CN108298238B - 物品保管设备 - Google Patents
物品保管设备 Download PDFInfo
- Publication number
- CN108298238B CN108298238B CN201810031577.7A CN201810031577A CN108298238B CN 108298238 B CN108298238 B CN 108298238B CN 201810031577 A CN201810031577 A CN 201810031577A CN 108298238 B CN108298238 B CN 108298238B
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- CN
- China
- Prior art keywords
- article
- positioning member
- surface portion
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Machine Parts And Wound Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017003539A JP6686914B2 (ja) | 2017-01-12 | 2017-01-12 | 物品保管設備 |
JP2017-003539 | 2017-01-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108298238A CN108298238A (zh) | 2018-07-20 |
CN108298238B true CN108298238B (zh) | 2021-05-14 |
Family
ID=62868807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810031577.7A Active CN108298238B (zh) | 2017-01-12 | 2018-01-12 | 物品保管设备 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6686914B2 (ja) |
KR (1) | KR102385796B1 (ja) |
CN (1) | CN108298238B (ja) |
TW (1) | TWI742215B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI752865B (zh) * | 2021-04-16 | 2022-01-11 | 迅得機械股份有限公司 | 具有擋止功能的卡匣及卡匣搬送系統 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6348708U (ja) * | 1986-09-18 | 1988-04-02 | ||
US5246218A (en) * | 1992-09-25 | 1993-09-21 | Intel Corporation | Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment |
WO1999040623A1 (fr) * | 1998-02-04 | 1999-08-12 | Nikon Corporation | Systeme d'exposition et appareil de positionnement de cassette a substrat |
WO2001092135A8 (en) * | 2000-05-09 | 2002-06-20 | Fluoroware Inc | Shock resistant variable load tolerant wafer shipper |
KR100557854B1 (ko) * | 2004-06-04 | 2006-03-10 | 주식회사 테라세미콘 | 반도체 제조장치의 웨이퍼 카세트 스테이지 |
JP2015171919A (ja) * | 2014-03-11 | 2015-10-01 | 株式会社ダイフク | 容器搬送設備 |
CN107130095A (zh) * | 2016-02-26 | 2017-09-05 | 株式会社三井高科技 | 托盘和热处理方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4082652B2 (ja) * | 2001-11-02 | 2008-04-30 | 平田機工株式会社 | 載置装置 |
TWI348988B (en) * | 2006-08-04 | 2011-09-21 | Hon Hai Prec Ind Co Ltd | Tray locating-device |
CN202186633U (zh) * | 2011-07-29 | 2012-04-11 | 宸鸿科技(厦门)有限公司 | 承载装置 |
JP5795521B2 (ja) | 2011-11-15 | 2015-10-14 | リンテック株式会社 | 支持装置 |
JP6043939B2 (ja) | 2012-08-24 | 2016-12-14 | ボンドテック株式会社 | 基板上への対象物の位置決め方法及び装置 |
JP6191543B2 (ja) * | 2014-05-22 | 2017-09-06 | 株式会社ダイフク | 搬送装置 |
-
2017
- 2017-01-12 JP JP2017003539A patent/JP6686914B2/ja active Active
- 2017-12-19 TW TW106144588A patent/TWI742215B/zh active
-
2018
- 2018-01-10 KR KR1020180003273A patent/KR102385796B1/ko active IP Right Grant
- 2018-01-12 CN CN201810031577.7A patent/CN108298238B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6348708U (ja) * | 1986-09-18 | 1988-04-02 | ||
US5246218A (en) * | 1992-09-25 | 1993-09-21 | Intel Corporation | Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment |
WO1999040623A1 (fr) * | 1998-02-04 | 1999-08-12 | Nikon Corporation | Systeme d'exposition et appareil de positionnement de cassette a substrat |
WO2001092135A8 (en) * | 2000-05-09 | 2002-06-20 | Fluoroware Inc | Shock resistant variable load tolerant wafer shipper |
KR100557854B1 (ko) * | 2004-06-04 | 2006-03-10 | 주식회사 테라세미콘 | 반도체 제조장치의 웨이퍼 카세트 스테이지 |
JP2015171919A (ja) * | 2014-03-11 | 2015-10-01 | 株式会社ダイフク | 容器搬送設備 |
CN107130095A (zh) * | 2016-02-26 | 2017-09-05 | 株式会社三井高科技 | 托盘和热处理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20180083263A (ko) | 2018-07-20 |
KR102385796B1 (ko) | 2022-04-11 |
JP6686914B2 (ja) | 2020-04-22 |
JP2018111577A (ja) | 2018-07-19 |
TW201829270A (zh) | 2018-08-16 |
CN108298238A (zh) | 2018-07-20 |
TWI742215B (zh) | 2021-10-11 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |