CN108303824A - 直下式背光模组以及液晶显示器 - Google Patents
直下式背光模组以及液晶显示器 Download PDFInfo
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Abstract
本发明公开了一种直下式背光模组,其包括:包含有驱动电路层的衬底基板;设置于所述衬底基板上的蓝光LED芯片,所述蓝光LED芯片电性连接到所述驱动电路层;覆设于所述蓝光LED芯片上的光学转换层,所述光学转换层包括胶体材料以及掺杂在所述胶体材料中的荧光粉和雾度粒子,所述光学转换层将所述蓝光LED芯片发出的蓝光转换为白光;依次形成于所述光学转换层上的透明介质层和金属光栅层片。本发明还公开了一种液晶显示器,其包括如上所述的直下式背光模组。本发明提供的直下式背光模组可以减小液晶显示器的厚度,有利于实现轻薄化、窄边框化的液晶显示器。
Description
技术领域
本发明涉及显示器技术领域,尤其涉及一种直下式背光模组,还涉及包含所述直下式背光模组的液晶显示器。
背景技术
液晶显示器(Liquid Crystal Display,LCD),为平面超薄的显示设备,它由一定数量的彩色或黑白像素组成,放置于光源或者反射面前方。液晶显示器功耗很低,并且具有高画质、体积小、重量轻的特点,因此倍受大家青睐,成为显示器的主流。现有市场上的液晶显示器大部分为背光型液晶显示器,包括液晶面板及背光模组,液晶面板与背光模组相对设置,背光模组提供显示光源给液晶面板,以使液晶面板显示影像。
随着显示技术的发展,用户对液晶显示器特别是液晶电视的外观涉及需求逐步趋向于超薄超窄边框的设计,背光模组的结构是影响液晶显示器实现轻薄化、窄边框化的重要因素之一。现有技术中,液晶显示器的背光模组主要包括直下式背光模组和侧入式背光模组。侧光式背光模组的灯条设置在模组的侧边,依靠导光板将光能均匀分布到模组的显示区域内,故而侧光式背光模组的结构比较轻薄,但难以做到窄边框设计。直下式背光模组的则是由多组光源均匀分布在背光模组的底部,在光源上加装发散透镜以在背光模组内部腔体的空间距离内进行混光,需要较大的混光高度,所以直下式背光模组可以满足窄边框的要求,但却难以实现薄型化。
发明内容
鉴于现有技术存在的不足,本发明提供了一种直下式背光模组,其可以在较小厚度的空间内实现均匀的混光效果,有利于实现轻薄化、窄边框化的液晶显示器。
为了达到上述的目的,本发明采用了如下的技术方案:
一种直下式背光模组,其包括:
包含有驱动电路层的衬底基板;
设置于所述衬底基板上的蓝光LED芯片,所述蓝光LED芯片电性连接到所述驱动电路层;
覆设于所述蓝光LED芯片上的光学转换层,所述光学转换层包括胶体材料以及掺杂在所述胶体材料中的荧光粉和雾度粒子,所述光学转换层将所述蓝光LED芯片发出的蓝光转换为白光;
依次形成于所述光学转换层上的透明介质层和金属光栅层。
优选地,所述包含有驱动电路层的衬底基板形成为印刷电路板结构或柔性印刷电路板结构。
优选地,所述蓝光LED芯片为倒装结构的LED芯片,多个所述蓝光LED芯片呈阵列排布在所述衬底基板上;所述蓝光LED芯片的宽度尺寸为100~600μm,相邻两个所述蓝光LED芯片的间距为100~1000μm。
优选地,所述胶体材料为硅胶或树脂。
优选地,所述荧光粉为黄色荧光粉;或者是,所述荧光粉包括红色荧光粉和绿色荧光粉;或者是,所述荧光粉包括能够激光红光和绿光的量子点。
优选地,所述雾度粒子的粒径为1~10μm。
优选地,所述透明介质层的材料选自SiO2、SiO、MgO、Si3N4、TiO2和Ta2O5中的任意一种或两种以上,所述金属光栅层的材料为Al、Ag或Au。
优选地,所述金属光栅层中的光栅周期为20~500nm,光栅占空比为0.1~0.9。
优选地,所述直下式背光模组还包括反射片,所述反射片设置于所述衬底基板的背离所述蓝光LED芯片的一侧。
本发明还提供了一种液晶显示器,所述液晶显示器包括液晶面板以及如上所述的直下式背光模组,所述液晶面板包括依次设置在所述直下式背光模组上的阵列基板、液晶层、滤光基板以及上偏光片;其中,所述直下式背光模组中的所述金属光栅层还用于作为所述液晶面板的下偏光片。
本发明实施例提供的直下式背光模组:首先是保持了现有技术中直下式背光模组可以实现窄边框设计的优点。然后通过设置雾度粒子和金属光栅层,所述雾度粒子可以对光线进行扩散,增大光线的出射角度,使得光线的分布更加均匀;所述金属光栅层形成为反射式偏光片,使得一部分光线被朝向蓝光LED芯片反射,在荧光粉和雾度粒子之间反复反射进行混光;因此,所述雾度粒子和所述金属光栅层使得该直下式背光模组可以在较小厚度的空间内实现均匀的混光效果,减小了直下式背光模组的厚度。
基于以上两方面的结合,本发明实施例提供的直下式背光模组应用于液晶显示器中,非常有利于实现轻薄化、窄边框化的液晶显示器。进一步地,在所述液晶显示器中,由于直下式背光模组中的金属光栅层形成为反射式偏光片,所述金属光栅层还用于作为液晶显示器的下偏光片,不仅能够进一步减小液晶显示器的总体厚度,还减小了传统下偏光片与背光模组之间间隔的多层膜片所造成的反射增光效果衰减的问题。
附图说明
图1是本发明实施例提供的直下式背光模组的结构示意图;
图2是本发明实施例中阵列排布的蓝光LED芯片的俯视结构示意图;
图3是本发明实施例提供的液晶显示器的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的,并且本发明并不限于这些实施方式。
在此,还需要说明的是,为了避免因不必要的细节而模糊了本发明,在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤,而省略了与本发明关系不大的其他细节。
本实施例首先提供了一种直下式背光模组,参阅图1,所述直下式背光模组100包括衬底基板10、蓝光LED芯片20、光学转换层30、透明介质层40和金属光栅层50。
其中,所述衬底基板10中形成有驱动电路层11,所述驱动电路层11设置为向所述蓝光LED芯片20提供驱动电压和驱动电流,以驱动所述蓝光LED芯片20发光。具体地,所述驱动电路层11设置有焊盘(PAD),所述蓝光LED芯片20连接在所述焊盘上。更具体地,所述包含有驱动电路层11的衬底基板10可以是形成为印刷电路板(PCB)结构或柔性印刷电路板(FPC)结构。
其中,所述蓝光LED芯片20设置于所述衬底基板10上,所述蓝光LED芯片20通过所述焊盘电性连接到所述驱动电路层11,所述蓝光LED芯片20在接收到驱动信号时发出蓝光。具体地,本实施例中,如图2所示,多个所述蓝光LED芯片20在所述衬底基板10上呈阵列排布。
其中,所述光学转换层30覆设于所述蓝光LED芯片20上,所述光学转换层30用于将所述蓝光LED芯片20发出的蓝光转换为白光。具体地,如图1所示,所述光学转换层30包括胶体材料31以及掺杂在所述胶体材料31中的荧光粉32和雾度粒子33。所述荧光粉32能够被所述蓝光LED芯片20发出的蓝光激发出红光和绿光,由此所述蓝光LED芯片20发出的蓝光和所述荧光粉32发出的红光和绿光混合形成白光。所述雾度粒子33可以对光线(包括所述蓝光LED芯片20发出的蓝光和所述荧光粉32发出的红光和绿光)进行扩散,增大光线的出射角度,使得从所述光学转换层30出射的光线的分布更加均匀。
进一步地,所述胶体材料31可以选择为硅胶或树脂。所述荧光粉32为黄色荧光粉;或者是,所述荧光粉32包括红色荧光粉和绿色荧光粉;或者是,所述荧光粉32包括能够激光红光和绿光的量子点。所述雾度粒子33的粒径可以选择为1~10μm的范围内。
其中,所述透明介质层40和所述金属光栅层50依次形成于所述光学转换层30上。所述透明介质层40主要用于保护所述光学转换层30。所述金属光栅层50形成为反射式偏光片,从所述光学转换层30出射的光线到达所述金属光栅层50时,偏振方向垂直于所述金属光栅层50中栅条51的光线可以透射出所述金属光栅层50,而偏振方向平行于所述金属光栅层50中栅条51的光线则被朝向所述蓝光LED芯片20反射,被反射的光线在所述荧光粉32和所述雾度粒子33之间反复反射进行混光。
具体地,所述透明介质层40的材料可以选自SiO2、SiO、MgO、Si3N4、TiO2和Ta2O5中的任意一种或两种以上,优选使用与液晶显示器制程工艺兼容的SiO2、SiO或Si3N4。所述金属光栅层50的材料可以选择为Al、Ag或Au。更具体地,所述金属光栅层50中的光栅周期可以设置为20~500nm,光栅占空比可以设置为0.1~0.9。
如上实施例提供的直下式背光模组,通过设置雾度粒子33和金属光栅层50,所述雾度粒子33的扩散功能和所述金属光栅层50的反射功能,使得该直下式背光模组可以在较小厚度的空间内实现均匀的混光效果,减小了直下式背光模组的厚度。相对于传统LED芯片理想的120°出光角,通过所述雾度粒子33和所述金属光栅层50的扩散和反射作用,单颗LED芯片的出光角可以提升至150°~180°,有利于在相同LED芯片尺寸与芯片间距的前提下实现超薄厚度的混光距离,减小背光模组的厚度。再结合直下式背光模组本身可以实现窄边框设计的优点,以上实施例提供的直下式背光模组应用于液晶显示器中,非常有利于实现轻薄化、窄边框化的液晶显示器。
进一步地,本实施例中,所述直下式背光模组100还包括反射片60,所述反射片60设置于所述衬底基板10的背离所述蓝光LED芯片20的一侧。所述反射片60可以防止所述直下式背光模组100的背面发生漏光,提高背光源的光线利用率。
进一步地,本实施例中,所述蓝光LED芯片20采用小尺寸无封装的倒装结构(flip-chip)的LED芯片,多个所述蓝光LED芯片20采用密集周期阵列式排布,通过减小相邻两个所述蓝光LED芯片20的间距,进一步减小混光距离和模组厚度,以满足超薄厚度的背光模组的需要(总体厚度小于1mm)。具体地,如图2所示,所述蓝光LED芯片20的宽度尺寸D可以为100~600μm,相邻两个所述蓝光LED芯片20的间距L可以为100~1000μm。
本实施例还提供了一种液晶显示器,如图3所示,所述液晶显示器包括液晶面板200及背光模组100,所述背光模组100采用的是本发明实施例所提供的直下式背光模组100。所述液晶面板200与所述直下式背光模组100相对设置,所述直下式背光模组100提供显示光源给所述液晶面板200,以使所述液晶面板200显示影像。其中,所述液晶面板200包括依次设置在所述直下式背光模组100上的阵列基板201、滤光基板202和上偏光片203,所述阵列基板201和所述滤光基板202之间设置有液晶层204。其中,所述直下式背光模组100中的所述金属光栅层50还用于作为所述液晶面板200的下偏光片。
如上所提供的液晶显示器,由于所述直下式背光模组100具有较小的混光高度,因此所述液晶显示器相应的较小的厚度,可以实现轻薄化、窄边框化的液晶显示器。进一步地,所述液晶显示器中,由于所述金属光栅层50还用于作为下偏光片,其不仅能够进一步减小液晶显示器的总体厚度,还减小了传统下偏光片与背光模组之间间隔的多层膜片所造成的反射增光效果衰减的问题。
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本申请的保护范围。
Claims (10)
1.一种直下式背光模组,其特征在于,包括:
包含有驱动电路层的衬底基板;
设置于所述衬底基板上的蓝光LED芯片,所述蓝光LED芯片电性连接到所述驱动电路层;
覆设于所述蓝光LED芯片上的光学转换层,所述光学转换层包括胶体材料以及掺杂在所述胶体材料中的荧光粉和雾度粒子,所述光学转换层将所述蓝光LED芯片发出的蓝光转换为白光;
依次形成于所述光学转换层上的透明介质层和金属光栅层。
2.根据权利要求1所述的直下式背光模组,其特征在于,所述包含有驱动电路层的衬底基板形成为印刷电路板结构或柔性印刷电路板结构。
3.根据权利要求1所述的直下式背光模组,其特征在于,所述蓝光LED芯片为倒装结构的LED芯片,多个所述蓝光LED芯片呈阵列排布在所述衬底基板上;所述蓝光LED芯片的宽度尺寸为100~600μm,相邻两个所述蓝光LED芯片的间距为100~1000μm。
4.根据权利要求1所述的直下式背光模组,其特征在于,所述胶体材料为硅胶或树脂。
5.根据权利要求4所述的直下式背光模组,其特征在于,所述荧光粉为黄色荧光粉;或者是,所述荧光粉包括红色荧光粉和绿色荧光粉;或者是,所述荧光粉包括能够激光红光和绿光的量子点。
6.根据权利要求4或5所述的直下式背光模组,其特征在于,所述雾度粒子的粒径为1~10μm。
7.根据权利要求1所述的直下式背光模组,其特征在于,所述透明介质层的材料选自SiO2、SiO、MgO、Si3N4、TiO2和Ta2O5中的任意一种或两种以上,所述金属光栅层的材料为Al、Ag或Au。
8.根据权利要求1或7所述的直下式背光模组,其特征在于,所述金属光栅层中的光栅周期为20~500nm,光栅占空比为0.1~0.9。
9.根据权利要求1所述的直下式背光模组,其特征在于,所述直下式背光模组还包括反射片,所述反射片设置于所述衬底基板的背离所述蓝光LED芯片的一侧。
10.一种液晶显示器,其特征在于,所述液晶显示器包括液晶面板以及如权利要求1-9任一所述的直下式背光模组,所述液晶面板包括依次设置在所述直下式背光模组上的阵列基板、液晶层、滤光基板以及上偏光片;
其中,所述直下式背光模组中的所述金属光栅层还用于作为所述液晶面板的下偏光片。
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