CN108993096B - A thermal recycling system for membrane-based gas absorption - Google Patents
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 15
- 238000004064 recycling Methods 0.000 title claims abstract description 6
- 239000012528 membrane Substances 0.000 title claims description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 50
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 20
- 238000010494 dissociation reaction Methods 0.000 claims description 19
- 230000005593 dissociations Effects 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000012774 insulation material Substances 0.000 claims description 4
- 230000005679 Peltier effect Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000002918 waste heat Substances 0.000 abstract description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
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Abstract
本发明涉及热交换技术，提出一种针对膜基气体吸收的热循环利用系统，包括：升温装置(3)，设置在第一容器(1)和第二容器(2)的一个输送导管上；降温装置(4)，设置在第一容器(1)和第二容器(2)的一个回流导管上；热循环装置，热循环装置设置在升温装置(3)和降温装置(4)之间，用于将输送导管内的高温流体和回流导管内的低温流体进行热交换，其中，所述热循环装置包括半导体组，半导体组通过导热元件连接在升温装置(3)和降温装置(4)之间，而且半导体组通电。本发明直接利用装置中的余热，配合少量的电能就可以完成热量从低温热源到高温热源的传递，而且装置的占地面积会大大减小，紧凑度大大提高。
The invention relates to heat exchange technology, and proposes a heat recycling system for film-based gas absorption, which includes: a heating device (3), which is arranged on a delivery conduit of the first container (1) and the second container (2); The cooling device (4) is arranged on a return conduit of the first container (1) and the second container (2); the thermal circulation device is arranged between the heating device (3) and the cooling device (4), It is used to perform heat exchange between high-temperature fluid in the delivery conduit and low-temperature fluid in the return conduit, wherein the thermal cycle device includes a semiconductor group, and the semiconductor group is connected between the heating device (3) and the cooling device (4) through a thermal conductive element. time, and the semiconductor group is powered on. The present invention directly uses the waste heat in the device and uses a small amount of electric energy to complete the transfer of heat from a low-temperature heat source to a high-temperature heat source, and the device's footprint is greatly reduced and its compactness is greatly improved.
Description
技术领域Technical field
本发明涉及热交换技术，更具体地，涉及一种针对膜基气体吸收的热循环利用装置和系统。The present invention relates to heat exchange technology, and more specifically, to a heat recycling device and system for membrane-based gas absorption.
背景技术Background technique
膜吸收是一种将膜技术与普通吸收技术结合的一种新型吸收过程，它具有气液流动互不干扰，比表面积大气液接触面积大的优点。膜吸收的过程主要由吸收和解离两个部分组成，其中吸收部分的温度在低温区(例如30℃)，解离部分的温度约为高温区(例如65℃5)。通常情况下，吸收与解离中加热与冷却是单独进行的，需要两套设备，这么做需要消耗的能量较大，而且装置也会因此增加不少面积。Membrane absorption is a new type of absorption process that combines membrane technology with ordinary absorption technology. It has the advantages that gas and liquid flows do not interfere with each other, and the specific surface area is large in contact with air and liquid. The process of membrane absorption mainly consists of two parts: absorption and dissociation. The temperature of the absorption part is in the low temperature zone (for example, 30°C), and the temperature of the dissociation part is about the high temperature zone (for example, 65°C5). Normally, heating and cooling are performed separately during absorption and dissociation, requiring two sets of equipment. Doing so consumes a lot of energy and increases the area of the device.
发明内容Contents of the invention
针对现有技术中的问题，本发明提出了一种针对膜基气体吸收的热循环利用系统，包括：升温装置，设置在第一容器和第二容器的一个输送导管上；降温装置，设置在第一容器和第二容器的一个回流导管上；热循环装置，热循环装置设置在升温装置和降温装置之间，用于将输送导管内的高温流体和回流导管内的低温流体进行热交换，其中，所述热循环装置包括半导体组，半导体组通过导热元件连接在升温装置和降温装置之间，而且半导体组通电。In view of the problems in the prior art, the present invention proposes a thermal recycling system for film-based gas absorption, which includes: a heating device arranged on a delivery conduit of the first container and the second container; a cooling device arranged on On a return conduit of the first container and the second container; a thermal cycle device, the thermal cycle device is arranged between the heating device and the cooling device, and is used for heat exchange between the high-temperature fluid in the delivery conduit and the low-temperature fluid in the return conduit, Wherein, the thermal cycle device includes a semiconductor group, the semiconductor group is connected between the heating device and the cooling device through a thermal conductive element, and the semiconductor group is energized.
