CN109071947A - 用于有机电子器件密封剂的组合物及使用其形成的密封剂 - Google Patents
用于有机电子器件密封剂的组合物及使用其形成的密封剂 Download PDFInfo
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- CN109071947A CN109071947A CN201780028295.5A CN201780028295A CN109071947A CN 109071947 A CN109071947 A CN 109071947A CN 201780028295 A CN201780028295 A CN 201780028295A CN 109071947 A CN109071947 A CN 109071947A
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- sealant
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- monomer
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- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 239000000565 sealant Substances 0.000 title claims abstract description 69
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 239000000178 monomer Substances 0.000 claims abstract description 36
- 239000003230 hygroscopic agent Substances 0.000 claims abstract description 28
- -1 acetal radical Chemical class 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 3
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000000686 lactone group Chemical group 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 2
- 125000005157 alkyl carboxy group Chemical group 0.000 claims description 2
- 125000005189 alkyl hydroxy group Chemical group 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 150000004292 cyclic ethers Chemical class 0.000 claims description 2
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 239000003906 humectant Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 125000000101 thioether group Chemical group 0.000 claims description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 229910021536 Zeolite Inorganic materials 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims 1
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 229910052570 clay Inorganic materials 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000001095 magnesium carbonate Substances 0.000 claims 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- 235000012222 talc Nutrition 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000010457 zeolite Substances 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 32
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000011368 organic material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- FRULOWHFMKCMSZ-UHFFFAOYSA-N (3-methyl-2-oxooxolan-3-yl) prop-2-enoate Chemical compound C=CC(=O)OC1(C)CCOC1=O FRULOWHFMKCMSZ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 2
- GISWNRNUVGGVOS-UHFFFAOYSA-N 3,4-dihydroxybutan-2-yl prop-2-enoate Chemical class OCC(O)C(C)OC(=O)C=C GISWNRNUVGGVOS-UHFFFAOYSA-N 0.000 description 2
- CXMYWOCYTPKBPP-UHFFFAOYSA-N 3-(3-hydroxypropylamino)propan-1-ol Chemical compound OCCCNCCCO CXMYWOCYTPKBPP-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000003682 fluorination reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000005400 gorilla glass Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001631 strontium chloride Inorganic materials 0.000 description 2
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 2
- GONNZDVAFLXPCZ-UHFFFAOYSA-N 1,2,3,4-tetrahydrobenzo[a]anthracene Chemical compound C1=CC2=CC3=CC=CC=C3C=C2C2=C1CCCC2 GONNZDVAFLXPCZ-UHFFFAOYSA-N 0.000 description 1
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- DXBHBZVCASKNBY-UHFFFAOYSA-N 1,2-Benz(a)anthracene Chemical compound C1=CC=C2C3=CC4=CC=CC=C4C=C3C=CC2=C1 DXBHBZVCASKNBY-UHFFFAOYSA-N 0.000 description 1
- ZENYUPUKNXGVDY-UHFFFAOYSA-N 1,4-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=C(C(C)=C)C=C1 ZENYUPUKNXGVDY-UHFFFAOYSA-N 0.000 description 1
- DVFAVJDEPNXAME-UHFFFAOYSA-N 1,4-dimethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(C)=CC=C2C DVFAVJDEPNXAME-UHFFFAOYSA-N 0.000 description 1
- 150000000191 1,4-naphthoquinones Chemical class 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- WVOVXOXRXQFTAS-UHFFFAOYSA-N 1-methyl-7-propan-2-ylphenanthrene-9,10-dione Chemical compound C1=CC=C2C3=CC=C(C(C)C)C=C3C(=O)C(=O)C2=C1C WVOVXOXRXQFTAS-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- KIJPZYXCIHZVGP-UHFFFAOYSA-N 2,3-dimethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=C(C)C(C)=C2 KIJPZYXCIHZVGP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- XXJWUZQJPJLUNE-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethyl 3-methylbut-2-enoate Chemical compound CC(=CC(=O)OCCOCCOCCOCCO)C XXJWUZQJPJLUNE-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- ZXAGXLDEMUNQSH-UHFFFAOYSA-N 2-ethylanthracene Chemical compound C1=CC=CC2=CC3=CC(CC)=CC=C3C=C21 ZXAGXLDEMUNQSH-UHFFFAOYSA-N 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- NTZCFGZBDDCNHI-UHFFFAOYSA-N 2-phenylanthracene-9,10-dione Chemical compound C=1C=C2C(=O)C3=CC=CC=C3C(=O)C2=CC=1C1=CC=CC=C1 NTZCFGZBDDCNHI-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- RSOMAGBQDFHGQR-UHFFFAOYSA-N 3-hydroxypropyl 3-methylbut-2-enoate Chemical compound CC(C)=CC(=O)OCCCO RSOMAGBQDFHGQR-UHFFFAOYSA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- ADLGYEIDDZWIBH-UHFFFAOYSA-N 3-methylbut-2-enoic acid propane Chemical compound CC(=CC(=O)O)C.CCC ADLGYEIDDZWIBH-UHFFFAOYSA-N 0.000 description 1
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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Classifications
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/068—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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Abstract
根据本申请的实施方式的用于密封剂的组合物包含:1)有机硅树脂;2)一种或多种吸湿剂;3)一种或多种光引发剂;和4)能够溶解所述光引发剂的单体。
Description
技术领域
本申请要求于2016年5月11日向韩国知识产权局提交的韩国专利申请第10-2016-0057676号的优先权和权益,其全部内容通过引用并入本文。
本申请涉及一种用于有机电子器件密封剂的组合物及使用该组合物形成的密封剂。
背景技术
通常,有机电子器件是具有如下特征的器件:当电荷注入到设置在正电极和负电极之间的有机层中时,发生诸如发光或电流的现象,并且根据所选的有机材料可以制造发挥各种功能的器件。
