CN221226191U - Silicon chip and glass prealignment device - Google Patents
Silicon chip and glass prealignment device Download PDFInfo
- Publication number
- CN221226191U CN221226191U CN202322440098.XU CN202322440098U CN221226191U CN 221226191 U CN221226191 U CN 221226191U CN 202322440098 U CN202322440098 U CN 202322440098U CN 221226191 U CN221226191 U CN 221226191U
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- China
- Prior art keywords
- glass
- wafer
- knob
- fixedly connected
- fine adjustment
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Links
- 239000011521 glass Substances 0.000 title claims abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 47
- 239000010703 silicon Substances 0.000 title claims abstract description 47
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 241000252254 Catostomidae Species 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 66
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the field of a method for pre-aligning and laminating a silicon wafer and glass before bonding, and discloses a silicon wafer and glass pre-aligning device which comprises a four-axis optical fine adjustment platform, wherein the upper part of the right side of the four-axis optical fine adjustment platform is fixedly connected with a first knob, the middle part of the front side of the four-axis optical fine adjustment platform is fixedly connected with a second knob, the bottom of the front side of the four-axis optical fine adjustment platform is fixedly connected with a fourth knob, the middle part of the left side of the four-axis optical fine adjustment platform is fixedly connected with a third knob, the middle part of the top side of the four-axis optical fine adjustment platform is fixedly connected with a wafer bearing table, the bottom side of the four-axis optical fine adjustment platform is fixedly connected with a bottom plate, and the rear part of the upper side of the bottom plate is fixedly connected with a supporting rod. According to the utility model, the problems of manual alignment under a microscope, no high-precision adjustment platform, poor alignment precision and difficult operation are solved by adopting structures such as a four-axis optical fine adjustment platform, an electron microscope and the like.
Description
Technical Field
The utility model relates to the field of a method for pre-aligning and attaching a silicon wafer and glass before bonding, in particular to a device for pre-aligning the silicon wafer and the glass.
Background
Silicon wafer and glass prealignment devices are one of the key techniques used to align and position silicon wafers with glass substrates in semiconductor manufacturing processes. In semiconductor fabrication, silicon wafers are used as the substrate for chips, and other layers of materials need to be deposited on the wafer during the chip fabrication process. Most glass to silicon wafer alignments are now done manually under a microscope.
Manual alignment generally requires a long time to adjust and optimize, especially for high precision alignment requirements, which may require multiple attempts and adjustments to achieve the required precision. The time consumption of the production process can be increased, the efficiency is reduced, meanwhile, manual alignment is performed under a microscope, a high-precision adjustment platform is not needed, the alignment precision is poor, and the operation is not easy. For this purpose, a device for pre-aligning a silicon wafer with glass is proposed to solve the above problems.
Disclosure of utility model
In order to make up for the defects, the utility model provides a device for pre-aligning a silicon wafer and glass, which aims to solve the problems that manual wafer alignment is carried out under a microscope, a high-precision adjustment platform is not needed, the alignment precision is poor, and the operation is difficult.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a silicon chip and glass prealignment device, includes four-axis optics fine tuning platform, four-axis optics fine tuning platform right side upper portion fixedly connected with first knob, four-axis optics fine tuning platform front side middle part fixedly connected with second knob, four-axis optics fine tuning platform front side bottom fixedly connected with fourth knob, four-axis optics fine tuning platform left side middle part fixedly connected with third knob, four-axis optics fine tuning platform top side middle part fixedly connected with holds the piece platform, four-axis optics fine tuning platform bottom side fixedly connected with bottom plate, bottom plate upside rear portion fixedly connected with branch, branch outside middle part fixedly connected with glass fixed station.
As a further description of the above technical solution:
The middle part of the upper side of the wafer bearing platform is provided with a plurality of evenly distributed vent holes, the middle part of the rear side of the wafer bearing platform is provided with a side end air source interface, and the side end air source interface is connected with a vacuum pump.
As a further description of the above technical solution:
The first knob is used for controlling the Z-axis direction movement of the wafer carrying platform, the second knob is used for controlling the X-axis direction movement of the wafer carrying platform, the third knob is used for controlling the Y-axis direction movement of the wafer carrying platform, and the fourth knob is used for controlling the radial rotary movement of the wafer carrying platform.
As a further description of the above technical solution:
The upper part of the outer side of the supporting rod is connected with an electron microscope in a sliding mode, the electron microscope is connected with a display screen through a data line, and the electron microscope is used for shooting glass, so that the display screen can display the position of a silicon chip relative to the glass in real time.
As a further description of the above technical solution:
Four suckers are arranged at the bottom of the circular ring of the glass fixing table, and the suckers on the glass fixing table are communicated with vacuum to adsorb and fix the glass wafer.
As a further description of the above technical solution:
The center of the electron microscope lens is coaxial with the center of the circular ring of the glass fixing table.