可选地，所述热循环利用装置包括：连接在半导体端部的导热元件，所述导热元件包括导热凝胶和铜板，导热凝胶涂在铜板上。Optionally, the heat recycling device includes: a thermal conductive element connected to the end of the semiconductor, the thermal conductive element includes thermal conductive gel and a copper plate, and the thermal conductive gel is coated on the copper plate.
可选地，所述半导体组由P型半导体片和N型半导体片组成，其中N型半导体连接电源正极，P型半导体片连接电源负极。Optionally, the semiconductor group is composed of a P-type semiconductor chip and an N-type semiconductor chip, where the N-type semiconductor is connected to the positive electrode of the power supply, and the P-type semiconductor chip is connected to the negative electrode of the power supply.
可选地，所述半导体组包括多组P型半导体片和N型半导体片，最外的N型半导体连接电源正极，最外的P型半导体片连接电源负极。Optionally, the semiconductor group includes multiple groups of P-type semiconductor chips and N-type semiconductor chips, the outermost N-type semiconductor is connected to the positive electrode of the power supply, and the outermost P-type semiconductor chip is connected to the negative electrode of the power supply.
可选地，所述的系统还包括：微结构换热元件，所述微结构换热元件位于升温装置和降温装置内部，微结构换热元件一端连接到所述热循环装置。Optionally, the system further includes: a microstructure heat exchange element, which is located inside the heating device and the cooling device, and one end of the microstructure heat exchange element is connected to the thermal cycle device.
可选地，所述微结构换热元件内部有用于流体通过的多个孔洞。Optionally, the microstructure heat exchange element has a plurality of holes inside for fluid to pass through.
可选地，所述微结构换热元件具有隔热材料包裹的铜丝，铜丝连接到热循环装置。Optionally, the microstructure heat exchange element has copper wires wrapped with thermal insulation material, and the copper wires are connected to the thermal circulation device.
可选地，所述铜丝连接到导热凝胶和/或铜板上。Optionally, the copper wire is connected to thermally conductive gel and/or copper plate.
可选地，第一容器为吸附箱，第二容器为解离箱，吸附箱的液体部分和解离箱的液体部分通过所述输送导管和所述回流导管连接。Optionally, the first container is an adsorption tank, the second container is a dissociation tank, and the liquid part of the adsorption tank and the liquid part of the dissociation tank are connected through the delivery conduit and the return conduit.
可选地，吸附箱内部具有非对称膜以隔开液体部分和气体部分，解离箱内部具有非对称膜以隔开液体部分和气体部分。Optionally, there is an asymmetric membrane inside the adsorption box to separate the liquid part and the gas part, and there is an asymmetric membrane inside the dissociation box to separate the liquid part and the gas part.
本发明的有益效果为：The beneficial effects of the present invention are:
而本专利为了增加能量的利用效率，选择使用半导体利用其珀尔帖效应来将冷端的温度传向热端，借以达到减少能量消耗的目的。In order to increase the energy utilization efficiency, this patent chooses to use semiconductors to use their Peltier effect to transfer the temperature of the cold end to the hot end, thereby achieving the purpose of reducing energy consumption.
如果利用本发明，则可以直接利用装置中的余热，配合少量的电能就可以完成热量从低温热源到高温热源的传递，而且装置的占地面积会大大减小，紧凑度大大提高。If the present invention is used, the waste heat in the device can be directly utilized, and with a small amount of electric energy, the heat transfer from the low-temperature heat source to the high-temperature heat source can be completed, and the floor space of the device will be greatly reduced and the compactness will be greatly improved.
附图说明Description of the drawings
图1为本发明的装置的结构原理图。Figure 1 is a schematic structural diagram of the device of the present invention.