作为代表性实例,有机发光二极管(OLED)由于厚度薄、重量轻及优异的彩印(color impression)作为下一代平板显示器受到关注,并且可以在玻璃基板、包含硅的无机材料基板、金属基板以及柔性基板(如相关技术中的塑料基板或金属箔)上制造。这些有机电子器件非常易受湿气和氧气的影响,因此具有如下缺点:当器件暴露在空气中或当湿气从外部进入面板内部时,发光效率和使用寿命显著降低。
为了解决上述问题,已经尝试通过利用使用玻璃盖或金属盖的密封剂膜或层压方法或沉积无机材料来阻挡从外部进入的湿气和氧气。此外,存在如下的方法:通过在有机层或金属层的表面上施加可固化膜或可固化材料,然后进行固化过程来实现粘合性质和封装性质。
然而,由于机械损坏等,玻璃盖在实现大面积方面存在问题,而金属盖由于与基板的热膨胀系数不同而在工艺上存在问题。此外,使用层压方法的粘合剂膜具有诸如通过膜的粘合表面的界面引入湿气和氧气的问题,而在真空下沉积有机材料并且在真空下溅射无机材料的现有工艺存在的问题是,由于无机材料需要在真空下通过溅射系统以多层沉积以防止通过溅射顶部的界面引入水和氧气使得生产率低,而由于有机材料和无机材料需要在真空下以多层形成,使得生产率降低并且不能大规模生产。
另外,液体封装方法的缺点在于,在固化过程中产生的副产物或固化引发剂中的未反应的残留物等保留在气密密封结构内部,从而干扰有机电子器件的驱动或缩短有机电子器件的使用寿命等。
此外,当在有机电子器件的封装期间使用在面板内部设置吸湿剂的金属盖方法时,在使用吸湿剂的金属盖结构中形成以预定高度突出的延伸部分,并且当使用粘合剂将金属盖最后粘合到基板上,或者通过加工玻璃来封装有机发光器件以形成玻璃盖时,使用如下方法:通过使用诸如喷砂或蚀刻的方法将金属盖粘合到基板上以在预定凹槽内设置吸湿剂。相关技术中的方法使得当面板变大时由于封装内部空间增大而难以加工金属盖,并且可能导致玻璃盖受到外部压力易破碎的问题。
发明内容
技术问题
本申请致力于提供一种能够制备密封剂的组合物及使用该组合物的密封剂,所述密封剂可以改善有机电子器件的使用寿命并有效地阻挡从外部进入的氧气或湿气等。
技术方案
本申请的示例性实施方式提供了一种用于密封剂的组合物,其包含:
1)有机硅树脂(silicone resin);
2)一种或多种吸湿剂;
3)一种或多种光引发剂;和
4)能够溶解所述光引发剂的单体。
此外,本申请的另一个示例性实施方式提供了一种使用所述用于密封剂的组合物的密封剂。
此外,本申请的又一个示例性实施方式提供了一种包含所述密封剂的有机电子器件。
有益效果
根据本申请的示例性实施方式的用于密封剂的组合物的特征在于,其可以制造可以改善有机电子器件的使用寿命并且有效地阻挡从外部进入的氧气和湿气等的密封剂。此外,在相关技术中用作密封剂的常规组合物的缺点在于,组合物粘合到有机电子器件上,然后与其它材料混合,从而失去特性,或者由于在粘合期间施加不均匀的压力而不能保持粘合表面之间的间隙。然而,根据本申请的示例性实施方式的用于密封剂的组合物具有以下特征:在将组合物粘合到有机电子器件之后可以很好地保持该间隙,这是因为通过使用可固化组合物固化的材料具有强度,因此即使施加压力,该间隙也不易改变。
具体实施方式
在下文中,将详细描述本申请。
有机EL器件是多晶半导体器件,并且用于液晶背光等,以便在低电压下获得具有高亮度的发光,并且期望作为薄型平板显示器件。然而,存在的问题是有机EL器件对湿气十分敏感,金属电场和有机EL层之间的界面由于湿气的影响可能脱落,由于金属的氧化电阻可能会增大,并且有机材料的质量可能因湿气而改变,结果,有机EL器件不发光,并且亮度可能变差。
为了解决这些问题,已经开发了用可固化组合物封装有机EL器件的方法。作为现有的封装方法,已经提出了的方法有:用丙烯酸树脂模制有机EL器件的方法,通过向有机EL器件的密封剂树脂中添加吸湿剂来防止有机EL器件受潮的方法等。
在这些方法中,最广泛使用的是将密封剂树脂与吸湿剂混合并使用该混合物的方法,但非可固化型密封剂的缺点在于,由于在进行后处理时难以承受高温高压的工艺限制点,因此产率低。
本申请致力于提供一种可固化的密封剂组合物以及使用该可固化的密封剂组合物的密封剂,该可固化的密封剂组合物可以制备一种密封剂,其能够改善有机电子器件的使用寿命并有效地阻挡从外部进入的氧气和湿气等,并且当通过引入可固化系统进行后处理时,可以具有工艺稳定性。
根据本申请的示例性实施方式的用于密封剂的组合物包含:1)有机硅树脂;2)一种或多种吸湿剂;3)一种或多种光引发剂;和4)能够溶解所述光引发剂的单体。
