CN108364934A - Electronic equipment, display panel and preparation method thereof - Google Patents
Electronic equipment, display panel and preparation method thereof Download PDFInfo
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- CN108364934A CN108364934A CN201810145599.6A CN201810145599A CN108364934A CN 108364934 A CN108364934 A CN 108364934A CN 201810145599 A CN201810145599 A CN 201810145599A CN 108364934 A CN108364934 A CN 108364934A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims description 86
- 229910052751 metal Inorganic materials 0.000 claims description 86
- 238000005538 encapsulation Methods 0.000 claims description 58
- 239000000565 sealant Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 5
- 230000004044 response Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000012858 packaging process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses an electronic device, a display panel and a preparation method thereof, wherein signal lines of the display panel extend from a step area of the display panel to a display area and form an overlapping area with a packaging area so as to reduce the area occupied by the step area and realize the effect of a narrow frame; and one side of the overlapping area of at least one signal line, which is far away from the substrate, is provided with a laser protection layer, the laser protection layer can protect the signal line positioned in the overlapping area in the laser packaging process, and the possibility that the film quality of the signal line positioned in the overlapping area with the packaging area is changed due to laser scanning is reduced, so that the delay increase of the signal line due to laser packaging is reduced, and the possibility of reducing the response speed of the display panel is reduced.
Description
Technical field
This application involves display device technical fields, more specifically to a kind of electronic equipment, display panel and its system
Preparation Method.
Background technology
With the continuous development of display technology, the application of display panel is also more and more extensive, the display panel of mainstream now
Type includes mainly liquid crystal display panel (Liquid CrystalDisplay, LCD) and organic light emitting display panel (Organic
Light-Emitting Diode, OLED).
In organic light emitting display panel, in order to realize the design effect of " narrow frame ", common design scheme reference chart
1, Fig. 1 is the overlooking structure diagram of display panel in the prior art, and display panel shown in Fig. 1 is mainly by viewing area
30, it constitutes, shows around the 30 1 weeks encapsulation regions in viewing area 20 and positioned at stepped region 10 of the encapsulation region 20 far from 30 side of viewing area
Show that the viewing area 30 of panel mainly includes machine luminescence unit layer and pixel driver film layer, wherein pixel driver film layer includes handing over
Pitch the grid line and data line of arrangement, and multiple thin film transistor (TFT)s in grid line and data line limited area
(ThinFilmTransistor, TFT) is constituted；For the signal transmission realized peripheral drive circuit with drive film layer, it is also necessary to
It arranges that signal wire realizes the electrical connection of driving film layer and peripheral drive circuit, is required to meet encapsulation, signal wire is by sealing
It needs to carry out thread-changing before dress area, and in order to reduce the area below display panel shared by stepped region, realizes " narrow frame "
Design effect, the signal wire after thread-changing form after one section of overlapping region the peripheral drive circuit being drawn out in stepped region with encapsulation region
In；In this configuration, it is provided commonly for carrying envelope frame positioned at the signal wire of encapsulation region and the patch metal layer being subsequently packaged
Glue is realized that the bonding with cover board encapsulates by laser package technology utilization sealant, is formed aobvious after the completion of prepared by above structure
Show panel.
But in this display panel structure, due to the signal wire positioned at encapsulation region needed during laser package by
Laser is scanned, this is possible to cause the film quality of signal wire to change, and is increased so as to cause the overall electrical resistance of signal wire,
And then the delay of signal wire is caused to increase, reduce the response speed of display panel.
Invention content
In order to solve the above technical problems, this application provides a kind of electronic equipment, display panel and preparation method thereof, with solution
Certainly caused film quality changed may to be asked by laser scanning during laser package due to the signal wire positioned at encapsulation region
Topic.
To realize the above-mentioned technical purpose, the embodiment of the present application provides following technical solution：
A kind of display panel, the display panel include viewing area, surround the encapsulation region of the viewing area, are located at the envelope
Fill stepped region of the area far from viewing area side；The display panel further includes：
Substrate；
Signal wire on the substrate, the signal wire extend to the viewing area from the stepped region, and with institute
It states encapsulation region and forms overlapping region；
The overlapping region of at least one signal wire is provided with laser protection layer away from the side of the substrate.
A kind of electronic equipment, including：Display panel as described in any one of the above embodiments.
A kind of preparation method of display panel, the display panel include viewing area, surround the one week envelope in the viewing area
Area is filled, stepped region of the encapsulation region far from viewing area side is located at；The preparation method of the display panel includes：
Substrate is provided；
It is formed over the substrate and extends to the viewing area from the stepped region, and crossover region is formed with the encapsulation region
The signal wire in domain；
In the overlapping region of at least one signal wire laser protection layer is formed away from the side of the substrate.
It can be seen from the above technical proposal that the embodiment of the present application provides a kind of electronic equipment, display panel and its system
Preparation Method, wherein the signal wire of the display panel extends to viewing area from the stepped region of display panel, and is formed with encapsulation region
Overlapping region realizes the effect of " narrow frame " to reduce the area shared by the stepped region；Also, at least one signal
The overlapping region of line is provided with laser protection layer away from the side of substrate, and the laser protection layer can be in the process of laser package
Protection of the middle realization to the signal wire positioned at overlapping region, reduces positioned at the signal wire with encapsulation region overlapping region due to laser
It scans and leads to the changed possibility of film quality, cause delay to increase to reduce signal wire due to laser package, reduce
The possibility of the response speed of display panel.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of application for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the overlooking structure diagram of display panel in the prior art；
Fig. 2 is a kind of overlooking structure diagram for display panel that one embodiment of the application provides；
Fig. 3 is a kind of overlooking structure diagram for display panel that another embodiment of the application provides；
Fig. 4 is the close-up schematic view in display panel dotted line frame shown in Fig. 3；
Fig. 5 is the cross-sectional view along BB ' lines in display panel close-up schematic view shown in Fig. 4；
Fig. 6 is that the three-layer metal for the display panel that one embodiment of the application provides and the position relationship of substrate are illustrated
Figure；
Fig. 7 is that the signal wire of overlapping region that one embodiment of the application provides and the position relationship of laser protection layer show
It is intended to；
Fig. 8 is the position relationship of the signal wire and laser protection layer for the overlapping region that another embodiment of the application provides
Schematic diagram；
Fig. 9 is the cross-sectional view along AA ' lines in display panel close-up schematic view shown in Fig. 4；
Figure 10 is that the signal wire for the overlapping region that another embodiment of the application provides and the position of laser protection layer are closed
It is schematic diagram；
Figure 11 is a kind of overlooking structure diagram for display panel that another embodiment of the application provides；
Figure 12 is display panel shown in Figure 11 along the cross-sectional view of CC ' lines；
Figure 13 is a kind of flow diagram of the preparation method for display panel that one embodiment of the application provides；
Figure 14 is a kind of flow diagram of the preparation method for display panel that another embodiment of the application provides.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
The embodiment of the present application provides a kind of display panel, and as shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, Fig. 2 and Fig. 3 are described
The schematic top plan view of display panel, Fig. 4 are the close-up schematic view in display panel dotted line frame shown in Fig. 3, Fig. 5 Fig. 4
Shown in display panel close-up schematic view along the cross-sectional view of BB ' lines；The display panel includes viewing area
100, the encapsulation region 200 of the viewing area 100 is surrounded, stepped region 300 of the encapsulation region far from viewing area side is located at；It is described
Display panel further includes：
Substrate PL；
Signal wire 400 on the substrate, the signal wire 400 extend to the display from the stepped region 300
Area 100, and form overlapping region with the encapsulation region 200；
The overlapping region of at least one signal wire 400 is provided with laser protection layer away from the side of the substrate PL
500。
Signal wire 400 in dotted line frame in fig 2 forms overlapping region with encapsulation region 200, in Figure 5, marked as
The arrow of Laser indicates the direction of illumination of laser during laser package.
Signal wire positioned at stepped region, can be still by the larger M1 metal layers of resistance or MC metal layers due to shorter
It is formed (with reference to figure 2), can also be formed (with reference to figure 3) by M2 metal layers, in stepped region again thread-changing to realize the electricity of signal wire
Resistance minimizes, and the application does not limit this.
In the present embodiment, since the overlapping region of at least one signal wire 400 deviates from the side of the substrate PL
It is provided with laser protection layer 500, the laser protection layer 500 can be realized during laser package to being located at overlapping region
Signal wire 400 protection, reducing is caused positioned at the signal wire 400 of 200 overlapping region of encapsulation region due to laser scanning
The changed possibility of film quality causes delay to increase, reduces display panel to reduce signal wire 400 due to laser package
Response speed possibility.
It should be noted that the laser protection layer 500 can be insulation material layer, can also be conductive material layer, only
It wants that signal wire 400 can be reduced by the probability of laser scanning, to realize to being located at overlapping region during laser package
Signal wire 400 protection function, the application do not limit this, specifically depending on actual conditions.
On the basis of the above embodiments, in one embodiment of the application, as shown in fig. 6, Fig. 6 is overlapping region
The position relationship schematic diagram of signal wire 400 and laser protection layer 500, the laser protection layer 500 include and the signal wire pair
The metal conductive wire 501 that should be arranged；
Projection of the every metal conductive wire 501 on the substrate PL at least partly covers a signal wire
400 projection in the part of the overlapping region on the substrate PL.
Under normal conditions, in the preparation process of display panel usually require use three-layer metal, be referred to as M1 metal layers,
MC metal layers and M2 metal layers, for the arrangement mode of this three-layer metal with reference to figure 7, Fig. 7 is the arrangement of the three-layer metal of display panel
Relation schematic diagram, in this three-layer metal, M1 metal layers are near substrate PL, and M2 metal layers are farthest away from substrate PL, MC metal layers
Between M1 metal layers and M2 metal layers；And in this three-layer metal layer, the resistance of M2 metal layers is minimum, therefore, in order to
The resistance for reducing signal wire as possible promotes the response speed of display panel, and generally use M2 metal layers, which are formed, is located at viewing area 100
Signal wire 400；Patch metal layer is usually provided in encapsulation region 200, the patch metal layer is used in laser package mistake
Cheng Zhongxiang is located at the sealant reflective metals on patch metal layer, and to improve the utilization rate of laser, the patch metal layer is usual
It is formed by M1 metal layers；
When signal wire 400 is by encapsulation region 200, it usually needs carry out thread-changing processing, i.e., by M1 metal layers or MC metals
Layer forms the signal wire 400 positioned at 200 overlapping region of encapsulation region, is then introduced into stepped region 300, this is mainly by following two original
Because causing：(1), M2 metal layers and the sealant positioned at encapsulation region 200 are in same layer, if signal wire 400 is in encapsulation region 200
In still formed using M2 metal layers, it is possible to the encapsulation region of display panel can be made different from normal packaging area, may
There can be stress problem and encapsulation is caused defect occur；(2), under normal conditions, the M2 metal layers of display panel and sealant it
Between insulating layer be usually organic insulator, the adhesive effect of sealant is bad, therefore signal wire 400 needs in encapsulation region 200
Carry out thread-changing.
In the present embodiment, the laser protection layer 500 is by 501 structure of metal conductive wire that is correspondingly arranged with signal wire 400
At in order to prepare conveniently, in one embodiment of the application, the metal conductive wire 501 of laser protection layer 500 can be by showing
The MC metal layers of panel are formed, and the signal wire 400 positioned at overlapping region can be formed by the M1 metal layers of display panel, without
One layer of metal layer is additionally set to form the laser protection layer 500, to avoid the integral thickness of display panel is increased.
Preferably, with reference to figure 8, Fig. 8 is to be located at the signal wire 400 of overlapping region in the preferred embodiment of the application
With the position relationship schematic diagram of laser protection layer 500, in the present embodiment, every metal conductive wire 501 is in the substrate
Projection of the signal wire 400 in the part of overlapping region on the substrate PL is completely covered in projection on PL.
For example, 4 signal lines 400 that number is A, B, C, D and 4 metals that number is a, b, c, d are shown in FIG. 8
Conductor wire 501, wherein the metal conductive wire 501 that number is a be arranged the signal wire 400 that the number in overlapping region is A just on
Side, and its area is greater than or equal to the area for the signal wire 400 for being A positioned at the number of overlapping region, to realize the gold of number a
Belong to conductor wire projection over the substrate, be completely covered positioned at the number of overlapping region be A signal wire 400 in the substrate
Projection on GL.Corresponding, the metal conductive wire 501 of number b, c, d and signal wire 400 that number is B, C, D are with same
Mode is arranged, protective effect that can maximumlly during laser package to the signal wire 400 positioned at overlapping region.
It is highly preferred that with reference to figure 9, Fig. 9 is what another preferred embodiment of the application provided, and the AA ' lines along Fig. 4 cut open
Face structural schematic diagram, in the present embodiment, every metal conductive wire 501 and a corresponding signal line 400 are in parallel.
Likewise, in order to prepare conveniently, in the present embodiment, the metal conductive wire 501 of the laser protection layer is by showing
The MC metal layers of panel are formed, and the signal wire 400 positioned at overlapping region can be formed by the M1 metal layers of display panel, by right
The insulating layer of covering M1 metal layers carries out punching processing, forms via HL shown in Fig. 9, metal material is filled in via HL, real
The parallel connection of existing metal conductive wire 501 and corresponding signal wire 400；In order to simplify the preparation process of display panel, filled out in via HL
Material identical of the metal material filled preferably with formation metal conductive wire.
The metal conductive wire 501 in parallel with signal wire 400 can reduce the overall electrical resistance of signal wire 400, reduce due to
Encapsulation region thread-changing increases for 400 resistance of signal wire caused by the signal wire 400 of M1 metal layers formation overlapping region to display surface
The harmful effect of the response speed of plate.
On the basis of the above embodiments, in another embodiment of the application, as shown in Figure 10, Figure 10 is described aobvious
Show that the cross-sectional view of panel, the display panel further include：
Between the signal wire 400 and the laser protection layer 500, and cover the first of the signal wire 400 absolutely
Edge layer GS1；
Deviate from the sides the substrate PL positioned at the laser protection layer 500, cover the laser protection layer 500 second is exhausted
Edge layer GS2；
The second insulating layer GS2 is inorganic insulating material layer.
In actual application, it is gone back with reference between the overlapping region signal wire 400 that figure 10, substrate and M1 metal layers are formed
It is provided with dielectric isolation layer GI, due to needing that sealant is arranged in second insulating layer, and common sealant is by inorganic material
Expect the glass powder that (silica etc.) is constituted, and the adhesive property of inorganic material and inorganic material is more preferable, therefore, second insulation
Layer GS2 preferably uses inorganic insulating material to prepare, to ensure after being handled by laser package, sealant and second insulating layer
GS2's has good adhesive effect.
On the basis of the above embodiments, in another embodiment of the application, with reference to figure 11, Figure 11 is the display
The overlooking structure diagram of panel, the display panel further include：Patch metal layer 600 positioned at the encapsulation region；
The patch metal layer 600 is arranged with the laser protection layer same layer；
The projection of the patch metal layer 600 over the substrate is with the laser protection layer positioned at encapsulation region in the substrate
On projection constitute the rectangle for covering the encapsulation region；
The patch metal layer 600 is insulated from each other with the laser protection layer.
The patch metal layer 600 and signal wire 400 positioned at encapsulation region need during subsequent laser package
The reflex to laser is played, therefore, patch metal layer 600 and the laser protection layer positioned at encapsulation region need composition one complete
The rectangle of whole covering encapsulation region.In practical applications, patch metal layer 600 usually requires ground connection setting, it is thus possible to letter
The laser protection layer in parallel of number line 400 may be also required to transmission various types of signal, therefore laser protection layer needs and patch metal layer
Insulation set.
In addition, in the present embodiment, patch metal layer and the setting of laser protection layer same layer can be lifted at encapsulation process
In homogeneity, reduce in encapsulation process generate stress concentration possibility.
On the basis of the above embodiments, in the further embodiment of the application, with reference to figure 12, Figure 12 is the edges Figure 11
The cross-sectional view of CC ' lines, in the present embodiment, the display panel further includes：It is carried on the back positioned at the package metals layer 600
The encapsulation is completely covered in sealant 700 from the sides the substrate PL, projection of the sealant 700 on the substrate PL
Projection of the area on the substrate PL；
The sealant 700 is glass frit layer.
The sealant 700 is during subsequent laser package, by melting and having viscosity after the scanning of laser, with
It is bonded encapsulation between the array substrate and cover board of realization display panel.Glass powder, also known as glass frit or Frit have molten
The advantages that point is low and barrier water oxygen performance is good.
On the basis of the above embodiments, in one embodiment of the application, the display panel further includes：With it is described
The capacitance metal layer of laser protection layer homonymy setting.
In the present embodiment, the laser protection layer and capacitance metal layer are formed using MC metal layers, and formation process can be with
It is the etching technics such as photoetching process.It, can using photoetching process after the completion of the graphic designs of laser protection layer and capacitance metal layer
With laser protection layer described in disposal molding and capacitance metal layer, simplify the preparation flow of display panel.
On the basis of the above embodiments, in another embodiment of the application, the display panel further includes：
Driving film layer and the organic light-emitting units layer being electrically connected with the driving film layer；
The driving film layer connects the driving circuit of the display panel by the signal wire.
Referring still to Figure 11, the viewing area for driving film layer and organic light-emitting units layer to together constitute display panel
100, the driving film layer includes a plurality of grid line, multiple data lines, multiple display pixels composition；The wherein described grid line is along
The arrangement of one direction, second direction extend；The data line extends in a first direction, second direction arranges；The display pixel packet
Three classes sub-pixel is included, this three classes sub-pixel can be red sub-pixel, green sub-pixels and blue subpixels, this three classes sub-pixel
According to certain aligned transfer, in the limited area of grid line and data line that each sub-pixel is located at, and each sub-pixel
Further include multiple thin film transistor (TFT)s other than including emitting red light unit, green emitting unit or blue-light-emitting unit
(ThinFilmTransistor, TFT), a thin film transistor (TFT) in multiple thin film transistor (TFT)s of each sub-pixel are responsible for control
The switch of luminescence unit, other thin film transistor (TFT)s collectively form shift LD function；When signal wire passes to certain a line sub-pixel
When signal, transmission of the signal in each display pixel in viewing area is realized by shift LD function.
Optionally, the signal wire is driving circuit signal wire；
The driving circuit signal wire is clock cable or voltage signal line or ground signal line.
Wherein, clock cable can there are many, in practical applications, generally there are 4 kinds of clock cables, voltage letter
Number line can also be divided into high voltage (VGH) signal wire and low-voltage (VGL) signal wire, in addition to this, the driving circuit signal
Line can also provide the PVDD of signal for the signal wire of transmission test signal or the signal wire of transmission start signal or to viewing area
Power signal line, VEF reference voltage signals or VDATA data signal lines etc..The application is to the driving circuit signal wire
Specific type do not limit, specifically depending on actual conditions.
Include aobvious as described in above-mentioned any embodiment correspondingly, the embodiment of the present application also provides a kind of electronic equipment
Show panel.
The preparation method of display panel provided by the embodiments of the present application is described below, display panel described below
The display panel for preparing of preparation method can correspond reference with the structure of above-described display panel.
Correspondingly, the embodiment of the present application also provides a kind of preparation methods of display panel, as shown in figure 13, Figure 13 is aobvious
Show that the flow diagram of the preparation method of panel, the display panel include viewing area, surrounds viewing area encapsulation in one week
Area is located at stepped region of the encapsulation region far from viewing area side；The preparation method of the display panel includes：
S101：Substrate is provided；
S102：It is formed over the substrate and extends to the viewing area from the stepped region, and formed with the encapsulation region
The signal wire of overlapping region；
S103：In the overlapping region of at least one signal wire laser protection layer is formed away from the side of the substrate.
Structural reference Fig. 2, Fig. 3, Fig. 4 and Fig. 5 of the display panel prepared.
The signal wire of the display panel extends to viewing area from the stepped region of display panel, and forms crossover region with encapsulation region
The effect of " narrow frame " is realized to reduce the area shared by the stepped region in domain；Also, the friendship of at least one signal wire
Folded region is provided with laser protection layer away from the side of substrate, and the laser protection layer can be realized during laser package
Protection to the signal wire positioned at overlapping region, reduce positioned at the signal wire of encapsulation region overlapping region due to laser scanning and
Lead to the changed possibility of film quality, causes delay to increase to reduce signal wire due to laser package, reduce display surface
The possibility of the response speed of plate.
For the detailed process of the preparation method of clearer description display panel provided by the embodiments of the present application, reference chart
14, Figure 14 be the flow diagram of the preparation method of display panel, and the preparation method of the display panel includes：
S201：Substrate is provided；
S202：Dielectric isolation layer is formed in the substrate surface；
S203：It is formed from the stepped region away from the one side of substrate in the dielectric isolation layer and extends to the display
Area, and with the encapsulation region formed overlapping region signal wire；
S204：The signal wire is covered, the first insulating layer at least two vias is formed；
S205：Deviate from the one side of substrate in first insulating layer, forms the laser with a plurality of metal conductive wire and protect
Sheath；Every laser protection layer is in parallel by the via and a corresponding signal line, every metallic signal lines
The projection of a signal wire over the substrate is completely covered in projection over the substrate；
S206：The laser protection layer is covered, second insulating layer is formed using inorganic insulating material.；
S207：In the overlapping region of at least one signal wire laser protection layer is formed away from the side of the substrate.
In the present embodiment, the metal conductive wire cross-sectional view in parallel with signal wire is with reference to figure 9, the mistake in Fig. 9
Hole HL is obtained by carrying out punching processing to the insulating layer for covering M1 metal layers, and filling metal material realizes that metal is led in via HL
The parallel connection of electric wire and corresponding signal wire；In order to simplify the preparation process of display panel, the metal material filled in via HL is excellent
Choosing and the material identical for forming metal conductive wire；The metal conductive wire in parallel with signal wire can reduce the whole electricity of signal wire
Resistance is reduced due to the signal line resistance increase pair caused by encapsulation region thread-changing is the signal wire of M1 metal layers formation overlapping region
The harmful effect of the response speed of display panel.
The diagrammatic cross-section of the display panel is with reference to figure 10.The overlapping region signal wire that substrate and M1 metal layers are formed it
Between be additionally provided with dielectric isolation layer, due to needing that sealant is arranged in second insulating layer, and common sealant is by inorganic
The glass powder that material (silica etc.) is constituted, and the adhesive property of inorganic material and inorganic material is more preferable, therefore, described second absolutely
Edge layer preferably uses inorganic insulating material to prepare, to ensure after being handled by laser package, sealant and second insulating layer GS2
Have good adhesive effect.
In conclusion the embodiment of the present application provides a kind of electronic equipment, display panel and preparation method thereof, wherein institute
The signal wire for stating display panel extends to viewing area from the stepped region of display panel, and forms overlapping region with encapsulation region, with contracting
Area shared by the small stepped region realizes the effect of " narrow frame "；Also, the overlapping region of at least one signal wire is carried on the back
Side from substrate is provided with laser protection layer, and the laser protection layer can be realized during laser package to be handed over being located at
The protection of the signal wire in folded region, reduce leads to film quality positioned at the signal wire with encapsulation region overlapping region due to laser scanning
Changed possibility causes delay to increase, reduces the response of display panel to reduce signal wire due to laser package
The possibility of speed.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the application.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can in other embodiments be realized in the case where not departing from spirit herein or range.Therefore, the application
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (14)
1. a kind of display panel, which is characterized in that the display panel includes viewing area, surrounds the encapsulation region of the viewing area,
Positioned at stepped region of the encapsulation region far from viewing area side；The display panel further includes：
Substrate；
Signal wire on the substrate, the signal wire extend to the viewing area from the stepped region, and with the envelope
It fills area and forms overlapping region；
The overlapping region of at least one signal wire is provided with laser protection layer away from the side of the substrate.
2. display panel according to claim 1, which is characterized in that the laser protection layer includes and the signal wire pair
The metal conductive wire that should be arranged；
The projection of every metal conductive wire over the substrate at least partly covers a signal wire described overlapping
The projection of the part in region over the substrate.
3. display panel according to claim 2, which is characterized in that every metal conductive wire and a corresponding letter
Number line parallel connection.
4. display panel according to claim 2, which is characterized in that every metal conductive wire is over the substrate
Projection, is completely covered projection of the signal wire in the part of overlapping region over the substrate.
5. display panel according to claim 1, which is characterized in that further include：
Between the signal wire and the laser protection layer, and cover the first insulating layer of the signal wire；
Deviate from the one side of substrate positioned at the laser protection layer, covers the second insulating layer of the laser protection layer；
The second insulating layer is inorganic insulating material layer.
6. display panel according to claim 1, which is characterized in that further include：Patch metal positioned at the encapsulation region
Layer；
The patch metal layer is arranged with the laser protection layer same layer；
Throwing of the projection with the laser protection layer positioned at encapsulation region on the substrate of the patch metal layer over the substrate
Shadow constitutes the rectangle for covering the encapsulation region；
The patch metal layer and the laser protection layer are insulated from each other.
7. display panel according to claim 6, which is characterized in that further include：Deviate from institute positioned at the package metals layer
The sealant of one side of substrate is stated, the encapsulation region is completely covered over the substrate in the projection of the sealant over the substrate
Projection；
The sealant is glass frit layer.
8. display panel according to claim 1, which is characterized in that further include：It is arranged with the laser protection layer same layer
Capacitance metal layer.
9. display panel according to claim 1, which is characterized in that further include：
Driving film layer and the organic light-emitting units layer being electrically connected with the driving film layer；
The driving film layer connects the driving circuit of the display panel by the signal wire.
10. display panel according to claim 1, which is characterized in that the signal wire is driving circuit signal wire；
The driving circuit signal wire is clock cable or voltage signal line or ground signal line.
11. a kind of electronic equipment, which is characterized in that including：Such as claim 1-10 any one of them display panels.
12. a kind of preparation method of display panel, which is characterized in that the display panel includes viewing area, surrounds the display
The one week encapsulation region in area is located at stepped region of the encapsulation region far from viewing area side；The preparation method packet of the display panel
It includes：
Substrate is provided；
It is formed over the substrate and extends to the viewing area from the stepped region, and overlapping region is formed with the encapsulation region
Signal wire；
In the overlapping region of at least one signal wire laser protection layer is formed away from the side of the substrate.
13. according to the method for claim 12, which is characterized in that described formed over the substrate prolongs from the stepped region
The viewing area is extended to, and further includes before with the signal wire of encapsulation region formation overlapping region：
Dielectric isolation layer is formed in the substrate surface.
14. according to the method for claim 13, which is characterized in that described formed over the substrate prolongs from the stepped region
The viewing area is extended to, and includes with the signal wire of encapsulation region formation overlapping region：
Formed from the stepped region away from the one side of substrate in the dielectric isolation layer and extend to the viewing area, and with it is described
Encapsulation region forms the signal wire of overlapping region；
The signal wire is covered, the first insulating layer at least two vias is formed；
Deviate from the one side of substrate in first insulating layer, forms the laser protection layer with a plurality of metal conductive wire；Every
The laser protection layer is in parallel by the via and a corresponding signal line, and every metallic signal lines are in the substrate
On projection, the projection of a signal wire over the substrate is completely covered；
The laser protection layer is covered, second insulating layer is formed using inorganic insulating material.
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| CN201810145599.6A CN108364934B (en) | 2018-02-12 | 2018-02-12 | Electronic equipment, display panel and preparation method thereof |
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