图2为微换热元件的剖面图。Figure 2 is a cross-sectional view of the micro heat exchange element.
图3为微换热元件的侧视图。Figure 3 is a side view of the micro heat exchange element.
附图标记Reference signs
吸附箱1，解离箱2，升温装置3，降温装置4，导热元件5。Adsorption box 1, dissociation box 2, heating device 3, cooling device 4, thermal conductive element 5.
具体实施方式Detailed ways
下面参照附图描述本发明的实施方式，其中相同的部件用相同的附图标记表示。在不冲突的情况下，下述的实施例及实施例中的技术特征可以相互组合。Embodiments of the present invention are described below with reference to the accompanying drawings, in which like components are designated with like reference numerals. The following embodiments and the technical features in the embodiments can be combined with each other unless there is any conflict.
本发明的系统包括吸附箱1，解离箱2，升温装置3，降温装置4以及导热元件5。The system of the present invention includes an adsorption box 1, a dissociation box 2, a heating device 3, a cooling device 4 and a thermal conductive element 5.
吸附箱1(第一容器)为长方体结构，中间由非对称膜隔开。其中吸附箱1的左半部分(图中G表示气体)为气体部分，右半部分为液体部分(图中L表示液体部分)，因此非对称膜中致密膜在靠近液体的右侧，过滤膜在左侧。解离箱2(第二容器)为长方体结构，中间由非对称膜隔开。解离箱2与吸附箱1则相反，左侧为液体部分(图中L表示液体部分)，右侧为气体部分(图中G表示气体)，因此非对成膜的致密膜在左边，过滤膜在右边。吸附箱1与解离箱2的气体与液体部分皆接有上下两根导管，来保证气体与液体的输运，其中液体部分所连接的导管要求有较好的传热性能，来保证半导体传热的效率。The adsorption box 1 (first container) has a rectangular parallelepiped structure and is separated by an asymmetric membrane in the middle. The left half of the adsorption box 1 (G in the figure represents gas) is the gas part, and the right half is the liquid part (L in the figure represents the liquid part). Therefore, the dense membrane in the asymmetric membrane is on the right side close to the liquid, and the filter membrane on the left. The dissociation box 2 (second container) has a rectangular parallelepiped structure and is separated by an asymmetric membrane in the middle. The dissociation box 2 is opposite to the adsorption box 1. The left side is the liquid part (L in the figure represents the liquid part) and the right side is the gas part (G in the figure represents the gas). Therefore, the non-pair-forming dense membrane is on the left, filtering The membrane is on the right. The gas and liquid parts of the adsorption box 1 and the dissociation box 2 are connected to two upper and lower conduits to ensure the transportation of gas and liquid. The conduits connected to the liquid part require good heat transfer performance to ensure semiconductor transfer. thermal efficiency.
在从吸附箱1的液体部分到解离箱2的液体部分的连接导管(输送导管)上，设置升温装置3。在从解离箱2的液体部分到吸附箱1的液体部分的连接导管(回流导管)上，设置降温装置4。另外，为了保证所需的吸附与解离的温度，加装了半导体传热装置来对热量进行传递，将需要降温的部分的热量传给需要升温的部分The temperature increasing device 3 is provided on the connecting conduit (transfer conduit) from the liquid part of the adsorption tank 1 to the liquid part of the dissociation tank 2 . A cooling device 4 is provided on the connecting conduit (return conduit) from the liquid part of the dissociation tank 2 to the liquid part of the adsorption tank 1 . In addition, in order to ensure the required adsorption and dissociation temperature, a semiconductor heat transfer device is installed to transfer heat, and transfer the heat from the part that needs to be cooled to the part that needs to be heated.
在升温装置3和降温装置4之间，连接有传热装置，所述传热装置包括：P型半导体片、N型半导体片、金属板、导热元件5。N型半导体连接电源正极，P型半导体连接电源负极。P型半导体片通过金属板和导热元件5连接在升温装置3和降温装置4之间，N型半导体片通过金属板和导热元件5连接在升温装置3和降温装置4之间。导热元件5可以是导热凝胶。金属板可以是铜板。所述金属板和导热元件5可以是多块组合而成，例如可以两块铜板中间加一层很薄的导热凝胶。由于导热凝胶的特性，使用导热凝胶不仅可以获得极好的传热性能，同时由于其化学性质稳定也增加了设备的使用寿命。A heat transfer device is connected between the heating device 3 and the cooling device 4. The heat transfer device includes: P-type semiconductor sheet, N-type semiconductor sheet, metal plate, and thermal conductive element 5. The N-type semiconductor is connected to the positive pole of the power supply, and the P-type semiconductor is connected to the negative pole of the power supply. The P-type semiconductor sheet is connected between the heating device 3 and the cooling device 4 through the metal plate and the thermal conductive element 5, and the N-type semiconductor sheet is connected between the heating device 3 and the cooling device 4 through the metal plate and the thermal conductive element 5. The thermally conductive element 5 may be a thermally conductive gel. The metal plate may be a copper plate. The metal plate and the thermal conductive element 5 can be composed of multiple pieces. For example, a thin layer of thermal conductive gel can be added between two copper plates. Due to the characteristics of thermally conductive gel, the use of thermally conductive gel not only achieves excellent heat transfer performance, but also increases the service life of the equipment due to its stable chemical properties.
另外，所述传热装置可以包括多个P型半导体片和N型半导体片(图1中仅显示一个P型半导体片和一个N型半导体片)。最边上的接在降温装置4上的P型与N型半导体片需要各接一个导热凝胶与铜板组，其余的每个半导体片组连接一个导热凝胶与铜板组。最后，向最边上的N型半导体连接电源正极，P型半导体片连接电源负极。In addition, the heat transfer device may include a plurality of P-type semiconductor sheets and N-type semiconductor sheets (only one P-type semiconductor sheet and one N-type semiconductor sheet are shown in FIG. 1 ). The outermost P-type and N-type semiconductor chips connected to the cooling device 4 need to be connected to a thermal conductive gel and copper plate group respectively, and each of the remaining semiconductor chip groups is connected to a thermal conductive gel and copper plate group. Finally, connect the positive pole of the power supply to the N-type semiconductor on the edge, and connect the negative pole of the power supply to the P-type semiconductor piece.
升温装置3和降温装置4内设置有微结构换热元件，其结构如图2-3所示。微结构换热元件采用铜管做材料来加强其传热能力，前端与后端分别有一部分具有螺纹便于与其他部件相连接。微结构换热元件内部有多个孔洞(例如方形)，便于在流体通过时加强换热效果，提高传热能力。其热量通过由隔热材料包裹的铜丝传递给所述传热装置的导热凝胶与铜板组，并通过半导体传热装置进行传导。增加隔热材料是为了在铜丝传热的途中保证热量不会有多余的散失。Microstructure heat exchange elements are provided in the heating device 3 and the cooling device 4, and their structures are shown in Figure 2-3. The microstructured heat exchange element is made of copper tubes to enhance its heat transfer capacity. The front and rear ends have threads for easy connection with other components. There are multiple holes (such as squares) inside the microstructure heat exchange element to enhance the heat exchange effect and improve the heat transfer capacity when the fluid passes through. The heat is transferred to the thermal conductive gel and copper plate group of the heat transfer device through the copper wire wrapped by the thermal insulation material, and is conducted through the semiconductor heat transfer device. The purpose of adding thermal insulation material is to ensure that there is no excess heat loss during the heat transfer process of the copper wire.
以二氧化碳及氮气为例来描述本发明的系统的运行过程。二氧化碳及氮气的混合气体通过第一根管道进入吸附箱1。吸附箱1的左侧为气体部分，其中二氧化碳气体通过带有致密膜的非对称膜进入右边的吸收液，氮气无法透过非对称膜因此随着上方第二根管道排出。采用非对称膜是为了在不降低气体吸收率的情况下更好的保证两侧压力不至于使液体透出。Carbon dioxide and nitrogen are used as examples to describe the operation process of the system of the present invention. The mixed gas of carbon dioxide and nitrogen enters the adsorption box 1 through the first pipe. The left side of the adsorption box 1 is the gas part, in which carbon dioxide gas enters the absorption liquid on the right through an asymmetric membrane with a dense membrane. Nitrogen cannot pass through the asymmetric membrane and is discharged through the second pipe above. The purpose of using an asymmetric membrane is to better ensure that the pressure on both sides does not cause liquid to leak out without reducing the gas absorption rate.