在根据本申请的示例性实施方式的用于密封剂的组合物中,所述有机硅树脂的具体实例包括基于有机聚硅氧烷的树脂(organopolysilicone-based resin)等,但不限于此。此外,下面将更详细地描述所述基于有机聚硅氧烷的树脂的实例。
在所述基于有机聚硅氧烷的树脂中,选自烷基、芳基和烯基中的一种或多种官能团可以与硅氧烷主链键合。
所述烷基的具体实例包括甲基、乙基、丙基、1-甲基乙基、丁基、1-甲基丙基、2-甲基丙基、1,1-二甲基乙基、戊基、1-甲基丁基、1-乙基丙基、2-甲基丁基、3-甲基丁基、1,2-二甲基丙基、2,2-二甲基丙基、己基、庚基、辛基、壬基、癸基、环烷基等,但不限于此。
所述芳基的具体实例包括:苯基;萘基;烷基芳基,例如甲苯基和二甲苯基;芳基烷基,例如苄基和苯乙基等,但不限于此。
所述烯基通常具有2至10个碳原子,并且其具体实例包括乙烯基、烯丙基、甲基丙烯酸基、甲基丙烯酸甲酯基、丙烯酸基等,但不限于此。
所述基于有机聚硅氧烷的树脂优选为选自由以下化学式1表示的化合物中的一种或多种。
[化学式1]
在化学式1中,
R1至R6彼此相同或不同,并且可各自独立地选自氢、烷基、烯基、芳基、缩水甘油基、异氰酸酯基、羟基、羧基、乙烯基、丙烯酸酯基、甲基丙烯酸酯基、环氧基、环醚基、硫醚基、缩醛基、内酯基、酰胺基、烷基芳基、烷基缩水甘油基、烷基异氰酸酯基、烷基羟基、烷基羧基、烷基乙烯基、烷基丙烯酸酯基、甲基丙烯酸烷基酯基、烷基环醚基、烷基硫醚基、烷基缩醛基、烷基内酯基和烷基酰胺基,以及
a、b、c和d各自独立地为0至1的实数,并且(a+b+c+d)为1。
所述基于有机聚硅氧烷的树脂可具有100至1,000,000或1,000至50,000的重均分子量,但重均分子量不限于此。
基于所述用于密封剂的组合物的总重量,所述有机硅树脂的含量可以为1重量%至80重量%,但不限于此。当有机硅树脂的含量在1重量%至80重量%的范围内时,可以混合一定量能够保持足够的吸湿性能的吸湿剂,同时保持与吸湿剂优异的混溶性。当有机硅树脂的含量小于1重量%时,不能混合吸湿剂,当该含量大于80重量%时,不能混合能够获得足以保护器件的吸湿性能的吸湿剂。
在根据本申请的示例性实施方式的用于密封剂的组合物中,所述吸湿剂可赋予所述用于密封剂的组合物的吸湿性,并且可用于调节触变性。所述吸湿剂的具体实例包括选自金属粉末(如氧化铝)、金属氧化物、有机金属氧化物、金属盐或五氧化二磷(P2O5)中的一种或者两种或更多种的混合物,但不限于此。
所述金属氧化物的具体实例包括氧化锂(Li2O)、氧化钠(Na2O)、氧化钡(BaO)、氧化钙(CaO)、氧化镁(MgO)等,所述金属盐的实例包括:硫酸盐,如硫酸锂(Li2SO4)、硫酸钠(Na2SO4)、硫酸钙(CaSO4)、硫酸镁(MgSO4)、硫酸钴(CoSO4)、硫酸镓(Ga2(SO4)3)、硫酸钛(Ti(SO4)2)或硫酸镍(NiSO4);金属卤化物,如氯化钙(CaCl2)、氯化镁(MgCl2)、氯化锶(SrCl2)、氯化钇(YCl3)、氯化铜(CuCl2)、氟化铯(CsF)、氟化钽(TaF5)、氟化铌(NbF5)、溴化锂(LiBr)、溴化钙(CaBr2)、溴化铯(CeBr3)、溴化硒(SeBr4)、溴化钒(VBr3)、溴化镁(MgBr2)、碘化钡(BaI2)或碘化镁(MgI2);或金属氯酸盐,如高氯酸钡(Ba(ClO4)2)或高氯酸镁(Mg(ClO4)2),但实例不限于此。
所述金属氧化物可以在吸湿剂被适当加工的状态下与组合物共混。例如,根据施加密封剂的有机电子器件的种类,所述密封剂可以是厚度为30μm以下的薄膜,并且在这种情况下,可能需要粉碎吸湿剂的过程。在吸湿剂的粉碎中,可以使用诸如三辊研磨机、珠磨机或球磨机的方法。
基于用于密封剂的组合物的总重量,吸湿剂的含量可以为10重量%至90重量%,但不限于此。当基于用于密封剂的组合物的总重量,吸湿剂的含量小于10重量%时,难以获得足以保护器件的吸湿性能,并且当含量超过90重量%时,粘度极度增加,使得吸湿剂可能不适用于该工艺。
在根据本申请的示例性实施方式的用于密封剂的组合物中,光引发剂是热惰性的,但当暴露于化学射线时产生自由基。光引发剂的实例包括取代或未取代的多核醌,其是在共轭碳环状化合物中具有两个环内碳原子的化合物,例如2-苄基-2-(二甲基氨基)-1-(4-吗啉代苯基)-1-丁酮、2,2-二甲氧基-2-苯基苯乙酮、9,10-蒽醌、2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、八甲基蒽醌、1,4-萘醌、9,10-菲醌、苯并蒽-7,12-二酮、2,3-并四苯-5,12-二酮、2-甲基-1,4-萘醌、1,4-二甲基蒽醌、2,3-二甲基蒽醌、2-苯基蒽醌、2,3-二苯基蒽醌、惹登醌retenquinone、7,8,9,10-四氢化萘-5,12-二酮和1,2,3,4-四氢苯并-蒽-7,12-二酮,但不限于此。
