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CN108544565A - Drilling processing emulsion sheet - Google Patents

Drilling processing emulsion sheet Download PDF

Info

Publication number
CN108544565A
CN108544565A CN201810568572.8A CN201810568572A CN108544565A CN 108544565 A CN108544565 A CN 108544565A CN 201810568572 A CN201810568572 A CN 201810568572A CN 108544565 A CN108544565 A CN 108544565A
Authority
CN
China
Prior art keywords
water
organic coating
emulsion sheet
drilling processing
soluble organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810568572.8A
Other languages
Chinese (zh)
Inventor
刘统发
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu He Hong Electronics Co Ltd
Original Assignee
Jiangsu He Hong Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu He Hong Electronics Co Ltd filed Critical Jiangsu He Hong Electronics Co Ltd
Priority to CN201810568572.8A priority Critical patent/CN108544565A/en
Publication of CN108544565A publication Critical patent/CN108544565A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/088Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The present invention relates to a kind of drilling processing emulsion sheets, wherein the emulsion sheet includes substrate layer, the surface of the substrate layer is provided with water-soluble organic coating, and the water-soluble organic coating is polyethylene glycol organic coating.The drilling processing emulsion sheet of the present invention is used, when drilling is positioned over emulsion sheet above line plate hole to be drilled, plays scratching effect;Used water-soluble coating fusing point is 30 DEG C~90 DEG C, and when drill point runs at high speed, the water solubility organic coating is by from solid-liquid phase transformation, taking away a large amount of heat, to make drill point cool down;Water-soluble organic coating has excellent lubricant effect, can effectively promote drill point service life, reduces Hole Wall Roughness.Therefore, drilling processing emulsion sheet of the invention can reduce wiring board manufacturing cost, improve wiring board capillary processing quality, have scratching, heat dissipation and lubricating function.

Description

Drilling processing emulsion sheet
Technical field
The present invention relates to wiring board manufacture field more particularly to drilling processings, in particular to a kind of drilling processing to cover Piece.
Background technology
At present when the circuit-board drilling hole machined of general technology, can assist side surface cover an aluminium flake, mainly can be to prevent Only line plate plate face scratching, cooling effect.When being drilled using aluminium flake emulsion sheet, there are with high costs, do not have lubrication work( It can defect.
Invention content
The purpose of the present invention is overcoming the above-mentioned prior art, provides one kind and can reduce wiring board and be manufactured into Originally wiring board capillary processing quality, the drilling processing emulsion sheet with scratching, heat dissipation and lubricating function, are improved.
To achieve the goals above, drilling processing of the invention emulsion sheet has following constitute:
The emulsion sheet includes substrate layer, and the surface of the substrate layer is provided with water-soluble organic coating, described Water-soluble organic coating is polyethylene glycol organic coating.
Preferably, the molecular weight of the polyethylene glycol in the water-soluble organic coating is 1000~30000.
Preferably, the thickness of the water-soluble organic coating is 10 μm~200 μm.
Preferably, the substrate layer is brown paper, art post paperboard, grey paperboard or package paper.
Preferably, the thickness of the substrate layer is 0.05mm~2.0mm.
Preferably, the fusing point of the water-soluble organic coating is 30 DEG C~90 DEG C.
The drilling processing emulsion sheet of the present invention is used, when drilling is positioned over emulsion sheet above line plate hole to be drilled, rises To scratching effect;Used water-soluble coating fusing point is 30 DEG C~90 DEG C, and when drill point runs at high speed, the water solubility is organic Coating is by from solid-liquid phase transformation, taking away a large amount of heat, to make drill point cool down;Water-soluble organic coating has excellent Lubricant effect, can effectively promote drill point service life, reduce Hole Wall Roughness.Therefore, drilling processing of the invention is with covering Cover plate can reduce wiring board manufacturing cost, improve wiring board capillary processing quality, have scratching, heat dissipation and lubricating function.
Description of the drawings
Fig. 1 is the structural schematic diagram of the drilling processing emulsion sheet of the present invention.
Reference numeral
1 substrate layer
2 water-soluble organic coatings
Specific implementation mode
In order to more clearly describe the technology contents of the present invention, carried out with reference to specific embodiment further Description.
As shown in Figure 1, the drilling processing emulsion sheet of the present invention includes substrate layer 1, the surface coating of the substrate layer 1 It is polyethylene glycol organic coating to have one layer of water-soluble organic coating 2, the water-soluble organic coating.
In a kind of preferably embodiment, the molecular weight of the polyethylene glycol in the water-soluble organic coating is 1000 ~30000.
In a kind of preferably embodiment, the thickness of the water-soluble organic coating is 10 μm~200 μm, such as 10 μm~100 μm.
In a kind of preferably embodiment, the substrate layer is brown paper, art post paperboard, grey paperboard or package paper.
In a kind of preferably embodiment, the thickness of the substrate layer is 0.05mm~2.0mm, such as 0.1mm~ 2.0mm。
In a kind of preferably embodiment, the fusing point of the water-soluble organic coating is 30 DEG C~90 DEG C, such as 50 DEG C~60 DEG C.
The drilling processing emulsion sheet of the present invention is used, when drilling is positioned over emulsion sheet above line plate hole to be drilled, rises To scratching effect;Used water-soluble coating fusing point is 30 DEG C~90 DEG C, and when drill point runs at high speed, the water solubility is organic Coating is by from solid-liquid phase transformation, taking away a large amount of heat, to make drill point cool down;Water-soluble organic coating has excellent Lubricant effect, can effectively promote drill point service life, reduce Hole Wall Roughness.Therefore, drilling processing of the invention is with covering Cover plate can reduce wiring board manufacturing cost, improve wiring board capillary processing quality, have scratching, heat dissipation and lubricating function.
In this description, the present invention is described with reference to its specific embodiment.But it is clear that can still make Various modifications and alterations are without departing from the spirit and scope of the invention.Therefore, the description and the appended drawings should be considered as illustrative And not restrictive.

Claims (6)

1. a kind of drilling processing emulsion sheet, which is characterized in that the emulsion sheet includes substrate layer, the table of the substrate layer Face is provided with water-soluble organic coating, and the water-soluble organic coating is polyethylene glycol coating.
2. drilling processing emulsion sheet according to claim 1, which is characterized in that in the water-soluble organic coating The molecular weight of polyethylene glycol is 1000~30000.
3. drilling processing emulsion sheet according to claim 1, which is characterized in that the thickness of the water-soluble organic coating Degree is 10 μm~200 μm.
4. drilling processing emulsion sheet according to claim 1, which is characterized in that the substrate layer is brown paper, in vain Paperboard, grey paperboard or package paper.
5. drilling processing emulsion sheet according to claim 1, which is characterized in that the thickness of the substrate layer is 0.05mm~2.0mm.
6. drilling processing emulsion sheet according to claim 1, which is characterized in that the water-soluble organic coating melts Point is 30 DEG C~90 DEG C.
CN201810568572.8A 2018-06-05 2018-06-05 Drilling processing emulsion sheet Withdrawn CN108544565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810568572.8A CN108544565A (en) 2018-06-05 2018-06-05 Drilling processing emulsion sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810568572.8A CN108544565A (en) 2018-06-05 2018-06-05 Drilling processing emulsion sheet

Publications (1)

Publication Number Publication Date
CN108544565A true CN108544565A (en) 2018-09-18

Family

ID=63492568

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810568572.8A Withdrawn CN108544565A (en) 2018-06-05 2018-06-05 Drilling processing emulsion sheet

Country Status (1)

Country Link
CN (1) CN108544565A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102049550A (en) * 2009-10-29 2011-05-11 富葵精密组件(深圳)有限公司 Substrate for assisting drilling circuit board and manufacturing method thereof
CN103008729A (en) * 2011-09-27 2013-04-03 合正科技股份有限公司 Drilling auxiliary board for printed circuit board
TWM495914U (en) * 2014-11-07 2015-02-21 Shu-Jing Yang Auxiliary board for drilling
CN105537090A (en) * 2016-02-01 2016-05-04 深圳市宏宇辉科技有限公司 Coating aluminum sheet and technological process for manufacturing same
CN105583889A (en) * 2014-10-22 2016-05-18 合正科技股份有限公司 Cover plate for drilling
CN208745002U (en) * 2018-06-05 2019-04-16 江苏贺鸿电子有限公司 Drilling processing emulsion sheet

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102049550A (en) * 2009-10-29 2011-05-11 富葵精密组件(深圳)有限公司 Substrate for assisting drilling circuit board and manufacturing method thereof
CN103008729A (en) * 2011-09-27 2013-04-03 合正科技股份有限公司 Drilling auxiliary board for printed circuit board
CN105583889A (en) * 2014-10-22 2016-05-18 合正科技股份有限公司 Cover plate for drilling
TWM495914U (en) * 2014-11-07 2015-02-21 Shu-Jing Yang Auxiliary board for drilling
CN105537090A (en) * 2016-02-01 2016-05-04 深圳市宏宇辉科技有限公司 Coating aluminum sheet and technological process for manufacturing same
CN208745002U (en) * 2018-06-05 2019-04-16 江苏贺鸿电子有限公司 Drilling processing emulsion sheet

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20180918