As a further description of the above technical solution:
the air holes are communicated with vacuum to fix the silicon wafer on the wafer bearing table in an adsorption mode.
The utility model has the following beneficial effects:
According to the utility model, the four-axis optical fine adjustment platform and the electron microscope are arranged, the XYZ axis direction and the Z axis angle of the silicon wafer are adjusted through the first knob, the second knob, the third knob and the fourth knob, the silicon wafer and the glass can be aligned and attached more accurately and rapidly through the display positions of the microscope and the display screen, and the silicon wafer and the glass are attached more tightly before being bonded through the adhesion of high-purity deionized water.
Drawings
FIG. 1 is a schematic perspective view of a wafer and glass pre-alignment apparatus according to the present utility model;
FIG. 2 is a schematic diagram of a side air source interface of a pre-alignment device for silicon wafer and glass according to the present utility model;
FIG. 3 is a schematic view of a glass fixing table of a pre-alignment device for silicon wafer and glass according to the present utility model;
Fig. 4 is an enlarged schematic view at a in fig. 1.
Legend description:
1. A four-axis optical fine tuning platform; 2. a wafer carrying table; 3. a bottom plate; 4. a support rod; 5. a glass fixing table; 6. an electron microscope; 7. a display screen; 8. a side end air source interface; 9. a vent hole; 10. a suction cup; 11. a first knob; 12. a second knob; 13. a third knob; 14. and a fourth knob.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides a silicon chip and glass prealignment device, including four-axis optics fine setting platform 1, four-axis optics fine setting platform 1 right side upper portion fixedly connected with first knob 11, four-axis optics fine setting platform 1 front side middle part fixedly connected with second knob 12, four-axis optics fine setting platform 1 front side bottom fixedly connected with fourth knob 14, four-axis optics fine setting platform 1 left side middle part fixedly connected with third knob 13, four-axis optics fine setting platform 1 top side middle part fixedly connected with holds piece platform 2, four-axis optics fine setting platform 1 bottom side fixedly connected with bottom plate 3, bottom plate 3 upside rear portion fixedly connected with branch 4, branch 4 outside middle part fixedly connected with glass fixed station 5, XYZ axle direction and the Z axle angle adjustment to the silicon chip through first knob 11, second knob 12, third knob 13 and fourth knob 14, four-axis optics fine setting platform 1 bottom is provided with the calibrated scale when adjusting holds piece platform 2 position.
The middle part of the upper side of the wafer bearing table 2 is provided with a plurality of evenly distributed vent holes 9, the middle part of the rear side of the wafer bearing table 2 is provided with a side end air source interface 8, the side end air source interface 8 is connected with a vacuum pump, the side end air source interface 8 and the air pump provide vacuum environment for the vent holes 9 and the suckers 10, the vent holes 9 are communicated with vacuum, a silicon wafer is adsorbed and fixed on the wafer bearing table 2, the glass wafer is adsorbed and fixed through the suckers 10 on the glass fixing table 5 in a communicated vacuum mode, and the damage of the silicon wafer and glass is reduced by the method of vacuum adsorption and fixation, and the fixation is more stable.
The first knob 11 is used for controlling the Z-axis direction movement of the wafer carrying platform 2, the second knob 12 is used for controlling the X-axis direction movement of the wafer carrying platform 2, the third knob 13 is used for controlling the Y-axis direction movement of the wafer carrying platform 2, and the fourth knob 14 is used for controlling the radial rotation movement of the wafer carrying platform 2.
The upper portion sliding connection in the outside of branch 4 has electron microscope 6, and electron microscope 6 is connected with display screen 7 through the data line, and electron microscope 6 is used for shooing glass to display screen 7 can show the position of silicon chip for glass in real time, through electron microscope 6 and display screen 7 demonstration position, can be more accurate and quick with silicon chip and glass alignment laminating.
Four suckers 10 are arranged at the bottom of the circular ring of the glass fixing table 5, the plurality of suckers 10 are all used for tightly connecting the wafer carrying table 2 with the glass fixing table 5, and the glass wafer is adsorbed and fixed by the sucker 10 on the glass fixing table 5 through vacuum communication.
The center of the lens of the electron microscope 6 is kept coaxial with the center of the circular ring of the glass fixing table 5, and the electron microscope 6 adjusts the center position of the lens by twisting a bolt fixed thereon.
The ventilation holes 9 are communicated with vacuum to adsorb and fix the silicon wafer on the wafer bearing platform 2, and the wafer bearing platform 2 is used for fixing the silicon wafer.
Working principle: the back surface of the silicon wafer faces upwards (the back surface is a silicon cup surface) and is placed in the groove position of the wafer bearing table 2, vent holes 9 are distributed in the groove position of the wafer bearing table 2 and are communicated with vacuum, and the silicon wafer is adsorbed and fixed on the wafer bearing table 2; the sucking disc 10 on the glass fixing table 5 is communicated with vacuum to adsorb and fix the glass wafer; the display screen 7 shoots glass through the electron microscope 6 to display the positions of the silicon chip and the glass in real time; manually adjusting a first knob 11 of the four-axis optical fine adjustment platform 1 to move in the Z-axis direction, and lifting a silicon wafer carried by the wafer carrying platform 2 upwards to enable the silicon wafer to be close to a glass wafer and not attached; and the second knob 12 is adjusted to move in the X-axis direction, the wafer carrying platform 2 carries the silicon wafer to translate in the X-axis, the display screen 7 is visually observed, and the position of the silicon wafer in the X-axis direction is aligned. And the third knob 13 is adjusted to move in the Y-axis direction, the wafer bearing platform 2 bears the silicon wafer to translate in the Y-axis direction, the display screen 7 is visually observed, and the position in the Y-axis direction is aligned. Adjusting the fourth knob 14 to perform Z-axis radial rotation, enabling the wafer bearing platform 2 to bear the silicon wafer to rotate on the Z axis, visually displaying the screen 7 and aligning the position; after the silicon wafer is aligned with the glass, the first knob 11 is adjusted to move in the Z-axis direction, and the wafer bearing platform 2 bears the silicon wafer and lifts upwards to enable the silicon wafer to be attached to the glass; and after the bonding, the high-purity deionized water is dripped into the bonding position of the silicon wafer and the glass for sealing, the bonding of the silicon wafer and the glass is more compact through the tension of water, and the bonded glass and the silicon wafer are taken down after the bonding is completed.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. The device for prealigning the silicon chip and the glass comprises a four-axis optical fine adjustment platform (1), and is characterized in that: the utility model discloses a four-axis optical fine adjustment platform, including four-axis optical fine adjustment platform (1), four-axis optical fine adjustment platform (1) right side upper portion fixedly connected with first knob (11), four-axis optical fine adjustment platform (1) front side middle part fixedly connected with second knob (12), four-axis optical fine adjustment platform (1) front side bottom fixedly connected with fourth knob (14), four-axis optical fine adjustment platform (1) left side middle part fixedly connected with third knob (13), four-axis optical fine adjustment platform (1) top side middle part fixedly connected with holds piece platform (2), four-axis optical fine adjustment platform (1) bottom side fixedly connected with bottom plate (3), bottom plate (3) upside rear portion fixedly connected with branch (4), branch (4) outside middle part fixedly connected with glass fixed station (5).
2. A wafer and glass prealignment device according to claim 1, wherein: the middle part of the upper side of the wafer bearing table (2) is provided with a plurality of evenly distributed vent holes (9), the middle part of the rear side of the wafer bearing table (2) is provided with a side end air source interface (8), and the side end air source interface (8) is connected with a vacuum pump.
3. A wafer and glass prealignment device according to claim 1, wherein: the first knob (11) is used for controlling the Z-axis direction movement of the wafer carrying platform (2), the second knob (12) is used for controlling the X-axis direction movement of the wafer carrying platform (2), the third knob (13) is used for controlling the Y-axis direction movement of the wafer carrying platform (2), and the fourth knob (14) is used for controlling the radial rotation movement of the wafer carrying platform (2).
4. A wafer and glass prealignment device according to claim 1, wherein: the electronic microscope is characterized in that the upper part of the outer side of the supporting rod (4) is connected with an electronic microscope (6) in a sliding mode, the electronic microscope (6) is connected with a display screen (7) through a data line, and the electronic microscope (6) is used for shooting glass, so that the display screen (7) can display the position of a silicon chip relative to the glass in real time.
5. A wafer and glass prealignment device according to claim 1, wherein: four suckers (10) are arranged at the bottom of the circular ring of the glass fixing table (5), and the suckers (10) on the glass fixing table (5) are communicated with vacuum to adsorb and fix the glass wafer.
6. The wafer and glass prealignment device according to claim 4, wherein: the center of the lens of the electron microscope (6) is coaxial with the center of the circular ring of the glass fixing table (5).
7. A wafer and glass prealignment device according to claim 2, wherein: the air holes (9) are communicated with vacuum to fix the silicon wafer on the wafer bearing table (2) in an adsorption mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322440098.XU CN221226191U (en) | 2023-09-08 | 2023-09-08 | Silicon chip and glass prealignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322440098.XU CN221226191U (en) | 2023-09-08 | 2023-09-08 | Silicon chip and glass prealignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221226191U true CN221226191U (en) | 2024-06-25 |
Family
ID=91572355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322440098.XU Active CN221226191U (en) | 2023-09-08 | 2023-09-08 | Silicon chip and glass prealignment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221226191U (en) |
-
2023
- 2023-09-08 CN CN202322440098.XU patent/CN221226191U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |