CN108666189A - A kind of multistation automatic centering device under high temperature high vacuum environment - Google Patents
A kind of multistation automatic centering device under high temperature high vacuum environment Download PDFInfo
- Publication number
- CN108666189A CN108666189A CN201810462781.4A CN201810462781A CN108666189A CN 108666189 A CN108666189 A CN 108666189A CN 201810462781 A CN201810462781 A CN 201810462781A CN 108666189 A CN108666189 A CN 108666189A
- Authority
- CN
- China
- Prior art keywords
- mcp
- chassis
- positioning mechanism
- vacuum chamber
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/263—Sealing together parts of vessels specially adapted for cathode-ray tubes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses the multistation automatic centering devices under a kind of high temperature high vacuum environment, including main vacuum chamber, main vacuum chamber is located on chamber chassis, bearing rotary positioning mechanism is equipped in main vacuum chamber, the main shaft of bearing rotary positioning mechanism is pierced by main vacuum chamber and is fixed on chamber chassis, it supports rotary positioning mechanism and is equipped with three stations for placing workpiece, workpiece is fixed on by workpiece holder on bearing rotary positioning mechanism, workpiece holder is equipped with guide pad, the lower section of main vacuum chamber is equipped with MCP Component trays, MCP components are carried on MCP Component trays, MCP components can cut down disk under including, MCP elevating mechanisms are equipped with below MCP Component trays, MCP elevating mechanisms are located at MCP intracavitary.Beneficial effects of the present invention：Using the preliminary to the heart of rotary positioning mechanism three station workpiece of realization is supported, then utilize adjusting chassis in MCP Component trays can be in the geometric dimension realization automatic centering for supporting 360 degree of characteristics free to slide and workpiece holder guiding bottom in horizontal direction in adjustment disk.
Description
Technical field
The present invention relates to technological equipment, the multistation automatic centering dress under a kind of high temperature high vacuum environment is related in particular to
It sets.
Background technology
In three station cathode transfer systems, workpiece is a kind of elliposoidal glass shell abbreviation glass bulb, and equipment vacuum cavity is
Multiple observation panels are arranged on bell jar cavity in bell-jar structure, liftable, and three glass bulbs can surround bell jar chamber central axis simultaneously
Rotation, three ellipsoid glass bulbs can shift switching on two station of one station of process and process simultaneously.Bottom of the frame is arranged three
One station chamber of process and three two station chambers of process, each chamber circle distribution use fluorine glue between bell jar cavity and bottom plate
Circle sealing.Equipment is by parts such as cavity, cooling system, vacuum system, heating system, workpiece rotary positioning mechanism, control systems
Composition.A very important step process is to realize MCP components in this equipment（Disk can be cut down containing under）With workpiece（Containing can above cut down disk）'s
Indium seals.Due to the influence of current various uncertain factors during indium seals, such as the inconsistency of workpiece size, showing can cut down
Disk sealing surface can cut down the coaxiality deviation etc. of disk axis and workpiece to the perpendicularity deviation of axis of workpiece；The rotation of rotary table is fixed
Position error；Equipment site error caused by due to heating；Installation error of glass bulb etc. factor causes that disk indium envelope can be cut down up and down
Degree of eccentricity precision it is difficult to ensure that.
Invention content
For the problems in the relevant technologies, the present invention proposes the multistation automatic centering dress under a kind of high temperature high vacuum environment
It sets, can realize the high-precision requirement of indium envelope concentricity.
In order to achieve the above technical purposes, the technical scheme is that it is such：
A kind of multistation automatic centering device under high temperature high vacuum environment, including main vacuum chamber, the main vacuum chamber position
Rotary positioning mechanism is supported in being equipped on chamber chassis, in the main vacuum chamber, the main shaft of the bearing rotary positioning mechanism
It is pierced by the main vacuum chamber to be fixed on chamber chassis, the bearing rotary positioning mechanism is equipped with three works for placing workpiece
Position, the workpiece are fixed on by workpiece holder on bearing rotary positioning mechanism, and the workpiece holder is equipped with guide pad, described
The lower section of main vacuum chamber is equipped with MCP Component trays, and MCP components, the MCP components packet are carried on the MCP Component trays
Disk can be cut down by including down, and MCP elevating mechanisms are equipped with below the MCP Component trays, and the MCP elevating mechanisms are located at MCP intracavitary；
The MCP Component trays include adjust chassis and support adjustment disk, it is described adjust chassis inner circle with support adjustment disk it
Between gap in be placed with adjusting shrapnel, heating support plate and ceramic electrode disk, the support are fixed on the adjusting chassis
Adjustment disk pressure ring, the MCP elevating mechanisms connection of the support adjustment disk and lower section are fixed on adjustment disk.
Further, the adjusting shrapnel is equipped with 8.
Further, the adjusting shrapnel uses high resiliency steel.
Further, the gap between the inner circle for adjusting chassis and support adjustment disk is 5mm.
Further, the heating support plate, ceramic electrode disk, which are bolted on, is adjusted on chassis.
Further, the adjustment disk pressure ring is bolted on support adjustment disk.
Beneficial effects of the present invention：The preliminary to the heart of three station workpiece is realized using bearing rotary positioning mechanism, ensures MCP
Disk can be cut down under component can enter workpiece holder guiding, then utilize adjusting chassis in MCP Component trays can be in support adjustment disk
360 degree of characteristics free to slide and workpiece holder are oriented to the geometric dimension of bottom in interior horizontal direction（It need to ensure geometric tolerance）It is real
Existing automatic centering；By adjust chassis and support adjustment disk between gap can make up hold rotary positioning mechanism positioning it is inclined
Difference, the manufacture deviation of workpiece size, position deviation, many uncertain factors such as installation error of workpiece cause as caused by heated
Deviation, realize indium envelope concentricity high-precision requirement.
Description of the drawings
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the knot of the multistation automatic centering device under a kind of high temperature high vacuum environment according to embodiments of the present invention
Structure schematic diagram；
Fig. 2 be single station according to embodiments of the present invention to the heart when structural schematic diagram；
Fig. 3 is the structural schematic diagram of the workpiece holder according to embodiments of the present invention；
Fig. 4 is the partial structural diagram of the MCP components and MCP Component trays according to embodiments of the present invention；
Fig. 5 is the structural schematic diagram of the support adjustment disk according to embodiments of the present invention；
Fig. 6 is the structural schematic diagram of the adjusting shrapnel according to embodiments of the present invention；
Fig. 7 is indium seal technique flow chart of the present invention.
In figure：
1, main vacuum chamber；2, workpiece；3, MCP components；31, disk can be cut down down；4, rotary positioning mechanism is supported；5, workpiece holder；
51, guide pad；6, chamber chassis；7, MCP Component trays；71, support plate is heated；72, ceramic electrode disk；73, adjustment disk pressure ring；
74, adjustment disk is supported；75, shrapnel is adjusted；76, chassis is adjusted；8, MCP elevating mechanisms；9, MCP chambers.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained belong to what the present invention protected
Range.
As shown in figs. 1-7, the multistation automatic centering device under a kind of high temperature high vacuum environment, including main vacuum chamber 1,
The main vacuum chamber 1 is located on chamber chassis 6, and bearing rotary positioning mechanism 4, the branch are equipped in the main vacuum chamber 1
The main shaft for holding rotary positioning mechanism 4 is pierced by the main vacuum chamber 1 and is fixed on chamber chassis 6, the bearing rotational positioning machine
Structure 4 is equipped with three stations for placing workpiece 2, and the workpiece 2 is fixed on by workpiece holder 5 on bearing rotary positioning mechanism 4,
The workpiece holder 5 is equipped with guide pad 51, and guide pad 51, which divides, limits the lower direction of motion reality that can cut down disk 31 when being sealed for indium
Existing automatic centering；The lower section of the main vacuum chamber 1 is equipped with MCP Component trays 7, and MCP is carried on the MCP Component trays 7
Component 3, the MCP components 3 can cut down disk 31 under including, 7 lower section of the MCP Component trays is equipped with MCP elevating mechanisms 8, the MCP
Elevating mechanism 8 is located in MCP chambers 9；The MCP Component trays 7 include adjusting chassis 76 and support adjustment disk 74, the adjusting bottom
The gap of 5mm is formed between the inner circle and support adjustment disk 74 of disk 76, adjusting chassis 76 can be horizontal in support adjustment disk 74
On direction 360 degree it is free to slide；It is placed with 8 adjusting shrapnels 75 in gap, both can guarantee support chassis 76 under natural conditions
And MCP components 3 are free to slide when supporting 74 center of adjustment disk that can cut down disk 31 under again into the guiding of workpiece holder 5 thereon,
Automatic centering is completed by geometric dimension, ensures that indium seals precision；Heating support plate 71 and pottery are fixed on the adjusting chassis 76
Porcelain electrode disk 72 is fixed with adjustment disk pressure ring 73 on the support adjustment disk 74, and the limitation of adjustment disk pressure ring 73 is utilized to adjust chassis
76 movement in the vertical direction, while shrapnel 75 will be adjusted and be limited in support 74 card slot of adjustment disk；The support adjustment disk
74 connect with the MCP elevating mechanisms 8 of lower section.
