introduction of this paper
Can derive and derive many change and amendment, still can be considered equivalent change made by conception of the invention, caused by make
It with the connotation still covered without departing from specification and schema, is regarded as within technology scope of the invention, closes first old
It is bright.
In conclusion the present invention really can reach the expected purpose of invention according to content disclosed above, a kind of drilling is provided
With cover board, the value utilized in great industry, whence proposes application for a patent for invention in accordance with the law.
Claims (14)
1. a kind of cover plate for drilling hole, it is characterised in that comprising:
One metal foil；And
At least one layer of hydrophilic resin fat composition layer, is incorporated into the metal foil, and the hydrophilic resin fat composition layer its
Reaction heat enthalpy is between 10~40J/g, and fusing point is between 48~70 DEG C.
2. cover plate for drilling hole as described in claim 1, wherein the metal foil with a thickness of 0.05mm~0.2mm.
3. cover plate for drilling hole as described in claim 1, wherein the hydrophilic resin fat composition layer with a thickness of 0.02mm~
0.15mm。
4. cover plate for drilling hole as described in claim 1, wherein the hydrophilic resin fat composition layer includes one selected from polycyclic oxygen
Propane, polyethylene oxide gather and stretch butanediol, polyolefin glycol polyester, carboxymethyl cellulose, polyvinyl pyrrolidone, poly- third
Acrylamide and Sodium Polyacrylate it is one of there is crystalline water-soluble resin.
5. cover plate for drilling hole as described in claim 1, wherein the hydrophilic resin fat composition layer includes one selected from poly- second two
Alcohol phenolic ether or polyethylene glycol alkyl ether have crystalline water-soluble resin.
6. cover plate for drilling hole as described in claim 1, wherein the hydrophilic resin fat composition layer include one selected from hexitol,
Propylene glycol or glycerine it is one of there is crystalline water-soluble resin.
7. the cover plate for drilling hole as described in claim 4,5 or 6, wherein the water-soluble resin be separately mixed with an inorganic compound,
One defoaming agent and an interfacial agent, to form the hydrophilic resin fat composition layer.
8. cover plate for drilling hole as claimed in claim 7, wherein the inorganic compound is talcum powder, molybdenum disulfide, zinc molybdate, carbon
Sour calcium, graphite, boron nitride, aluminium nitride, aluminium oxide or aluminium hydroxide is one of or the mixture of two or more arbitrary proportions.
9. cover plate for drilling hole as claimed in claim 7, wherein the defoaming agent is modified polyorganosiloxane resin and its relevant
The mixing of derivative, silicon power health and its fatty acid, fatty acid amine or polyether compound one of which or two or more arbitrary proportions
Object.
10. cover plate for drilling hole as claimed in claim 7, wherein the interfacial agent is to have hydrophilic portion and parent in a molecule
The compound that lipid part coexists, wherein the hydrophilic portion is selected from the mixture of carbonate, sulfate or its arbitrary proportion, should
Even lipophilicity part has direct steel, side refining cyclic aromatic hydrocarbon radical.
11. cover plate for drilling hole as claimed in claim 7, wherein the hydrophilic resin fat composition layer is number average molecular weight
300000 to 400,000 20 parts by weight of water-soluble resin, the water-soluble resin 60 with number average molecular weight 10000 to 80000
After parts by weight are dissolved in water, the inorganic compound of 8 parts by weight of addition stirs and is allowed to be fully dispersed in water-soluble resin water-soluble
In liquid, is stirred after then adding the defoaming agent of 2 parts by weight and the interfacial agent of 2 parts by weight again and be allowed to be fully dispersed in water-soluble
Formed in property resin aqueous solution.
12. cover plate for drilling hole as claimed in claim 7, wherein the hydrophilic resin fat composition layer is number average molecular weight
200000 to 300,000 20 parts by weight of water-soluble resin, the water-soluble resin with number average molecular weight 300000 to 400000
After 60 parts by weight are dissolved in water, the inorganic compound of 8 parts by weight of addition stirs and is allowed to be fully dispersed in water-soluble resin water
In solution, is stirred after then adding the defoaming agent of 2 parts by weight and the interfacial agent of 2 parts by weight again and be allowed to be fully dispersed in water
Formed in soluble resin aqueous solution.
13. cover plate for drilling hole as described in claim 1 is wherein equipped between the metal foil and the hydrophilic resin fat composition layer
One primer layer.
14. cover plate for drilling hole as claimed in claim 13, wherein the primer layer is in thermoplastic resin or thermosetting resin
Any or two kinds of arbitrary proportions mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204497.3A CN109291135A (en) | 2014-10-22 | 2014-10-22 | cover plate for drilling |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204497.3A CN109291135A (en) | 2014-10-22 | 2014-10-22 | cover plate for drilling |
| CN201410566017.3A CN105583889A (en) | 2014-10-22 | 2014-10-22 | Cover plate for drilling |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410566017.3A Division CN105583889A (en) | 2014-10-22 | 2014-10-22 | Cover plate for drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109291135A true CN109291135A (en) | 2019-02-01 |
Family
ID=55923967
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410566017.3A Pending CN105583889A (en) | 2014-10-22 | 2014-10-22 | Cover plate for drilling |
| CN201811204497.3A Pending CN109291135A (en) | 2014-10-22 | 2014-10-22 | cover plate for drilling |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410566017.3A Pending CN105583889A (en) | 2014-10-22 | 2014-10-22 | Cover plate for drilling |
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| Country | Link |
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| CN (2) | CN105583889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110281308A (en) * | 2019-06-28 | 2019-09-27 | 烟台柳鑫新材料科技有限公司 | A kind of boring gluing aluminum-based cover plate of PCB and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105583889A (en) * | 2014-10-22 | 2016-05-18 | 合正科技股份有限公司 | Cover plate for drilling |
| CN108213519A (en) * | 2017-12-08 | 2018-06-29 | 安徽蓝润自动化仪表有限公司 | A kind of anti-slip drilling holes on circuit board upper padding plate |
| CN108544565A (en) * | 2018-06-05 | 2018-09-18 | 江苏贺鸿电子有限公司 | Drilling processing emulsion sheet |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105583889A (en) | 2016-05-18 |
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Application publication date: 20190201 |