从吸附箱1出来的含二氧化碳的吸附液进入管道，经由升温装置3进行加热，随后进入解离箱2。在解离箱2中，由于温度原因二氧化碳会从液体测扩散至气体侧，经由扫气将其带出。经过解离的吸收液通过降温装置4获得较低温度后，再次进入吸附箱1进行下一轮的循环。The carbon dioxide-containing adsorption liquid coming out of the adsorption box 1 enters the pipeline, is heated through the temperature increasing device 3, and then enters the dissociation box 2. In the dissociation box 2, due to temperature reasons, carbon dioxide diffuses from the liquid side to the gas side and is brought out via the scavenging gas. After the dissociated absorption liquid reaches a lower temperature through the cooling device 4, it enters the adsorption box 1 again for the next cycle.
在这其中，升温装置3的热量来自降温装置，由于温差不大，可以通过珀尔帖效应(传热效率与电流以及珀尔帖系数有关)，用很低的电量就完成35℃温差之间的热量传递，大约使用20w电量就可以使1kg流体完成1秒钟的热量传递。将低温装置3最边上两铜片端通上直流电，注意正极连在N型半导体上，负极连在P型半导体上，这样完成从低温部分到高温部分的热量传递。Among them, the heat of the heating device 3 comes from the cooling device. Since the temperature difference is not large, the Peltier effect (heat transfer efficiency is related to the current and the Peltier coefficient) can be used to complete the 35°C temperature difference with very low electricity. For heat transfer, approximately 20W of electricity can be used to complete the heat transfer of 1kg of fluid for 1 second. Connect the two copper ends of the low-temperature device 3 with direct current. Note that the positive electrode is connected to the N-type semiconductor and the negative electrode is connected to the P-type semiconductor. This completes the heat transfer from the low-temperature part to the high-temperature part.
以上所述的实施例，只是本发明较优选的具体实施方式，本领域的技术人员在本发明技术方案范围内进行的通常变化和替换都应包含在本发明的保护范围内。The above-described embodiments are only preferred specific implementations of the present invention, and ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.
Claims (5)
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| CN1273565A (en) * | 1997-10-03 | 2000-11-15 | Usf过滤分离集团公司 | Purification of liquid flow |
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| KR20110031940A (en) * | 2011-03-16 | 2011-03-29 | 임광희 | Visible ray utilizing devices to treat waste-air |
| WO2012144189A1 (en) * | 2011-04-21 | 2012-10-26 | パナソニック株式会社 | Device for adsorbing and emitting carbon dioxide |
| WO2015109283A1 (en) * | 2014-01-20 | 2015-07-23 | Prism Analytical Technologies, Inc. | Ambient air purifier with humidification and dehumidification |
| CN106523057A (en) * | 2016-11-24 | 2017-03-22 | 华北电力大学 | Atmospheric low temperature source utilization device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1273565A (en) * | 1997-10-03 | 2000-11-15 | Usf过滤分离集团公司 | Purification of liquid flow |
| CN1759922A (en) * | 2004-10-13 | 2006-04-19 | 中国科学院大连化学物理研究所 | A kind of application of membrane module in mixed gas separation of adopting the densified polymer film |
| KR20110031940A (en) * | 2011-03-16 | 2011-03-29 | 임광희 | Visible ray utilizing devices to treat waste-air |
| WO2012144189A1 (en) * | 2011-04-21 | 2012-10-26 | パナソニック株式会社 | Device for adsorbing and emitting carbon dioxide |
| WO2015109283A1 (en) * | 2014-01-20 | 2015-07-23 | Prism Analytical Technologies, Inc. | Ambient air purifier with humidification and dehumidification |
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