When specifically used, by workpiece 2 as bearing rotary positioning mechanism 4 on station in, and by workpiece holder 5 into
Row positioning clamping, when into indium seal technique step, bearing rotary positioning mechanism 4 by 2 rotational positioning of workpiece to 9 top of MCP chambers, it is complete
At tentatively to the heart；When indium Fengkai is begun, the elevating mechanism 8 in MCP chambers 9 starts to jack, and MCP components 3 enter inside workpiece 2, work as MCP
Can be cut down under component 3 disk enter workpiece holder 5 be oriented to when, MCP Component trays 7 adjust chassis 76 support adjustment disk 74 in free skating
Dynamic, automatic centering completes indium envelope.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (6)
1. the multistation automatic centering device under a kind of high temperature high vacuum environment, which is characterized in that including main vacuum chamber（1）,
The main vacuum chamber（1）Positioned at chamber chassis（6）On, the main vacuum chamber（1）It is interior to be equipped with bearing rotary positioning mechanism
（4）, the bearing rotary positioning mechanism（4）Main shaft be pierced by the main vacuum chamber（1）It is fixed on chamber chassis（6）On, institute
State bearing rotary positioning mechanism（4）It is equipped with and places workpiece（2）Three stations, the workpiece（2）Pass through workpiece holder（5）Gu
It is scheduled on bearing rotary positioning mechanism（4）On, the workpiece holder（5）It is equipped with guide pad（51）, the main vacuum chamber（1）'s
Lower section is equipped with MCP Component trays（7）, the MCP Component trays（7）On carry MCP components（3）, the MCP components（3）Packet
Disk can be cut down by including down（31）, the MCP Component trays（7）Lower section is equipped with MCP elevating mechanisms（8）, the MCP elevating mechanisms（8）Position
In MCP chambers（9）It is interior；
The MCP Component trays（7）Including adjusting chassis（76）With support adjustment disk（74）, the adjusting chassis（76）Inner circle
With support adjustment disk（74）Between gap in be placed with adjusting shrapnel（75）, the adjusting chassis（76）On be fixed with heating branch
Support plate（71）With ceramic electrode disk（72）, the support adjustment disk（74）On be fixed with adjustment disk pressure ring（73）, the support tune
Save disk（74）With the MCP elevating mechanisms of lower section（8）Connection.
2. the multistation automatic centering device under a kind of high temperature high vacuum environment according to claim 1, which is characterized in that
The adjusting shrapnel（75）Equipped with 8.
3. the multistation automatic centering device under a kind of high temperature high vacuum environment according to claim 2, which is characterized in that
The adjusting shrapnel（75）Using high resiliency steel.
4. the multistation automatic centering device under a kind of high temperature high vacuum environment according to claim 1, which is characterized in that
The adjusting chassis（76）Inner circle with support adjustment disk（74）Between gap be 5mm.
5. the multistation automatic centering device under a kind of high temperature high vacuum environment according to claim 1, which is characterized in that
The heating support plate（71）, ceramic electrode disk（72）It is bolted on and adjusts chassis（76）On.