基于用于密封剂的组合物的总重量,光引发剂的含量可以为0.1重量%至10重量%,但不限于此。当基于用于密封剂的组合物的总重量,光引发剂的含量小于0.1重量%时,可能出现的问题是,即使在其上照射强紫外线,由于少量的促进固化的活性自由基,固化也不能进行,当该含量超过10重量%时,因为在固化后在低于100℃的温度条件下发生脱气,存在的顾虑是有机发光器件的使用寿命可能缩短。
所述能够溶解光引发剂的单体可包括在与有机硅树脂混合时不引起光学分离的单体。能够溶解光引发剂的单体的具体实例包括基于丙烯酸酯的单体、基于甲基丙烯酸酯的单体、基于硅氧烷的单体等,但不限于此。能够溶解光引发剂的单体优选是具有能够与粘合剂交联的官能团的单体,以便在施加到器件上后不产生脱气,并且可以优选为分子量为1,000以下,优选为400以下的单体,以便满足用有机硅树脂的光学特性。能够溶解光引发剂的单体的实例包括α-甲基丙烯酰氧基-γ-丁内酯、甲基丙烯酸甲酯、甲基丙烯酸羟甲酯、苯乙烯、甲基丙烯酸金刚烷基甲酯、1,6-己二醇二甲基丙烯酸酯、1,6-己二醇二丙烯酸酯、1,3-丙二醇二甲基丙烯酸酯、1,3-丙二醇二丙烯酸酯、新戊二醇二甲基丙烯酸酯、新戊二醇二丙烯酸酯、乙二醇二甲基丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、二乙二醇二丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、四乙二醇二甲基丙烯酸酯、四乙二醇二丙烯酸酯、丁二醇二甲基丙烯酸酯、丁二醇二丙烯酸酯、二丙二醇二甲基丙烯酸酯、二丙二醇二丙烯酸酯等,但不限于此。
基于用于密封剂的组合物的总重量,能够溶解光引发剂的单体的含量可以为0.1重量%至30重量%,但不限于此,因为所用单体的量可以根据所用光引发剂的溶解度而变化。
根据本申请的示例性实施方式的用于密封剂的组合物可另外包含本领域已知的单体,以调节有机硅树脂材料的固化速度。所述单体的具体实例包括基于丙烯酸酯的单体、基于甲基丙烯酸酯的单体、基于硅氧烷的单体等,但不限于此。
所述单体的实例包括三羟乙基丙烷乙氧基三丙烯酸酯(triethylolpropaneethoxy triacrylate)、(甲基)丙烯酸叔丁酯、1,5-戊二醇二(甲基)丙烯酸酯、(甲基)丙烯酸N,N-二乙基氨基乙酯、乙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、1,3-丙二醇二(甲基)丙烯酸酯、癸二醇二(甲基)丙烯酸酯、1,4-环己二醇二(甲基)丙烯酸酯、2,2-二羟甲基丙烷二(甲基)丙烯酸酯、二(甲基)丙烯酸甘油酯、三丙二醇二(甲基)丙烯酸酯、三(甲基)丙烯酸甘油酯、三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、聚氧乙基化三羟甲基丙烷三(甲基)丙烯酸酯、2,2-二-(对羟基苯基)丙烷二丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、2,2-二-(对羟基苯基)丙烷二甲基丙烯酸酯、三乙二醇二丙烯酸酯、聚氧乙基-2,2-二-(对羟基苯基)丙烷二甲基丙烯酸酯、双酚-A的二-(3-甲基丙烯酰氧基-2-羟丙基)醚、双酚A的二-(2-甲基丙烯酰氧基乙基)醚、双酚-A的二-(3-丙烯酰氧基-2-羟丙基)醚、双酚-A的二-(2-丙烯酰氧基乙基)醚、1,4-丁二醇的二-(3-甲基丙烯酰氧基-2-羟丙基)醚、三乙二醇二甲基丙烯酸酯、聚氧丙基三羟甲基丙烷三丙烯酸酯、丁二醇二(甲基)丙烯酸酯、1,2,4-丁三醇三(甲基)丙烯酸酯、2,2,4-三甲基-1,3-戊二醇二(甲基)丙烯酸酯、1-苯基亚乙基-1,2-二甲基丙烯酸酯、富马酸二烯丙酯、苯乙烯、1,4-苯二酚二甲基丙烯酸酯、1,4-二异丙烯基苯、1,3,5-三异丙烯基苯、基于有机硅的单体(silicone-based monomer)、基于有机硅丙烯酸酯的单体(silicone acrylate-based monomer)、基于有机硅氨基甲酸酯的单体(siliconeurethane-based monomer)等,但不限于此。
另外,根据本申请的示例性实施方式的用于密封剂的组合物依其用途可包含一种或多种添加剂,例如固化催化剂、粘度调节剂、固化剂、分散剂、稳定剂和固化促进剂。这些添加剂可以单独使用,也可以两种以上混合使用。
此外,根据本申请的示例性实施方式的密封剂的特征在于使用了所述用于密封剂的组合物。更具体地,根据本申请的示例性实施方式的密封剂可包含:1)有机硅树脂;2)一种或多种吸湿剂;3)一种或多种光引发剂;和4)能够溶解光引发剂的单体。
在根据本申请的示例性实施方式的密封剂中,对有机硅树脂、吸湿剂、光引发剂、能够溶解光引发剂的单体等的描述与上述那些相同,因此将省略其具体描述。
除了使用上述用于密封剂的组合物之外,根据本申请的示例性实施方式的密封剂可以通过使用本领域已知的方法形成。更具体地,可以通过使用在基板上施加、涂覆或印刷所述用于密封剂的组合物的方法来形成密封剂,但是该方法不限于此。
根据本申请的示例性实施方式的用于密封剂的组合物的特征在于,其可以制造可以改善有机电子器件的使用寿命并且有效地阻挡从外部进入的氧气和湿气等的密封剂。此外,在相关技术中作为密封剂应用的通用吸气剂的缺点在于吸气剂粘合到有机电子器件上然后与其他材料混合,从而失去特性,或者由于在粘合期间施加的不均匀的压力而不能保持粘合表面之间的间隙。然而,根据本申请的示例性实施方式的用于密封剂的组合物具有以下特征:在将组合物粘合到有机电子器件之后可以很好地保持该间隙,这是因为通过使用可固化组合物固化的材料具有强度,因此即使施加压力,间隙也不易改变。
根据本申请的示例性实施方式的密封剂可以应用于封装和保护各种物体的密封剂。特别地,所述密封剂可以有效地保护包含对外部因素(例如湿气和湿度)敏感的器件的物体。可以应用密封剂的物体的实例包括:光伏器件、整流器、发射器、或有机电子器件,例如有机发光二极管(OLED);太阳能电池;或二次电池等,但不限于此。
所述密封剂可以有效地固定和支撑上基板和下基板,同时在有机电子器件中表现出优异的防潮特性和光学特性。另外,由于通过制备纳米单位尺寸的吸湿剂并将吸湿剂均匀地分散在用于密封剂的组合物中而使密封剂显示出优异的透明性,无论有机电子器件的类型如何(如顶部发射或底部发射),所述密封剂都可以形成为稳定的密封剂。
除了由上述材料形成密封剂之外,有机电子器件可以具有本领域已知的通用配置。例如,可以使用本领域中通常使用的玻璃、金属或聚合物膜等作为下基板或上基板。此外,有机电子器件可包括例如一对电极和在该对电极之间形成的有机材料层。这里,一对电极中的一个可以由透明电极形成。此外,有机材料层可包括例如空穴传输层、发光层、电子传输层等。
[发明方式]
在下文中,将通过实施例更详细地描述本说明书。然而,提供以下实施例仅用于举例说明本说明书,而不用于限制本说明书。
<实施例>
<实施例1>
将41.4g有机硅树脂(1)(甲基丙烯酸酯聚二甲基硅氧烷,Aldrich)、45g吸湿剂(CaO,Y日本吉泽石灰工业株式会社)和3.6g BASF SE的光引发剂(Irgacure 369)溶解在含量为10重量%的α-甲基丙烯酰氧基-γ-丁内酯(GBLMA)中,并且通过使用调糊机初步混合。将混合的组合物放入三辊研磨机中,并进行三次研磨过程以制备用于吸气剂的粘合剂组合物。向160cc注射器中加入该混合物,然后使用离心机充分除去气泡,并将所得混合物在室温和无水氮气氛下储存在手套箱中。
<实施例2>
除了在实施例1中将光引发剂溶解在含量为10重量%的1,6-己二醇二甲基丙烯酸酯(HDDA)中以外,使用与实施例1中相同的方法制备组合物。
<对比实施例1>
除了在实施例1中,将光引发剂直接引入组合物中而不使用可溶性单体,然后将未使用的单体的重量部分用有机硅树脂替代以外,使用与实施例1中相同的方法制备组合物。
<对比实施例2>
除了在实施例1中,将有机硅树脂(1)变为41.4g由Miwon有限公司制造的丙烯酸树脂以外,使用与实施例1中相同的方法制备组合物。
<对比实施例3>
除了在实施例1中,将有机硅树脂(1)变为1g甲基丙烯酸酯聚二甲基硅氧烷(Aldrich),并且将吸湿剂(CaO,Yoshizawa)的重量变为85.4g以外,使用与实施例1中相同的方法制备组合物。
<对比实施例4>
除了在实施例1中,将有机硅树脂(1)变为81.4g甲基丙烯酸酯聚二甲基硅氧烷(Aldrich),并且将吸湿剂(CaO,Yoshizawa)的重量变为5g以外,使用与实施例1中相同的方法制备组合物。
[表1]
评价实施例1和2以及对比实施例1至4中制备的组合物的特性,评价结果示于下表2中。
[表2]
对于触变指数(T.I.),通过使用流变仪分析根据每个剪切速率的粘度。得到的T.I.值为在3 1/s的粘度值除以在30 1/s的粘度值得到的值。
对于固化能量,在通过使用光流变仪(全固化)在UV-A波长范围内照射UV进行曝光时,确认粘度增加,并且将粘度不随时间增加的区间确定为固化能量。
对于保存期限,通过将每个样品放置于40℃的条件下,定期确认每次的粘度,然后确认粘度增加超过50%的时间。
对于排出特性,通过使用具有20G尺寸的喷嘴并使用由Musashi Engineering有限公司制造的50cc注射器以250Kpa的压力将样品排出10秒来获得排出的样品量,并且当排出量可以在0.0005g和0.003g之间调节时,确定排出特性良好。
对于真空粘合加工性,将样品线分配在厚度为0.5mm的gorilla玻璃上,然后使用相同的玻璃将样品粘合到gorilla玻璃上以具有100μm的间隙,粘合的样品在真空室中放置1周,确定当分配线的宽度不改变时真空粘合加工性良好。
对于吸湿量,将3g每种样品在培养皿上薄薄地铺展,将样品在85%RH和85℃条件下放置7天,然后确认样品重量的变化来获得3g每种样品吸收的湿气量。
通过热解炉对脱气进行取样并使用GC/MS进行分析。通过在280℃的热解炉温度和300℃的GC炉温度的条件下进行分析来获得脱气。
如结果中所述,根据本申请的示例性实施方式的用于密封剂的组合物的特征在于,可以制备可以改善有机电子器件的使用寿命并且有效地阻挡从外部进入的氧气和湿气等的密封剂。此外,在相关技术中用作密封剂的常规组合物的缺点在于组合物粘合到有机电子器件上,然后与其它材料混合,从而失去特性,或者由于在粘合期间施加不均匀的压力而不能保持粘合表面之间的间隙。然而,根据本申请的示例性实施方式的用于密封剂的组合物具有以下特征:在将组合物粘合到有机电子器件之后可以很好地保持该间隙,这是因为通过使用可固化组合物固化的材料具有强度,因此即使施加压力,该间隙也不容易改变。
Claims (12)
1.一种用于密封剂的组合物,其包含:
1)有机硅树脂;
2)一种或多种吸湿剂;
3)一种或多种光引发剂;和
4)能够溶解所述光引发剂的单体。
2.如权利要求1所述的组合物,其中,所述有机硅树脂为基于有机聚硅氧烷的树脂。
3.如权利要求2所述的组合物,其中,所述基于有机聚硅氧烷的树脂为选自以下化学式1表示的化合物中的一种或多种:
[化学式1]
在化学式1中,
R1至R6彼此相同或不同,并且各自独立地选自氢、烷基、烯基、芳基、缩水甘油基、异氰酸酯基、羟基、羧基、乙烯基、丙烯酸酯基、甲基丙烯酸酯基、环氧基、环醚基、硫醚基、缩醛基、内酯基、酰胺基、烷基芳基、烷基缩水甘油基、烷基异氰酸酯基、烷基羟基、烷基羧基、烷基乙烯基、烷基丙烯酸酯基、甲基丙烯酸烷基酯基、烷基环醚基、烷基硫醚基、烷基缩醛基、烷基内酯基和烷基酰胺基,以及
a、b、c和d各自独立地为0至1的实数,并且(a+b+c+d)为1。
4.如权利要求1所述的组合物,其中,基于所述用于密封剂的组合物的总重量,所述有机硅树脂的含量为1重量%至80重量%。
5.如权利要求1所述的组合物,其中,所述吸湿剂包括选自金属粉末、金属氧化物、有机金属氧化物、金属盐和五氧化二磷(P2O5)中的一种或多种。
6.如权利要求1所述的组合物,其中,基于所述用于密封剂的组合物的总重量,所述吸湿剂的含量为10重量%至90重量%。
7.如权利要求1所述的组合物,其进一步包含:
选自粘土、滑石、二氧化硅、硫酸钡、氢氧化铝、碳酸钙、碳酸镁、沸石、氧化锆、二氧化钛和蒙脱土中的一种或多种无机填料。
8.如权利要求1所述的组合物,其中,基于所述用于密封剂的组合物的总重量,所述光引发剂的含量为0.1重量%至10重量%。
9.如权利要求1所述的组合物,其中,所述能够溶解光引发剂的单体包括选自基于丙烯酸酯的单体和基于甲基丙烯酸酯的单体中的一种或多种。
10.如权利要求1所述的组合物,其中,基于所述用于密封剂的组合物的总重量,所述能够溶解光引发剂的单体的含量为0.1重量%至30重量%,并且
所述能够溶解光引发剂的单体具有1,000以下的分子量。
11.一种密封剂,其是使用根据权利要求1至10中任一项所述的用于密封剂的组合物形成的。
12.一种有机电子器件,其包含根据权利要求11所述的密封剂。
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Application publication date: 20181221 |