6. the multistation automatic centering device under a kind of high temperature high vacuum environment according to claim 1, which is characterized in that
The adjustment disk pressure ring（73）It is bolted on support adjustment disk（74）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462781.4A CN108666189B (en) | 2018-05-15 | 2018-05-15 | Multi-station automatic centering device in high-temperature and high-vacuum environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810462781.4A CN108666189B (en) | 2018-05-15 | 2018-05-15 | Multi-station automatic centering device in high-temperature and high-vacuum environment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108666189A true CN108666189A (en) | 2018-10-16 |
| CN108666189B CN108666189B (en) | 2020-01-24 |
Family
ID=63779755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810462781.4A Active CN108666189B (en) | 2018-05-15 | 2018-05-15 | Multi-station automatic centering device in high-temperature and high-vacuum environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666189B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111463090A (en) * | 2020-05-09 | 2020-07-28 | 北方夜视技术股份有限公司 | Device for accurately sealing large-size and small-diameter photomultiplier |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6837410B1 (en) * | 2000-04-19 | 2005-01-04 | Neng-Kuei Yeh | Automatic picture tube cutting machine |
| CN203863575U (en) * | 2014-05-26 | 2014-10-08 | 北方夜视技术股份有限公司 | Shell positioning clamp of photomultiplier tube |
| CN203871298U (en) * | 2014-05-26 | 2014-10-08 | 北方夜视技术股份有限公司 | Exhaust device structure for photomultiplier cathode making and sealing |
| CN206839929U (en) * | 2017-05-05 | 2018-01-05 | 北京中科科美科技股份有限公司 | High temperature, vacuum environment workpiece rotationally support disk be accurately positioned and control system |
| CN107706072A (en) * | 2017-08-25 | 2018-02-16 | 北方夜视技术股份有限公司 | The indium encapsulation method and prepared photomultiplier of photomultiplier based on negative electrode transfer equipment |
| CN207217898U (en) * | 2017-04-27 | 2018-04-10 | 北京中科科美科技股份有限公司 | More jack electrical connection components under high temperature, high vacuum environment |
-
2018
- 2018-05-15 CN CN201810462781.4A patent/CN108666189B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6837410B1 (en) * | 2000-04-19 | 2005-01-04 | Neng-Kuei Yeh | Automatic picture tube cutting machine |
| CN203863575U (en) * | 2014-05-26 | 2014-10-08 | 北方夜视技术股份有限公司 | Shell positioning clamp of photomultiplier tube |
| CN203871298U (en) * | 2014-05-26 | 2014-10-08 | 北方夜视技术股份有限公司 | Exhaust device structure for photomultiplier cathode making and sealing |
| CN207217898U (en) * | 2017-04-27 | 2018-04-10 | 北京中科科美科技股份有限公司 | More jack electrical connection components under high temperature, high vacuum environment |
| CN206839929U (en) * | 2017-05-05 | 2018-01-05 | 北京中科科美科技股份有限公司 | High temperature, vacuum environment workpiece rotationally support disk be accurately positioned and control system |
| CN107706072A (en) * | 2017-08-25 | 2018-02-16 | 北方夜视技术股份有限公司 | The indium encapsulation method and prepared photomultiplier of photomultiplier based on negative electrode transfer equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111463090A (en) * | 2020-05-09 | 2020-07-28 | 北方夜视技术股份有限公司 | Device for accurately sealing large-size and small-diameter photomultiplier |
| CN111463090B (en) * | 2020-05-09 | 2022-07-08 | 北方夜视技术股份有限公司 | Device for accurately sealing large-size and small-diameter photomultiplier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108666189B (en) | 2020-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019210626A1 (en) | Long-distance, accurate and rapid chip loading and unloading device | |
| EP2226300B1 (en) | Method for manufacturing quartz glass crucible | |
| TW201437421A (en) | Apparatus and methods for carousel atomic layer deposition | |
| CN108666189A (en) | A kind of multistation automatic centering device under high temperature high vacuum environment | |
| CN208266260U (en) | Block platen component and semiconductor processing | |
| CN204380931U (en) | A kind of bulb lamp adhesive supplier | |
| JP2014509446A (en) | Electrostatic clamp and ion implantation system | |
| CN112233951B (en) | Cathode-anode alignment device for X-ray tube | |
| CN105624634A (en) | Reaction chamber and semiconductor processing equipment | |
| CN105644105A (en) | Curved-surface screen laminating device and curved-surface screen laminating method | |
| CN205312630U (en) | Glass overturning device | |
| US3607174A (en) | Method and apparatus for applying a glass collet to a cathode-ray tube | |
| TW202100324A (en) | Scan robot for semiconductor wafer ion implantation | |
| CN216793653U (en) | Silicon wafer chamfering sucker | |
| CN204824939U (en) | Blast -furnace tuyere trompil device | |
| CN111463090B (en) | Device for accurately sealing large-size and small-diameter photomultiplier | |
| CN115011943A (en) | Switchable uniformity correcting plate group structure and vacuum coating machine thereof | |
| CN210287480U (en) | High-flux discrete mask device | |
| CN109605077A (en) | A kind of xenogenesis tubing automatic processing device and processing method | |
| CN220781055U (en) | Battery piece rubber coating equipment | |
| CN105762098A (en) | Chip conveying system and semiconductor processing equipment | |
| CN202142513U (en) | Alignment device | |
| CN221226191U (en) | Silicon chip and glass prealignment device | |
| CN220284198U (en) | Magnetron sputtering target material | |
| CN212553444U (en) | Multifunctional small turntable for optical detection and laser printing of semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |